KR20010077392A - Apparatus for sensing robot chuck working in cleaning facility of semiconductor - Google Patents

Abstract

PURPOSE: An apparatus for detecting operation of a robot chuck of semiconductor cleaning equipment is provided to prevent damage to a wafer, by making a sensor smoothly detect an operation according to a transfer of a cam plate, and by precisely controlling the operation of the robot chuck by the sensor. CONSTITUTION: The first detection unit includes a bar set up in an end portion of a driving axis(12,14) and a sensor for detecting the transfer of the bar so that the transfer of the driving axis connected to a cam plate(38) is detected. The second detection unit includes a bar set up in the cam plate and a sensor for detecting the transfer of the bar so that the transfer of the cam plate is detected.

Description

Apparatus for sensing robot chuck working in cleaning facility of semiconductor}

The present invention relates to a robot chuck operation detection device of a semiconductor cleaning device, and more particularly, to a sensing device for sensing the operation state of a robot chuck used in the cleaning device more sensitively and more clearly. It relates to a robot chuck operation detection device.

The cleaning process of the semiconductor device manufacturing process is the most basic process because the yield can be determined according to the cleaning result. Facilities for this cleaning process include loaders, unloaders, QDR (Quick Dumped Rinse) processes or cleaners used in IPA, Final Rinse and Spin Dryers. The units of are combined to be configured to proceed with the process sequentially.

At this time, the wafer moved between the devices is to be automatically moved by the robot, it is common to proceed automatically from wafer loading to unloading (Unloading).

Holding and transporting the wafer by the robot is performed by the contraction and relaxation of the chuck, and it is necessary to adjust the wafer to an optimum condition so that damage and contamination do not occur on the wafer. It is also necessary to incompletely grip the wafer so that the wafer does not break off and break during the transfer.

An example of an apparatus for sensing the operating state of a conventional robotic chuck for wafer transfer is shown in FIG. Referring to FIG. 1, as the cam plate 10 is moved back and forth, the drive shafts 12 and 14 move from side to side, and the sensor bars 20 and 26 forming the sensing units 1 and 2 also operate. The robot chuck (not shown) connected to the lower side of the cam plate 10 is detected by an operation state of the sensors 22 and 28 and the sensors 24 and 30 fixed to the sensor support 32 while moving from side to side. Hold and release the wafer while it is open and closed.

Specifically, when the control unit (not shown) that controls the cleaning equipment supplies a control signal for operating the robot chuck to the cam plate 10, the cam plate 10 is operated and the robot chuck is linked thereto. That is, when the camplet 10 moves in the X direction, it moves forward 3 cm. At this time, when the rolling guides 16 and 18 rotate and push the driving shafts 12 and 14, the sensor bars 20 and 26 that move at the same time are moved. It is detected by the sensors 22 and 26 to indicate a closed state in which the robot chuck is pinched.

In addition, when the cam plate 10 moves in the Y direction, the cam plate 10 moves backward about 3 cm. At this time, as the rolling guides 16 and 18 rotate, the sensor bars 20 and 26 that move simultaneously with the driving shafts 12 and 14 are sensors. It is detected at (24, 28) and informs that the robot chuck is in an open state.

However, the moving distance of the cam bars 10 is only 3 cm, whereas the moving distances of the sensor bars 20 and 26 are only 0.5 cm, and the width of the sensor bars 20 and 26 is 1 cm, so that the cam plate 10 is moved. Even though it did not move completely, the robot chuck was detected as closed or open, and an error occurred that could not accurately control the operation of the robot chuck for transferring wafers. In other words, when the wafer is transported, the wafer is loosely grasped or placed in advance so that the wafer is dropped and broken.

An object of the present invention for solving the above-described problems, the sensor informing the operation state of the robot chuck in response to the operation of the cam plate to operate the robot chuck to transfer the wafer of the cleaning equipment is sensitively controlled to accurately control the operation of the robot chuck To provide a robot chuck operation detection device of a semiconductor cleaning equipment.

1 is a view for explaining a sensing structure of a conventional robot chuck operation detection device.

2 is a view showing an embodiment of a robot chuck operation detection device of a semiconductor cleaning device according to the present invention.

※ Explanation of codes for main parts of drawing

1, 2, 40: sensing unit 10, 38: cam plate

12, 14: drive shaft 16, 18: rolling guide

20, 26, 48: sensor bar 22, 24, 28, 30, 42, 44: sensor

32: sensor support 46: support bar

Robot chuck operation detection device of a semiconductor cleaning device according to the present invention for achieving the above object, and provided with a sensor that detects the movement of the bar and the erected at the end of the drive shaft to detect the movement of the drive shaft in conjunction with the cam plate A first sensing means and a second sensing means including a sensor mounted on a cam plate to sense movement of the cam plate so as to sense a movement of the cam plate. Preferably, the means and the second sensing means each comprise two photosensors, and the second sensing bar is preferably smaller than the width of the first sensing bar so that sensitive sensing is achieved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The configuration for the embodiment of the present invention is shown in Figure 2, the drive shafts 12, 14 are provided on both sides of the cam plate 38, and the drive shafts 12, 14 are fixed by the cam plate 38 The rolling guides 16 and 18 which rotate in the closed state are provided, respectively.

One end portions of the drive shafts 12 and 14 are connected to each other by a spring 19, and a sensor bar 20 is installed at the end of the drive shaft 12 in the opposite direction, and is supported at the end of the drive shaft 14. The sensors 42 and 44 fixed by the bar 46 are provided in a state spaced apart by a predetermined distance.

And, both sides of the sensor bar 20, the sensors 22, 24 for detecting the movement of the sensor bar 20 are installed facing each other, fixed to the upper end of the cam plate 38, the sensor bar (moving horizontally) The sensors 42 and 44 are installed in the vertical direction so as to detect 48).

In the robot chuck operation detecting apparatus according to the embodiment of the present invention configured as described above, the robot chuck (not shown) installed below the cam plate 38 operates according to the movement of the cam plate 38, and the sensor As the bars 20 and 48 move, they provide a sensing signal that allows the robot chuck to operate correctly.

Specifically, when the cam plate 38 formed in the tapered trapezoidal shape is advanced in the opposite direction of the spring 19, the drive shafts 12 and 14 become wider as the cam plate 38 becomes wider. Then, the sensing signal is supplied from the sensor 22 to the control unit (not shown) by the sensor bar 20, and the sensor bar 48 is moved from the position of the sensor 44 to the sensor 42 and the sensor 42. The sensing signal is provided to the controller. Accordingly, the control unit stops the operation of the cam plate 38, and the robot chuck picks up the wafer.

On the contrary, when the cam plate 38 advances in the spring 19 direction, the cam shafts 38 become narrower and the drive shafts 12 and 14 narrow. Then, the sensing signal is supplied from the sensor 24 to the controller (not shown) by the sensor bar 20, and the sensor bar 48 is moved from the position of the sensor 42 to the position of the sensor 44 to control the controller. The sensing signal is supplied. Accordingly, the control unit stops the operation of the cam plate 38, the robot chuck to place the wafer.

At this time, it is preferable that the time detected by the sensor bars 20 and 48 be equally made while the cam plate 38 moves forward or backward, and the drive shaft 12 is moved to move the sensor 22 or the sensor 24. The detected time and the time detected by the sensor 42 or the sensor 44 by moving the sensor bar 48 should be installed to be the same.

In addition, in the embodiment of the present invention, since the width of the sensor bar 48 is 0.2 cm so that the sensor bar 48 can be sensitively reacted by the sensors 42 and 44 according to the movement of the cam plate 38, You can control the robot chuck. In addition, the sensor bar 20 and the sensors 22 and 24 provided on the drive shaft 12 may also be manufactured and installed in the same manner as the sensor bar 48 and the sensors 42 and 44.

According to the embodiment according to the present invention as described above, there is an advantage that the operation of the robot chuck can be accurately controlled by the sensor is sensitive to the operation of the cam plate.

Therefore, according to the present invention, it is possible to smoothly detect the motion of the sensor according to the movement of the cam plate, and to accurately control the operation of the robot chuck by the sensitive sensor, thereby preventing the loss of the wafer.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (3)

First sensing means including a bar standing at the end of the driving shaft so as to sense the movement of the driving shaft linked with the cam plate; And Second sensing means having a bar mounted on the cam plate and a sensor for sensing the driving thereof so as to sense the movement of the cam plate; Robot chuck operation detection device of a semiconductor cleaning equipment, characterized in that for detecting the operation of the robot chuck. The method of claim 1, The second sensing means is a pair of sensors fixed to the upper surface of the cam plate to face upward, fixed to the support bar to be located at the start and end of the movement path of the bar, respectively, a pair of sensors for detecting the position of the support bar Robot chuck operation detection device of the semiconductor cleaning equipment comprising a. The method according to claim 1 or 2, The sensor is a robot chuck operation detection device of the semiconductor cleaning equipment, characterized in that the photosensor.