KR20000020257A - Semiconductor wafer transfer apparatus - Google Patents
Semiconductor wafer transfer apparatus Download PDFInfo
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- KR20000020257A KR20000020257A KR1019980038786A KR19980038786A KR20000020257A KR 20000020257 A KR20000020257 A KR 20000020257A KR 1019980038786 A KR1019980038786 A KR 1019980038786A KR 19980038786 A KR19980038786 A KR 19980038786A KR 20000020257 A KR20000020257 A KR 20000020257A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
본 발명은 반도체 웨이퍼 이송장치에 관한 것으로서, 보다 상세하게는, 웨이퍼에 작용하는 외력을 감지하여 웨이퍼 깨짐을 방지하게 하는 반도체 웨이퍼 이송장치에 관한 것이다.The present invention relates to a semiconductor wafer transfer apparatus, and more particularly, to a semiconductor wafer transfer apparatus that detects an external force acting on the wafer to prevent wafer cracking.
일반적으로 반도체공정은 확산, 식각, 화학기상증착, 금속박막, 포토리소그래피 등 여러 가지의 공정들이 반복적으로 수행되어 이루어진다.In general, a semiconductor process is performed by repeatedly performing various processes such as diffusion, etching, chemical vapor deposition, metal thin film, and photolithography.
따라서, 반도체 공정라인에는 웨이퍼에 이러한 여러 가지 공정을 수행하기 위해서 다양한 종류의 설비들이 설치된다.Therefore, various kinds of facilities are installed in the semiconductor processing line to perform these various processes on the wafer.
통상, 상기 다수개의 설비들은 웨이퍼를 공정챔버의 소정의 위치로 이송하기 위한 다양한 형태의 웨이퍼 이송장치들을 구비하고 있다.Typically, the plurality of facilities have various types of wafer transfer devices for transferring the wafer to a predetermined position in the process chamber.
이러한 종래의 반도체 웨이퍼 이송장치들 중에서 카셋트에 적재된 다수개의 웨이퍼를 상기 카셋트로부터 이탈시켜서 소정의 장소로 이동시키는 반도체 웨이퍼 이송장치를 도1에 도시하였다.Among these conventional semiconductor wafer transfer apparatuses, a semiconductor wafer transfer apparatus for moving a plurality of wafers loaded in a cassette from the cassette to a predetermined place is shown in FIG. 1.
도1에 도시된 바와 같이, 종래의 반도체 웨이퍼 이송장치는, 테이블(10)과, 상기 테이블(10)에 형성된 푸셔창(11)을 관통하고, 카셋트(2) 내의 다수개 웨이퍼(1)에 접촉하여 상기 웨이퍼(1)를 안착시키는 푸셔(130)와, 상기 푸셔(130)를 고정하는 가동체(131) 및 상기 가동체(131)를 미리 대기하고 있는 웨이퍼가이드(20)방향으로 상승시키는 승강부를 구비하여 이루어지는 구성이다.As shown in Fig. 1, a conventional semiconductor wafer transfer device passes through a table 10 and a pusher window 11 formed on the table 10, and a plurality of wafers 1 in a cassette 2 are provided. Which pushes the pusher 130 in contact with the wafer 1, the movable body 131 fixing the pusher 130, and the movable body 131 in the direction of the wafer guide 20 waiting in advance. It is a structure provided with a lifting part.
여기서, 상기 웨이퍼가이드(20)는 지지대(21)에 의해 상기 테이블(10) 상부에 위치하고, 서로 대향하는 슬롯이 각각 형성된 좌측 웨이퍼가이드(20a) 및 우측 웨이퍼가이드(20b)로 이루어져서 상기 좌측 및 우측 웨이퍼가이드(20a)(20b)의 서로 대향하는 슬롯 사이에 웨이퍼가 위치된다.Here, the wafer guide 20 is located on the table 10 by the support 21, and consists of a left wafer guide 20a and a right wafer guide 20b each having slots facing each other, and thus the left and right sides. Wafers are positioned between slots of the wafer guides 20a and 20b facing each other.
또한, 상기 푸셔(130)는 다수개의 웨이퍼(1)를 하측에서 밀어 동시에 승강시키는 것으로서 상면에 상기 웨이퍼(1)의 측면 테두리가 삽입되는 다수개의 슬롯이 형성된다.In addition, the pusher 130 pushes the plurality of wafers 1 downward and simultaneously lifts them, and a plurality of slots into which the side edges of the wafer 1 are inserted is formed on the upper surface.
또한, 상기 승강부는 일측단부가 테이블(10) 및 리드스크류프레임(42)에 자유회전이 가능하게 지지되고, 상기 가동체(131)에 나사로 관통되는 리드스크류(40) 및 모터프레임(53)에 고정되고, 상기 리드스크류(40)의 타측단부에 회전축(51)이 커플링(41)으로 연결되어 상기 리드스크류(40)를 회전시키는 모터(50)를 구비한다.In addition, the elevating part may be freely rotated on one side of the table 10 and the lead screw frame 42, and the lead screw 40 and the motor frame 53 which pass through the movable body 131 with screws. It is fixed to the other end of the lead screw 40, the rotary shaft 51 is connected to the coupling 41 is provided with a motor 50 for rotating the lead screw 40.
여기서, 상기 리드스크류(40) 및 상기 회전축(51)은 베어링(43)(52)에 의해 회전지지되는 구성이다.Here, the lead screw 40 and the rotating shaft 51 is configured to be rotated by the bearing 43, 52.
따라서, 상기 모터(50)에 의해 상기 리드스크류(40)가 정·역회전하면 상기 가동체(131)가 전·후진하게 되고, 상기 가동체(131)에 고정된 푸셔(130)가 상승·하강하면서 웨이퍼(1)를 이송하게 되는 것이다.Therefore, when the lead screw 40 rotates forward and backward by the motor 50, the movable body 131 moves forward and backward, and the pusher 130 fixed to the movable body 131 rises. The wafer 1 is transferred while descending.
그러나, 푸셔에 의해 웨이퍼가 웨이퍼가이드의 슬롯 사이에 삽입될 때, 도2에 도시된 바와 같이, 웨이퍼가 잘못된 슬롯에 비스듬히 삽입되어 상기 웨이퍼가이드로부터 외력을 받아 이를 이기지 못하거나 웨이퍼간의 충돌로 인해 웨이퍼가 깨지는 현상이 발생하는 문제점이 있었다.However, when the wafer is inserted between the slots of the wafer guide by the pusher, as shown in Fig. 2, the wafer is inserted obliquely into the wrong slot to receive an external force from the wafer guide and cannot overcome it, or the wafer may be caused by collision between wafers. There was a problem that the cracking phenomenon occurs.
본 발명은 상기와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은 웨이퍼에 가해지는 외력을 감지하여 웨이퍼가 깨지는 현상을 방지하게 하는 반도체 웨이퍼 이송장치를 제공함에 있다.The present invention is to solve the conventional problems as described above, the object of the present invention is to provide a semiconductor wafer transfer apparatus that detects the external force applied to the wafer to prevent the wafer from breaking.
도1은 종래의 반도체 웨이퍼 이송장치를 나타낸 도면이다.1 is a view showing a conventional semiconductor wafer transfer apparatus.
도2는 도1의 반도체 웨이퍼 이송장치에 의해 웨이퍼가 웨이퍼가이드의 슬롯에 잘못 진입할 때 웨이퍼가 깨지는 상태를 상방에서 바라본 도면이다.FIG. 2 is a view from above of the broken state of the wafer when the wafer is incorrectly entered into the slot of the wafer guide by the semiconductor wafer transfer apparatus of FIG.
도3은 본 발명의 바람직한 일 실시예에 따른 반도체 웨이퍼 이송장치를 나타낸 도면이다.3 is a view showing a semiconductor wafer transfer apparatus according to an embodiment of the present invention.
※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing
1: 웨이퍼 2: 카셋트1: wafer 2: cassette
10: 테이블 11: 푸셔창10: Table 11: Pusher Window
20: 웨이퍼가이드 20a: 좌측웨이퍼가이드20: Wafer Guide 20a: Left Wafer Guide
20b: 우측웨이퍼가이드 21: 지지대20b: right wafer guide 21: support
30, 130: 푸셔 31, 131: 가동체30, 130: pusher 31, 131: movable body
32: 가이드봉 33: 가이드홀32: guide rod 33: guide hole
34: 코일스프링 40: 리드스크류34: coil spring 40: lead screw
41: 커플링 42: 리드스크류프레임41: coupling 42: lead screw frame
43, 52: 베어링 50: 모터43, 52: bearing 50: motor
51: 회전축 53: 모터프레임51: shaft 53: motor frame
60: 센서 60a: 발광센서60: sensor 60a: light emitting sensor
60b: 수광센서60b: light receiving sensor
상기의 목적을 달성하기 위한 본 발명에 따른 반도체 웨이퍼 이송장치는, 웨이퍼에 접촉하여 상기 웨이퍼를 파지하는 푸셔;와, 상기 푸셔와 소정의 거리로 이격되게 설치되는 가동체;와, 상기 푸셔와 상기 가동체 사이의 이격된 거리가 가변되도록 서로 이격된 상기 푸셔와 가동체 사이에 설치되어 신장 및 수축이 가능한 탄성부재;와, 상기 가동체를 소정의 장소로 이송시키는 이송수단;과, 상기 푸셔에 가해지는 소정 정도 이상의 외력을 감지하도록 상기 가동체에 설치되어 상기 푸셔와 상기 가동체 사이의 이격된 거리를 감지하는 센서; 및 상기 센서로부터 거리신호를 인가받아 상기 이송수단에 제어신호를 인가하여 상기 이송수단을 제어하는 제어부;를 포함하여 이루어지는 것을 특징으로 한다.A semiconductor wafer transfer apparatus according to the present invention for achieving the above object, a pusher for contacting a wafer and holding the wafer; and a movable body spaced apart from the pusher by a predetermined distance; and the pusher and the An elastic member installed between the pusher and the movable body spaced apart from each other such that the spaced distance between the movable body and the movable body is variable, and an elastic member capable of stretching and contracting; and transfer means for transferring the movable body to a predetermined place; and on the pusher A sensor installed in the movable body to sense an external force applied to a predetermined degree or more, the sensor sensing a spaced distance between the pusher and the movable body; And a controller configured to control the transfer means by receiving a distance signal from the sensor and applying a control signal to the transfer means.
또한, 바람직하기로는, 상기 센서는 상기 푸셔가 상기 가동체를 기준으로 소정의 간격 이상 이동되면 접속이 끊어지도록 가동체측에 설치되는 발광센서 및 푸셔측에 설치되는 수광센서를 포함하여 이루어지거나, 상기 푸셔가 상기 가동체를 기준으로 소정의 간격 이상 이동되면 접속이 끊어지도록 일측단자는 가동체측에 설치되고, 상기 일측단자에 대응하는 타측단자는 상기 푸셔측에 설치되는 슬라이딩스윗치이고, 상기 제어부는 상기 슬라딩스윗치가 설치된 전선을 통해 상기 이송수단에 전력을 공급하는 것이 가능하다.In addition, preferably, the sensor comprises a light emitting sensor provided on the side of the movable body and a light receiving sensor provided on the pusher so that the connection is disconnected when the pusher is moved more than a predetermined interval relative to the movable body, or the One side terminal is installed on the movable body side so that the connection is disconnected when the pusher is moved more than a predetermined interval with respect to the movable body, the other terminal corresponding to the one terminal is a sliding switch installed on the pusher side, the control unit is It is possible to supply electric power to the transfer means via a wire provided with a sliding switch.
이하, 본 발명의 구체적인 일 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도3을 참조하여 설명하면, 본 발명의 반도체 웨이퍼 이송장치는, 테이블(10)과, 상기 테이블(10)에 형성된 푸셔창(11)을 관통하고, 카셋트(2) 내의 다수개 웨이퍼(1)에 접촉하여 상기 웨이퍼(1)를 안착시키는 푸셔(30)와, 상기 푸셔(30)와 소정의 거리로 이격되게 설치되는 가동체(31)와, 상기 푸셔(30)와 상기 가동체(31) 사이의 이격된 거리가 가변되도록 서로 이격된 상기 푸셔와 가동체 사이에 설치되어 신장 수축이 가능한 코일스프링(34)과, 상기 가동체(31)를 미리 대기하고 있는 웨이퍼가이드방향으로 상강시키는 승강부와, 상기 푸셔(30)에 가해지는 소정 정도 이상의 외력을 감지하도록 상기 가동체(31)에 설치되어 상기 푸셔(30)와 상기 가동체(31) 사이의 이격된 거리를 감지하는 센서(60) 및 상기 센서(60)로부터 거리신호를 인가받아 상기 승강부에 제어신호를 인가하여 상기 승강부를 제어하는 제어부(도시하지 않음))를 구비하여 이루어지는 구성이다.Referring to FIG. 3, the semiconductor wafer transfer apparatus of the present invention passes through a table 10 and a pusher window 11 formed on the table 10, and a plurality of wafers 1 in the cassette 2. A pusher 30 which contacts the pusher 30 to seat the wafer 1, a movable body 31 spaced apart from the pusher 30 by a predetermined distance, and the pusher 30 and the movable body 31. A coil spring 34 provided between the pusher and the movable body spaced apart from each other so that the spaced distance therebetween is variable, and a lifting spring for raising and contracting the movable spring 31 in a wafer guide direction waiting for the movable body 31 in advance; And a sensor 60 installed on the movable body 31 to detect an external force applied to the pusher 30 by a predetermined degree or more and detecting a spaced distance between the pusher 30 and the movable body 31. And the sensor 6 A control unit (not shown) for receiving a distance signal from 0) and applying a control signal to the lift unit to control the lift unit.
여기서, 상기 웨이퍼가이드(20)는 지지대(21)에 의해 상기 테이블(10) 상방에 위치하고, 서로 대향하는 슬롯이 각각 형성된 좌측 웨이퍼가이드(20a) 및 우측 웨이퍼가이드(20b)로 이루어져서 상기 좌측 및 우측 웨이퍼가이드(20a)(20b)의 서로 대향하는 슬롯 사이에 웨이퍼(1)가 위치된다.Here, the wafer guide 20 is positioned above the table 10 by the support 21, and consists of a left wafer guide 20a and a right wafer guide 20b each having slots facing each other. The wafer 1 is positioned between the slots facing each other of the wafer guides 20a and 20b.
또한, 상기 푸셔(30)는 다수개의 웨이퍼(1)를 하측에서 밀어 동시에 승강시키는 것으로서 상면에 상기 웨이퍼의 측면 테두리가 삽입되는 다수개의 슬롯이 형성된다.In addition, the pusher 30 pushes the plurality of wafers 1 downward and simultaneously lifts the plurality of slots into which the side edges of the wafer are inserted.
또한, 상기 승강부는 일측단부가 테이블(10) 및 리드스크류프레임(42)에 베어링(43)으로 자유회전이 가능하게 지지되고, 상기 가동체(31)에 나사결합으로 관통되는 리드스크류(40) 및 모터프레임(53)에 고정되고, 상기 리드스크류의 타측단부에 회전축(51)이 커플링(41)으로 연결되어 상기 리드스크류(40)를 회전시키는 모터(50)를 구비한다.In addition, the lifting portion is supported on the table 10 and the lead screw frame 42 to one end of the freely rotatable with the bearing 43, the lead screw 40 is penetrated through the movable body 31 by screwing And a motor 50 fixed to the motor frame 53 and having a rotation shaft 51 connected to the coupling end 41 at the other end of the lead screw to rotate the lead screw 40.
여기서, 상기 리드스크류(40) 및 상기 회전축(51)은 베어링(43)(52)에 의해 회전지지되는 구성이다.Here, the lead screw 40 and the rotating shaft 51 is configured to be rotated by the bearing 43, 52.
또한, 상기 푸셔(30)에 상기 코일스프링(34)의 신장 및 수축경로를 안내하는 가이드봉(32)이 상기 코일스프링(34)을 관통하여 형성되고, 상기 가동체(31)에는 상기 가이드봉(32)이 삽입되어 그 직선운동이 안내되도록 가이드홀(33)이 형성된다.In addition, a guide rod 32 for guiding the extension and contraction paths of the coil spring 34 to the pusher 30 is formed through the coil spring 34, and the movable rod 31 has the guide rod. A guide hole 33 is formed to insert 32 to guide the linear motion thereof.
한편, 상기 푸셔(30)가 상기 가동체(31)를 기준으로 소정의 간격 이상 이동되면 접속이 끊어지도록 가동체(31)측에 발광센서(60a)를 설치하고, 상기 푸셔(30)측에 수광센서(60b)를 설치한다.On the other hand, when the pusher 30 moves more than a predetermined interval with respect to the movable body 31, a light emitting sensor 60a is installed on the movable body 31 side so that the connection is disconnected, and on the pusher 30 side. Install the light receiving sensor 60b.
이러한 센서의 종류는 두 물체간의 거리를 감지할 수 있는 것이면 모두 사용 가능하다. 즉, 일례로서, 상기 푸셔가 상기 가동체(31)를 기준으로 소정의 간격 이상 이동되면 접속이 끊어지도록 일측단자는 가동체(31)측에 설치되고, 상기 일측단자에 대응하는 타측단자는 상기 푸셔(30)측에 설치되는 슬라이딩스윗치형태의 센서를 설치하고, 상기 제어부는 상기 슬라딩스윗치가 설치된 전선을 통해 상기 승강부의 모터(50)에 전력을 공급하는 것도 가능하다.These types of sensors can be used as long as they can detect the distance between two objects. That is, as an example, one side terminal is provided on the movable body 31 side so that the connection is disconnected when the pusher is moved by a predetermined distance or more with respect to the movable body 31, and the other terminal corresponding to the one terminal is A sliding switch-type sensor is installed on the pusher 30 side, and the control unit may supply power to the motor 50 of the lifting unit through a wire provided with the sliding switch.
따라서, 상기 모터(50)에 의해 상기 리드스크류(40)가 정·역회전하면 상기 가동체(31)가 전·후진하게 되고, 상기 가동체(31)에 고정된 푸셔(30)가 상승·하강하면서 웨이퍼(1)를 웨이퍼가이드(20)로 로딩 및 언로딩하게 된다.Therefore, when the lead screw 40 rotates forward and backward by the motor 50, the movable body 31 moves forward and backward, and the pusher 30 fixed to the movable body 31 rises. While descending, the wafer 1 is loaded and unloaded into the wafer guide 20.
이때, 상기 카셋트(2) 내에 적재된 웨이퍼(1)가 상승하면서 상기 웨이퍼가이드(20)의 슬롯에 잘못 진입하게 되면 웨이퍼(1)에 작용하는 외력으로 인해 코일스프링(34)이 수축되고, 상기 푸셔(30)가 후퇴하게 하게 되는 데 이러한 푸셔(30)의 완충작용으로 웨이퍼(1)의 깨짐이 방지되는 것은 물론, 상기 푸셔(30)의 후퇴된 거리를 감지한 센서(60)에 의해 제어부가 상기 모터(50)의 동작을 정지 또는 역동작시켜서 상기 웨이퍼(1)의 외력을 완전히 해소할 수 있게 되는 것이다.At this time, when the wafer 1 loaded in the cassette 2 rises and incorrectly enters the slot of the wafer guide 20, the coil spring 34 contracts due to an external force acting on the wafer 1. The pusher 30 causes the pusher 30 to retreat. The buffering action of the pusher 30 not only prevents the wafer 1 from being broken, but also controls the sensor 60 to detect the retracted distance of the pusher 30. Stops or reverses the operation of the motor 50 to completely eliminate the external force of the wafer 1.
그러므로, 상기 푸셔(30)에 의해 웨이퍼(1)가 웨이퍼가이드(20)의 슬롯 사이에 삽입될 때, 웨이퍼(1)가 잘못된 슬롯에 비스듬히 삽입되어 상기 웨이퍼가이드(20)로부터 외력을 받으면 즉시, 웨이퍼(1)의 이송이 중단되어 종래와 같이, 웨이퍼(1)의 계속되는 이송으로 인해 잘못 위치된 웨이퍼(1)가 외력을 이기지 못하여 깨지는 것을 방지할 수 있는 것이다.Therefore, when the wafer 1 is inserted between the slots of the wafer guide 20 by the pusher 30, as soon as the wafer 1 is inserted obliquely into the wrong slot and receives an external force from the wafer guide 20, The transfer of the wafer 1 is interrupted, and as in the prior art, the misplaced wafer 1 can be prevented from being broken due to the continuous transfer of the wafer 1.
이상에서와 같이 본 발명에 따른 반도체 웨이퍼 이송장치에 의하면, 센서를 통해 외력을 감지한 제어부가 웨이퍼의 이송을 중단하여 웨이퍼가 이송 도중 외력을 이기지 못하고 깨지는 현상을 방지하게 하는 효과를 갖는 것이다.As described above, according to the semiconductor wafer transfer apparatus according to the present invention, the control unit that detects the external force through the sensor has an effect of stopping the transfer of the wafer to prevent the wafer from breaking without the external force during the transfer.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980038786A KR100289848B1 (en) | 1998-09-18 | 1998-09-18 | Semiconductor Wafer Transfer Device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980038786A KR100289848B1 (en) | 1998-09-18 | 1998-09-18 | Semiconductor Wafer Transfer Device |
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| KR20000020257A true KR20000020257A (en) | 2000-04-15 |
| KR100289848B1 KR100289848B1 (en) | 2001-06-01 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100576150B1 (en) * | 2004-08-12 | 2006-05-03 | 세메스 주식회사 | Substrate transport apparatus |
| KR20170004552A (en) * | 2015-07-03 | 2017-01-11 | 주식회사 케이씨텍 | Apparatus of loading wafeer in chemical mechanical polishing system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5264050B2 (en) * | 2005-09-02 | 2013-08-14 | 東京エレクトロン株式会社 | Lifting mechanism and transfer device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR0114988Y1 (en) * | 1993-12-29 | 1998-04-15 | Hyundai Electronics Ind | Lift system of wafer transfer apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100576150B1 (en) * | 2004-08-12 | 2006-05-03 | 세메스 주식회사 | Substrate transport apparatus |
| KR20170004552A (en) * | 2015-07-03 | 2017-01-11 | 주식회사 케이씨텍 | Apparatus of loading wafeer in chemical mechanical polishing system |
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| KR100289848B1 (en) | 2001-06-01 |
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