KR19980018322A - 반도체 칩에 결합된 기생 인덕턴스를 줄이기 위한 패키지와 패키지와 반도체 칩간의 조립에 사용된 콜레트 - Google Patents
반도체 칩에 결합된 기생 인덕턴스를 줄이기 위한 패키지와 패키지와 반도체 칩간의 조립에 사용된 콜레트 Download PDFInfo
- Publication number
- KR19980018322A KR19980018322A KR1019970037090A KR19970037090A KR19980018322A KR 19980018322 A KR19980018322 A KR 19980018322A KR 1019970037090 A KR1019970037090 A KR 1019970037090A KR 19970037090 A KR19970037090 A KR 19970037090A KR 19980018322 A KR19980018322 A KR 19980018322A
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Packaging Frangible Articles (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP96-204746 | 1996-08-02 | ||
JP8204746A JP2812313B2 (ja) | 1996-08-02 | 1996-08-02 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR19980018322A true KR19980018322A (ko) | 1998-06-05 |
Family
ID=16495650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970037090A KR19980018322A (ko) | 1996-08-02 | 1997-08-02 | 반도체 칩에 결합된 기생 인덕턴스를 줄이기 위한 패키지와 패키지와 반도체 칩간의 조립에 사용된 콜레트 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2812313B2 (ja) |
KR (1) | KR19980018322A (ja) |
DE (1) | DE19733416A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW594888B (en) | 2001-09-05 | 2004-06-21 | Hitachi Ltd | Semiconductor device and manufacturing method thereof and wireless communication device |
JP4624170B2 (ja) * | 2005-04-25 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
DE102013214486A1 (de) * | 2013-07-24 | 2015-01-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5314345A (en) * | 1976-07-26 | 1978-02-08 | Mitsubishi Electric Corp | Stability decision method of associated system |
JPH02146431U (ja) * | 1989-05-15 | 1990-12-12 | ||
JPH03214643A (ja) * | 1990-01-19 | 1991-09-19 | Hitachi Ltd | 真空吸着治具 |
JPH0465439U (ja) * | 1990-10-17 | 1992-06-08 |
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1996
- 1996-08-02 JP JP8204746A patent/JP2812313B2/ja not_active Expired - Fee Related
-
1997
- 1997-08-01 DE DE19733416A patent/DE19733416A1/de not_active Withdrawn
- 1997-08-02 KR KR1019970037090A patent/KR19980018322A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2812313B2 (ja) | 1998-10-22 |
DE19733416A1 (de) | 1998-02-05 |
JPH1050737A (ja) | 1998-02-20 |
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