KR19980075878A - How the temperature drop in the test handler - Google Patents

Abstract

Preparation steps for preparing a test handler with gas injection means installed in the chamber and the test site, test steps for checking the normal operation of the package, and gas injection means for the chamber and test site. By providing a temperature drop method of the test handler characterized in that it comprises a forced cooling step of forcibly spraying and cooling, by reducing the time required for cooling by forcibly cooling the chamber and the test site without opening the chamber cover There is no effect on other facilities nearby, which reduces the preparation time for the next test, which increases the utilization rate.

Description

How the temperature drop in the test handler

The present invention relates to a method for lowering the temperature of a test handler, and more particularly, in a test handler for inspecting and classifying semiconductor devices manufactured in a manufacturing process so as not to affect other facilities when the temperature of the test handler is dropped after a temperature test. Test handler temperature drop method.

In general, a test handler for inspecting and classifying a semiconductor device manufactured in a manufacturing process is as follows.

The test handler usually includes a stacking unit in which the sleeves in which semiconductor elements are inserted are sequentially stacked, a transfer unit for sequentially transferring the loaded sleeves to the supply unit one by one, a supply unit for supplying the semiconductor elements transferred to the test unit to the test unit, and a supply unit supplied from the supply unit. And a testing unit for electrically connecting the semiconductor elements to the head unit, a classifying unit for classifying the tested semiconductor elements into a delivery track, and a sending unit for transmitting the semiconductor elements classified by the classifying unit.

1 is a process flow diagram schematically illustrating a general test method.

Referring to FIG. 1, conventionally, step 10 of preparing a test handler as described above is performed. The test unit proceeds a test step 11 of checking whether the package is normally operated. After the temperature test, open the chamber cover to return the chamber to room temperature, remove the tester head from the test handler, and then proceed with the natural cooling step 12 to keep the temperature down until it is at the ambient temperature. do. The temperature drop method of the test handler by such a method is a method conventionally used.

However, this method takes a long time because the temperature of the equipment is lowered by air in the environment in which the equipment is placed at the time of switching to room temperature after the temperature test. If such a long time is taken, the equipment cannot be operated for that time. In addition, since the chamber cover is opened to lower the temperature of the equipment, heat is transferred to other equipment around the equipment, which affects the temperature of other equipment.

Accordingly, an object of the present invention is to provide a method for lowering the temperature of a test handler to shorten the temperature drop time to improve the operation rate of the facility and to not affect other facilities during the temperature drop.

1 is a process flow diagram schematically illustrating a general test method.

Figure 2 is a side view schematically showing a test handler applied to the test temperature drop method according to the present invention.

Figure 3 is a view showing a coupling structure of the chamber and the air nozzle of the test handler to which the temperature drop method of the test handler according to the present invention is applied.

4 is a view illustrating a coupling structure of a chamber and a test site of a test handler to which a temperature dropping method of the test handler according to the present invention is applied.

5 is a flowchart showing a state in which a temperature drop method of the test handler proceeds according to the present invention;

Explanation of symbols for the main parts of the drawings

30: dump 31: supply means

32: cover 33: chamber

34: chamber cover 35: test unit

36: test head 37: unloader

38: control panel 39: operation indicator

40: adjustment switch 41: body

42: chamber input 43: inlet

44,54: nozzle 45,55: nozzle rod

46,56: gas supply pipe 47,57: gas supply means

48: test site 49: support guide

50: rail cover 51: rail fixed block

The temperature drop method of the test handler according to the present invention for achieving the above object is a preparatory step of preparing a test handler with a gas injection means is installed in the chamber and the test site, a test step for checking the normal operation of the package, the chamber and the test And a forced cooling step of cooling the site by forcibly injecting gas by using the gas injection means.

Preferably the cooling step comprises cooling by a test handler further having a cooling fan. And, in order to increase the effect of cooling, the gas injection means is installed so as to correspond to the respective chamber input unit and the test site to enter the package.

Hereinafter, a temperature drop method of the test handler according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a side view schematically showing a test handler applied to the test temperature drop method according to the present invention.

The test handler is in the form shown in FIG. When classified into functions according to the function, the dump 30 stacking the sleeves into which the semiconductor elements are inserted is sequentially stacked, the supply means 31 for transferring the loaded sleeves one by one to supply the semiconductor elements to the tester position, and the supply means. And a test section 35 for electrically connecting the semiconductor elements supplied from the 31 to the test head 36, and an unloader 37 for classifying and delivering the tested semiconductor elements. The control panel is coupled to identify and control the progress of the test, and an operation indicator 39 is provided to indicate whether the test operation is in progress. On the other hand, the semiconductor element supplied to the test part 35 is provided with the chamber 33 which opens and closes by the chamber cover 32 in the supply means 31 in order to warm it to a predetermined temperature and to test. In the test unit 35, a semiconductor device is tested.

3 is a view showing a coupling structure of a chamber and an air nozzle of a test handler to which the temperature dropping method of the test handler according to the present invention is applied, and FIG. 4 is a view of the test handler to which the temperature dropping method of the test handler is applied according to the present invention. A diagram showing a coupling structure of a chamber and a test site.

Referring to FIG. 3, when the chamber cover 34 is opened, there is a chamber input unit 42 as shown in the drawing. The chamber input part 42 is formed with a plurality of injection holes 43 into which the respective semiconductor elements enter. The chamber input part 42 is provided with a nozzle rod 45 so as to correspond to each injection hole 43 one-to-one, so that the nozzle 44 is located at a close distance. This nozzle rod 45 is connected to the gas supply means 47 by the gas supply pipe 46.

Referring to FIG. 4, the test site 48 is coupled with a rail fixing block 51 to fix a rail (not shown), which is a path through which a semiconductor device is transferred. In addition, the support guide 49 is installed to be supported when the rail is coupled. A plurality of nozzles 54 are located so as to correspond to the positions of the rails of the test site 48, and the nozzles 54 are coupled to the nozzle rods 55. The nozzle rod 55 is connected to one side of the gas supply pipe 56, and the other side of the gas supply pipe 56 is connected to the gas supply means 57.

5 is a flowchart showing a state in which a temperature drop method of the test handler according to the present invention proceeds.

Referring to FIG. 5, a preparation step 20 for preparing a test handler in which gas injection means is installed in a chamber and a test site is performed. Open the cover of the supply means and install the air nozzle in the chamber input and at the test site. The gas injection means comprises, for example, an air nozzle and gas supply means connected thereto.

When the preparation step is completed, the test step 21 for checking the normal operation of the package is carried out. The chamber is warmed to a predetermined temperature and a test current flows through the test head coupled with the test site to check the normal operation of the semiconductor device with the output data.

Next, a forced cooling step 22 of spraying gas to the chamber and the test site through the air nozzle is performed. Gases that can be used here are gases that are suitable for lowering the temperature of the chamber and test. For example, compressed air can be used. As the test operation proceeds, the chamber and the test site which have been heated can be forcibly cooled by compressed air and the like, and the time taken for the natural cooling method is reduced. If the cooling fan is installed in the test handler in the preparation step and the forced cooling step 22 is performed, the cooling effect is increased.

According to the temperature drop method of the test handler according to the present invention as described above, because the chamber and the test site can be forcibly cooled without opening the chamber cover, the cooling effect is larger than that of the natural cooling method, and other facilities around It has no effect in terms of temperature. Therefore, there is an advantage that the preparation time for the next operation is reduced, resulting in an improvement in the utilization rate.

Claims (2)

Preparation steps for preparing a test handler with gas injection means installed in the chamber and test site, Test step for checking the normal operation of the package, Forced injection of the chamber and test site by means of gas injection means for cooling And a cooling step. The method of claim 1, wherein the cooling step further comprises cooling by a test handler having a cooling fan.