KR19980066336A - Wafer transfer mechanism - Google Patents
Wafer transfer mechanism Download PDFInfo
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- KR19980066336A KR19980066336A KR1019970001788A KR19970001788A KR19980066336A KR 19980066336 A KR19980066336 A KR 19980066336A KR 1019970001788 A KR1019970001788 A KR 1019970001788A KR 19970001788 A KR19970001788 A KR 19970001788A KR 19980066336 A KR19980066336 A KR 19980066336A
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- wafer
- transfer mechanism
- wafer transfer
- holding part
- gas
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- 230000007246 mechanism Effects 0.000 title abstract description 32
- 239000007789 gas Substances 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 9
- 238000011109 contamination Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 77
- 238000010586 diagram Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 웨이퍼와의 직접적인 접촉없이 홀딩하여 운반하는 웨이퍼 이송기구로, 접촉으로 인한 웨이퍼 표면의 긁힘현상이나 파티클등의 오염원이 묻어나는 문제점을 해결하여 제품의 수득율을 향상시킨다.The present invention is a wafer transfer mechanism that is held and transported without direct contact with the wafer, and solves the problem of contamination of the wafer surface due to contact or contamination such as particles to improve the yield of the product.
Description
본 발명은 웨이퍼를 홀딩하여 운반시키는 웨이퍼 이송기구에 관한 것으로, 특히 노광장비 내로의 웨이퍼 이송 시에 발생되는 긁힘현상이나 파티클(particle) 등의 오염원으로 인한 웨이퍼 손상을 최소화하여 웨이퍼 어라인(wafer align) 시 에러(error)를 방지하기에 적당한 웨이퍼 이송기구에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer mechanism for holding and transporting wafers. In particular, wafer alignment is minimized by minimizing wafer damage due to scratches or contamination sources such as particles generated during wafer transfer into exposure equipment. The present invention relates to a wafer transfer mechanism suitable for preventing errors.
(도 1)은 종래의 웨이퍼 이송기구를 설명하기 위한 도면으로, (도 1)의 (A)(B)(C)는 종래의 웨이퍼 이송기구의 실시예를 설명하기 위한 도면이고, (도 1)의 (D)는 종래의 웨이퍼 이송기구의 문제점을 도출하기 위해 보인 도면으로, 종래의 일반적인 웨이퍼 이송기구를 이용하여 웨이퍼 이송시, 이송기구에 묻어있는 파티클 등의 오염원이 웨이퍼 뒷면에 부착된 채로 노광장비 내로 이송되어 오정렬됨을 보인 도면이다.1 is a view for explaining a conventional wafer transfer mechanism, (A) (B) (C) of (Fig. 1) is a view for explaining an embodiment of a conventional wafer transfer mechanism, (FIG. 1 (D) is a drawing to draw a problem of the conventional wafer transfer mechanism, when the wafer transfer using the conventional wafer transfer mechanism, the contamination source such as particles on the transfer mechanism attached to the back of the wafer The figure shows misalignment transferred to the exposure equipment.
이하, 첨부된 도면을 참조하여 종래의 웨이퍼 이송도구에 관해 설명하겠다.Hereinafter, a conventional wafer transfer tool will be described with reference to the accompanying drawings.
반도체 제조공정 진행에 있어서 웨이퍼를 각각의 장비에서 장비로의 이송 시,(특히 노광장비로의 이송 시)종래의 일반적인 이송기구로는 도 1의 (A)(B)(C)와 같이, 진공트위져(vacuum tweezer), 척(chuck), 벨트(belt) 등을 이용하여 왔다.In the process of manufacturing a semiconductor, during the transfer of wafers from each device to the equipment (particularly to the exposure equipment), conventional transfer mechanisms are vacuum as shown in FIG. 1 (A) (B) (C). Vacuum tweezers, chucks, belts and the like have been used.
즉, 도 1의 (A)와 같이, 종래의 웨이퍼 이송기구인 진공트위져는 웨이퍼가 안착되는 부위(11)의 표면에 진공홀(10)이 형성되고, 내부에는 진공홀과 연결된 진공관(12)이 설치된다.That is, as shown in FIG. 1A, a vacuum tweezer, which is a conventional wafer transfer mechanism, has a vacuum hole 10 formed on a surface of a portion 11 on which a wafer is seated, and a vacuum tube 12 connected to a vacuum hole therein. ) Is installed.
따라서 진공홀(10)을 이용하여 웨이퍼 뒷면을 흡착하여 홀딩시킨 후, 웨이퍼안착부위(11)와 연결된 로봇암(robot arm)에 의해 원하는 장비로의 이송이 진행되었다.Therefore, after the suction of the back side of the wafer using the vacuum hole (10) to hold, the transfer to the desired equipment by the robot arm (robot arm) connected to the wafer seating portion (11).
그리고 웨이퍼 이송 시 가장 일반적으로 사용된 웨이퍼 이송에 사용된 종래의 다른 웨이퍼 이송기구인 척은 도 1의 (B)와 같이, 웨이퍼가 안착되는 부위의 표면에 다수개의 고무패드(pad)(20)가 형성되어져서, 척에 웨이퍼(가상선으로 표시된 부분, W) 안착 시에는 웨이퍼(W)와 고무패드(20)가 접촉되므로 웨이퍼 이송 시의 미끄러짐이 방지되었다.In addition, the chuck, which is another conventional wafer transfer mechanism used for wafer transfer, most commonly used during wafer transfer, has a plurality of rubber pads 20 on the surface of the site where the wafer is seated, as shown in FIG. Was formed, and the wafer W and the rubber pad 20 were in contact with each other when the wafer (part indicated by the phantom line, W) was seated on the chuck, thereby preventing slipping during wafer transfer.
그리고 도 1의 (C)와 같이, 또 다른 종래의 이송기구로는 회전되는 벨트(30)의 회전력을 이용하여 웨이퍼를 홀딩 및 이송시켰다.As shown in FIG. 1C, another conventional transfer mechanism is used to hold and transfer the wafer using the rotational force of the belt 30 that is rotated.
그러나 상기와 같은 종래의 일반적인 웨이퍼 이송기구인 진공트위져나 척 또는 벨트는 웨이퍼와 직접적인 접촉으로 인하여 웨이퍼 뒷면에 파티클 등의 오염원이 부착되고 긁힘현상이 일어나는 등의 문제점이 발생된다.However, a vacuum tweezer, a chuck or a belt, which is a conventional wafer transfer mechanism as described above, has a problem such as a contamination source such as particles attached to the back surface of the wafer due to direct contact with the wafer and scratches.
따라서 종래의 웨이퍼 이송기구로 인해 파티클이나 긁힘으로 인해 손상된 웨이퍼가 노광장비 등에서 어라인 시, 도 1의(D)와 같이, 스테이지(40)에 안착된 웨이퍼(W)가 이물질(41) 등의 오염원에 의해 경사가 발생되어 오정렬로 인한 에러가 발생된다.Therefore, when a wafer damaged by particles or scratches due to a conventional wafer transfer mechanism is aligned in an exposure apparatus or the like, as illustrated in FIG. 1D, the wafer W seated on the stage 40 may be a foreign material 41 or the like. Inclination is caused by the source of contamination, and errors due to misalignment occur.
본 발명은 웨이퍼와의 직접적인 접촉으로 인하여 웨이퍼 상에 발생되는 파티클 등의 오염원으로 인한 손상 및 웨이퍼 표면의 긁힘현상을 방지하여 안전하게 웨이퍼를 홀딩하여 운반가능한 웨이퍼 이송기구를 제공하는 데 있다.The present invention provides a wafer transfer mechanism that can safely hold and transport a wafer by preventing damage due to contamination sources such as particles generated on the wafer due to direct contact with the wafer and scratches on the wafer surface.
본 발명은 웨이퍼와의 직접적인 접촉으로 인하여 웨이퍼 상에 발생되는 파티클등의 오염원으로 인한 손상 및 웨이퍼 표면의 긁힘현상을 방지하여 안전하게 웨이퍼를 홀딩하여 운반가능한 웨이퍼 이송기구를 제공하는 데 있다.The present invention is to provide a wafer transport mechanism that can safely transport and hold the wafer by preventing damage due to contamination sources such as particles generated on the wafer due to direct contact with the wafer and scratches on the wafer surface.
본 발명은 웨이퍼와의 직접적인 접촉없이 웨이퍼를 고정시키어 운반가능한 웨이퍼 이송기구에 관한 것으로, 직접적인 접촉으로 인한 웨이퍼 표면의 긁힘현상이나 파티클등의 오염원이 묻어나는 문제점을 해결하여 제품의 수득율을 향상시킨다.The present invention relates to a wafer transfer mechanism that can be transported by fixing a wafer without direct contact with the wafer. The present invention solves the problem of contaminants such as scratches or particles on the wafer surface due to direct contact, thereby improving product yield.
도 1은 종래의 웨이퍼 이송기구를 설명하기 위한 도면으로,1 is a view for explaining a conventional wafer transfer mechanism,
도 1의 (A)(B)(C)는 종래의 웨이퍼 이송기구의 실시예를 설명하기 위한 도면이고,1 (A) (B) (C) is a diagram for explaining an embodiment of a conventional wafer transfer mechanism,
도 1의 (D)는 종래의 웨이퍼 이송기구의 문제점을 도출하기 위해 보인 도면이다.FIG. 1D is a diagram illustrating a problem of the conventional wafer transfer mechanism.
그리고 도 2는 본 발명의 웨이퍼 이송기구를 설명하기 위한 도면으로,2 is a view for explaining the wafer transfer mechanism of the present invention,
도 2의 (A)는 본 발명의 웨이퍼 이송기구의 평면도이고,2 (A) is a plan view of the wafer transfer mechanism of the present invention,
도 2의 (B)는 본 발명의 웨이퍼 이송기구의 단면도이다.2B is a cross-sectional view of the wafer transfer mechanism of the present invention.
＊ 도면의 주요 부분에 대한 부호의 설명＊ Explanation of symbols on main parts of drawing
10 : 진공홀, 11 : 안착부위, 12 : 진공관, 20 : 고무패드, 30 : 벨트, 40 : 스테이지, 41 : 이물질, 100 : 분사홀, 101 : 홀딩부, 102 : 지지부, 103 : 가스라인10: vacuum hole, 11: seating area, 12: vacuum tube, 20: rubber pad, 30: belt, 40: stage, 41: foreign matter, 100: injection hole, 101: holding part, 102: support part, 103: gas line
(도 2)는 본 발명의 웨이퍼 이송기구를 설명하기 위한 도면으로, (도 2)의 (A)는 본 발명의 웨이퍼 이송기구의 평면도이고, (도 2)의 (B)는 본 발명의 웨이퍼 이송기구의 단면도이다.2 is a view for explaining the wafer transfer mechanism of the present invention, (A) of FIG. 2 is a plan view of the wafer transfer mechanism of the present invention, and (B) of FIG. 2 is the wafer of the present invention. Sectional view of the transfer mechanism.
본 발명의 웨이퍼 이송기구는 도 2의 (A)(B)와 같이, 일면 가장자리부위에 다수의 분사홀(100)이 형성되며, 일면과 대응된 면이 개방되고, 그 측면이 소정폭의 두께를 갖는 원통형의 홀딩부(holhing part)(101)와, 홀딩부와 연결설치되고, 내부에 분사홀(100)과 연결된 가스라인(gas line)(103)을 갖는 지지부(102)로 구성된다.In the wafer transfer mechanism of FIG. 2, as shown in FIG. 2A, a plurality of injection holes 100 are formed at one edge of a surface, a surface corresponding to one surface is opened, and a side surface thereof has a predetermined width. It is composed of a cylindrical holding part (holhing part) 101 having a, and the support portion 102 having a gas line (103) connected to the holding part and connected to the injection hole 100 therein.
이와같은 구성을 갖는 본 발명의 웨이퍼 이송기구를 이용하여 웨이퍼를 홀딩 및 이송시키는 과정을 살펴보면 다음과 같다.Looking at the process of holding and transferring the wafer using the wafer transfer mechanism of the present invention having such a configuration as follows.
우선, 홀딩부(101)의 개방된 부위로 웨이퍼(W')를 인입시킨 후, 가스라인(103)을 통하여 가스를 공급한다.First, the wafer W 'is introduced into an open portion of the holding part 101, and then gas is supplied through the gas line 103.
여기에서 공급되는 가스로는 공기 또는 질소가스 등을 사용한다.As the gas supplied here, air or nitrogen gas is used.
이어서 가스라인(103) 내에 흐르는 가스는 분사홀(100)을 통하여 웨이퍼(W') 가장자리로 분사된다.Subsequently, gas flowing in the gas line 103 is injected to the edge of the wafer W ′ through the injection hole 100.
이때, 홀딩부(101)의 밀폐된 일면 가장자리에 형성된 분사홀(100)을 통하여 가스가 분사될 시, 가스가 분사되는 분사홀 내부는 외부쪽보다 저기압상태가 된다.At this time, when the gas is injected through the injection hole 100 formed at the edge of the closed one surface of the holding portion 101, the interior of the injection hole in which the gas is injected becomes a low pressure state than the outside.
따라서 웨이퍼는 허공에 뜬 상태로 유지되어 홀딩부에 고정된다.Thus, the wafer is held in the air and fixed to the holding portion.
이어서 본 발명의 홀딩부에 고정된 웨이퍼는 노광장비 내의 스테이지로 이송되어 웨이퍼 어라인이 진행된다.Subsequently, the wafer fixed to the holding part of the present invention is transferred to a stage in the exposure apparatus to proceed with wafer alignment.
본 발명의 웨이퍼 이송기구는 홀딩부의 개방된 부위로 웨이퍼를 인입한 후, 분사홀을 통하여 웨이퍼 상에 가스를 분사하여 분사홀 내부쪽을 외부쪽보다 상대적으로 저기압 상태로 형성함으로써 웨이퍼를 홀딩부에 고정시키어 이송시키는 원리를 이용한다.The wafer transfer mechanism of the present invention introduces the wafer into the open portion of the holding portion, and then sprays gas onto the wafer through the injection hole to form the inside of the injection hole in a relatively low pressure state than the outside, thereby forming the wafer in the holding portion. Use the principle of fixing and conveying.
상기에서 살펴본 바와 같이, 본 발명의 웨이퍼 이송기구에서는 웨이퍼와 직접적인 접촉없이 웨이퍼 가장자리에 가스를 분사시키며, 가스가 분사되는 분사홀 내부와 외부와 의 압력차에 의해 웨이퍼를 홀딩부에 고정시킨다.As described above, in the wafer transfer mechanism of the present invention, gas is injected to the edge of the wafer without direct contact with the wafer, and the wafer is fixed to the holding part by a pressure difference between the inside and the outside of the injection hole through which the gas is injected.
웨이퍼와의 직접적인 접촉을 통하여 웨이퍼를 홀딩한 후, 이송시키는 종래의 기구와는 달리, 본 발명의 웨이퍼 이송기구는 웨이퍼와 직접적인 접촉이 없으므로, 웨이퍼가 파티클 등의 오염원이 부착되거나 그 표면이 긁히는 등의 손상을 예방할 수 있다.Unlike the conventional mechanism for holding a wafer through direct contact with the wafer and then transferring the wafer, the wafer transfer mechanism of the present invention has no direct contact with the wafer, so that the wafer is attached to a pollutant such as particles or the surface thereof is scratched. Damage can be prevented.
따라서 제품의 생산수율을 극대화할 수 있다.Therefore, the yield of the product can be maximized.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970001788A KR100239785B1 (en) | 1997-01-22 | 1997-01-22 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970001788A KR100239785B1 (en) | 1997-01-22 | 1997-01-22 | Wafer transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980066336A true KR19980066336A (en) | 1998-10-15 |
| KR100239785B1 KR100239785B1 (en) | 2000-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970001788A KR100239785B1 (en) | 1997-01-22 | 1997-01-22 | Wafer transfer device |
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| KR (1) | KR100239785B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221237A (en) * | 1985-07-22 | 1987-01-29 | Ulvac Corp | Table for wafer positioning |
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- 1997-01-22 KR KR1019970001788A patent/KR100239785B1/en not_active IP Right Cessation
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| KR100239785B1 (en) | 2000-01-15 |
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