KR102845027B1 - 프로세싱 스테이션으로 물체를 이동시키는 디바이스 및 방법, 이송 시스템 및 프로세싱 장치 - Google Patents

프로세싱 스테이션으로 물체를 이동시키는 디바이스 및 방법, 이송 시스템 및 프로세싱 장치

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Publication number
KR102845027B1
KR102845027B1 KR1020227001988A KR20227001988A KR102845027B1 KR 102845027 B1 KR102845027 B1 KR 102845027B1 KR 1020227001988 A KR1020227001988 A KR 1020227001988A KR 20227001988 A KR20227001988 A KR 20227001988A KR 102845027 B1 KR102845027 B1 KR 102845027B1
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KR
South Korea
Prior art keywords
carrier
movement
substrate
processing
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227001988A
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English (en)
Korean (ko)
Other versions
KR20220024771A (ko
Inventor
뤼디거 프레처
Original Assignee
아토테크 도이칠란트 게엠베하 운트 콤파니 카게
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Application filed by 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 filed Critical 아토테크 도이칠란트 게엠베하 운트 콤파니 카게
Publication of KR20220024771A publication Critical patent/KR20220024771A/ko
Application granted granted Critical
Publication of KR102845027B1 publication Critical patent/KR102845027B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/67742—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/12—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length
    • B05C3/132—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length supported on conveying means
    • H01L21/67126—
    • H01L21/67173—
    • H01L21/6723—
    • H01L21/67718—
    • H01L21/67751—
    • H01L21/68707—
    • H01L21/68764—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Specific Conveyance Elements (AREA)
  • General Factory Administration (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Multi-Process Working Machines And Systems (AREA)
KR1020227001988A 2019-06-26 2020-06-24 프로세싱 스테이션으로 물체를 이동시키는 디바이스 및 방법, 이송 시스템 및 프로세싱 장치 Active KR102845027B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19182628.8A EP3758049B8 (en) 2019-06-26 2019-06-26 Device and method for moving an object into a processing station, conveying system and processing apparatus
EP19182628.8 2019-06-26
PCT/EP2020/067697 WO2020260389A1 (en) 2019-06-26 2020-06-24 Device and method for moving an object into a processing station, conveying system and processing apparatus

Publications (2)

Publication Number Publication Date
KR20220024771A KR20220024771A (ko) 2022-03-03
KR102845027B1 true KR102845027B1 (ko) 2025-08-11

Family

ID=67105738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227001988A Active KR102845027B1 (ko) 2019-06-26 2020-06-24 프로세싱 스테이션으로 물체를 이동시키는 디바이스 및 방법, 이송 시스템 및 프로세싱 장치

Country Status (9)

Country Link
US (1) US12205838B2 (https=)
EP (1) EP3758049B8 (https=)
JP (1) JP7539935B2 (https=)
KR (1) KR102845027B1 (https=)
CN (1) CN114144870B (https=)
PH (1) PH12021553206A1 (https=)
PT (1) PT3758049T (https=)
TW (1) TWI811554B (https=)
WO (1) WO2020260389A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4332277A1 (en) 2022-08-29 2024-03-06 Atotech Deutschland GmbH & Co. KG Apparatus and method for non-immersive wet-chemical treatment of a planar substrate and device for holding the substrate
WO2024046871A1 (en) 2022-08-29 2024-03-07 Atotech Deutschland GmbH & Co. KG Device and system for delivering a stream of liquid and apparatus and method for non-immersive wet-chemical treatment of a planar substrate
EP4679496A1 (en) 2024-07-12 2026-01-14 Atotech Deutschland GmbH & Co. KG Apparatus and method for non-immersive wet-chemical treatment of a substrate and device for holding the substrate
EP4715086A1 (en) 2024-09-23 2026-03-25 Atotech Deutschland GmbH & Co. KG Method and apparatus for non-immersive plating of a surface of a workpiece

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030012885A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing and plating planar articles
JP2014189806A (ja) * 2013-03-26 2014-10-06 Ebara Corp めっき装置およびめっき方法

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
GB8531723D0 (en) * 1985-12-24 1986-02-05 Vg Instr Group Wafer transfer apparatus
US20030077396A1 (en) * 2001-10-23 2003-04-24 Lecompte Robert S. Dip coating system
JP3827627B2 (ja) 2002-08-13 2006-09-27 株式会社荏原製作所 めっき装置及びめっき方法
JP2007056350A (ja) 2005-08-26 2007-03-08 Akebono Brake Ind Co Ltd メッキ装置
JP2012195562A (ja) * 2011-02-28 2012-10-11 Hitachi Kokusai Electric Inc 異径基板用アタッチメントおよび基板処理装置ならびに基板若しくは半導体デバイスの製造方法
US9449862B2 (en) 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
WO2014116681A2 (en) * 2013-01-22 2014-07-31 Brooks Automation, Inc. Substrate transport
JP6077886B2 (ja) * 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
JP6239417B2 (ja) * 2014-03-24 2017-11-29 株式会社荏原製作所 基板処理装置
EP3176288A1 (en) 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
JP6865613B2 (ja) 2017-03-28 2021-04-28 株式会社荏原製作所 基板搬送装置、基板搬送装置の制御装置、基板搬送装置における変位補償方法、当該方法を実施するプログラムおよび当該プログラムが記録された記録媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030012885A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing and plating planar articles
JP2014189806A (ja) * 2013-03-26 2014-10-06 Ebara Corp めっき装置およびめっき方法

Also Published As

Publication number Publication date
US12205838B2 (en) 2025-01-21
KR20220024771A (ko) 2022-03-03
JP7539935B2 (ja) 2024-08-26
WO2020260389A1 (en) 2020-12-30
EP3758049A1 (en) 2020-12-30
EP3758049B1 (en) 2022-02-16
US20220336243A1 (en) 2022-10-20
TWI811554B (zh) 2023-08-11
TW202117892A (zh) 2021-05-01
PT3758049T (pt) 2022-03-21
JP2022538161A (ja) 2022-08-31
CN114144870A (zh) 2022-03-04
EP3758049B8 (en) 2022-03-23
PH12021553206A1 (en) 2022-11-07
CN114144870B (zh) 2025-08-15

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