CN112153807A - 聚酰亚胺膜、覆金属层叠板及柔性电路基板 - Google Patents

聚酰亚胺膜、覆金属层叠板及柔性电路基板 Download PDF

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Publication number
CN112153807A
CN112153807A CN202010570679.3A CN202010570679A CN112153807A CN 112153807 A CN112153807 A CN 112153807A CN 202010570679 A CN202010570679 A CN 202010570679A CN 112153807 A CN112153807 A CN 112153807A
Authority
CN
China
Prior art keywords
layer
polyimide film
axis direction
polyimide
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010570679.3A
Other languages
English (en)
Chinese (zh)
Inventor
向井大挥
松井弘贵
庄司直幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Publication of CN112153807A publication Critical patent/CN112153807A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202010570679.3A 2019-06-28 2020-06-19 聚酰亚胺膜、覆金属层叠板及柔性电路基板 Pending CN112153807A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019122330 2019-06-28
JP2019-122330 2019-06-28

Publications (1)

Publication Number Publication Date
CN112153807A true CN112153807A (zh) 2020-12-29

Family

ID=73891141

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010570679.3A Pending CN112153807A (zh) 2019-06-28 2020-06-19 聚酰亚胺膜、覆金属层叠板及柔性电路基板

Country Status (4)

Country Link
JP (1) JP7730624B2 (https=)
KR (1) KR102921850B1 (https=)
CN (1) CN112153807A (https=)
TW (1) TWI911158B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115742354A (zh) * 2022-10-27 2023-03-07 中电科能源有限公司 一种模块化柔性合页铰链及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250170069A (ko) * 2023-04-03 2025-12-04 가부시끼가이샤 레조낙 폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072405A (ja) * 2014-09-30 2016-05-09 新日鉄住金化学株式会社 フレキシブル回路基板、その使用方法及び電子機器
TW201920373A (zh) * 2017-09-27 2019-06-01 日商大日本印刷股份有限公司 膜、聚醯亞胺膜、積層體、顯示器用構件、觸摸面板構件、液晶顯示裝置、及有機電致發光顯示裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5355478B2 (ja) * 2010-04-07 2013-11-27 株式会社フジクラ フレキシブルプリント基板及びその製造方法
JP5858915B2 (ja) 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話
TWI599277B (zh) 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板
JP2019012098A (ja) 2017-06-29 2019-01-24 株式会社ジャパンディスプレイ 表示装置
JP6509294B2 (ja) 2017-09-28 2019-05-08 株式会社Ｎｓｃ フレキシブルデバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072405A (ja) * 2014-09-30 2016-05-09 新日鉄住金化学株式会社 フレキシブル回路基板、その使用方法及び電子機器
TW201920373A (zh) * 2017-09-27 2019-06-01 日商大日本印刷股份有限公司 膜、聚醯亞胺膜、積層體、顯示器用構件、觸摸面板構件、液晶顯示裝置、及有機電致發光顯示裝置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115742354A (zh) * 2022-10-27 2023-03-07 中电科能源有限公司 一种模块化柔性合页铰链及其制备方法

Also Published As

Publication number Publication date
TW202108663A (zh) 2021-03-01
KR102921850B1 (ko) 2026-02-03
JP7730624B2 (ja) 2025-08-28
KR20210001986A (ko) 2021-01-06
JP2021009997A (ja) 2021-01-28
TWI911158B (zh) 2026-01-11

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