TWI574749B - Methods and systems for removing colloids - Google Patents

Description

Method and system for removing colloid

The present invention relates to a method and system for removing colloids, and more particularly to a method and system for removing colloids for touch device components and display device components.

In touch devices (such as capacitive sensing devices, resistive signal sensing devices, etc.) and display devices (such as liquid crystal displays, light-emitting diode displays, etc.) in current electronic products, a glue is often used to bond the device. Two adjacent components. However, in the process of bonding, it may be necessary to remove the adhesive adhered to the two components due to the inaccuracy of the alignment of the two components, the presence of air bubbles in the adhesive, and the overflow of the adhesive, and then re-bonding. The two components.

Specifically, when performing two-component re-bonding, it is necessary to perform (1) breaking the colloidal structure adhered between the two elements to separate the two elements; and (2) removing the residual colloid on the surface of the two elements. .

In the case of the step (1), a specific solution has been proposed, for example, in the U.S. Patent No. 20,110, 126, 989, and the Patent No. 20,110,180,218.

But for step (2), the existing method is not mature enough. For example, U.S. Patent No. 20,110, 126, 989 discloses a technique for manually rolling a glue on a component to separate the adhesive from the component, but the method is inefficient and applied to the roller by manual winding. The positive pressure of the component is liable to damage the component; for example, the technique of removing a glue on a component using a cylindrical rod is disclosed in the US Patent No. 20130034713, but the component is produced when the cylindrical rod is used to remove the adhesive. The positive pressure also tends to damage the component due to compression.

In view of the above, the existing method of removing colloids needs to be improved to improve the degreasing efficiency and to avoid damage to the gel removal during the degreasing process.

Accordingly, it is an object of the present invention to provide a method of removing colloid that avoids damage to the gel to be removed.

Furthermore, it is another object of the present invention to provide a system for removing colloid that avoids damage to the gel to be removed.

Therefore, the method for removing the colloid of the present invention comprises: (a) controlling a dipping attachment pivotally connected to a body of the device to rotate about an axis thereof; and (b) attaching a workpiece to which a surface is adhered with a glue. Moving the adhesive attachment to the adhesive, and causing the adhesive to be attached to the adhesive attachment by a pulling force applied from the adhesive attachment in a direction away from the surface of the workpiece; (c) moving the work object relative to the adhesive attachment in the adhesive adhering range, and causing the adhesive to be wound away from the work by the adhesive attachment to obtain a cleaned product.

In addition, the gel removal system of the present invention comprises a Work object, a glue removal device, and a control interface. The work includes a surface and a glue adhered to the surface. The degreasing device includes a device body and a damp attachment pivotally coupled to the device body and controllably rotatable about an axis thereof. The control interface controls the rotation of the adhesive attachment and the movement of the workpiece relative to the adhesive attachment to allow the adhesive attachment in rotation to contact the adhesive and subject the adhesive to a direction away from the surface of the workpiece The adhesive force is removed to attach the adhesive tape to the adhesive attachment, thereby causing the adhesive to be wound away from the surface.

The effect of the invention is that the adhesive is attached to the adhesive attachment by the rotation of the adhesive attachment and contacting the surface of the workpiece, so that the adhesive is subjected to the pulling force away from the surface. The adhesive is caused to be wound away from the surface, thus improving the efficiency of the removal of the glue and avoiding damage to the workpiece during the process of removing the glue.

1‧‧‧Degumming system

11‧‧‧Works

111‧‧‧ surface

112‧‧‧Viscos

12‧‧‧Glue removal device

121‧‧‧ device body

122‧‧‧Stained accessories

123‧‧‧ axis

124‧‧‧ convex

125‧‧ ‧ film

81‧‧‧Steps

82‧‧‧Steps

83‧‧‧Steps

991‧‧‧Distance of attachment

994‧‧‧Working direction of work

995‧‧‧Draw out the direction of tension

996‧‧‧Distance between the attachment and the surface of the workpiece

997‧‧‧An angle between the axis and the surface of the work object

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a flow chart illustrating a preferred embodiment of the method for removing colloids of the present invention; Referring to the schematic diagram, the colloid removal system of the preferred embodiment is illustrated; FIG. 3 is a side elevational view showing the movement of a workpiece relative to a dip attachment by a human hand; FIG. 4 is a schematic view of the operation. The attachment of the attachment to the glue on the surface of the work; Figure 5 is a side elevational view showing the applicator attachment comprising a plurality of patches formed on the surface; and Figure 6 is a side elevational view showing the application of a film on the applicator attachment as shown in Figure 2. situation.

Referring to Figures 1 and 2, a preferred embodiment of the method of removing colloids of the present invention is carried out in a degumming system 1 as shown in Figure 2.

The degreasing system 1 includes a work object 11, a degreasing device 12, and a control interface (not shown). The work object 11 includes a surface 111 and a glue 112 adhered to the surface 111 of the work object 11. In the glue removal system 1 executed in the preferred embodiment, the work object 11 is, for example, in a touch device. Capacitive touch panel, resistive touch panel, optical touch panel and other components, or a liquid crystal display panel, a light emitting diode display panel, a plasma display panel, an electronic paper and the like in a display device.

The degreasing device 12 includes a device body 121 and a damp attachment 122 pivotally coupled to the device body 121 and controllably rotatable about an axis 123 of itself. In the present embodiment, the dip attachment 122 has a straight rod shape, but may be one of a cone shape, a spherical shape, and a curved shape such as a undulating curve. The dip attachment 122 has a radius of rotation of 2.5-5 mm.

Referring to FIG. 3, the control interface can be, for example, manually controlling the movement of the workpiece 11 relative to the dip attachment 122, and controlling the rotation of the dip attachment 122 with an electronic implement (not shown).

Referring to FIG. 1 and referring to FIG. 2 and FIG. 4, a preferred embodiment of the method for removing colloids of the present invention first performs step 81, using the control interface. In a preferred embodiment of the method for removing the colloid, the damp attachment 122 pivotally attached to the device body 121 is first rotated about the axis 123 of the device in the direction of 991. The speed of the dip attachment 122 is controlled at 200-2000 revolutions per minute, with 300-500 revolutions per minute being preferred.

Then, step 82 is performed, and the control object is used to control the work object 11 to move relative to the touch attachment 122 in the direction of 994 at a speed of "the radius of rotation of the adhesive attachment 122 × the rotational speed of the adhesive attachment 122 × 0.10467 (mm / sec)". The adhesive attachment 122 is brought into contact with the adhesive 112, and the adhesive 112 is subjected to a pulling force 995 applied away from the surface 111 of the workpiece 11 by the adhesive attachment 122 to cause the adhesive 112 to be attached to the adhesive. Annex 122. In particular, during the process of this step, when the adhesive attachment 122 contacts the adhesive 112, the angle 997 between the axis 123 and the surface 111 of the workpiece 11 is 0-20 degrees, wherein 5-15 degrees is preferred. And the distance 996 between the applicator attachment 122 and the surface 111 of the workpiece 11 is 0-10 mm, wherein 2-5 mm is preferred; thus, better degreasing efficiency is obtained, and the surface of the workpiece 11 is provided. The stress generated by 111 is controlled at -1-0 (kg/cm 2 ) to avoid destructive positive pressure on the workpiece 11 . The stress is calculated as “stress=applied force application area”; wherein the force applied to the workpiece 11 during the degumming can be measured by a scale, as follows: the work object 11 is placed on the scale to be zeroed. When the glue is removed, the value displayed by the scale is the force value; if the displayed value is a positive value, it means that the force is a positive pressure; otherwise, if the displayed value is a negative value, it means that the force is a set. pull.

Finally, step 83 is performed, and the control interface is used to control the workpiece 11 to move relative to the adhesive attachment portion 122 in the adhesion range of the adhesive 112. The adhesive 112 is wound away from the workpiece 11 by the adhesive attachment 122 to obtain a cleaned product.

Referring to FIG. 5, further, the de-glue device 12 of the preferred embodiment can use the design of the dip attachment 122 of FIG. 5, that is, the dip attachment 122 includes a plurality of protrusions 124 formed on the surface, and each of the protrusions The granules 124 have a length of 5-15 mm and are at an angle of 30-45 degrees to the surface; such a design enables the squeegee attachment 122 to have a better adhesion to the adhesive 112 during the degreasing process. Furthermore, the distance between the two adjacent protrusions 124 is designed to be 5-15 mm, so that the applicator attachment 122 can be easily cleaned; in particular, the user can easily take a solvent with a dust-free cloth. Wipe and clean the damp attachment 122.

In addition, it is worth mentioning that the degreasing device 12 of the preferred embodiment can also be provided with an auxiliary member on the dip attachment 122 as shown in FIG. 2 to enhance the degreasing effect. Referring to FIG. 6, the auxiliary member is, for example, a film 125 having a thickness of 0.2 mm; after testing, the applicator attachment 122 having the film 125 is provided with a damp attachment 122 having a plurality of bumps 124 as shown in FIG. A similar degreasing effect.

In summary, the method and system for removing colloids of the present invention rotates the applicator attachment 122 at a moderate speed during the de-glue process, and the adhesive 112 on the surface 111 of the damp attachment 122 and the workpiece 11. When contacting, the relative position of the adhesive attachment 122 to the surface 111 is moderately controlled, so that the adhesive 112 is subjected to the pulling force away from the surface 111 to cause the adhesive 112 to be attached to the adhesive attachment 122. Further, the adhesive 112 is efficiently wound away from the surface 111, and damage to the workpiece 11 is effectively prevented. In addition, the embodiment of the dip attachment 122 enables the dip attachment 122 to be easily wiped and cleaned, and the dip attachment 122 can be easily combined with an auxiliary member to enhance the degreasing effect, so that the object of the present invention can be achieved. .

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

1‧‧‧Degumming system

11‧‧‧Works

111‧‧‧ surface

112‧‧‧Viscos

12‧‧‧Glue removal device

121‧‧‧ device body

122‧‧‧Stained accessories

123‧‧‧ axis

124‧‧‧ convex

991‧‧‧Distance of attachment

997‧‧‧An angle between the axis and the surface of the work object

Claims (19)

A method for removing a colloid, comprising: (a) controlling a dipping attachment pivotally attached to a body of the device to rotate about an axis thereof; and (b) attaching a workpiece having a glue on a surface thereof to the opposite side The adhesive attachment moves to contact the adhesive, and the adhesive is attached to the adhesive attachment by a pulling force applied from the adhesive attachment in a direction away from the surface of the workpiece; and (c And moving the work object relative to the adhesive attachment in the adhesive adhesion range, so that the adhesive is wound away from the work by the adhesive attachment to obtain a clean finished product. The method for removing a colloid according to claim 1, wherein in the step (b) and the step (c), when the adhesive attachment contacts the adhesive, the angle between the axis and the surface of the workpiece is 0- 20 degrees. The method for removing a colloid according to claim 2, wherein in the step (b) and the step (c), when the adhesive attachment contacts the adhesive, the distance between the adhesive attachment and the surface of the workpiece is 0. -10 mm. The method of removing colloids according to claim 3, wherein the speed of the applicator attachment is 200-2000 revolutions per minute. The method for removing colloids according to claim 4, wherein the applicator attachment is one of a straight rod shape, a cone shape, a spherical shape, and a curved shape such as a undulating shape. The method of removing colloids according to claim 5, wherein the dip attachment has a radius of rotation of 2.5 to 5 mm. The method of removing colloids according to claim 6, wherein the applicator comprises a plurality of bumps formed on the surface, and each of the bumps forms an angle of 30-45 degrees with the surface. The method of removing colloids according to claim 6, wherein in the step (b) and the step (c), the relative moving speed of the workpiece and the damp attachment is controlled at "the radius of rotation of the applicator attachment x" The speed of the attachment is ×0.10467 (mm/sec). The method of removing colloid according to claim 1, wherein in the step (b) and the step (c), the stress generated on the surface of the workpiece when the adhesive attachment contacts the adhesive is controlled at -1 -0 (kg/cm2). A colloid removal system comprising: a work object comprising a surface and a glue adhered to the surface; a degreasing device comprising a device body, and a pivotally connected to the device body and controllably a dip attachment rotating about an axis thereof; and a control interface for controlling the rotation of the dip attachment and the movement of the workpiece relative to the dip attachment to allow the dip attachment in rotation to contact the adhesive and The adhesive is attached to the adhesive attachment by a pulling force away from the surface of the workpiece, thereby causing the adhesive to be wound away from the surface. The gel removal system of claim 10, wherein the axis is at an angle of 0-20 degrees to the surface of the workpiece when the applicator contacts the glue. The colloid removal system of claim 11, wherein when the adhesion is When the piece contacts the glue, the distance between the applicator and the surface of the workpiece is 0-10 mm. The gel removal system of claim 12, wherein the applicator attachment has a rotational speed of 200-2000 revolutions per minute. The colloid removal system of claim 13, wherein the applicator attachment is one of a straight rod shape, a cone shape, a spherical shape, and a curved shape such as a undulating shape. The colloid removal system of claim 14, wherein the dip attachment has a radius of rotation of 2.5-5 mm. The colloid removal system of claim 15, wherein the applicator comprises a plurality of bumps formed on the surface, and the angle of each of the bumps to the surface is 30-45 degrees. The colloid removal system of claim 16, wherein each of the lobes has a length of 5-15 mm. The colloid removal system of claim 15, wherein the workpiece is moved to contact the adhesive relative to the adhesive attachment, and the moving speed is controlled at "the radius of rotation of the adhesive attachment x the rotational speed of the adhesive attachment". ×0.10467 (mm/sec)". The colloid removal system of claim 10, wherein the stress generated on the surface of the workpiece is controlled at -1-0 (kg/cm 2 ) when the adhesive attachment contacts the adhesive.