JPH07318878A - Production of liquid crystal display device and apparatus for production therefor - Google Patents

Production of liquid crystal display device and apparatus for production therefor

Info

Publication number
JPH07318878A
JPH07318878A JP11275894A JP11275894A JPH07318878A JP H07318878 A JPH07318878 A JP H07318878A JP 11275894 A JP11275894 A JP 11275894A JP 11275894 A JP11275894 A JP 11275894A JP H07318878 A JPH07318878 A JP H07318878A
Authority
JP
Japan
Prior art keywords
glass substrate
liquid crystal
crystal display
manufacturing
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11275894A
Other languages
Japanese (ja)
Inventor
Isao Tani
功 谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Mitsubishi Electric Corp filed Critical Asahi Glass Co Ltd
Priority to JP11275894A priority Critical patent/JPH07318878A/en
Publication of JPH07318878A publication Critical patent/JPH07318878A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

PURPOSE:To provide a process for production of a liquid crystal display device capable of preventing destruction or deterioration by static electricity of a liquid crystal display element and generation of a defect by suction of foreign matter and an apparatus for production therefor. CONSTITUTION:This process for production of the liquid crystal display device comprises subjecting the surface of a glass substrate 1 to at least one treatment for production of the liquid crystal display element in the state of placing the glass substrate 1 on a metallic transporting jig 3 and transporting the transporting jig 3 and the glass substrate 1 between respective treating stages while bringing rollers 2 of the transporting device into contact with the transporting jig 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は液晶表示装置の製法およ
びその製造装置に関する。さらに詳しくは、アクティブ
マトリックス型カラー液晶表示装置などの製造工程にお
いて、ガラス基板と搬送装置とのあいだ、またはガラス
基板と温度制御用プレートとのあいだに生じる静電気に
よって、薄膜トランジスタが破壊または劣化したり、ガ
ラス基板表面に異物が吸着するのを防止しうる液晶表示
装置の製法およびその製造装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device and a manufacturing apparatus thereof. More specifically, in a manufacturing process such as an active matrix type color liquid crystal display device, the thin film transistor is destroyed or deteriorated due to static electricity generated between the glass substrate and the carrier device or between the glass substrate and the temperature control plate, The present invention relates to a method of manufacturing a liquid crystal display device and a manufacturing apparatus thereof that can prevent foreign substances from adsorbing to the surface of a glass substrate.

【0002】[0002]

【従来の技術】アクティブマトリックス型カラー液晶表
示装置は、ガラス基板の表面に成膜、写真製版、エッチ
ング、レジスト除去の製造工程を経て形成された薄膜ト
ランジスタアレイ基板とカラーフィルタ基板とを、それ
ぞれ配向処理を施して重ね合わせて組み立てたのち、液
晶を注入し、そして、駆動回路を実装することにより製
造される。
2. Description of the Related Art In an active matrix type color liquid crystal display device, a thin film transistor array substrate and a color filter substrate formed on a surface of a glass substrate through a film forming process, a photoengraving process, an etching process and a resist removing process are respectively subjected to an alignment treatment. It is manufactured by injecting liquid crystal and mounting a drive circuit after assembling by applying.

【0003】これらの製造工程では多くの処理が施され
る。たとえば、薄膜トランジスタアレイ基板の製造工程
では、純水洗浄、乾燥、成膜、レジスト塗布、露光、現
像、エッチングおよびレジスト除去の一連の処理が複数
回繰り返される。また、この処理工程の途中に製品の検
査を行なう検査工程が加わる。
Many processes are performed in these manufacturing processes. For example, in the manufacturing process of the thin film transistor array substrate, a series of processes of washing with pure water, drying, film formation, resist coating, exposure, development, etching and resist removal are repeated a plurality of times. In addition, an inspection step for inspecting the product is added in the middle of this processing step.

【0004】前述の多数の処理工程において、各工程間
のガラス基板の搬送方法として、図5に示される搬送装
置のローラ22の上にガラス基板21を載せて移送させ
る方法、またはガラス基板をカセットに挿入して運搬車
で移送させる方法などがとられている。これらの従来例
は、ガラス基板が直接搬送装置のローラまたはカセット
に接触する。
In the above-mentioned many processing steps, as a method of transferring the glass substrate between the steps, a method of placing the glass substrate 21 on the roller 22 of the transfer device shown in FIG. The method is such that it is inserted into and transferred by a transport vehicle. In these conventional examples, the glass substrate directly contacts the roller or cassette of the transport device.

【0005】[0005]

【発明が解決しようとする課題】前述の液晶表示装置の
製法およびその製造装置では、ガラス基板が絶縁性であ
ることから、ガラス基板を搬送中に搬送装置のローラと
ガラス基板とのあいだでの摩擦または剥離によってガラ
ス基板に静電気が帯電する。
In the above-described method for manufacturing the liquid crystal display device and the manufacturing apparatus therefor, since the glass substrate is insulative, the glass substrate is transported between the roller of the transport device and the glass substrate during transport. The glass substrate is electrostatically charged by friction or peeling.

【0006】また、搬送中以外に熱処理工程においても
ガラス基板に静電気が帯電する。たとえば、ガラス基板
の熱処理工程では温度制御用プレートにガラス基板を吸
着し、熱処理後ガラス基板を離脱させているが、この操
作は具体的には以下のようにして行なわれる。図6に示
されるように、まず前の処理工程から搬送されてきたガ
ラス基板21を温度制御用プレート23に載せ、温度制
御用プレート23に設けられた空気吸引孔24(図7参
照)を介して真空引きすることにより、ガラス基板21
を温度制御用プレート23に吸着させる。温度制御用プ
レート23の熱をガラス基板21に伝導することにより
ガラス基板21を設定された温度になるように制御し、
所定の時間その温度を維持することにより、熱処理を行
なう。熱処理後、図7に示されるように、温度制御用プ
レート23に設けられた空気吸引孔24を大気に開放
し、そして、ピン25をプレートの表面より突出させる
ことにより、ガラス基板21を温度制御用プレート23
から離脱させる。温度制御用プレート23からガラス基
板21を離脱させたときに、ガラス基板21に剥離によ
って静電気が帯電する。
Further, the glass substrate is charged with static electricity not only during transportation but also during the heat treatment process. For example, in the heat treatment step of the glass substrate, the glass substrate is adsorbed on the temperature control plate and the glass substrate is removed after the heat treatment. This operation is specifically performed as follows. As shown in FIG. 6, first, the glass substrate 21 conveyed from the previous processing step is placed on the temperature control plate 23, and the air suction holes 24 (see FIG. 7) provided in the temperature control plate 23 are provided. The glass substrate 21
Are adsorbed on the temperature control plate 23. By controlling the heat of the temperature control plate 23 to the glass substrate 21, the glass substrate 21 is controlled to the set temperature,
Heat treatment is performed by maintaining the temperature for a predetermined time. After the heat treatment, as shown in FIG. 7, the air suction holes 24 provided in the temperature control plate 23 are opened to the atmosphere, and the pins 25 are projected from the surface of the plate to control the temperature of the glass substrate 21. Plate 23
Disengage from. When the glass substrate 21 is detached from the temperature control plate 23, the glass substrate 21 is peeled off to be charged with static electricity.

【0007】このようにガラス基板に静電気が帯電する
ことにより、ガラス基板上に形成した薄膜トランジスタ
素子が破壊したり劣化するという問題点がある。また、
静電気力によって空気中に浮遊している異物がガラス基
板上に吸着するため、異物が吸着した箇所の薄膜トラン
ジスタのパターンが欠落したり、短絡するという欠陥が
生じる問題点がある。
There is a problem in that the thin film transistor element formed on the glass substrate is broken or deteriorated by the electrostatic charge on the glass substrate. Also,
Since the foreign matter floating in the air is adsorbed on the glass substrate by the electrostatic force, there is a problem that a pattern of the thin film transistor at the portion where the foreign matter is adsorbed is missing or a short circuit occurs.

【0008】本発明は前記問題点を解消するためになさ
れたものであり、薄膜トランジスタ素子の静電気による
破壊または劣化を防止し、かつ異物の吸着による欠陥の
発生を解消しうる液晶表示装置の製法およびその製造装
置を提供することを目的とする。
The present invention has been made to solve the above problems, and a method of manufacturing a liquid crystal display device capable of preventing destruction or deterioration of a thin film transistor element due to static electricity and eliminating defects due to adsorption of foreign matter, and It is an object of the present invention to provide a manufacturing device thereof.

【0009】[0009]

【課題を解決するための手段】本発明の液晶表示装置の
製法は、導電性の搬送治具にガラス基板を載置した状態
で、前記ガラス基板表面に液晶表示素子を製造するため
の少なくとも1つの処理を施すとともに搬送装置の少な
くとも一部を搬送治具に接触させながら搬送治具および
ガラス基板の各処理工程間の搬送を行なうことを特徴と
している。
According to a method of manufacturing a liquid crystal display device of the present invention, at least one method for manufacturing a liquid crystal display element on the surface of a glass substrate is placed with the glass substrate placed on a conductive carrying jig. It is characterized in that the two treatments are performed and at the same time at least part of the conveying device is brought into contact with the conveying jig, the conveying jig and the glass substrate are conveyed between the respective treatment steps.

【0010】前記搬送治具が金属製であるのが好まし
い。
It is preferable that the carrying jig is made of metal.

【0011】前記搬送治具の上面に、ガラス基板の周縁
に当接する落下防止用の止め具を具備するのが好まし
い。
It is preferable that a stopper for contacting the periphery of the glass substrate is provided on the upper surface of the carrying jig to prevent falling.

【0012】前記搬送治具に、空気吸引孔を設けるのが
好ましい。
It is preferable to provide an air suction hole in the carrying jig.

【0013】また、他の製法として、ガラス基板の裏面
に金属箔を貼り付けた状態で、前記ガラス基板表面に液
晶表示素子を製造するための少なくとも1つの処理を施
すとともに搬送装置の少なくとも一部を金属箔に接触さ
せながらガラス基板の各処理工程間の搬送を行なっても
よい。
As another manufacturing method, at least one process for manufacturing a liquid crystal display element is applied to the surface of the glass substrate with a metal foil attached to the back surface of the glass substrate, and at least a part of the carrier device is provided. The glass substrate may be conveyed between the processing steps while being in contact with the metal foil.

【0014】また、さらに他の製法として、ガラス基板
の裏面に1010Ω・cm以下の体積抵抗率の導電性フィ
ルムシートを貼り付けた状態で、前記ガラス基板表面に
液晶表示素子を製造するための少なくとも1つの処理を
施すとともに搬送装置の少なくとも一部をフィルムシー
トに接触させながらガラス基板の各処理工程間の搬送を
行なってもよい。
As still another manufacturing method, a liquid crystal display device is manufactured on the surface of the glass substrate with a conductive film sheet having a volume resistivity of 10 10 Ω · cm or less attached to the back surface of the glass substrate. It is also possible to carry out at least one of the above processes and carry the glass substrate between the processing steps while contacting at least a part of the carrying device with the film sheet.

【0015】本発明の液晶表示装置は、ガラス基板の裏
面に当接する、導電性の材料からなる搬送治具を有して
なることを特徴とするものである。
The liquid crystal display device of the present invention is characterized by including a carrying jig made of a conductive material, which is in contact with the back surface of the glass substrate.

【0016】前記搬送治具が金属製であるのが好まし
い。
It is preferable that the carrying jig is made of metal.

【0017】[0017]

【作用】本発明における液晶表示装置の製法では、導電
性の搬送治具にガラス基板を載せて処理したり、搬送す
ることにより、ガラス基板への静電気の帯電を抑制し、
薄膜トランジスタ素子の静電気による破壊または劣化を
防止し、しかも異物の吸着による欠陥の発生を防止す
る。
In the method of manufacturing the liquid crystal display device according to the present invention, the electrostatic charge on the glass substrate is suppressed by placing the glass substrate on the conductive transport jig for processing or transporting.
This prevents damage or deterioration of the thin film transistor element due to static electricity, and also prevents generation of defects due to adsorption of foreign matter.

【0018】[0018]

【実施例】以下、本発明の液晶表示装置の製法およびそ
の製造装置の実施例を図面を参照しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a liquid crystal display device according to the present invention and an embodiment of the manufacturing device will be described below with reference to the drawings.

【0019】[実施例1]図1は本発明の液晶表示装置
の製法の一実施例におけるガラス基板の搬送方法を示す
斜視説明図、図2は本発明の液晶表示装置の製法の一実
施例における搬送治具にガラス基板を載せた状態を示す
斜視説明図である。図2において、搬送治具3は、厚さ
1.1mm程度のガラス基板1と同程度の外形寸法であ
り、かつ厚さ0.5mm程度の金属板、たとえばステン
レス板またはアルミニウム板からなり、その上面にガラ
ス基板1を載せる構成になっている。なお、金属板の厚
さは、とくに限定されないが、通常0.1〜3.0mm
であり、このうち搬送治具の変形をなくし、重量を軽く
するために0.5〜1.0mmであるのが好ましい。
[Embodiment 1] FIG. 1 is a perspective explanatory view showing a method of transporting a glass substrate in an embodiment of a method of manufacturing a liquid crystal display device of the present invention, and FIG. 2 is an embodiment of a method of manufacturing a liquid crystal display device of the present invention. FIG. 3 is a perspective explanatory view showing a state in which a glass substrate is placed on the carrying jig in FIG. In FIG. 2, the carrying jig 3 has the same outer dimensions as the glass substrate 1 having a thickness of about 1.1 mm, and is made of a metal plate having a thickness of about 0.5 mm, for example, a stainless plate or an aluminum plate. The glass substrate 1 is placed on the upper surface. The thickness of the metal plate is not particularly limited, but is usually 0.1 to 3.0 mm.
Of these, 0.5 to 1.0 mm is preferable in order to eliminate the deformation of the carrying jig and reduce the weight.

【0020】本実施例によれば、導電性の金属板からな
る搬送治具3にガラス基板1を載せて液晶表示装置の製
造のための処理を施し、そして、図1に示されるよう
に、搬送装置のローラ2に搬送治具3を接触させながら
ガラス基板2および搬送治具3を処理工程間の搬送を行
なうようにしたので、ローラ2と搬送治具3とのあいだ
で摩擦または剥離が生じるが、従来の製法と比較してガ
ラス基板1の静電気の帯電が非常に小さくなる。
According to the present embodiment, the glass substrate 1 is placed on the carrying jig 3 made of a conductive metal plate and subjected to a process for manufacturing a liquid crystal display device, and as shown in FIG. Since the glass substrate 2 and the transfer jig 3 are transferred between the processing steps while the transfer jig 3 is in contact with the roller 2 of the transfer device, there is no friction or peeling between the roller 2 and the transfer jig 3. Although it occurs, the electrostatic charge of the glass substrate 1 becomes very small as compared with the conventional manufacturing method.

【0021】また、ガラス基板の熱処理工程において
は、ガラス基板1を載せた搬送治具3を温度制御用プレ
ートに吸着させ、その状態で熱処理を行なう。したがっ
てガラス基板と温度制御用プレートとは直接接触しない
ので、ガラス基板は温度制御用プレートから離脱すると
きに帯電しない。たとえば、従来の製法のように温度制
御用プレートに吸着させたガラス基板を離脱させたとき
に、ガラス基板に剥離帯電した静電気の電位は9kVで
あったが、本実施例によれば測定感度(10V)以下の
電位となった。
In the heat treatment step of the glass substrate, the carrier jig 3 on which the glass substrate 1 is placed is adsorbed on the temperature control plate and heat treatment is performed in that state. Therefore, since the glass substrate and the temperature control plate do not come into direct contact with each other, the glass substrate is not charged when it is separated from the temperature control plate. For example, when the glass substrate adsorbed on the temperature control plate was released as in the conventional manufacturing method, the electrostatic potential peeled and charged on the glass substrate was 9 kV, but according to this example, the measurement sensitivity ( The potential became 10 V or less.

【0022】前述のようにガラス基板への静電気の帯電
を制御することにより、ガラス基板上に形成した薄膜ト
ランジスタ素子の静電気による破壊または劣化を防止で
きる。また、静電気力による空気中に浮遊している異物
のガラス基板への吸着が少なくなり、この異物による薄
膜トランジスタのパターンの欠落または短絡などの欠陥
の発生を防止することができる。
By controlling the charging of the glass substrate with static electricity as described above, it is possible to prevent the thin film transistor element formed on the glass substrate from being destroyed or deteriorated by static electricity. Further, the foreign matter floating in the air due to the electrostatic force is less likely to be adsorbed on the glass substrate, and it is possible to prevent the occurrence of defects such as a missing pattern of the thin film transistor or a short circuit due to the foreign matter.

【0023】なお、本明細書において、「搬送治具」と
は、ガラス基板と製造装置とのあいだに介在する、導電
性の材料からなる部材を意味するものであり、本実施例
における板状物以外にも後述する金属箔やフィルムシー
トを含む、広い概念である。
In the present specification, the "conveying jig" means a member made of a conductive material, which is interposed between the glass substrate and the manufacturing apparatus, and has a plate shape in this embodiment. It is a broad concept including metal foils and film sheets described later in addition to objects.

【0024】[実施例2]図3は本発明の液晶表示装置
の製法の他の実施例に用いられる搬送治具の斜視説明図
である。図3に示す実施例は、ガラス基板の外形寸法よ
り大きな寸法のステンレス板からなる搬送治具3の表面
に、ガラス基板の落下を防止するためのステンレスなど
からなる止め具4を設けたものである。止め具4は幅5
mm、厚さ0.5mmの帯状のステンレス板を搬送治具
3の表面にコ字状に固着することにより形成される。止
め具の断面形状は、本実施例で示す以外の形状、たとえ
ば円形であってもよく、またその寸法もガラス基板の厚
さなどに合わせて適宜選定することができる。
[Embodiment 2] FIG. 3 is a perspective explanatory view of a carrying jig used in another embodiment of the manufacturing method of the liquid crystal display device of the present invention. In the embodiment shown in FIG. 3, a stopper 4 made of stainless steel or the like for preventing the glass substrate from falling is provided on the surface of a conveying jig 3 made of a stainless steel plate having a size larger than the outer dimensions of the glass substrate. is there. Stopper 4 width 5
It is formed by fixing a strip-shaped stainless steel plate having a thickness of 0.5 mm and a thickness of 0.5 mm on the surface of the transport jig 3 in a U-shape. The cross-sectional shape of the stopper may be a shape other than that shown in this embodiment, for example, a circular shape, and its size can be appropriately selected according to the thickness of the glass substrate and the like.

【0025】本実施例は、搬送中に搬送治具3からガラ
ス基板1の落下を防止することができるとともに、実施
例1と同様にガラス基板の帯電抑制の作用効果も奏しう
る。
In this embodiment, the glass substrate 1 can be prevented from dropping from the carrying jig 3 during carrying, and the effect of suppressing the charging of the glass substrate can be obtained as in the case of the first embodiment.

【0026】[実施例3]図4は本発明の液晶表示装置
の製法のさらに他の実施例に用いられる搬送治具の斜視
説明図である。図4において、ガラス基板の外形寸法と
同じ大きさのステンレス板などの金属板からなる搬送治
具3に、温度制御用プレートの空気吸引孔と同じ配置に
なるように空気吸引孔5を設けたものである。空気吸引
孔5の直径は、温度制御用プレートの空気吸引孔と同じ
になるように設定すればよい。
[Embodiment 3] FIG. 4 is a perspective view of a carrying jig used in still another embodiment of the method for manufacturing a liquid crystal display device of the present invention. In FIG. 4, the air suction holes 5 are provided in the transport jig 3 made of a metal plate such as a stainless steel plate having the same size as the outer dimensions of the glass substrate so as to have the same arrangement as the air suction holes of the temperature control plate. It is a thing. The diameter of the air suction hole 5 may be set to be the same as the air suction hole of the temperature control plate.

【0027】本実施例では、搬送治具3が介在しても温
度制御用プレートとガラス基板との密着性がよくなり、
温度制御用プレートからガラス基板への熱伝導が向上
し、温度制御特性が向上する。それとともに、実施例1
と同様にガラス基板の帯電抑制の作用効果も奏しうる。
In this embodiment, the adhesion between the temperature control plate and the glass substrate is improved even if the transfer jig 3 is interposed,
The heat conduction from the temperature control plate to the glass substrate is improved, and the temperature control characteristics are improved. At the same time, Example 1
Similarly, the effect of suppressing the charging of the glass substrate can be obtained.

【0028】なお、前述の実施例1〜3では、搬送治具
としてステンレス板などの金属板を例に説明したが、本
発明はこれに限定されるものではなく、たとえばCFR
P(炭素繊維強化プラスチック)などの導電性の材料で
搬送治具を作製すればよい。
In the first to third embodiments described above, a metal plate such as a stainless plate was described as an example of the carrying jig, but the present invention is not limited to this, and for example, CFR.
The carrying jig may be made of a conductive material such as P (carbon fiber reinforced plastic).

【0029】[実施例4]実施例1〜3においては導電
性の金属板を搬送治具として用いているが、この搬送治
具に代えて、ガラス基板の裏面に金属箔を貼りつけて、
ガラス基板の表面に液晶表示素子を製造してもよい。具
体的には、ガラス基板の裏面に厚さ0.05mm程度の
アルミニウム箔を接着剤で貼りつけ、液晶表示装置の製
造処理工程ならびに搬送を行なう。液晶表示装置の製造
終了後、ガラス基板からアルミニウム箔ははがされる。
金属箔としては、アルミニウム箔以外にもアルミニウム
合金箔を用いることができる。また、その厚さは、通常
0.04〜0.2mm程度であり、とくに0.04〜
0.08mm程度であるのが好ましい。
[Embodiment 4] In Embodiments 1 to 3, a conductive metal plate is used as a carrying jig. Instead of this carrying jig, a metal foil is attached to the back surface of the glass substrate,
A liquid crystal display device may be manufactured on the surface of the glass substrate. Specifically, an aluminum foil having a thickness of about 0.05 mm is attached to the back surface of the glass substrate with an adhesive, and the manufacturing process and the transportation of the liquid crystal display device are performed. After the manufacturing of the liquid crystal display device is completed, the aluminum foil is peeled off from the glass substrate.
As the metal foil, an aluminum alloy foil can be used in addition to the aluminum foil. The thickness is usually about 0.04 to 0.2 mm, especially 0.04 to 0.2 mm.
It is preferably about 0.08 mm.

【0030】本実施例の製法においても、実施例1と同
様にガラス基板の帯電抑制の作用効果を奏しうる。
Also in the manufacturing method of this embodiment, the effect of suppressing the charging of the glass substrate can be obtained as in the first embodiment.

【0031】[実施例5]さらに、ガラス基板の裏面
に、たとえばアキレス(株)製のSTポリ導電性フィル
ムなどの導電性のフィルムシートを貼りつけ、ガラス基
板の表面に液晶表示素子を製造してもよい。具体的に
は、ガラス基板の裏面に厚さ0.05mm程度、体積抵
抗率106〜1010Ω・cm程度の導電性フィルムシー
トを接着剤で貼りつけ、液晶表示装置の製造処理工程な
らびに搬送を行なう。液晶表示装置の製造終了後、ガラ
ス基板から導電性フィルムシートははがされる。
Example 5 Further, a conductive film sheet such as ST poly conductive film manufactured by Achilles Co., Ltd. was attached to the back surface of the glass substrate to manufacture a liquid crystal display element on the surface of the glass substrate. May be. Specifically, a conductive film sheet having a thickness of about 0.05 mm and a volume resistivity of about 10 6 to 10 10 Ω · cm is attached to the back surface of the glass substrate with an adhesive, and the manufacturing process and transportation of the liquid crystal display device are performed. Do. After manufacturing the liquid crystal display device, the conductive film sheet is peeled off from the glass substrate.

【0032】本実施例の製法においては、106〜10
10Ω・cm程度の体積抵抗率のフィルムシートを採用す
ることにより、液晶表示装置の製造終了後にフィルムシ
ートをはがすときに発生する静電気の発生を抑制すると
ともに、実施例1と同様にガラス基板の帯電抑制の作用
効果も奏しうる。
In the manufacturing method of this embodiment, 10 6 to 10
By adopting a film sheet having a volume resistivity of about 10 Ω · cm, it is possible to suppress the generation of static electricity that occurs when the film sheet is peeled off after the manufacturing of the liquid crystal display device is finished, and the glass substrate The effect of suppressing charging can also be obtained.

【0033】なお、本実施例では導電性フィルムシート
を106〜1010Ω・cmの体積抵抗率としたが、本発
明はこの範囲にとくに限定されるものではなく、1010
Ω・cm以下であれば同様の効果を奏しうる。
[0033] Although the conductive film sheet and volume resistivity of 10 6 ~10 10 Ω · cm in the present embodiment, the present invention is not intended to be particularly limited to this range, 10 10
If it is Ω · cm or less, the same effect can be obtained.

【0034】また、フィルムシートの厚さは、とくに限
定されるものではないが、通常0.05〜1.0mmで
あり、とくに0.05〜0.1mm程度であるのが好ま
しい。
The thickness of the film sheet is not particularly limited, but is usually 0.05 to 1.0 mm, preferably about 0.05 to 0.1 mm.

【0035】[実施例6]前述の実施例3に示した搬送
治具を具備した液晶表示装置の製造装置の例として、た
とえば、実施例3に示したステンレス板などの金属板か
らなる搬送治具3を製造装置に内蔵し、製造装置のロー
ダ部およびアンローダ部にセットされたカセットからガ
ラス基板をロボットのアームで出し入れし、搬送治具3
にガラス基板を載せて製造装置内での搬送および処理工
程をできるように構成する。
[Embodiment 6] As an example of an apparatus for manufacturing a liquid crystal display device equipped with the carrying jig shown in the above-mentioned Embodiment 3, for example, a carrying jig made of a metal plate such as a stainless steel plate shown in Embodiment 3 is used. The tool 3 is built in the manufacturing apparatus, and the glass substrate is taken in and out by the robot arm from the cassette set in the loader section and the unloader section of the manufacturing apparatus.
The glass substrate is placed on the substrate so that the glass substrate can be transported and processed in the manufacturing apparatus.

【0036】このばあい、搬送治具3は、実施例3に示
されるものに限定されるものではなく、製造装置内の搬
送工程または処理工程において、ガラス基板の裏面に当
接する、導電性の材料からなる搬送治具を用いれば、前
述のガラス基板の帯電抑制の作用効果を奏しうる。
In this case, the carrying jig 3 is not limited to the one shown in the third embodiment, and is made of a conductive material that comes into contact with the back surface of the glass substrate in the carrying step or the processing step in the manufacturing apparatus. If a carrying jig made of a material is used, it is possible to achieve the above-described action and effect of suppressing the charging of the glass substrate.

【0037】[0037]

【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載するような効果を奏する。
Since the present invention is constructed as described above, it has the following effects.

【0038】絶縁性のガラス基板を導電性の搬送治具に
載せて製造の処理工程を施し、そして、処理工程間を搬
送することにより、ガラス基板への静電気の帯電を抑制
することができる。その結果、ガラス基板上に形成した
薄膜トランジスタ素子の静電気による破壊または劣化を
防止できる。また、静電気力による空気中に浮遊してい
る異物のガラス基板裏面への吸着が少なくなり、異物に
よる薄膜トランジスタ素子のパターンの欠落や短絡など
の欠陥の発生を防止できる。
By placing an insulating glass substrate on a conductive carrying jig, performing manufacturing process steps, and carrying between the process steps, electrostatic charging of the glass substrate can be suppressed. As a result, it is possible to prevent the thin film transistor element formed on the glass substrate from being destroyed or deteriorated by static electricity. In addition, the foreign matter floating in the air due to the electrostatic force is less adsorbed to the back surface of the glass substrate, and it is possible to prevent the occurrence of defects such as a missing pattern of the thin film transistor element and a short circuit due to the foreign matter.

【0039】とくに、金属製の搬送治具を採用すれば、
好適にガラス基板への静電気の帯電を抑制することがで
きるとともに熱処理工程における温度制御用プレートか
らガラス基板への熱伝導もよい。
In particular, if a metal carrying jig is used,
The electrostatic charge on the glass substrate can be preferably suppressed, and the heat conduction from the temperature control plate to the glass substrate in the heat treatment step is also good.

【0040】また、搬送治具の上面に、ガラス基板の周
縁に当接する落下防止用の止め具を具備することによっ
てガラス基板の落下を防止することができる。
Further, the glass substrate can be prevented from falling by providing a stopper for preventing the glass substrate from contacting the peripheral edge of the glass substrate on the upper surface of the carrying jig.

【0041】また、前記搬送治具に、空気吸引孔を設け
ることによって、温度制御用プレートが搬送治具の空気
吸引を行なったとき搬送治具が介在しても温度制御用プ
レートとガラス基板との密着性がよくなり、温度制御用
プレートからガラス基板への熱伝導が向上し、温度特性
が向上する。
Further, by providing an air suction hole in the transfer jig, the temperature control plate and the glass substrate can be separated from each other even if the transfer jig intervenes when the temperature control plate sucks air from the transfer jig. The adhesiveness is improved, heat conduction from the temperature control plate to the glass substrate is improved, and temperature characteristics are improved.

【0042】また、ガラス基板の裏面に金属箔を貼り付
けた状態で、前記ガラス基板表面に液晶表示素子を製造
するための少なくとも1つの処理を施すとともに搬送装
置の少なくとも一部を金属箔に接触させながらガラス基
板の各処理工程間の搬送を行なってもガラス基板の帯電
抑制の作用効果を奏しうる。
Further, with the metal foil attached to the back surface of the glass substrate, at least one treatment for manufacturing a liquid crystal display element is applied to the surface of the glass substrate, and at least a part of the carrier is brought into contact with the metal foil. Even if the glass substrate is transported between the processing steps while being carried out, the effect of suppressing the charging of the glass substrate can be obtained.

【0043】また、ガラス基板の裏面に1010Ω・cm
以下の体積抵抗率の導電性フィルムシートを貼り付けた
状態で、前記ガラス基板表面に液晶表示素子を製造する
ための少なくとも1つの処理を施すとともに搬送装置の
少なくとも一部をフィルムシートに接触させながらガラ
ス基板の各処理工程間の搬送を行なってもガラス基板の
帯電抑制の作用効果を奏しうる。
On the back surface of the glass substrate, 10 10 Ω · cm
While the conductive film sheet having the following volume resistivity is attached, at least one treatment for producing a liquid crystal display element is performed on the surface of the glass substrate, and at least a part of the transport device is brought into contact with the film sheet. Even if the glass substrate is transported between the processing steps, the effect of suppressing the charging of the glass substrate can be obtained.

【0044】本発明の液晶表示装置の製造装置は、ガラ
ス基板の裏面に当接する、導電性の材料からなる搬送治
具を有してなることにより、絶縁性のガラス基板を導電
性の搬送治具に載せて製造の処理工程を施し、そして、
処理工程間を搬送することにより、ガラス基板への静電
気の帯電を抑制することができる。
The apparatus for manufacturing a liquid crystal display device of the present invention has a transport jig which is in contact with the back surface of the glass substrate and is made of a conductive material. And put it on a processing tool for manufacturing, and
By transporting between the processing steps, electrostatic charging of the glass substrate can be suppressed.

【0045】とくに、金属製の搬送治具を採用すれば、
好適にガラス基板への静電気の帯電を抑制することがで
きるとともに熱処理工程における温度制御用プレートか
らガラス基板への熱伝導もよい。
In particular, if a metal carrying jig is used,
The electrostatic charge on the glass substrate can be preferably suppressed, and the heat conduction from the temperature control plate to the glass substrate in the heat treatment step is also good.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の液晶表示装置の製法の一実施例にお
けるガラス基板の搬送方法を示す斜視説明図である。
FIG. 1 is a perspective explanatory view showing a method of transporting a glass substrate in an embodiment of a method for manufacturing a liquid crystal display device of the present invention.

【図2】 本発明の液晶表示装置の製法の一実施例にお
ける搬送治具にガラス基板を載せた状態を示す斜視説明
図である。
FIG. 2 is a perspective explanatory view showing a state in which a glass substrate is placed on a carrying jig in an embodiment of a method for manufacturing a liquid crystal display device of the present invention.

【図3】 本発明の液晶表示装置の製法の他の実施例に
用いられる搬送治具の斜視説明図である。
FIG. 3 is a perspective explanatory view of a carrying jig used in another embodiment of the manufacturing method of the liquid crystal display device of the present invention.

【図4】 本発明の液晶表示装置の製法のさらに他の実
施例に用いられる搬送治具の斜視説明図である。
FIG. 4 is a perspective explanatory view of a carrying jig used in still another embodiment of the method for manufacturing the liquid crystal display device of the present invention.

【図5】 従来のガラス基板の搬送方法を示す概略斜視
図である。
FIG. 5 is a schematic perspective view showing a conventional method of transporting a glass substrate.

【図6】 従来のガラス基板の熱処理工程の状態を示す
斜視図である。
FIG. 6 is a perspective view showing a state of a conventional glass substrate heat treatment step.

【図7】 従来のガラス基板の熱処理工程におけるガラ
ス基板が離脱した状態を示す斜視図である。
FIG. 7 is a perspective view showing a state in which a glass substrate is detached in a conventional glass substrate heat treatment process.

【符号の説明】[Explanation of symbols]

1 ガラス基板、2 ローラ、3 搬送治具、4 止め
具、5 空気吸引孔。
1 glass substrate, 2 rollers, 3 conveying jig, 4 stoppers, 5 air suction holes.

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 導電性の搬送治具にガラス基板を載置し
た状態で、前記ガラス基板表面に液晶表示素子を製造す
るための少なくとも1つの処理を施すとともに搬送装置
の少なくとも一部を搬送治具に接触させながら搬送治具
およびガラス基板の各処理工程間の搬送を行なうことを
特徴とする液晶表示装置の製法。
1. With a glass substrate placed on a conductive transport jig, at least one treatment for manufacturing a liquid crystal display element is performed on the surface of the glass substrate, and at least a part of the transport device is transported and treated. A manufacturing method of a liquid crystal display device, wherein a transfer jig and a glass substrate are transferred between respective processing steps while being in contact with a tool.
【請求項2】 前記搬送治具が金属製である請求項1記
載の製法。
2. The manufacturing method according to claim 1, wherein the carrying jig is made of metal.
【請求項3】 前記搬送治具の上面に、ガラス基板の周
縁に当接する落下防止用の止め具を具備した請求項1記
載の液晶表示装置の製法。
3. The method of manufacturing a liquid crystal display device according to claim 1, further comprising a stopper for preventing a drop coming into contact with a peripheral edge of the glass substrate, which is provided on an upper surface of the carrying jig.
【請求項4】 前記搬送治具に、空気吸引孔を設けた請
求項1記載の液晶表示装置の製法。
4. The method of manufacturing a liquid crystal display device according to claim 1, wherein the conveying jig is provided with an air suction hole.
【請求項5】 ガラス基板の裏面に金属箔を貼り付けた
状態で、前記ガラス基板表面に液晶表示素子を製造する
ための少なくとも1つの処理を施すとともに搬送装置の
少なくとも一部を金属箔に接触させながらガラス基板の
各処理工程間の搬送を行なうことを特徴とする液晶表示
装置の製法。
5. With a metal foil attached to the back surface of the glass substrate, at least one treatment for manufacturing a liquid crystal display element is performed on the surface of the glass substrate, and at least a part of a carrier device is brought into contact with the metal foil. A method of manufacturing a liquid crystal display device, characterized in that the glass substrate is transported between each processing step while being carried out.
【請求項6】 ガラス基板の裏面に1010Ω・cm以下
の体積抵抗率の導電性フィルムシートを貼り付けた状態
で、前記ガラス基板表面に液晶表示素子を製造するため
の少なくとも1つの処理を施すとともに搬送装置の少な
くとも一部をフィルムシートに接触させながらガラス基
板の各処理工程間の搬送を行なうことを特徴とする液晶
表示装置の製法。
6. At least one treatment for producing a liquid crystal display device on the surface of the glass substrate, with a conductive film sheet having a volume resistivity of 10 10 Ω · cm or less attached to the back surface of the glass substrate. A method of manufacturing a liquid crystal display device, characterized in that the glass substrate is transported between the processing steps while at least a part of the transport device is brought into contact with the film sheet.
【請求項7】 ガラス基板の裏面に当接する、導電性の
材料からなる搬送治具を有してなることを特徴とする液
晶表示装置の製造装置。
7. An apparatus for manufacturing a liquid crystal display device, comprising a carrying jig made of a conductive material, which is in contact with the back surface of the glass substrate.
【請求項8】 前記搬送治具が金属製である請求項7記
載の製造装置。
8. The manufacturing apparatus according to claim 7, wherein the carrying jig is made of metal.
JP11275894A 1994-05-26 1994-05-26 Production of liquid crystal display device and apparatus for production therefor Pending JPH07318878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11275894A JPH07318878A (en) 1994-05-26 1994-05-26 Production of liquid crystal display device and apparatus for production therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11275894A JPH07318878A (en) 1994-05-26 1994-05-26 Production of liquid crystal display device and apparatus for production therefor

Publications (1)

Publication Number Publication Date
JPH07318878A true JPH07318878A (en) 1995-12-08

Family

ID=14594808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11275894A Pending JPH07318878A (en) 1994-05-26 1994-05-26 Production of liquid crystal display device and apparatus for production therefor

Country Status (1)

Country Link
JP (1) JPH07318878A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980023327A (en) * 1996-09-30 1998-07-06 엄길용 Heat treatment system of flat panel device
JP2007326358A (en) * 2006-05-08 2007-12-20 Asahi Glass Co Ltd Thin glass laminate, process for manufacturing display apparatus using the same, and supporting glass substrate
JP2011124279A (en) * 2009-12-08 2011-06-23 Apic Yamada Corp Carrying tool and cutting device
JP2018065109A (en) * 2016-10-20 2018-04-26 東京応化工業株式会社 Washing equipment and washing method
CN111556638A (en) * 2020-05-22 2020-08-18 Tcl华星光电技术有限公司 Method and system for improving static accumulation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980023327A (en) * 1996-09-30 1998-07-06 엄길용 Heat treatment system of flat panel device
JP2007326358A (en) * 2006-05-08 2007-12-20 Asahi Glass Co Ltd Thin glass laminate, process for manufacturing display apparatus using the same, and supporting glass substrate
JP2011124279A (en) * 2009-12-08 2011-06-23 Apic Yamada Corp Carrying tool and cutting device
JP2018065109A (en) * 2016-10-20 2018-04-26 東京応化工業株式会社 Washing equipment and washing method
CN111556638A (en) * 2020-05-22 2020-08-18 Tcl华星光电技术有限公司 Method and system for improving static accumulation

Similar Documents

Publication Publication Date Title
JP2007251080A (en) Fixing method for plastic substrate, circuit substrate, and manufacturing method therefor
JPH07318878A (en) Production of liquid crystal display device and apparatus for production therefor
JP2002313891A (en) Tray for substrate transport and manufacturing method therefor
JP2015126092A (en) Cleaning substrate and method for cleaning substrate processing device
JP2002233808A (en) Liquid treatment apparatus
JP4400877B2 (en) Substrate processing equipment
JP3610187B2 (en) Static elimination method, processing apparatus and processing method
JPH08321537A (en) Treatment equipment and treatment method
JP2003037156A (en) Suction plate
JP3194592B2 (en) Single wafer cleaning equipment
JP2000260671A (en) Dust adsorbing wafer and method of cleaning inside of semiconductor device
JP2004079614A (en) Work processing method and its processing apparatus
JP2008041355A (en) Plasma surface treatment device, and surface treatment method
JPH08124892A (en) Adhesive tape for removing impurity attached to semiconductor wafer and removal
JPH0737962A (en) Transfering apparatus and conveying apparatus for substrate
JPH09102444A (en) Substrate treatment device
JP3833827B2 (en) Heat treatment equipment
JP3217717B2 (en) Antistatic device and rubbing device used in liquid crystal panel manufacturing process
JPH06250162A (en) Production of liquid crystal display element
JP3157934B2 (en) Thin film processing method
JP2004063826A (en) Method and unit for removing residual charge
JP2002047466A (en) Double-sided self-adhesive tape for cleaning for semiconductor substrate-treating device
JPH0766117A (en) System for removing unnecessary film formed on substrate through spin coating
JPH08148461A (en) Method for removing foreign object attached to semiconductor wafer
JPH11354618A (en) Processor