KR102921850B1 - 폴리이미드 필름, 금속 피복 적층판 및 플렉시블 회로 기판 - Google Patents

폴리이미드 필름, 금속 피복 적층판 및 플렉시블 회로 기판

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Publication number
KR102921850B1
KR102921850B1 KR1020200076889A KR20200076889A KR102921850B1 KR 102921850 B1 KR102921850 B1 KR 102921850B1 KR 1020200076889 A KR1020200076889 A KR 1020200076889A KR 20200076889 A KR20200076889 A KR 20200076889A KR 102921850 B1 KR102921850 B1 KR 102921850B1
Authority
KR
South Korea
Prior art keywords
bent portion
layer
axis direction
polyimide
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020200076889A
Other languages
English (en)
Korean (ko)
Other versions
KR20210001986A (ko
Inventor
다이키 무카이
히로키 마츠이
나오유키 쇼지
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20210001986A publication Critical patent/KR20210001986A/ko
Application granted granted Critical
Publication of KR102921850B1 publication Critical patent/KR102921850B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020200076889A 2019-06-28 2020-06-24 폴리이미드 필름, 금속 피복 적층판 및 플렉시블 회로 기판 Active KR102921850B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019122330 2019-06-28
JPJP-P-2019-122330 2019-06-28

Publications (2)

Publication Number Publication Date
KR20210001986A KR20210001986A (ko) 2021-01-06
KR102921850B1 true KR102921850B1 (ko) 2026-02-03

Family

ID=73891141

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200076889A Active KR102921850B1 (ko) 2019-06-28 2020-06-24 폴리이미드 필름, 금속 피복 적층판 및 플렉시블 회로 기판

Country Status (4)

Country Link
JP (1) JP7730624B2 (https=)
KR (1) KR102921850B1 (https=)
CN (1) CN112153807A (https=)
TW (1) TWI911158B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115742354B (zh) * 2022-10-27 2026-02-17 中电科蓝天科技股份有限公司 一种模块化柔性合页铰链及其制备方法
KR20250170069A (ko) * 2023-04-03 2025-12-04 가부시끼가이샤 레조낙 폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222664A (ja) 2010-04-07 2011-11-04 Fujikura Ltd フレキシブルプリント基板及びその製造方法
JP2016072405A (ja) * 2014-09-30 2016-05-09 新日鉄住金化学株式会社 フレキシブル回路基板、その使用方法及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858915B2 (ja) 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話
TWI599277B (zh) 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板
JP2019012098A (ja) 2017-06-29 2019-01-24 株式会社ジャパンディスプレイ 表示装置
JP7363019B2 (ja) * 2017-09-27 2023-10-18 大日本印刷株式会社 ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP6509294B2 (ja) 2017-09-28 2019-05-08 株式会社Ｎｓｃ フレキシブルデバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222664A (ja) 2010-04-07 2011-11-04 Fujikura Ltd フレキシブルプリント基板及びその製造方法
JP2016072405A (ja) * 2014-09-30 2016-05-09 新日鉄住金化学株式会社 フレキシブル回路基板、その使用方法及び電子機器

Also Published As

Publication number Publication date
CN112153807A (zh) 2020-12-29
TW202108663A (zh) 2021-03-01
JP7730624B2 (ja) 2025-08-28
KR20210001986A (ko) 2021-01-06
JP2021009997A (ja) 2021-01-28
TWI911158B (zh) 2026-01-11

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