KR20000001126U - Solder Ball Guide Structure in Test Sockets for Ball Grid Array Packages - Google Patents

Abstract

The present invention relates to a solder ball guide structure of a test socket for a ball grid array package, and the prior art has a contact pin built in the lower base and the solder ball formed in the package when pressed downward after seating the package on the upper surface of the upper base Due to the mismatch of the arrangements, a test error is generated. Therefore, the present invention relies on a lower base having a plurality of contact pins built in contact with the solder balls of the package to form an electrical connection terminal, and an elastic support installed on the upper surface of the lower base. A test socket for a ball grid array package having an upper base supported and seated thereon, wherein the upper base is provided with a plurality of contact holes at regular intervals such that each contact pin is always inserted and aligned. Solder of the package around each of the contact holes Because the guide is formed by inclined parts of the upper side for guiding, to always maintain a constant alignment of the contact pin and the solder ball can maintain a constant connection that a correct test of the package can be to occur.

Description

Solder Ball Guide Structure in Test Sockets for Ball Grid Array Packages

The present invention relates to a test socket for a ball grid array package, and in particular, a test socket for a ball grid array package to improve the alignment and contact characteristics when testing the electrical characteristics of the ball grid array package. Of the solder ball guide structure.

In general, ball grid array packages are widely used because they can realize multiple pins in a given area. Such ball grid array packages are electrically connected terminals of a package connected to chip pads, and solder balls are arranged on the mounting surface of the package. The short length of the external terminal prevents warping from external impact, facilitates the transmission of electrical signals, and shortens the mounting time by reflowing and mounting the package in a furnace at the time of mounting the package. There is an advantage.

On the other hand, when testing the electrical characteristics of such a ball grid array package is to use a socket, the socket according to the prior art, as shown in Figure 1, the upper base 10 and lower base 20 of a substantially rectangular shape Is made of.

The upper base 10 has a plurality of contact holes 11 are formed at regular intervals so that the solder balls (S) of the ball grid array package (P) is seated, the four corners of the upper base (10) The guide bar 12 for guiding the correct position is installed when the package P transported by Si) is seated on the upper surface of the upper base 10.

A plurality of contact pins 21 are formed on the lower base 20 so that the ball grid array package P contacts the solder balls S when the ball grid array package P is seated on the upper base 10 and is pressed downward. The contact pin 21 is provided to be connected to the circuit line of the electrical inspection equipment (not shown) of the ball grid array package (P).

On the other hand, the contact pin 21 is a first contact pin 21a protruding a predetermined length extending to the upper surface of the injection-molded lower base 20, and a second protruding length extending to the lower surface of the lower base 20 Intermediate between the contact pin 21b and the first contact pin 21a and the second contact pin 21b to form an electrical connection medium and pressurize the upper base 10 on which the package P is seated. It is comprised by the spring 21c for buffering mutual impact.

As described above, the second contact pin 21b protruding from the lower base 20 is inserted into and fixed to the test board (not shown), and is connected to the electrical circuit line of the test board, by a handler (not shown). When the solder ball S of the ball grid array package P is seated in the contact hole 11 formed in the upper base 10, and then pressurized with a predetermined force, the solder ball S of the package P contacts the contact hole 11. Corresponding contact with the pin 21 makes it possible to check the electrical state.

However, the prior art as described above, the solder ball formed in the contact pin 21 and the package (P) built in the lower base 20 when pressing the lower side after mounting the package (P) on the upper surface of the upper base 10 There was a problem that caused a test error because the arrangement with (S) did not match.

Therefore, the present invention was devised to solve the above-mentioned problems, and the solder ball guide structure of the test socket for the ball grid array package that can prevent the test error by ensuring that the contact pin and the solder ball of the package is always stable. The purpose is to provide.

1A and 1B are longitudinal cross-sectional views showing a test socket for a ball grid array package according to the prior art;

1A is a longitudinal sectional view showing a state before connection of a package and a socket;

1B is a longitudinal sectional view showing a state after connection of a package and a socket;

2a and 2b is a longitudinal sectional view showing a test socket for a ball grid array package according to the present invention,

2A is a longitudinal sectional view showing a state before connection of a package and a socket;

2B is a longitudinal sectional view showing a state after connection of a package and a socket;

** Explanation of symbols for main parts of drawings **

10; Upper base 11; Contact hole

12; Guide portion 20; Lower base

21; Contact pins 30; Elastic support

Therefore, to achieve the above object, the present invention is elastically supported by a lower base having a plurality of contact pins built in contact with the solder ball of the package to form an electrical connection terminal, and an elastic support provided on the upper surface of the lower base. In addition, the test socket for a ball grid array package consisting of an upper base on which the package is seated, a plurality of contact holes are formed in the upper base at regular intervals so that each contact pin is always inserted and aligned. Provides a solder ball guide structure of the test socket for the ball grid array package, characterized in that the guide hole for guiding the solder ball of the package is inclined upward in the vicinity of the contact hole of the.

Hereinafter, an embodiment of a test socket for a ball grid array package according to the present invention will be described with reference to the accompanying drawings.

The test socket for the ball grid array package of the present invention is divided into an upper base 10 and a lower base 20, as shown in FIG. 2A, and four corner portions of the upper base 10 and the lower base 20. An elastic support 30 having a spring 31 is coupled thereto to elastically support the upper base 10.

A plurality of contact holes 11 having a predetermined depth are formed in the upper base 10 at a predetermined interval, and when the package P is placed on the upper base 10 around each of the contact holes 11. The guide part 12 is formed to be inclined at a predetermined angle in an upward direction so that the solder balls S formed on the bottom surface of the package P to form the external connection terminals are accurately guided to the respective contact holes 11.

In addition, the lower base 20 includes a plurality of contact pins 21 formed of a first contact pin 21a, a spring 21c, and a second contact 21b pin. And the first contact pin 21a protrudes a predetermined portion onto the upper surface of the lower base 20 so that a predetermined depth is inserted into the bottom surface of the contact hole 11 formed in the upper base 10. The second contact pin 21b protrudes a predetermined amount on the lower surface of the lower base 20 and is inserted into the test board during the test of the package P to contact the circuit line of the test board.

The test operation of the package using the test socket for the ball grid array package according to the present invention configured as described above is as follows.

The ball grid array package P is placed on the upper surface of the upper base 10 with the contact pins 21 installed in the lower base 20 inserted into the contact holes 11 formed on the lower surface of the upper base 10. When placed, a plurality of solder balls S formed on the bottom surface of the package P are seated in the contact hole 11 by the guide part 12 formed to be inclined around the contact hole 11 of the upper base 10. .

Thereafter, when the upper base 10 is pressed downward with a predetermined force, the contact pins 21 inserted into the bottom surface of the contact hole 11 and the solder balls S come into contact with each other.

As such, the contact pins 21 are always inserted and aligned in the contact holes 11, and the solder balls S are accurately seated on the upper surfaces of the contact holes 11, so that the solder balls S and the contact pins 21 are fixed. Poor contact can be prevented.

As described above, the test socket for the ball grid array package according to the present invention can maintain the alignment state of the contact pin and the solder ball at all times, so that the connection state can be kept constant, so that the accurate test of the package can be made. .

Claims (1)

A ball grid array package consisting of a lower base having a plurality of contact pins built in contact with the solder balls of the package and an upper base elastically supported by an elastic support installed on the upper surface of the lower base and seating the package. In the test socket for the use, a plurality of contact holes are formed in the upper base at regular intervals so that each contact pin is always inserted and aligned, the guide for guiding the solder ball of the package around the respective contact holes Solder ball guide structure of the test socket for the ball grid array package, characterized in that the portion is formed to be inclined upward.