JPS6221237A - Table for wafer positioning - Google Patents

Table for wafer positioning

Info

Publication number
JPS6221237A
JPS6221237A JP16013785A JP16013785A JPS6221237A JP S6221237 A JPS6221237 A JP S6221237A JP 16013785 A JP16013785 A JP 16013785A JP 16013785 A JP16013785 A JP 16013785A JP S6221237 A JPS6221237 A JP S6221237A
Authority
JP
Japan
Prior art keywords
wafer
table
gas
provided
jet nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16013785A
Inventor
Rikio Sugimoto
Original Assignee
Ulvac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Corp filed Critical Ulvac Corp
Priority to JP16013785A priority Critical patent/JPS6221237A/en
Publication of JPS6221237A publication Critical patent/JPS6221237A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To simplify the constitution of a table for wafer positioning by a method wherein, when a semiconductor wafer is positioned on the table, gas jet nozzles located inside the peripheral edge of the wafer are provided on the surface of the table whereon the wafer is placed, at equal intervals and the wafer is levitated by the jet gas flows and is positioned on the table.
CONSTITUTION: A table 10 for transferring a semiconductor wafer 2 is formed in a box type, the interior thereof is used as a gas chamber 13, the sidewall on one side of the table 10 is provided with a connection opening 14 for gas inflow, and moreover, plural gas jet nozzles 15 located on the side inner slightly than the peripheral edge of the wafer 2 placed on the flat surface 11 of the top surface of the table 10, are provided on the flat surface 11 at equal intervals. The wafer 2 is levitated by gas flows 15 to jet from the jet nozzles 15 in such a way to the prescribed height within an outer peripheral edge flange 12 surrounding the wafer 2, and the wafer 2 is positioned by the gas flows 15a. Here it does not matter whether the jet nozzles 15 are provided in two rows or shaped in a cacoon-form. According to such a way, the wafer 2 can be kept in a clean state, and a linkage mechanism, which is normally used, and so forth become unnecessary.
COPYRIGHT: (C)1987,JPO&Japio
JP16013785A 1985-07-22 1985-07-22 Table for wafer positioning Pending JPS6221237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16013785A JPS6221237A (en) 1985-07-22 1985-07-22 Table for wafer positioning

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16013785A JPS6221237A (en) 1985-07-22 1985-07-22 Table for wafer positioning

Publications (1)

Publication Number Publication Date
JPS6221237A true JPS6221237A (en) 1987-01-29

Family

ID=15708671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16013785A Pending JPS6221237A (en) 1985-07-22 1985-07-22 Table for wafer positioning

Country Status (1)

Country Link
JP (1) JPS6221237A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770851B2 (en) 1999-12-29 2004-08-03 Asm International N.V. Method and apparatus for the treatment of substrates
US6805749B2 (en) 1996-07-08 2004-10-19 Asm International, N.V. Method and apparatus for supporting a semiconductor wafer during processing
US6940047B2 (en) 2003-11-14 2005-09-06 Asm International N.V. Heat treatment apparatus with temperature control system
US6964751B2 (en) 2001-05-16 2005-11-15 Asm International N.V. Method and device for heat treating substrates
US7022627B2 (en) 2003-10-31 2006-04-04 Asm International N.V. Method for the heat treatment of substrates
US7217670B2 (en) 2004-11-22 2007-05-15 Asm International N.V. Dummy substrate for thermal reactor
US7410355B2 (en) 2003-10-31 2008-08-12 Asm International N.V. Method for the heat treatment of substrates
US7601223B2 (en) 2003-04-29 2009-10-13 Asm International N.V. Showerhead assembly and ALD methods
US7601224B2 (en) 2002-03-08 2009-10-13 Asm America, Inc. Method of supporting a substrate in a gas cushion susceptor system
JP2010016199A (en) * 2008-07-03 2010-01-21 Murata Mach Ltd Purge apparatus
US7754013B2 (en) 2002-12-05 2010-07-13 Asm International N.V. Apparatus and method for atomic layer deposition on substrates
EP3002346A1 (en) 2007-01-08 2016-04-06 Eastman Kodak Company Deposition system and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753964A (en) * 1980-09-17 1982-03-31 Sanyo Electric Co Ltd Multilayer wiring method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753964A (en) * 1980-09-17 1982-03-31 Sanyo Electric Co Ltd Multilayer wiring method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312156B2 (en) 1996-07-08 2007-12-25 Asm International N.V. Method and apparatus for supporting a semiconductor wafer during processing
US6805749B2 (en) 1996-07-08 2004-10-19 Asm International, N.V. Method and apparatus for supporting a semiconductor wafer during processing
US6770851B2 (en) 1999-12-29 2004-08-03 Asm International N.V. Method and apparatus for the treatment of substrates
US6964751B2 (en) 2001-05-16 2005-11-15 Asm International N.V. Method and device for heat treating substrates
US7601224B2 (en) 2002-03-08 2009-10-13 Asm America, Inc. Method of supporting a substrate in a gas cushion susceptor system
US7754013B2 (en) 2002-12-05 2010-07-13 Asm International N.V. Apparatus and method for atomic layer deposition on substrates
US7601223B2 (en) 2003-04-29 2009-10-13 Asm International N.V. Showerhead assembly and ALD methods
US7410355B2 (en) 2003-10-31 2008-08-12 Asm International N.V. Method for the heat treatment of substrates
US7022627B2 (en) 2003-10-31 2006-04-04 Asm International N.V. Method for the heat treatment of substrates
US6940047B2 (en) 2003-11-14 2005-09-06 Asm International N.V. Heat treatment apparatus with temperature control system
US7217670B2 (en) 2004-11-22 2007-05-15 Asm International N.V. Dummy substrate for thermal reactor
EP3002346A1 (en) 2007-01-08 2016-04-06 Eastman Kodak Company Deposition system and method
US10351954B2 (en) 2007-01-08 2019-07-16 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
JP2010016199A (en) * 2008-07-03 2010-01-21 Murata Mach Ltd Purge apparatus
JP4692584B2 (en) * 2008-07-03 2011-06-01 村田機械株式会社 Purge device
US8240346B2 (en) 2008-07-03 2012-08-14 Murata Machinery, Ltd. Purge apparatus

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