KR19990000667A - Method of manufacturing printed circuit board and printed circuit board manufactured accordingly - Google Patents
Method of manufacturing printed circuit board and printed circuit board manufactured accordingly Download PDFInfo
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- KR19990000667A KR19990000667A KR1019970023694A KR19970023694A KR19990000667A KR 19990000667 A KR19990000667 A KR 19990000667A KR 1019970023694 A KR1019970023694 A KR 1019970023694A KR 19970023694 A KR19970023694 A KR 19970023694A KR 19990000667 A KR19990000667 A KR 19990000667A
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Abstract
본 발명은 인쇄회로기판의 제조방법 및 이에 따라 제조되는 인쇄회로기판에 관한 것이다.The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board manufactured accordingly.
본 발명은 회로기판 상에 부품을 실장시키는 리드선이 삽입되는 기능성리드홀과 비기능성리드홀을 포함하는 리드홀들을 형성시키는 인쇄회로기판의 제조방법에 있어서, 상기 모든 리드홀들이 형성되는 영역의 입구에 동박랜드를 형성시키는 동박랜드형성단계 및 상기 동박랜드형성단계의 수행으로 동박랜드를 형성시킨 후, 상기 모든 리드홀을 펀칭하는 펀칭단계를 구비하여 이루어짐을 특징으로 하고, 본 발명에 따른 인쇄회로기판은, 회로기판 상에 부품을 실장시키는 리드선이 삽입되는 리드홀들이 구비되는 인쇄회로기판에 있어서, 상기 리드홀들의 입구에는 동박랜드가 형성됨을 특징으로 한다.The present invention provides a method of manufacturing a printed circuit board for forming lead holes including a functional lead hole and a non-functional lead hole into which a lead wire for mounting a component is inserted on a circuit board, the inlet of the region where all the lead holes are formed. And a punching step of punching all the lead holes after forming the copper foil land by performing the copper foil land forming step of forming the copper foil land in the copper foil land forming step, and the printed circuit according to the present invention. The substrate is a printed circuit board having lead holes into which lead wires for mounting components are mounted on a circuit board, wherein the copper foil lands are formed at the entrances of the lead holes.
따라서, 리드홀을 펀칭시키는 펀칭공정시 발생되는 불량을 재거함으로 인하여 공정효율이 상승되고, 또한 제품의 수율 및 신뢰도가 향상되는 효과가 있다.Therefore, the process efficiency is increased by removing the defects generated during the punching process of punching the lead hole, and the yield and reliability of the product are improved.
Description
본 발명은 인쇄회로기판의 제조방법 및 이에 따라 제조되는 인쇄회로기판에 관한 것으로서, 보다 상세하게는 기능성리드홀 뿐만 아니라 비기능성리드홀을 포함한 회로기판 상의 모든 리드홀(Lead Hole)의 입구에 동박랜드를 형성시킨 인쇄회로기판의 제조방법 및 이에 따라 제조되는 인쇄회로기판에 관한 것이다.The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board manufactured according to the present invention. More specifically, the present invention relates to a copper foil at an inlet of all lead holes on a circuit board including a functional lead hole as well as a non-functional lead hole. The present invention relates to a method of manufacturing a printed circuit board having lands formed thereon, and a printed circuit board manufactured according to the method.
일반적으로, 인쇄회로기판(Printed Circuit Board)은 동판이 적층된 페이퍼-페놀 수지(Paper Phenol Resin) 또는 글래스-에폭시 수지(Glass Epoxy Resin) 등과 같은 절연 재질의 기판을 패턴(Pattern) 인쇄 및 식각(Etching) 등의 공정을 수행하여 배선을 위한 동박을 도형으로 완성시킨 것이다.In general, a printed circuit board is a pattern printed and etched on an insulating substrate such as paper-phenol resin (Paper Phenol Resin) or glass-Epoxy Resin (copper laminated) Etching) and the like to complete the copper foil for wiring to a figure.
최근 인쇄회로기판은 전자기술의 발달로 반도체장치 등과 같은 고집적도의 부품을 삽입시키기 위하여 가공, 형성시키는 리드홀들이 간격이 점차 미세화되어가고 있다.Recently, with the development of electronic technology, the spacing of lead holes to be processed and formed in order to insert high-integration components such as semiconductor devices is becoming smaller.
도1은 종래의 인쇄회로기판의 제조방법에 따라 제조된 인쇄회로기판을 나타내는 평면도이다.1 is a plan view illustrating a printed circuit board manufactured according to a conventional method for manufacturing a printed circuit board.
먼저, 회로기판(1) 상에 부품을 실장시키는 리드선(Lead Wire)이 삽입되는 리드홀(10)이 가공, 형성되어 있는 상태이고, 이러한 상기 리드홀(10)중에서 패턴(Pattern)(12)과 전기의 인가가 이루어지는 리드선이 삽입되는 기능성리드홀(13)에는 동박랜드(14)가 형성되어 있고, 패턴과 전기의 인가가 이루어지지않는 리드선이 삽입되는 비기능성리드홀(15)에는 동박랜드(14)가 형성되어 있지 않은 상태이다.First, a lead hole 10 into which a lead wire for mounting a component is inserted is formed and formed on the circuit board 1, and a pattern 12 of the lead hole 10 is formed. Copper foil lands 14 are formed in the functional lead holes 13 into which lead wires are applied to which electrical power is applied, and copper foil lands are inserted into the non-functional lead holes 15 into which lead wires are not applied to the pattern and electricity. (14) is not formed.
여기서 상기 리드홀(10)은 프레스(Press)로 가공한 프레스홀 및 씨엔씨(CNC)로 가공한 씨엔씨홀 등을 포함한다.In this case, the lead hole 10 includes a press hole processed by a press, and a CNC hole processed by CNCC.
이러한 구성으로 이루어지는 종래의 상기 리드홀(10)의 형성은 먼저, 회로기판 상에 리드홀(10)이 가공, 형성되는 영역을 포함하여 패턴인쇄를 수행한다.In the conventional formation of the lead hole 10 having such a configuration, first, pattern printing is performed including a region in which the lead hole 10 is processed and formed on a circuit board.
여기서 상기 패턴인쇄시 상기 기능성리드홀(13)의 입구 영역에는 패턴(12)과 연결되는 동박랜드(14)를 형성시키고, 상기 비기능성리드홀(15)의 영역에는 상기 동박랜드(14)가 형성되지 않도록 한다.Here, when printing the pattern, the copper foil land 14 connected to the pattern 12 is formed in the inlet region of the functional lead hole 13, and the copper foil land 14 is formed in the region of the non-functional lead hole 15. Do not form.
그리고 프레스(Press)를 이용한 펀칭(Punching)공정을 수행하여 상기 리드홀(10)을 형성시킨다.The lead hole 10 is formed by performing a punching process using a press.
여기서 상기 펀칭공정은 프레스를 이용하여 수행하는 것으로서, 상기 펀칭공정수행시 프레스의 전단응력으로 인하여 비기능성리드홀의 영역에서는 회로기판에 균열이 발생하였다.Here, the punching process is performed by using a press. In the punching process, a crack occurs in the circuit board in the region of the non-functional lead hole due to the shear stress of the press.
즉, 상기 전단응력이 회로기판(1) 상에 그대로 전달되기 때문에 균열이 발생하였다.That is, since the shear stress is transmitted as it is on the circuit board 1, cracking occurs.
이러한 균열은 리드홀(10)들의 간격이 미세화되어가는 최근의 인쇄회로기판의 제조에서는 치명적인 결함이었다.This crack was a fatal defect in the manufacture of a printed circuit board in which the spacing of the lead holes 10 becomes smaller.
따라서 종래의 리드홀의 형성을 위한 펀칭공정시 회로기판 상의 균열의 발생으로 인한 불량으로 제품의 수율 및 신뢰도가 저하되고, 또한 재작업을 수행함으로 인하여 공정효율이 저하되는 문제점이 있었다.Therefore, there is a problem that the yield and reliability of the product is lowered due to a defect caused by cracking on the circuit board during the punching process for forming the lead hole, and the process efficiency is lowered by reworking.
본 발명의 목적은, 리드홀을 형성시키는 펀칭공정시 회로기판 상의 균열을 제거하여 공정효율을 향상시키고, 또한 제품의 수율 및 신뢰도를 향상시키기 위한 인쇄회로기판의 제조방법 및 이에 따라 제조되는 인쇄회로기판을 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention is to remove a crack on a circuit board during a punching process for forming lead holes, to improve process efficiency, and to improve a yield and reliability of a product. To provide a substrate.
도1은 종래의 인쇄회로기판의 제조방법에 따라 제조된 인쇄회로기판을 나타내는 평면도이다.1 is a plan view illustrating a printed circuit board manufactured according to a conventional method for manufacturing a printed circuit board.
도2는 본 발명에 따른 인쇄회로기판의 제조방법에 따라 제조된 인쇄회로기판의 일 실시예를 나타내는 평면도이다.2 is a plan view showing an embodiment of a printed circuit board manufactured according to the method of manufacturing a printed circuit board according to the present invention.
※도면의 주요부분에 대한 부호의 설명※ Explanation of symbols for main parts of drawing
1, 2 : 회로기판 10, 20 : 리드홀1, 2: circuit board 10, 20: lead hole
12, 22 : 패턴 13, 23 : 기능성리드홀12, 22: pattern 13, 23: functional lead hole
14, 24 : 동박랜드 15, 25 : 비기능성리드홀14, 24: Dongbakland 15, 25: Non-functional lead hole
상기 목적을 달성하기 위한 본 발명에 따른 인쇄회로기판의 제조방법은, 회로기판 상에 부품을 실장시키는 리드선이 삽입되는 기능성리드홀과 비기능성리드홀을 포함하는 모든 리드홀들을 형성시키는 인쇄회로기판의 제조방법에 있어서, 상기 모든 리드홀들이 형성되는 영역의 입구에 동박랜드를 형성시키는 동박랜드형성단계 및 상기 동박랜드형성단계의 수행으로 동박랜드를 형성시킨 후, 상기 모든 리드홀을 펀칭하는 펀칭단계를 구비하여 이루어짐을 특징으로 한다.A printed circuit board manufacturing method according to the present invention for achieving the above object, a printed circuit board for forming all lead holes including a functional lead hole and a non-functional lead hole is inserted into the lead wire for mounting the component on the circuit board In the manufacturing method of the copper foil land forming step of forming the copper foil land at the inlet of the region where all the lead holes are formed and the copper foil land forming step by performing the copper foil land forming step, punching all the lead holes punched Characterized in that it comprises a step.
본 발명에 따른 인쇄회로기판은, 회로기판 상에 부품을 실장시키는 리드선이 삽입되는 기능성리드홀과 비기능성리드홀을 포함하는 모든 리드홀들이 구비되는 인쇄회로기판에 있어서, 상기 모든 리드홀들의 입구에는 동박랜드가 형성됨을 특징으로 한다.The printed circuit board according to the present invention is a printed circuit board having all lead holes including a functional lead hole and a non-functional lead hole into which a lead wire for mounting a component is inserted on a circuit board, wherein the entrances of all the lead holes are provided. It is characterized in that the copper foil land is formed.
이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 인쇄회로기판의 제조방법에 따라 제조된 인쇄회로기판의 일 실시예를 나타내는 평면도이다.2 is a plan view showing an embodiment of a printed circuit board manufactured according to the method of manufacturing a printed circuit board according to the present invention.
먼저, 회로기판(2) 상에 부품을 실장시키는 리드선이 삽입되는 리드홀(20)이 가공, 형성되어 있는 상태이다.First, the lead hole 20 into which the lead wire which mounts a component is inserted on the circuit board 2 is processed and formed.
본 발명은 패턴(22)과 전기의 인가가 이루어지는 리드선이 삽입되는 기능성리드홀(23) 뿐만 아니라 패턴(22)과 전기의 인가가 이루어지지않는 리드선이 삽입되는 비기능성리드홀(25)을 포함하는 모든 리드홀(20)의 입구 영역에 동박랜드(24)를 형성시킨다.The present invention includes a functional lead hole 23 into which a pattern 22 and a lead wire to which electricity is applied are inserted, as well as a non-functional lead hole 25 into which the pattern 22 and a lead wire to which electricity is not applied are inserted. The copper foil land 24 is formed in the inlet region of all the lead holes 20.
이러한 구성으로 이루어지는 본 발명의 삽입홀(20)을 형성시키기 위한 인쇄회로기판의 제조는 먼저, 회로기판(2) 상에 리드홀(20)이 가공, 형성되는 영역을 포함하여 패턴인쇄를 수행한다.In the manufacture of a printed circuit board for forming the insertion hole 20 of the present invention having such a configuration, first, pattern printing is performed including a region where the lead hole 20 is processed and formed on the circuit board 2. .
여기서 본 발명은 상기 패턴인쇄시 상기 리드홀(20), 즉 기능성리드홀(23) 뿐만 아니라 비기능성리드홀(25)을 포함하는 모든 리드홀(20)의 입구에 동박랜드(24)가 형성되도록 인쇄공정을 수행하는 것으로서, 스크린(Screen)의 설계상을 달리하여 상기 패턴인쇄공정을 수행한다.In the present invention, the copper foil land 24 is formed at the entrance of all the lead holes 20 including the non-functional lead holes 25 as well as the lead holes 20, that is, the functional lead holes 23. As the printing process is performed, the pattern printing process is performed by changing the design of the screen.
그리고 솔더레지스트(Solder Resist) 인쇄공정, 마킹(Marking) 인쇄공정 등의 후속공정을 수행하는 것이 일반적이고, 상기 후속공정의 수행 후, 상기 리드홀(20)을 펀칭하는 펀친공정을 수행하는 공정수행의 단계를 본 발명의 당업자라면 충분히 이해할 수 있다.In addition, it is common to perform a subsequent process such as a solder resist printing process or a marking printing process, and a process of performing a punching process of punching the lead hole 20 after performing the subsequent process. The steps of can be fully understood by those skilled in the art.
계속해서 동박랜드(24)가 입구에 형성되어 있는 상기 리드홀(20)들을 펀칭시키기 위하여 프레스를 이용한 펀칭공정을 수행한다.Subsequently, a punching process using a press is performed to punch the lead holes 20 having the copper foil land 24 formed at the inlet.
여기서 상기 펀칭공정은 프레스를 이용함으로 인해 프레스의 전단응력이 회로기판(2) 상에 전달되고, 상기 전단응력은 동박랜드(24)에 의하여 회로기판(2) 상에 전달되는 정도가 감소된다.In the punching process, the shear stress of the press is transmitted to the circuit board 2 by using the press, and the shear stress is reduced to the extent that the shear stress is transmitted to the circuit board 2 by the copper foil land 24.
이에 따라 상기 펀칭공정시 회로기판(2) 상의 리드홀(20) 입구 영역에 형성되는 동박랜드(24)가 전단응력이 그대로 회로기판(2) 상에 전달되는 것을 방지하여 상기 전단응력에 기인하는 회로기판(2) 상의 균열 등을 방지할 수 있다.Accordingly, during the punching process, the copper foil land 24 formed in the inlet region of the lead hole 20 on the circuit board 2 is prevented from transmitting the shear stress to the circuit board 2 as it is, resulting from the shear stress. Cracks or the like on the circuit board 2 can be prevented.
이러한 회로기판(2)의 균열의 방지는 상기 삽입홀(20)들의 간격이 미세화되어가는 최근의 인쇄회로기판의 제조에서 발생되는 불량을 제거할 수 있다.The prevention of the crack of the circuit board 2 can eliminate the defects caused in the recent manufacturing of the printed circuit board, the spacing of the insertion holes 20 is miniaturized.
따라서, 본 발명에 의하면 리드홀을 펀칭시키는 펀칭공정시 발생되는 불량을 제거함으로 인하여 공정효율이 상승되고, 또한 제품의 수율 및 신뢰도가 향상되는 효과가 있다.Therefore, according to the present invention, the process efficiency is increased by removing defects generated during the punching process of punching the lead hole, and the yield and reliability of the product are improved.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970023694A KR19990000667A (en) | 1997-06-09 | 1997-06-09 | Method of manufacturing printed circuit board and printed circuit board manufactured accordingly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970023694A KR19990000667A (en) | 1997-06-09 | 1997-06-09 | Method of manufacturing printed circuit board and printed circuit board manufactured accordingly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990000667A true KR19990000667A (en) | 1999-01-15 |
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ID=65999676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970023694A KR19990000667A (en) | 1997-06-09 | 1997-06-09 | Method of manufacturing printed circuit board and printed circuit board manufactured accordingly |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19990000667A (en) |
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1997
- 1997-06-09 KR KR1019970023694A patent/KR19990000667A/en not_active Application Discontinuation
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