KR20000036376A - Method for manufature of printed circuit board - Google Patents

Method for manufature of printed circuit board Download PDF

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Publication number
KR20000036376A
KR20000036376A KR1020000010113A KR20000010113A KR20000036376A KR 20000036376 A KR20000036376 A KR 20000036376A KR 1020000010113 A KR1020000010113 A KR 1020000010113A KR 20000010113 A KR20000010113 A KR 20000010113A KR 20000036376 A KR20000036376 A KR 20000036376A
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South Korea
Prior art keywords
pattern
printed circuit
circuit board
substrate
printing
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KR1020000010113A
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Korean (ko)
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KR100331250B1 (en
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안종열
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안종열
중앙전자통신 주식회사
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Priority to KR1020000010113A priority Critical patent/KR100331250B1/en
Publication of KR20000036376A publication Critical patent/KR20000036376A/en
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Publication of KR100331250B1 publication Critical patent/KR100331250B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: A method for manufacturing a printed circuit board capable of improving an internal voltage of a pattern part of the printed circuit by preventing the pattern part of the printed circuit from exposing to an outside is provided. CONSTITUTION: In a method for manufacturing a printed circuit board, a thermosetting resin is cut by a predetermined size. Front and rear surfaces of a printed circuit board are washed by a predetermined pressure and is oxidized by a sulfuric acid, an ammonia, or a hydrochloride acid to remove an impurity included in the printed circuit board. A pattern is printed on a substrate surface in which a copper thin portion is formed. A pattern ink is coated on a pattern part and an etching operation is performed with respect thereto, and a remaining copper thin portion other than a pattern on a pattern ink is coated is eroded. A solder printing is performed with respect to a part other than a pattern in which a copper thin portion is eroded. A marking ink is printed on an upper surface of a pattern part of the printed circuit board in which a solder printing is performed. A character mark printing with respect to other side of the printed circuit board in which a copper thin portion is not formed is performed. An outline of the printed circuit board is cut and an inner hole thereof is perforated by means of a press.

Description

인쇄회로기판의 제조 방법{Method for manufature of printed circuit board}Method for manufacturing printed circuit board {Method for manufature of printed circuit board}

본 발명은 인쇄회로기판의 제조방법에 관한 것으로, 보다 상세하게는 패턴이 형성된 부분에 마킹 인쇄를 실시하여 패턴간의 내전압을 향상시킴과 아울러 습기발생으로 인한 쇼트를 방지하도록 한 인쇄회로기판의 제조 방법에 관한 것이다.The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method of manufacturing a printed circuit board to improve the breakdown voltage between patterns by performing marking printing on a portion where a pattern is formed and to prevent short circuit due to moisture generation. It is about.

일반적으로 인쇄회로기판(Printed-Circuit Board; 이하 PCB라 칭함)은 각종 열경화성 합성수지로 이루어진 보드의 일면 또는 양면에 동선으로 배선하고, 보드 상에 집적회로 또는 전자부품들을 배치하여 이들간의 전기적 배선을 구현하여 절연체로 코팅한다.In general, a printed-circuit board (hereinafter referred to as a PCB) is wired on one side or both sides of a board made of various thermosetting synthetic resins, and integrated circuits or electronic components are placed on the board to realize electrical wiring therebetween. Coated with an insulator.

종래 인쇄회로기판의 제조공정을 도 1을 참조하여 설명하면, 먼저 CEM, 에폭시, 폴리이미드 등의 합성수지를 일정크기로 재단하고, 소정의 압력으로 수세를 함과 동시에 황산, 암모니아, 염산 등으로 산처리를 한다. 재단된 기판의 일측면에 도전성을 주기 위해 무전해 동도금처리 하며, 다시 브러쉬 등으로 기판의 일측면을 크리닝하여 이물질을 제거한다.Referring to FIG. 1, a process for manufacturing a conventional printed circuit board is first described. First, a synthetic resin such as CEM, epoxy, polyimide, etc. is cut to a certain size, washed with a predetermined pressure, and acidic with sulfuric acid, ammonia, hydrochloric acid, and the like. Do the processing. Electroless copper plating is applied to give one side of the cut substrate a conductive surface, and one side of the substrate is cleaned with a brush to remove foreign substances.

이물질이 제거된 기판면의 정면에 패턴을 인쇄하며, 패턴 잉크를 도포한 후, 에칭을 실시하여 패턴 잉크가 도포된 패턴부분만 남기고 나머지 동박부분은 부식시킨다. 이후 기판의 일측면에서 발생된 이물질을 다시 브러쉬를 사용하여 제거한다.The pattern is printed on the front of the substrate surface from which the foreign matter is removed, and after the pattern ink is applied, etching is performed to leave only the pattern portion to which the pattern ink is applied, and to corrode the remaining copper foil portion. After that, the foreign substances generated on one side of the substrate are removed again using a brush.

동박이 형성되지 않은 기판의 타측면은 문자의 마킹 인쇄를 실시하며, 자외선 방출기를 통과시켜 잉크를 경화시킨다.The other side of the substrate on which the copper foil is not formed performs marking printing of letters, and passes through an ultraviolet emitter to cure the ink.

문자의 인쇄 공정이 완료된 후에는 프레스를 하기 위한 기준점을 잡고, 프레스를 사용하여 기판의 외곽 절단 및 내부의 홀을 천공하며, 동박면의 이물질 유입 및 산화를 방지하기 위한 프락스를 도포한다.After the printing process of the letter is completed, the reference point for the press is set, the press is used to cut the outer periphery of the substrate and the holes in the inside, and the proxy is applied to prevent foreign matter from entering and oxidizing the copper foil surface.

이후 검사과정을 거쳐 제품을 출하한다.After the inspection process, the product is shipped.

이와 같이 실시되는 제조 공정에 의한 종래 인쇄회로기판은 통상적으로 패턴들이 인접된 상태로 인쇄되어 있기 때문에 검사 공정중 내전압 검사시 빈번하게 쇼트가 발생되는 문제점이 있다.In the conventional printed circuit board by the manufacturing process performed as described above, since the patterns are usually printed in an adjoining state, a short occurs frequently during the withstand voltage inspection during the inspection process.

또한, 패턴이 외부에 노출된 상태이기 때문에 작업 조건 및 환경에 따른 습기로 인하여 쇼트가 발생되는 문제가 있다.In addition, since the pattern is exposed to the outside, there is a problem that a short is generated due to moisture according to the working conditions and the environment.

이와 같은 문제점을 감안하여 안출한 본 발명의 목적은 인쇄회로기판의 패턴 부분의 내전압을 향상시킬 수 있는 인쇄회로기판의 제조 방법을 제공함에 있다.SUMMARY OF THE INVENTION An object of the present invention devised in view of such a problem is to provide a method of manufacturing a printed circuit board which can improve the withstand voltage of the pattern portion of the printed circuit board.

본 발명의 다른 목적은 인쇄회로기판의 패턴 부분이 외부로 노출되지 않도록 함으로써 습기로 인한 쇼트 발생을 방지하도록 한 인쇄회로기판의 제조 방법을 제공함에 있다.Another object of the present invention is to provide a method of manufacturing a printed circuit board to prevent a short circuit caused by moisture by preventing the pattern portion of the printed circuit board from being exposed to the outside.

본 발명의 또 다른 목적은 인쇄회로기판의 패턴을 외부에서 용이하게 식별가능하도록 함으로써 검사를 실시하기에 적합하도록 한 인쇄회로기판의 제조 방법을 제공함에 있다.Still another object of the present invention is to provide a method of manufacturing a printed circuit board, which is suitable for conducting inspection by making the pattern of the printed circuit board easily distinguishable from the outside.

도 1은 종래 기술에 의한 인쇄회로기판의 제조 공정도.1 is a manufacturing process diagram of a printed circuit board according to the prior art.

도 2는 본 발명에 의한 인쇄회로기판의 제조 공정도.2 is a manufacturing process diagram of a printed circuit board according to the present invention.

도 3은 본 발명에 의하여 패턴에 마킹 인쇄가 된 상태를 보인 기판의 평면도.Figure 3 is a plan view of the substrate showing a state that the marking printing on the pattern by the present invention.

상기한 바와 같은 본 발명의 목적을 달성하기 위한 인쇄회로기판의 제조 방법은 열경화성수지를 일정크기로 재단하는 단계(S1); 소정의 압력으로 기판의 전후면을 수세를 함과 동시에 황산, 암모니아, 염산 등으로 산처리를 하여 이물질을 제거하는 단계(S2); 동박이 형성된 기판면에 패턴을 인쇄하는 단계(S3); 패턴부위에 패턴 잉크를 도포한 후에 에칭을 실시하여 패턴 잉크가 도포된 패턴부분만 남기고 나머지 동박부분은 부식시키는 단계(S4); 동박면이 부식된 패턴 이외의 부분에 솔더 인쇄를 실시하는 단계(S5); 솔더 인쇄가 실시된 기판의 패턴부분의 상면에 마킹 잉크로 인쇄를 실시하는 단계(S6); 동박이 형성되지 않은 기판의 타측면에 문자의 마킹 인쇄를 실시하는 단계(S7); 프레스를 사용하여 기판의 외곽 절단 및 내부의 홀을 천공하는 단계(S8); 동박면의 이물질 유입 및 산화를 방지하기 위한 프락스를 도포하는 단계(S9)를 포함하는 것을 특징으로 한다.The method of manufacturing a printed circuit board for achieving the object of the present invention as described above comprises the steps of cutting the thermosetting resin to a predetermined size (S1); Washing the front and rear surfaces of the substrate at a predetermined pressure and simultaneously removing the foreign substances by acid treatment with sulfuric acid, ammonia, hydrochloric acid, etc. (S2); Printing a pattern on a substrate surface on which copper foil is formed (S3); Etching after applying the pattern ink to the pattern portion, leaving only the pattern portion to which the pattern ink is applied and leaving the remaining copper foil portion to corrode (S4); Performing solder printing on portions other than the pattern having the copper foil surface corroded (S5); Performing printing with marking ink on the upper surface of the pattern portion of the substrate on which the solder printing is performed (S6); Performing marking printing on the other side of the substrate on which the copper foil is not formed (S7); Cutting the outer periphery of the substrate and using the press to drill holes (S8); It characterized in that it comprises a step (S9) of applying a proxy for preventing the inflow and oxidation of foreign matter on the copper foil surface.

상기 마킹 인쇄 공정 후에는 자외선 방출기를 통과시켜 마킹 잉크를 경화시키는 단계를 실시하는 것이 바람직하다.After the marking printing process, it is preferable to carry out the step of passing the ultraviolet emitter to cure the marking ink.

이하, 상기한 바와 같은 본 발명에 의한 실시예를 첨부도면에 의거하여 보다 상세하게 설명한다.Hereinafter, embodiments of the present invention as described above will be described in more detail with reference to the accompanying drawings.

첨부도면 도 2는 본 발명에 의한 인쇄회로기판의 제조 공정도이고, 도 3은 본 발명에 의하여 패턴에 마킹 인쇄가 된 상태를 보인 기판의 평면도이다.2 is a manufacturing process diagram of a printed circuit board according to the present invention, and FIG. 3 is a plan view of a substrate showing a state in which marking printing is performed on a pattern according to the present invention.

먼저 CEM, 에폭시, 폴리이미드 등의 합성수지를 일정크기로 재단한다(S1).First, the synthetic resin such as CEM, epoxy, polyimide, etc. are cut to a certain size (S1).

이후 소정의 압력으로 기판의 전후면을 수세를 함과 동시에 황산, 암모니아, 염산 등으로 산처리를 한다(S2).After washing the front and rear surfaces of the substrate at a predetermined pressure and acid treatment with sulfuric acid, ammonia, hydrochloric acid (S2).

다음에는 재단된 기판의 일측면에 도전성을 주기 위해 무전해 동도금처리를 실시하며, 다시 브러쉬 등으로 기판의 일측면을 크리닝하여 이물질을 제거한 후에 이물질이 제거된 기판면의 정면에 패턴을 인쇄한다(S3).Next, electroless copper plating is performed to give conductivity to one side of the cut substrate, and one side of the substrate is cleaned again with a brush or the like to remove foreign substances, and then a pattern is printed on the front of the substrate surface from which the foreign substances have been removed. S3).

패턴이 인쇄된 부분에 패턴 잉크를 도포한 후에 에칭을 실시하여 패턴 잉크가 도포된 패턴부분만 남기고 나머지 동박부분은 부식시키는 에칭 공정을 실시한다(S4).After the pattern ink is applied to the portion where the pattern is printed, etching is performed to carry out an etching process in which only the pattern portion to which the pattern ink is applied is left, and the remaining copper foil portion is corroded (S4).

그리고 동박면이 부식된 패턴의 이외의 부분은 솔더 인쇄를 실시한다(S5).And parts other than the pattern in which the copper foil surface was corroded are solder-printed (S5).

솔더 인쇄가 실시된 기판의 일측면에서 남아 있는 패턴부분은 패턴 마킹 인쇄를 실시한다. 이때, 마킹 인쇄후에는 자외선 방출기를 통과시켜 마킹 인쇄부분을 경화시킨다(S6)The pattern portion remaining on one side of the substrate subjected to solder printing is subjected to pattern marking printing. At this time, after marking printing to pass through the ultraviolet emitter to cure the marking printing portion (S6)

또한, 동박이 형성되지 않은 기판의 타측면은 문자의 마킹 인쇄를 실시하며, 자외선 방출기를 통과시켜 잉크를 경화시킨다(S7).In addition, the other side of the substrate on which the copper foil is not formed performs marking printing of letters, and passes through an ultraviolet emitter to cure the ink (S7).

문자의 마킹 인쇄 공정이 완료된 후에는 프레스를 하기 위한 기준점을 잡고, 프레스를 사용하여 기판의 외곽 절단 및 내부의 홀을 천공하며(S8), 동박면의 이물질 유입 및 산화를 방지하기 위한 프락스를 도포한다(S9).After the marking process of the character is completed, the reference point for the press is set, and the press is used to cut the outer periphery of the substrate and to drill holes in the inside (S8), and to prevent the inflow and oxidation of foreign matter on the copper foil surface. Apply (S9).

상기의 공정이 완료된 기판은 검사과정을 거친 후에, 제품으로서 출하된다.After the above process is completed, the substrate is inspected and then shipped as a product.

이와 같이 본 발명에 의한 인쇄회로기판의 제조 방법에서는 패턴이 인쇄된 기판면의 패턴 부분을 마킹 인쇄를 실시하는 공정을 추가하는 바, 이때 인쇄시 사용되는 잉크는 인쇄회로기판용 자외선 경화용 문자잉크로서, 본 발명의 실시예에서 사용된 잉크의 구성은 아래의 표1과 같다.As described above, in the method of manufacturing a printed circuit board according to the present invention, a process of marking and printing a pattern portion of a substrate surface on which a pattern is printed is added. In this case, the ink used for printing is a character ink for ultraviolet curing for a printed circuit board As a configuration of the ink used in the embodiment of the present invention is shown in Table 1 below.

구성성분의 명칭 및 함유량Composition / information on ingredients 함유(%)contain(%) 에폭시 알킬레이트 레진Epoxy alkylate resins 30.030.0 아킬릭 엣터 모노머Achilles Etter Monomer 26.026.0 포토 프로모터Photo promoter 3.03.0 티탄늄 디옥사이드Titanium dioxide 15.015.0 필터filter 26.026.0 계system 100.0100.0

이처럼 본 발명에 의하여 제조된 인쇄회로기판은 도 3에 도시한 바와 같이, 기판(1)의 일측면에 패턴부위가 마킹 잉크(2)에 의하여 코팅된 상태이기 때문에 인접된 패턴간의 내전압이 향상됨은 물론 패턴이 외부로 노출되지 않게 된다.As shown in FIG. 3, the printed circuit board manufactured according to the present invention improves the breakdown voltage between adjacent patterns because the pattern portion is coated on the one side of the substrate 1 by the marking ink 2. Of course, the pattern is not exposed to the outside.

또한, 소정의 색깔(본 발명 실시예에서는 백색)을 갖는 잉크이기 때문에 외부에서 관찰하기가 용이하다.In addition, since the ink has a predetermined color (white in the embodiment of the present invention), it is easy to observe from the outside.

이상에서 설명한 바와 같이, 본 발명에 의한 인쇄회로기판의 제조 방법은 패턴으로 형성된 동박면에 마킹 잉크로 패턴 마킹 인쇄를 실시함으로써 패턴간의 내전압이 향상되어 내전압 검사시 우수한 성능을 발휘하는 효과가 있다.As described above, the method of manufacturing a printed circuit board according to the present invention has an effect of exhibiting excellent performance during the withstand voltage test by improving the withstand voltage between patterns by performing pattern marking printing with marking ink on the copper foil surface formed with the pattern.

또한, 패턴 동박면이 외부로 노출되지 않게 됨으로써 주위 환경에 따른 습기 발생을 방지하여 습기로 인한 쇼트 발생을 방지하는 효과가 있다.In addition, the pattern copper foil surface is not exposed to the outside, thereby preventing the generation of moisture according to the surrounding environment, thereby preventing short generation due to moisture.

아울러 패턴부분이 마킹 잉크로 인쇄된 상태이기 때문에 외부에서 용이하게 패턴 부위를 관찰할 수 있어 검사 공정이 용이하게 실시하는 이점이 있는 유용한 발명인 것이다.In addition, since the pattern portion is printed with marking ink, the pattern portion can be easily observed from the outside, which is a useful invention having the advantage of easily performing the inspection process.

본 발명은 통상적인 인쇄회로기판의 제조 방법을 근거로 한 실시예를 일례로 하여 설명하였으나 이에 한정하는 것이 아니라 본 발명 청구범위에 기재된 기술 사상의 범위 내에서 얼마든지 변형하여 실시가능함은 물론이다.Although the present invention has been described by way of example only on the basis of a conventional method for manufacturing a printed circuit board, the present invention is not limited thereto, and may be modified and practiced within the scope of the technical idea of the present invention.

Claims (2)

열경화성수지를 일정크기로 재단하는 단계(S1);Cutting the thermosetting resin into a predetermined size (S1); 소정의 압력으로 기판의 전후면을 수세를 함과 동시에 황산, 암모니아, 염산 등으로 산처리를 하여 이물질을 제거하는 단계(S2);Washing the front and rear surfaces of the substrate at a predetermined pressure and simultaneously removing the foreign substances by acid treatment with sulfuric acid, ammonia, hydrochloric acid, etc. (S2); 동박이 형성된 기판면에 패턴을 인쇄하는 단계(S3);Printing a pattern on a substrate surface on which copper foil is formed (S3); 패턴부위에 패턴 잉크를 도포한 후에 에칭을 실시하여 패턴 잉크가 도포된 패턴부분만 남기고 나머지 동박부분은 부식시키는 단계(S4);Etching after applying the pattern ink to the pattern portion, leaving only the pattern portion to which the pattern ink is applied and leaving the remaining copper foil portion to corrode (S4); 동박면이 부식된 패턴 이외의 부분에 솔더 인쇄를 실시하는 단계(S5);Performing solder printing on portions other than the pattern having the copper foil surface corroded (S5); 솔더 인쇄가 실시된 기판의 패턴부분의 상면에 마킹 잉크로 인쇄를 실시하는 단계(S6);Performing printing with marking ink on the upper surface of the pattern portion of the substrate on which the solder printing is performed (S6); 동박이 형성되지 않은 기판의 타측면에 문자의 마킹 인쇄를 실시하는 단계(S7);Performing marking printing on the other side of the substrate on which the copper foil is not formed (S7); 프레스를 사용하여 기판의 외곽 절단 및 내부의 홀을 천공하는 단계(S8);Cutting the outer periphery of the substrate and using the press to drill holes (S8); 동박면의 이물질 유입 및 산화를 방지하기 위한 프락스를 도포하는 단계(S9)를 포함하는 인쇄회로기판의 제조 방법.Method of manufacturing a printed circuit board comprising the step (S9) of applying a proxy for preventing the inflow and oxidation of foreign matter on the copper foil surface. 제 1 항에 있어서,The method of claim 1, 상기 마킹 인쇄 공정 후에는 자외선 방출기를 통과시켜 마킹 잉크를 경화시키는 단계를 실시하는 것을 특징으로 하는 인쇄회로기판의 제조 방법.And after the marking printing process, curing the marking ink by passing an ultraviolet emitter.
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR100693481B1 (en) * 2006-02-14 2007-03-12 (주)인터플렉스 Manufacturing method of printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693481B1 (en) * 2006-02-14 2007-03-12 (주)인터플렉스 Manufacturing method of printed circuit board

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