KR102915461B1 - 기판 프로세싱 시스템들의 모델 기반 제어 - Google Patents

기판 프로세싱 시스템들의 모델 기반 제어

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Publication number
KR102915461B1
KR102915461B1 KR1020257003228A KR20257003228A KR102915461B1 KR 102915461 B1 KR102915461 B1 KR 102915461B1 KR 1020257003228 A KR1020257003228 A KR 1020257003228A KR 20257003228 A KR20257003228 A KR 20257003228A KR 102915461 B1 KR102915461 B1 KR 102915461B1
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South Korea
Prior art keywords
plant
parameter
fluid
support assembly
substrate support
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Application number
KR1020257003228A
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English (en)
Korean (ko)
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KR20250022890A (ko
Inventor
타오 장
카이 리우
에릭 사무론
Original Assignee
램 리써치 코포레이션
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Priority to KR1020267001517A priority Critical patent/KR20260022464A/ko
Publication of KR20250022890A publication Critical patent/KR20250022890A/ko
Application granted granted Critical
Publication of KR102915461B1 publication Critical patent/KR102915461B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B17/00—Systems involving the use of models or simulators of said systems
    • G05B17/02—Systems involving the use of models or simulators of said systems electric
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/41—Servomotor, servo controller till figures
    • G05B2219/41303—Flow rate valve controls speed
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49004—Modeling, making, manufacturing model to control machine, cmm

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Control Of Temperature (AREA)
  • Feedback Control In General (AREA)
KR1020257003228A 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어 Active KR102915461B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020267001517A KR20260022464A (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16/014,606 US10741429B2 (en) 2018-06-21 2018-06-21 Model-based control of substrate processing systems
US16/014,606 2018-06-21
PCT/US2019/037234 WO2019245908A1 (en) 2018-06-21 2019-06-14 Model-based control of substrate processing systems
KR1020217001795A KR102763350B1 (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020217001795A Division KR102763350B1 (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020267001517A Division KR20260022464A (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어

Publications (2)

Publication Number Publication Date
KR20250022890A KR20250022890A (ko) 2025-02-17
KR102915461B1 true KR102915461B1 (ko) 2026-01-19

Family

ID=68981660

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020257003228A Active KR102915461B1 (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어
KR1020217001795A Active KR102763350B1 (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어
KR1020267001517A Pending KR20260022464A (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020217001795A Active KR102763350B1 (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어
KR1020267001517A Pending KR20260022464A (ko) 2018-06-21 2019-06-14 기판 프로세싱 시스템들의 모델 기반 제어

Country Status (4)

Country Link
US (1) US10741429B2 (enExample)
JP (1) JP7454509B2 (enExample)
KR (3) KR102915461B1 (enExample)
WO (1) WO2019245908A1 (enExample)

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WO2022070310A1 (ja) * 2020-09-30 2022-04-07 株式会社Kokusai Electric 基板処理装置、温度制御プログラム、半導体装置の製造方法及び温度制御方法
US12130606B2 (en) * 2021-12-22 2024-10-29 Applied Materials, Inc. Disturbance compensation for substrate processing recipes
JP7763421B2 (ja) * 2021-12-24 2025-11-04 Ｎｔｔ株式会社 温度制御装置、温度制御システム及び温度制御方法
KR102952769B1 (ko) 2022-12-07 2026-04-15 삼성전자주식회사 반도체 공정 설비용 온도 제어 시스템 및 온도 제어 방법
US20250117002A1 (en) * 2023-10-04 2025-04-10 Applied Materials, Inc. Precision timing of processing actions in manufacturing systems

Citations (3)

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US20120170639A1 (en) 2011-01-04 2012-07-05 Johnson Controls Technology Company Delay compensation for feedback controllers
KR101367086B1 (ko) 2013-10-17 2014-02-24 (주)테키스트 반도체 제조 설비를 위한 온도제어 시스템
JP2015114677A (ja) 2013-12-09 2015-06-22 株式会社ニコン 駆動システム及び駆動方法、露光装置及び露光方法、並びに防振装置及び防振方法

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US6299753B1 (en) 1999-09-01 2001-10-09 Applied Materials, Inc. Double pressure vessel chemical dispenser unit
US7376472B2 (en) * 2002-09-11 2008-05-20 Fisher-Rosemount Systems, Inc. Integrated model predictive control and optimization within a process control system
JP2009064814A (ja) 2007-09-04 2009-03-26 Hitachi High-Technologies Corp プラズマ処理装置
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
JP5540586B2 (ja) 2009-07-01 2014-07-02 ソニー株式会社 信号処理回路、ａｇｃ回路、および記録再生装置
KR20110054837A (ko) 2009-11-18 2011-05-25 삼성전자주식회사 온도제어시스템
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JP6034231B2 (ja) * 2012-07-25 2016-11-30 株式会社Kelk 半導体製造装置用温度調整装置、半導体製造におけるｐｉｄ定数演算方法、及び半導体製造装置用温度調整装置の運転方法
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US20120170639A1 (en) 2011-01-04 2012-07-05 Johnson Controls Technology Company Delay compensation for feedback controllers
KR101367086B1 (ko) 2013-10-17 2014-02-24 (주)테키스트 반도체 제조 설비를 위한 온도제어 시스템
JP2015114677A (ja) 2013-12-09 2015-06-22 株式会社ニコン 駆動システム及び駆動方法、露光装置及び露光方法、並びに防振装置及び防振方法

Also Published As

Publication number Publication date
US20190393059A1 (en) 2019-12-26
US10741429B2 (en) 2020-08-11
KR102763350B1 (ko) 2025-02-04
KR20210014738A (ko) 2021-02-09
WO2019245908A1 (en) 2019-12-26
KR20260022464A (ko) 2026-02-19
KR20250022890A (ko) 2025-02-17
JP7454509B2 (ja) 2024-03-22
JP2021528854A (ja) 2021-10-21

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