KR102804109B1 - 기판 상에 마이크로led를 조립하기 위한 방법 및 시스템 - Google Patents

기판 상에 마이크로led를 조립하기 위한 방법 및 시스템 Download PDF

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KR102804109B1
KR102804109B1 KR1020210017940A KR20210017940A KR102804109B1 KR 102804109 B1 KR102804109 B1 KR 102804109B1 KR 1020210017940 A KR1020210017940 A KR 1020210017940A KR 20210017940 A KR20210017940 A KR 20210017940A KR 102804109 B1 KR102804109 B1 KR 102804109B1
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substrate
coupon
microled chips
chips
transfer
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KR20210111155A (ko
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왕 윤다
루 제핑
왕 퀴안
래이차우드후리 소롭
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팔로 알토 리서치 센터, 엘엘씨
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H01L21/52—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • H01L21/67144—
    • H01L21/6835—
    • H01L25/0753—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/232—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising connection or disconnection of parts of a device in response to a measurement
    • H01L2221/68368—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020210017940A 2020-03-02 2021-02-09 기판 상에 마이크로led를 조립하기 위한 방법 및 시스템 Active KR102804109B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/805,911 2020-03-02
US16/805,911 US11348905B2 (en) 2020-03-02 2020-03-02 Method and system for assembly of micro-LEDs onto a substrate

Publications (2)

Publication Number Publication Date
KR20210111155A KR20210111155A (ko) 2021-09-10
KR102804109B1 true KR102804109B1 (ko) 2025-05-09

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US (1) US11348905B2 (enExample)
EP (1) EP3876270B1 (enExample)
JP (1) JP7514777B2 (enExample)
KR (1) KR102804109B1 (enExample)
CN (1) CN113345878B (enExample)
TW (1) TWI858227B (enExample)

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WO2022230952A1 (ja) * 2021-04-27 2022-11-03 昭和電工マテリアルズ株式会社 Ｌｅｄ移設部材及びｌｅｄ装置の製造方法
US12263576B2 (en) 2021-08-19 2025-04-01 Hyundai Mobis Co., Ltd. Robot system for automated assembly of modular component
CN115771214A (zh) * 2021-09-09 2023-03-10 日月光半导体制造股份有限公司 用于形成多个分离组件的模具及装置
EP4410067A4 (en) * 2021-09-30 2025-10-01 Univ Texas TOOL AND METHODS FOR TAKER-PLACER ASSEMBLY
TWI807544B (zh) * 2021-12-17 2023-07-01 友達光電股份有限公司 顯示面板及其製造方法
KR102700929B1 (ko) * 2021-12-21 2024-08-30 한국광기술원 Led 측정장치
CN114709163A (zh) * 2022-03-30 2022-07-05 北京石油化工学院 液气双态Mini/Micro LED芯片巨量转移用晶膜及制作方法
CN115101439B (zh) * 2022-05-27 2025-05-02 黄招凤 物料传送系统及方法
KR102787169B1 (ko) * 2022-09-06 2025-03-26 삼성전자주식회사 마이크로 반도체 칩의 대량 전사 방법 및 대량 전사 장치
CN117976569A (zh) * 2022-10-25 2024-05-03 群创光电股份有限公司 电子装置及其制作方法
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TWI872659B (zh) * 2023-08-23 2025-02-11 雷傑科技股份有限公司 晶粒填補方法
WO2025057271A1 (ja) * 2023-09-11 2025-03-20 東京エレクトロン株式会社 接合装置、接合システム、接合方法、載せ替え装置、及び載せ替え方法
TWI879346B (zh) * 2023-12-26 2025-04-01 前源科技股份有限公司 電子元件的接合方法與巨量轉移電子元件的方法
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Publication number Publication date
EP3876270B1 (en) 2025-01-08
US20210272935A1 (en) 2021-09-02
US11348905B2 (en) 2022-05-31
EP3876270A1 (en) 2021-09-08
JP7514777B2 (ja) 2024-07-11
JP2021140144A (ja) 2021-09-16
KR20210111155A (ko) 2021-09-10
CN113345878B (zh) 2024-04-05
TW202135279A (zh) 2021-09-16
CN113345878A (zh) 2021-09-03
TWI858227B (zh) 2024-10-11

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