KR0181901B1 - Vacuum tweezer for transferring semiconductor wafers - Google Patents

Vacuum tweezer for transferring semiconductor wafers Download PDF

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Publication number
KR0181901B1
KR0181901B1 KR1019950033424A KR19950033424A KR0181901B1 KR 0181901 B1 KR0181901 B1 KR 0181901B1 KR 1019950033424 A KR1019950033424 A KR 1019950033424A KR 19950033424 A KR19950033424 A KR 19950033424A KR 0181901 B1 KR0181901 B1 KR 0181901B1
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South Korea
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wafer
vacuum
suction
protrusions
transport
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KR1019950033424A
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Korean (ko)
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KR970017929A (en
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이재철
라기정
김진식
홍정의
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김광호
삼성전자주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼의 운반시 웨이퍼의 저면을 진공튀저로 진공흡착하는 과정에서 발생할 수 있는 파티클을 극소화 함으로써 웨이퍼의 취급에 따른 오염을 방지할 수 있는 반도체 웨이퍼 운반용 진공튀저를 제공하는데 있다.The present invention is to provide a semiconductor wafer transport vacuum thrower that can prevent contamination due to the handling of the wafer by minimizing particles that can occur during the vacuum suction process of the bottom surface of the wafer with a vacuum buzzer during the transport of the wafer.

본 발명의 구성은 진공발생장치와 연결되는 것으로 상면(10a) 일측에 복수개의 흡착구명(12)이 형성되어 이 흡착구멍(12)으로 웨이퍼(14)를 진공흡착하여 운반하기 위한 반도체 웨이퍼 운반용 진공튀저에 있어서, 상면(10a)에 웨이퍼(14)와 접촉하는 복수개의 돌출부(11)를 형성하고, 이 복수개의 돌출부(11)에 흡착구멍(12)을 각각 형성하여 웨이퍼(14)를 진공흡착함으로써 웨이퍼 저면과의 접촉면적이 돌출부의 접촉면적으로 국한되어 최소화시키도록 된것이다.The structure of the present invention is connected to a vacuum generator, a plurality of suction holes 12 is formed on one side of the upper surface (10a) is a semiconductor wafer transport vacuum for vacuum suction and transport the wafer 14 to the suction hole 12 In the plunger, a plurality of protrusions 11 contacting the wafer 14 are formed on the upper surface 10a, and suction holes 12 are formed in the plurality of protrusions 11, respectively, to vacuum-absorb the wafer 14. As a result, the contact area with the bottom surface of the wafer is limited to the contact area of the protrusion, thereby minimizing the contact area.

따라서, 본 발명에 따르면, 반도체 제조 공정중 웨이퍼 운반 과정에서 발생할 수 있는 오염이 극소화되는 효과가 있다.Therefore, according to the present invention, there is an effect that the contamination that may occur in the wafer transport process during the semiconductor manufacturing process is minimized.

Description

반도체 웨이퍼 운반용 진공튀저Vacuum Wafer Transporter for Semiconductor Wafer

제1도는 종래의 진공튀저를 나타낸 부분 절결사시도이다.1 is a partially cutaway perspective view showing a conventional vacuum fryer.

제2도는 종래의 진공튀저에 의해 웨이퍼가 흡착된 상태를 나타내는 단면구조도이다.2 is a cross-sectional view showing a state in which a wafer is adsorbed by a conventional vacuum plunger.

제3도는 종래의 진공튀저에 의해 파티클이 형성된 모습을 나타내는 웨이퍼의 저면도이다.3 is a bottom view of a wafer showing a state in which particles are formed by a conventional vacuum splatter.

제4도는 본 발명에 따른 진공튀저를 나타낸 부분 절결사시도이다.4 is a partially cutaway perspective view showing a vacuum fryer according to the present invention.

제5도는 본 발명에 따른 진공튀저에 의해 웨이퍼가 흡착된 상태의 단면구조도이다.5 is a cross-sectional structural view of a state in which a wafer is adsorbed by a vacuum plunger according to the present invention.

제6도는 본 발명에 따른 진공튀저에 의해 파티클이 형성된 모습을 나타내는 웨이퍼의 저면도이다.6 is a bottom view of a wafer showing a state in which particles are formed by a vacuum splasher according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10 : 진공튀저(Vacuum Tweezer) 11 : 돌출부10: Vacuum Tweezer 11: Projection

12 : 흡착구멍 13 : 연결구멍12: suction hole 13: connection hole

14 : 웨이퍼 15 : 파티클(Particle)14 wafer 15 particle

본 발명은 반도체 웨이퍼 운반용 진공튀저(Vacuum Tweezer)에 관한 것으로서, 더욱 상세하게는 반도체 웨이퍼의 진공흡착시 웨이퍼의 저면에 형성되는 파티클(Particle)을 줄일 수 있도록 한 반도체 웨이퍼 운반용 진공튀저에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum wafer transporter (Vacuum Tweezer), and more particularly to a semiconductor wafer transporter vacuum blower that can reduce the particles (particles) formed on the bottom surface of the wafer during vacuum adsorption of the semiconductor wafer.

일반적으로 반도체는 수백만분의 일이라도, 원치않는 오염에 매우 민감하다. 대표적인 오염원으로는 공기, 생산설비, 사람, 물, 약품, 가스, 정전기(Static Charge)등이 있고, 특히 웨이퍼의 취급시 운반하는 과정에서 오염되는 비중도 크다.In general, semiconductors, even millions of times, are very sensitive to unwanted contamination. Representative pollutants include air, production facilities, people, water, chemicals, gases, static charges, etc., and in particular, the proportion of contamination during transportation of wafers is large.

웨이퍼의 취급시 웨이퍼 오염에 대한 가장 큰 위험은 조작자의 손이나 손가락이다. 즉 피부에 항상 존재하는 염분과 지방분은 나트륨 오염으로 소자를 못쓰게 한다. 따라서 스테인레스로 제조된 튀저(Limited Grasp Tweezer)를 사용하게 되었고, 이 스테인레스 튀저는 웨이퍼의 가장자리만 잡게 하므로써 오염을 최소한으로 줄일 수 있다.The greatest risk for wafer contamination when handling a wafer is the operator's hand or finger. In other words, the salt and fat always present in the skin can prevent the device from sodium contamination. Therefore, a stainless steel limiter (Limited Grasp Tweezer) is used, which minimizes contamination by holding only the edge of the wafer.

그러나 이러한 스테인레스 튀저는 웨이퍼를 잡아 PR막이 찢어지는 결과를 초래하므로 이 역시 웨이퍼에 상처를 주어 결정 결함의 원인이 되게 하고, 공정중에 그 결함이 웨이퍼속으로 전파되기도 한다.However, this stainless fryer catches the wafer and results in the PR film being torn, which also damages the wafer, causing crystal defects, and during the process, the defect propagates into the wafer.

이러한 문제를 해결하기 위한 방안으로 진공튀저가 개발되었다. 진공튀저는 웨이퍼의 저면을 진공흡착함으로써 상기와 같은 스테인레스 튀저의 문제를 해결하였다.In order to solve this problem, vacuum splatters have been developed. The vacuum splasher solved the problem of the stainless steel splasher by vacuum-absorbing the bottom surface of the wafer.

제1도는 상기한 진공튀저를 나타낸 사시도로서, 진공튀저(1)는 대략 육면체의긴 막대형상이고, 속이 빈 중공형태이다. 이러한 진공튀저(1)는 일측에 복수개의 흡착구멍(2)이 나란하게 형성되어 있고, 타측에는 진공발생 장치(도시안됨)와 연결되는 연결구멍(3)이 형성되어 있다.FIG. 1 is a perspective view showing the above-mentioned vacuum chuck, wherein the vacuum plunger 1 is a substantially hexahedron-shaped long rod and hollow hollow form. The vacuum plunger 1 has a plurality of adsorption holes 2 formed side by side on one side, and a connection hole 3 connected to a vacuum generating device (not shown) is formed on the other side.

따라서 제2도에 도시된 바와 같이 웨이퍼(4)의 저면(4a)에 흡착구멍(2)이 형성된 진공튀저(1)의 상면(1a)을 밀착시키고 진공발생장치를 작동시키게 되면, 연결구멍(3)을 통해 진공이 작용하여 진공튀저(1)의 내부가 진공상태가 되는 것이므로 웨이퍼(4)의 저면(4a)은 진공튀저(1)의 흡착구멍(2) 에 의해 진공흡착되어 진공튀저(1)의 상면(1a)에 밀착되는 것이고, 이로써 진공튀저(1)에 웨이퍼(4)가 고정되어 웨이퍼의 운반이 가능하게 되는 것이다.Therefore, as shown in FIG. 2, when the upper surface 1a of the vacuum plunger 1 having the adsorption hole 2 is formed in close contact with the bottom surface 4a of the wafer 4 and the vacuum generator is operated, the connection hole ( 3) Since the vacuum is applied to the inside of the vacuum thrower 1 to be in a vacuum state, the bottom surface 4a of the wafer 4 is vacuum-adsorbed by the suction holes 2 of the vacuum thrower 1 and the vacuum splasher ( It is in close contact with the upper surface 1a of 1), whereby the wafer 4 is fixed to the vacuum plunger 1, so that the wafer can be transported.

그러나 이러한 진공튀저(1)는 흡착구멍(2)을 형성한 상면(1a)이 편평한 구조이므로, 웨이퍼(4)의 진공흡착시 웨이퍼(4)의 저면(4a)과 접촉면적이 크다. 따라서 제3도에서와 같이 웨이퍼(4)의 저면(4a)에 진공튀저(1)의 상면(1a)과 대략 동일한 형상의 파티클(5)이 형성되어 웨이퍼(4)를 오염시키게 되었던 것이다.However, since the upper surface 1a on which the suction hole 2 is formed is a flat structure, the vacuum splasher 1 has a large contact area with the bottom surface 4a of the wafer 4 during vacuum suction of the wafer 4. Accordingly, as shown in FIG. 3, particles 5 having substantially the same shape as the top surface 1a of the vacuum blower 1 are formed on the bottom surface 4a of the wafer 4 to contaminate the wafer 4.

이와 같이 진공튀저(1)로 웨이퍼(4)를 진공흡착하여 운반하는 작업은 주로 캐리어(Carrier)에서 보우트(Boat)로 또는 보우트에서 캐리어로 이동시킬때 행하여지고, 이러한 웨이퍼 운반작업은 반도체 전체 제조공정중 많은 횟수에 걸쳐 반복적으로 행하여지기 때문에 웨이퍼 오염에 큰 영향을 주게 되며, 이러한 웨이퍼의 오염은 반도체 제조공정중에 또 다른 오염을 유발하게 되므로 결국 오염으로 인해 반도체의 기능이 저하되고, 이로써 수율이 저하되는 문제점이 있었다.As such, the vacuum suction and conveyance of the wafer 4 by the vacuum bouncer 1 is mainly performed when the carrier is moved from the carrier to the boat or from the boat to the carrier. Since it is repeatedly performed a large number of times during the process, the contamination of the wafer has a great influence, and the contamination of the wafer causes another contamination during the semiconductor manufacturing process, and thus the contamination of the semiconductor degrades due to the contamination, thereby yielding There was a problem of deterioration.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은, 웨이퍼의 운반시 웨이퍼의 지면을 진공튀저로 진공흡착하는 과정에서 발생할 수 있는 파티클을 극소화함으로써 웨이퍼의 취급에 따른 오염을 방지할 수 있는 반도체 웨이퍼 운반용 진공튀저를 제공하는 데 있다.The present invention is to solve the conventional problems as described above, the object is to minimize the particles that can occur in the process of vacuum suction the surface of the wafer with a vacuum buzzer during transportation of the wafer to prevent contamination due to the handling of the wafer A vacuum wafer for transporting a semiconductor wafer can be provided.

상기의 목적은 진공발생장치와 연결되는 것으로 상면 일측에 복수개의 흡착구멍이 형성되어 이 흡착구멍으로 웨이퍼를 진공흡착하여 운반하기 위한 반도체 웨이퍼 운반용 진공튀저에 있어서, 상면에 웨이퍼와 접촉하는 복수개의 돌출부를 형성하고, 이 복수개의 돌출부에 흡착구멍을 각각 형성하여 웨이퍼를 진공흡착함으로써 웨이퍼 저면과의 접촉면적이 돌출부의 접촉면적으로 국한되어 최소화되는 것을 특징으로 하는 반도체 웨이퍼 운반용 진공튀저에 의해 달성될 수 있다.The above object is to be connected to the vacuum generating device, a plurality of suction holes are formed on one side of the upper surface of the semiconductor wafer transport vacuum buzzer for vacuum suction and transport the wafer to the suction hole, a plurality of protrusions in contact with the wafer on the upper surface By forming suction holes in the plurality of protrusions, and vacuum adsorbing the wafer, the contact area with the bottom surface of the wafer is limited to the contact area of the protrusion, thereby minimizing it. have.

이하, 본 발명에 따른 반도체 웨이퍼 운반용 진공튀저를 첨부도면에 의하여 상세하게 설명한다. 제4도는 본 발명에 따른 진공튀저를 나타낸 사시도로서, 진공튀저(10)는 대략 육면체의 긴 막대형상이고, 속이 빈 중공형태이다. 이러한 진공튀저(10)는 상면(10a) 일측에 복수개의 돌출부(111)를 구비하고 , 이 복수개의 돌출부(11)의 중앙에 내부의 중공부와 연통하는 흡착구멍(12)을 수직방향으로 각각 형성한다.Hereinafter, the vacuum wafer for conveying semiconductor wafers according to the present invention will be described in detail with reference to the accompanying drawings. 4 is a perspective view showing a vacuum squirter according to the present invention, wherein the vacuum squirter 10 is a substantially hexahedron-shaped rod-shaped, hollow hollow form. The vacuum plunger 10 is provided with a plurality of protrusions 111 on one side of the upper surface 10a, each of the suction holes 12 in communication with the hollow portion in the center of the plurality of protrusions 11 in the vertical direction, respectively. Form.

상기 돌출부(11)와 흡착구멍(12)은 타원형으로 형성하는 것이 바람직하고, 소정간격으로 이격시켜 나란하게 형성한다. 또한 상기 흡착구멍(12)이 형성된 위치의 반대쪽인 진공튀저(10)의 상면(10a)에는 진공발생장치(도시안됨)와 연결되는 연결구멍(13)을 형성한 구성이다.The protrusion 11 and the suction hole 12 is preferably formed in an elliptical shape, and are formed side by side at a predetermined interval. In addition, the upper surface 10a of the vacuum thrower 10 opposite to the position where the suction hole 12 is formed is formed with a connection hole 13 connected to the vacuum generator (not shown).

따라서 제5도에 도시된 바와 같이 웨이퍼(14)의 저면(14a)에 흡착구멍(12)이 형성된 돌출부(11)의 상면을 밀착시키고 진공발생장치를 작동시키게 되면, 연결구멍(13)을 통해 진공이 작용하여 진공튀저(10)의 내부가 진공상태로 되는 것이므로 웨이퍼(14)의 저면(14a)은 진공튀저(10)의 돌출부(11)에 형성된 흡착구멍(12)에 의해 진공흡착되어 복수개의 돌출부(11) 상면에 밀착되는 것이고, 이로써 진공튀저(10)에 웨이퍼(14)가 고정되어 웨이퍼의 운반이 가능하게 되는 것이다.Therefore, as shown in FIG. 5, when the upper surface of the protrusion 11 having the adsorption hole 12 is formed on the bottom surface 14a of the wafer 14 is brought into close contact with the vacuum generator, the vacuum generating device is operated. Since the inside of the vacuum plunger 10 becomes a vacuum state due to the action of a vacuum, the bottom surface 14a of the wafer 14 is vacuum-absorbed by the adsorption holes 12 formed in the protrusion 11 of the vacuum plunger 10 and thus a plurality of vacuum plungers 10 are formed. It is in close contact with the upper surface of the two projections 11, thereby fixing the wafer 14 to the vacuum plunger 10 to be able to transport the wafer.

이때 본 발명의 진공튀저(10)는 흡착구멍(12)이 형성된 돌출부(11)가 상면(10a)보다는 적어도 높게 돌출형성된 것이므로 웨이퍼(14)의 진공흡착시 웨이퍼(14)의 저면(14a)과 돌출부(11)의 상면이 접촉하게 된다. 따라서 웨이퍼(14)의 저면(14a)과 진공튀저(10)의 접촉면적이 작아지게 되고, 제6도에서와 같이 웨이퍼(14)의 저면(14a)에 진공튀저(10)의 돌출부(11) 상면과 대략 동일한 형상의 파티클(15)이 형성되어 웨이퍼(14)의 오염을 극소화시키게 되는 것이다.In this case, since the protrusion 11 of the vacuum hole 10 having the suction hole 12 is formed to protrude at least higher than the upper surface 10a, the bottom surface 14a of the wafer 14 and the vacuum suction of the wafer 14 are formed. The upper surface of the protrusion 11 is in contact. Accordingly, the contact area between the bottom face 14a of the wafer 14 and the vacuum splasher 10 becomes small, and as shown in FIG. 6, the protrusion 11 of the vacuum splasher 10 is attached to the bottom face 14a of the wafer 14. Particles 15 having substantially the same shape as the top surface are formed to minimize contamination of the wafer 14.

이상에서와 같이 본 발명에 따른 반도체 웨이퍼 운반용 진공튀저에 의하면, 흡착구멍을 형성한 복수개의 돌출부가 진공튀저의 상면에 돌출형성되어 웨이퍼의 진공흡착시 웨이퍼의 저면에 돌출부의 상면이 접촉됨으로써 웨이퍼와 진공튀저와의 접촉면적이 감소되는 것이고, 이로인해 웨이퍼를 운반하는 과정에서 발생할 수 있는 오염이 극소화되는 효과가 있다.As described above, according to the vacuum wafer transporter according to the present invention, a plurality of protrusions having adsorption holes are formed on the upper surface of the vacuum fuser so that the upper surface of the protrusion contacts the bottom surface of the wafer during vacuum suction of the wafer. The contact area with the vacuum splatter is reduced, thereby minimizing the contamination that may occur during the wafer transport process.

Claims (3)

진공발생장치와 연결되는 것으로 상면 일측에 복수개의 흡착구멍이 형성되어 이 흡착구멍으로 웨이퍼를 진공흡착하여 운반하기 위한 반도체 웨이퍼 운반용 진공튀저에 있어서, 상면에 웨이퍼와 접촉하는 복수개의 돌출부를 형성하고, 이 복수개의 돌출부에 흡착구멍을 각각 형성하여 웨이퍼를 진공흡착함으로써 웨이퍼 저면과의 접촉면적이 돌출부의 접촉면적으로 국한되어 최소화되는 것을 특징으로 하는 반도체 웨이퍼 운반용 진공튀저.A plurality of suction holes are formed on one side of the upper surface to be connected to the vacuum generating device, and the vacuum wafer for conveying the vacuum wafer by vacuum suction and transporting the wafers to the suction holes, the plurality of protrusions contacting the wafer on the upper surface, A vacuum wafer for transporting a semiconductor wafer, characterized in that the contact areas with the bottom of the wafer are limited to the contact areas of the protrusions by minimizing the suction holes by forming suction holes in the plurality of protrusions, respectively. 제1항에 있어서, 상기 돌출부가 2개로 형성되는 것을 특징으로 하는 상기 반도체 웨이퍼 운반용 진공튀저.The vacuum wafer carrying vacuum wafer according to claim 1, wherein the protrusions are formed in two. 제1항에 있어서, 상기 돌출부 및 흡착구멍의 단면 형상이 원형 또는 타원형으로 되는 것을 특징으로 하는 반도체 웨이퍼 운반용 진공튀저.2. The semiconductor wafer conveyance vacuum fuzzer according to claim 1, wherein the cross-sectional shapes of the protrusions and the suction holes are circular or elliptical.
KR1019950033424A 1995-09-30 1995-09-30 Vacuum tweezer for transferring semiconductor wafers KR0181901B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100867094B1 (en) * 2007-07-18 2008-11-04 주식회사 동부하이텍 Loader arm of auto loader

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100867094B1 (en) * 2007-07-18 2008-11-04 주식회사 동부하이텍 Loader arm of auto loader

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