JP7730624B2 - ポリイミドフィルム、金属張積層板及びフレキシブル回路基板 - Google Patents

ポリイミドフィルム、金属張積層板及びフレキシブル回路基板

Info

Publication number
JP7730624B2
JP7730624B2 JP2020094403A JP2020094403A JP7730624B2 JP 7730624 B2 JP7730624 B2 JP 7730624B2 JP 2020094403 A JP2020094403 A JP 2020094403A JP 2020094403 A JP2020094403 A JP 2020094403A JP 7730624 B2 JP7730624 B2 JP 7730624B2
Authority
JP
Japan
Prior art keywords
layer
polyimide
fpc
bending
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020094403A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021009997A5 (https=
JP2021009997A (ja
Inventor
大揮 向井
弘貴 松井
直幸 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Steel Chemical and Materials Co Ltd
Publication of JP2021009997A publication Critical patent/JP2021009997A/ja
Publication of JP2021009997A5 publication Critical patent/JP2021009997A5/ja
Application granted granted Critical
Publication of JP7730624B2 publication Critical patent/JP7730624B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020094403A 2019-06-28 2020-05-29 ポリイミドフィルム、金属張積層板及びフレキシブル回路基板 Active JP7730624B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019122330 2019-06-28
JP2019122330 2019-06-28

Publications (3)

Publication Number Publication Date
JP2021009997A JP2021009997A (ja) 2021-01-28
JP2021009997A5 JP2021009997A5 (https=) 2023-05-09
JP7730624B2 true JP7730624B2 (ja) 2025-08-28

Family

ID=73891141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020094403A Active JP7730624B2 (ja) 2019-06-28 2020-05-29 ポリイミドフィルム、金属張積層板及びフレキシブル回路基板

Country Status (4)

Country Link
JP (1) JP7730624B2 (https=)
KR (1) KR102921850B1 (https=)
CN (1) CN112153807A (https=)
TW (1) TWI911158B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115742354B (zh) * 2022-10-27 2026-02-17 中电科蓝天科技股份有限公司 一种模块化柔性合页铰链及其制备方法
KR20250170069A (ko) * 2023-04-03 2025-12-04 가부시끼가이샤 레조낙 폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5355478B2 (ja) * 2010-04-07 2013-11-27 株式会社フジクラ フレキシブルプリント基板及びその製造方法
JP5858915B2 (ja) 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話
TWI599277B (zh) 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板
JP6461540B2 (ja) * 2014-09-30 2019-01-30 日鉄ケミカル＆マテリアル株式会社 フレキシブル回路基板、その使用方法及び電子機器
JP2019012098A (ja) 2017-06-29 2019-01-24 株式会社ジャパンディスプレイ 表示装置
JP7363019B2 (ja) * 2017-09-27 2023-10-18 大日本印刷株式会社 ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP6509294B2 (ja) 2017-09-28 2019-05-08 株式会社Ｎｓｃ フレキシブルデバイス

Also Published As

Publication number Publication date
CN112153807A (zh) 2020-12-29
TW202108663A (zh) 2021-03-01
KR102921850B1 (ko) 2026-02-03
KR20210001986A (ko) 2021-01-06
JP2021009997A (ja) 2021-01-28
TWI911158B (zh) 2026-01-11

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