KR20000063732A - Apparatus for peeling film of printed circuit board - Google Patents

Abstract

PURPOSE: A film filling device of a printed circuit board is provided to easily remove a Mylor film on a dry film and reduce the time and cost needed for washing a bonding roller. CONSTITUTION: A film filling device of a printed circuit board comprises a loading section, a clamp, a scratching roller, a bonding roller, and an auxiliary roller. The loading section feeds an inner copper plate in which a drying film including a Mylor film is coated on the front surface and the rear surface by using a roller. The clamp clamps the inner copper plate when the inner copper plate is moved to a peeling position in the loading section. The scratching roller is moved upward and downward to an end portion of the clamped inner copper plate, and knurls the Mylor film of the front surface and the rear surface of the inner copper plate. The bonding roller absorbs the Mylor film and transfers the Mylor film to a belt.

Description

Apparatus for peeling film of printed circuit board

The present invention relates to a film peeling apparatus for a printed circuit board, and more particularly, to a film peeling apparatus for a printed circuit board to easily remove the mylar film on the dry film coated on the upper and lower surfaces of the printed circuit board.

In general, a printed circuit board forms an inner layer on an inner copper plate, laminates a plurality of films, drills, plating, forms a circuit by a photo process, and a photo solder register (PSR). ), The processing (Routing) and inspection (Inspection) process is performed sequentially.

Particularly, the process of forming an inner layer on the inner copper plate includes coating a dry film having a mylar film on the front / rear surface of the inner copper plate by using a compression roller. Exposing the coated dry film using UV (Ultra-Violet) light, removing the mirror film on the exposed dry film, and developing the dry film from which the mirror film is removed to form a circuit. Process.

A film peeling apparatus of a printed circuit board in which a process of removing a mylar film coated on a conventional dry film is performed, as shown in FIG. 1, has a dry film having a mylar film 42 at an upper layer thereof. A loading unit 10 for loading the inner copper plate 2 having a thickness of 0.1 mm or more coated on the front and rear surfaces of the 40 and the front and rear surfaces of the inner copper plate 2 loaded by the loading unit 10. A plurality of rotating wheels 34 to which the film peeling part 20 removing the coated mylar film 42 and the inner copper plate 2 from which the mylar film 42 is removed are fixed by the fixing bar 32. An unloading unit 30 which is unloaded is provided.

The film peeling apparatus of the related art will be described in more detail with reference to FIG. 2. In the loading unit 10, a plurality of rollers 12 rotated by driving of a driving source are sequentially installed, and a plurality of rollers 12 and When the inner copper plate 2 is positioned between the rollers 12 on the plurality of rollers 12 of the loading unit 10, the inner copper plate 2 is moved to the center of the loading unit 10 to move the inner copper plate 2 to the loading unit 10. Centering bar 14 to align in the center of the is provided.

In addition, the knurled portion of the film peeling unit 20 of the film peeling apparatus is lowered as the inner copper plate 2 moves as shown in FIG. 3, and thus the mylar film on the dry film 40 attached to the front surface of the inner copper plate 2. The upper scratching roller 46 connected to the upper roller shaft 44 so as to knurled the 42, and the mylar film on the dry film 40 attached to the rear side of the inner copper plate 2 when the inner copper plate 2 moves, A lower scratching roller 50 connected to the lower roller shaft 48 is provided to knurled the 42.

And, as shown in Fig. 4, the mylar film discharge portion of the film peeling portion 20, the first roller 56, the second roller 58, the third roller 60, the fourth roller connected to the upper by a belt And a sixth roller 70, an eighth roller 74, and a seventh roller 72 and a ninth roller 76, which are provided with a roller 62 and a fifth roller 64, and also connected to the lower part by a belt. And an upper adhesive roller 66 and a lower adhesive roller 68 facing each other between the fourth roller 62 and the fifth roller 64. Here, the first roller 56, the third roller 60 and the fifth roller 64 are connected by one belt so as to rotate counterclockwise, and the second roller 58 and the fourth roller 62 ) Is connected by one belt so as to rotate clockwise. In addition, the sixth roller 70 and the eighth roller 74 are connected by one belt to rotate counterclockwise, and the seventh roller 72 and the ninth roller 76 are connected by one belt. Connected and rotated counterclockwise. Then, the upper adhesive roller 66 and the lower adhesive roller 68 is made of a urethane material, the upper adhesive roller 66 and the lower adhesive roller 68 is to rotate in a clockwise direction so that the upper adhesive roller 66 and By adhering the mylar film 42 on the front and rear surfaces of the inner copper plate 2 moving between the lower adhesive rollers 68, the mylar film 42 on the front surface of the inner copper plate 2 is attached to the third roller 60. After the movement between the fourth roller 62, the second roller 58, and between the fourth roller 62 and the fifth roller 64 to move to the waste basket (Waste basket: 54), The mylar film 42 on the back of the inner copper plate 2 is moved between the sixth roller 70 and the seventh roller 72 to move between the eighth roller 74 and the ninth roller 76. Here, the cover (Cover: 52) is provided on the inner copper plate (2).

In addition, the inner copper plate 2 from which the mylar film 42 is removed is moved to one side by a plurality of rotating wheels 34 connected to the fixing bar 32 of the unloading unit 30.

Therefore, when the inner copper plate 2 is cut into a predetermined size and the dry film 40 is attached to the front and rear surfaces of the loading unit 10, the plurality of rollers 12 of the loading unit 10 rotate. The inner copper plate 2 is moved to the film filling unit 20. At this time, the centering bar 14 located between the plurality of rollers 12 is moved to the center portion, so that the inner copper plate 2 is aligned with the center of the ring portion 10.

Then, the inner copper plate (2) moved to the film peeling unit 20 is first lower and upper scratching roller 46 and lower scratching roller 50 connected to the upper roller shaft 44 and the lower roller shaft 48 is lowered and raised The upper scratching roller 46 and the lower scratching roller 50 will knurled the mylar film 42 on the dry film 40, and the inner copper plate 2 will have the upper scratching roller 46 and the lower scratching roller. To move between 50.

Next, the inner copper plate 2 in which the mylar film 42 is knurled is moved between the upper adhesive roller 66 and the lower adhesive roller 68, so that the mirror film 42 on the upper inner copper plate 2 is It is adsorbed by the upper adhesion roller 66 and moved to the belt between the third roller 6 and the fourth roller 62, and then the fourth roller 62 and the fifth roller via the upper portion of the second roller 58. It moves between the 64 and is contained in the waste basket 54, the mylar film 42 of the lower inner copper plate 2 is adsorbed by the lower adhesion roller 68 is the sixth roller 70 and the seventh roller After the movement between the 72 and the movement between the eighth roller 74 and the ninth roller 76 is to be contained in the waste basket (54).

In addition, since a large amount of particles may be adsorbed on the surfaces of the upper adhesive roller 66 and the lower adhesive roller 68 during the process, the upper adhesive roller may be stopped once a day by stopping the driving of the printed circuit board film peeling apparatus. 66) and the lower adhesion roller (68) by separating the surface with deionized water (deionized water) and alcohol to perform a cleaning process to remove the particles or replace the new upper adhesion roller (66) and lower adhesion roller (68) do.

In addition, the inner copper plate 2 from which the mylar film 42 is removed is moved to one side by a plurality of rotating wheels 34 connected to the fixing bar 32 of the unloading unit 30.

However, in recent years, with the rapid development of information technology, the thickness of the inner copper plate 2 is limited to 0.05 mm or more as information communication-related products become light and thin.

Therefore, at present, the mylar film 42 on the dry film 40 of the inner copper plate 2 having a thickness of 0.05 mm or more is not easily knurled due to the cause of the inner copper plate 2 being easily bent. There was this.

In addition, the upper adhesive roller 66 and the lower adhesive roller 68 should be periodically cleaned or replaced with a new upper adhesive roller 66 and the lower adhesive roller 68 so that the downlink of the printed circuit board film peeling device is performed. Loss of time (Loss time) caused by the decrease in productivity, there was a problem in that the replacement cost of the upper adhesive roller 66 and the lower adhesive roller 68 takes.

In addition, the thickness of the inner copper plate 2 moving between the upper adhesive roller 66 and the lower adhesive roller 68 is very thin, such as 0.05 mm, so that it cannot go straight, or between the upper adhesive roller 66 and the third roller 60 or the lower portion. By moving between the adhesive roller 68 and the sixth roller 70, there was a problem that a defect in the film peeling process occurs.

In addition, since the upper adhesive roller 66 and the lower adhesive roller 68 are formed of a urethane material, there was a problem that particles are generated in the upper adhesive roller 66 and the lower adhesive roller 68.

SUMMARY OF THE INVENTION An object of the present invention is to provide a film peeling apparatus for a printed circuit board which easily knurles the mylar film on the dry film of the inner copper plate having a thickness of 0.05 mm or less.

Another object of the present invention is to provide a film peeling apparatus for a printed circuit board which can reduce the loss time and the replacement cost of the adhesive roller by cleaning the adhesive roller by easily removing particles present on the adhesive roller. .

Still another object of the present invention is to provide a film peeling apparatus for a printed circuit board, wherein the inner copper plate easily moves straight through a pair of scratching rollers and adhesive rollers.

1 is a schematic configuration diagram illustrating a film peeling apparatus of a conventional printed circuit board.

2 is a cross-sectional view for explaining a film peeling apparatus of a conventional printed circuit board.

3 is a cross-sectional view illustrating a knurled portion of a film peeling apparatus of a conventional printed circuit board.

4 is a cross-sectional view illustrating a film discharge part of a film peeling apparatus of a conventional printed circuit board.

5 is a cross-sectional view illustrating a film peeling apparatus of a printed circuit board according to an exemplary embodiment of the present invention.

6 is a perspective view illustrating a film peeling apparatus of a printed circuit board according to an exemplary embodiment of the present invention.

7 is a cross-sectional view illustrating a knurled portion of a film peeling apparatus of a printed circuit board according to an exemplary embodiment of the present invention.

8 is a cross-sectional view for describing a mylar film discharge part of a printed circuit board according to an exemplary embodiment of the present invention.

※ Explanation of symbols for main parts of drawing

2: inner copper plate 10; Loading section

12: roller 14: centering bar

20, 100: film peeling part 30: unloading part

32: fixed bar 34: rotating wheel

40 dry film 42 mylar film

44, 102: upper roller shaft 46, 104: upper scratching roller

48, 106: Lower roller shaft 50, 108: Lower scratching roller

52, 110: cover 54: waste basket

56, 112: first roller 58, 114: second roller

60, 122: third roller 62, 120: fourth roller

64, 118: fifth roller 66, 116: upper adhesive roller

68, 128: lower adhesive roller 70, 134: sixth roller

72, 132: seventh roller 74, 130: eighth roller

76, 136: ninth roller 124: upper auxiliary roller

126: subsidiary roller 127: guide rail

138: tenth roller 140: eleventh roller

142: 12th roller

The film peeling apparatus of the printed circuit board according to the present invention for achieving the above object, the upper film and the dry film (Myry film) having a mylar film (Dry film) coated on the front and back by the inner copper plate by a roller A loading unit for transferring; A clamp for clamping the inner copper plate when the inner copper plate moves to a peeling position in the loading unit; A scratching roller for knuring the mylar film on the front or rear surface of the inner copper plate by raising or lowering to the end of the clamped inner copper plate and performing left and right movements; An adhesive roller which absorbs the mylar film knurled by the scratching roller and transfers it to a belt wound around a plurality of neighboring rollers; And an auxiliary roller for removing particles on the surface of the adhesive roller by idling in contact with the adhesive roller.

The adhesive roller may be made of a silicon material.

And, any one of the plurality of rollers immediately adjacent to the adhesive roller may be installed with a predetermined step with the adhesive roller.

In addition, the scratching roller and the adhesive roller face each other with the inner copper plate interposed therebetween is preferably installed, a guide rail for guiding the inner copper plate may be further installed between the pair of adhesive roller.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

5 is a cross-sectional view illustrating a film peeling apparatus of a printed circuit board according to an embodiment of the present invention, and FIG. 6 is a perspective view illustrating a film peeling apparatus of a printed circuit board according to an embodiment of the present invention. Parts identical to 2 are denoted by the same reference numerals.

The loading portion 10 of the printed circuit board film peeling apparatus according to the present invention is provided with a plurality of rollers 12 which are rotated by the driving of the driving unit, as shown in FIGS. 5 and 6, between each roller 12. The centering bar 14 is installed in the upper layer to move the inner copper plate 2 coated on the front and rear of the dry film 40 having the mylar film 42 to one side.

And, according to the present invention, as shown in Figure 7, one side of the loading portion 10, the upper portion for knurling the mylar film 42 of the front and rear of the inner copper plate 10 is supplied by the loading portion 10 An upper scratching roller 104 connected to the roller shaft 102 and a lower scratching roller 108 connected to the lower roller shaft 106 are provided. Here, the upper scratching roller 104 and the lower scratching roller 108 is an inner copper plate having a thickness of 0.05 mm or more to move between the upper scratching roller 104 and the lower scratching roller 108 by performing the vertical movement and the left and right movement ( The mylar film 42 of the front and back of 2) can be knurled easily. In addition, although not shown in the drawings, a clamp for clamping and fixing the upper surface of the inner copper plate 2 when the inner copper plate 2 supplied by the loading unit 10 moves to the knurled position is further included. It is provided to be knurled.

Then, as shown in FIG. 8, the mirror film of the front and rear of the inner copper plate (2) is moved between the upper scratching roller 104 and the lower scratching roller 108 and the mylar film 42 is knurled. ), The upper adhesive roller 116 and the lower adhesive roller 128 of a silicon material having a hardness of about 35 to 40 are attached to face each other up and down. Here, a guide rail 127 is further provided between the upper adhesive roller 116 and the lower adhesive roller 128 to perform a guide role so that the inner copper plate 2 can easily go straight.

In addition, the fifth roller 118, the fourth roller 120, and the third roller 122 are sequentially installed on the side of the upper adhesive roller 116, and the second roller 114 and the first roller on the top thereof. 112 is provided. Since the first roller 112, the upper adhesive roller 116 and the third roller 122 are connected by one belt, the first roller 112, the upper adhesive roller 116 and the third roller 122 Is rotated clockwise, the second roller 114, the fifth roller 118 and the fourth roller 112 are connected to each other by one belt, the second roller 114, the fifth roller 118 and the fourth roller 112 are adapted to rotate counterclockwise.

And the 8th roller 130, the 7th roller 132, and the 6th roller 134 are provided in the lower adhesion roller 128 side one by one, and the 9th roller 136 and the 10th roller in the lower part 138, the eleventh roller 140, and the twelfth roller 142 are provided in this order. Here, the lower adhesion roller 128 and the ninth roller 136 is connected by one belt, the lower adhesion roller 128 and the ninth roller 142 is rotated in the counterclockwise direction, the eighth roller The 130 and the 10th roller 138 are connected by one belt, and the 8th roller 130 and the 10th roller 138 are made to rotate counterclockwise. The sixth roller 134 and the eleventh roller 140 are connected by one belt, and the sixth roller 134 and the eleventh roller 140 are rotated in a clockwise direction, and the seventh roller. 132 and 9th roller 142 are connected by one belt, and 7th roller 132 and 9th roller 142 are made to rotate counterclockwise.

In particular, in order to prevent the inner copper plate 2 from moving in the direction of the fifth roller 118 and the eighth roller 130, the fifth roller 118 and the eighth roller 130 may include peripheral rollers 120, 122, 132, 134 is provided to have a predetermined step.

In addition, according to the present invention, the upper auxiliary roller 124 is coated with an adhesive material on the surface of the upper adhesive roller 116 to remove particles on the surface of the upper adhesive roller 116 by rotating in contact with each other. It is installed between the 104 and the upper adhesive roller 116, the subsidiary coating the adhesive material on the surface to remove particles on the surface of the lower adhesive roller 128 by regularly idling contact with the lower adhesive roller 128 The roller 126 is provided between the lower scratching roller 108 and the lower adhesion roller 128.

In addition, the inner copper plate 2 from which the mylar film 42 is removed is moved to one side by a plurality of rotating wheels 34 connected to the fixing bar 32 of the unloading unit 30.

Therefore, when the inner copper plate 2 is cut into a predetermined size and the dry film 40 coated on the front and rear surfaces is positioned in the loading unit 10, the plurality of rollers 12 of the loading unit 10 ) Is rotated so that the inner copper plate 12 is moved to one side in the loading unit (10). At this time, the centering bar 14 located between the plurality of rollers 12 is moved to the center portion, so that the inner copper plate 2 is aligned with the center of the ring portion 10.

When the inner copper plate 2 aligned in the loading unit 10 moves to the knurled position by the rotation of the roller 12, the clamp clamps the inner copper plate 2 to fix it.

Next, after the upper and lower scratching rollers 104 and the lower scratching rollers 108 connected to the upper roller shaft 102 and the lower roller shaft 106 are lowered and raised, the left and right movements of the inner copper plate 2 are performed. The mylar film 42 on the dry film 40 is knurled, and the inner copper plate 2 passes between the upper scratching roller 104 and the lower scratching roller 108.

Next, the inner copper plate 2 in which the mylar film 42 is knurled is moved between the upper adhesive roller 124 and the lower adhesive roller 126, so that the mirror film 42 on the upper portion of the inner copper plate 2 is Adhered by the upper adhesive roller 124 and moved to the belt between the upper adhesive roller 124 and the fifth adhesive roller 118, and the fourth roller 120 and the third roller (via the second roller 114). And the sixth roller 134 and the seventh roller 132 to move to the waste basket 54. Further, the mylar film 42 under the inner copper plate 2 is adhered by the lower adhesive roller 128 to move between the lower adhesive roller 128 and the eighth roller 130, and the ninth roller 136 It moves between the tenth rollers 138 to the waste basket 54.

In addition, since a large amount of particles may be adsorbed on the surfaces of the upper adhesive roller 116 and the lower adhesive roller 128 during the process, the upper adhesive roller 116 and the lower part after stopping the printed circuit board film peeling device regularly. Particles on the upper adhesive roller 116 and the lower adhesive roller 128 are removed by contacting the adhesive roller 128 with the upper auxiliary roller 124 and the lower auxiliary roller 126 by idling.

Then, the inner copper plate 2 from which the mylar film 42 has been removed is safely passed through the upper adhesive roller 116 and the lower adhesive roller 128 by the guide rail installed according to the present invention, and according to the present invention, The gap is moved to the unloading part 30 by passing through the fifth roller 118 and the seventh roller 130.

In addition, the inner copper plate of the unloading unit 30 is moved to one side by a plurality of rotating wheels 34 connected to the fixing bar 32.

Therefore, according to the present invention, the knurled film of the inner copper plate having a thickness of 0.05 mm or less is easily knurled by a scratching roller that knuckles the mirror film by raising or lowering the inner copper plate in the clamped state by the clamp. The guide rail installed between the upper and lower adhesive rollers and the rollers immediately adjacent to the adhesive rollers are installed stepwise so that the inner copper plate can be easily moved straight to the unloading part, and the auxiliary rollers are regularly attached to the adhesive rollers. It is possible to easily remove particles on the surface of the adhesive roller by contacting the machine to make it idle, thereby squeezing the use time of the adhesive roller and reducing the loss time and replacement cost due to the disassembly, cleaning and replacement of the adhesive roller. This is effective in suppressing particle generation.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (5)

A loading unit for transporting the inner copper plate coated on the front and rear surfaces of the dry film having a mylar film on the upper layer by a roller; A clamp for clamping the inner copper plate when the inner copper plate moves to a peeling position in the loading unit; A scratching roller for knuring the mylar film on the front or rear surface of the inner copper plate by raising or lowering to the end of the clamped inner copper plate and performing left and right movements; An adhesive roller which absorbs the mylar film knurled by the scratching roller and transfers it to a belt wound around a plurality of neighboring rollers; And An auxiliary roller for removing particles on the surface of the adhesive roller by idling with the adhesive roller; Printed circuit board film peeling device comprising a. The method of claim 1, The adhesive roller is a printed circuit board film peeling device, characterized in that made of a silicon material. The method of claim 1, The printed circuit board film peeling apparatus, characterized in that any one of the plurality of rollers immediately adjacent to the adhesive roller is provided with a predetermined step with the adhesive roller. The method of claim 1, The scratching roller and the adhesive roller is a printed circuit board film peeling apparatus characterized in that a pair is installed facing each other with the inner copper plate therebetween. The method of claim 4, wherein The printed circuit board film peeling device, characterized in that the guide rail for guiding the inner copper plate is further installed between the pair of adhesive rollers.