KR102803105B1 - 질화물 재료 및 그것으로 이루어지는 압전체 및 그 압전체를 이용한 mems 디바이스, 트랜지스터, 인버터, 트랜스듀서, saw 디바이스 및 강유전체 메모리 - Google Patents
질화물 재료 및 그것으로 이루어지는 압전체 및 그 압전체를 이용한 mems 디바이스, 트랜지스터, 인버터, 트랜스듀서, saw 디바이스 및 강유전체 메모리 Download PDFInfo
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- KR102803105B1 KR102803105B1 KR1020237021492A KR20237021492A KR102803105B1 KR 102803105 B1 KR102803105 B1 KR 102803105B1 KR 1020237021492 A KR1020237021492 A KR 1020237021492A KR 20237021492 A KR20237021492 A KR 20237021492A KR 102803105 B1 KR102803105 B1 KR 102803105B1
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- nitride
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- nitride material
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- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0602—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with two or more other elements chosen from metals, silicon or boron
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- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/072—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
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- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3293—Tin oxides, stannates or oxide forming salts thereof, e.g. indium tin oxide [ITO]
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
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- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Physical Vapour Deposition (AREA)
- Semiconductor Memories (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-027147 | 2021-02-24 | ||
| JP2021027147A JP7572048B2 (ja) | 2021-02-24 | 2021-02-24 | 窒化物材料およびそれからなる圧電体並びにその圧電体を用いたmemsデバイス、トランジスタ、インバーター、トランスデューサー、sawデバイスおよび強誘電体メモリ |
| PCT/JP2021/042898 WO2022180961A1 (ja) | 2021-02-24 | 2021-11-24 | 窒化物材料およびそれからなる圧電体並びにその圧電体を用いたmemsデバイス、トランジスタ、インバーター、トランスデューサー、sawデバイスおよび強誘電体メモリ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| KR20230111235A KR20230111235A (ko) | 2023-07-25 |
| KR20230111235A9 KR20230111235A9 (ko) | 2024-03-25 |
| KR102803105B1 true KR102803105B1 (ko) | 2025-05-07 |
Family
ID=83047919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237021492A Active KR102803105B1 (ko) | 2021-02-24 | 2021-11-24 | 질화물 재료 및 그것으로 이루어지는 압전체 및 그 압전체를 이용한 mems 디바이스, 트랜지스터, 인버터, 트랜스듀서, saw 디바이스 및 강유전체 메모리 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240101423A1 (https=) |
| EP (1) | EP4273945A4 (https=) |
| JP (1) | JP7572048B2 (https=) |
| KR (1) | KR102803105B1 (https=) |
| CN (1) | CN116897615A (https=) |
| WO (1) | WO2022180961A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022213055A1 (de) * | 2022-12-05 | 2024-06-06 | Robert Bosch Gesellschaft mit beschränkter Haftung | Piezoelektrische Wandlervorrichtung |
| CN116056553B (zh) * | 2023-01-19 | 2025-10-28 | 河北大学 | 基于氮化铝钪的铁电忆阻器、其制备方法及应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013128267A (ja) * | 2011-11-18 | 2013-06-27 | Murata Mfg Co Ltd | 圧電薄膜共振子及び圧電薄膜の製造方法 |
| JP2013148562A (ja) * | 2012-01-23 | 2013-08-01 | National Institute Of Advanced Industrial & Technology | 圧電素子およびその製造方法、ならびに圧電センサ |
| JP2014236051A (ja) * | 2013-05-31 | 2014-12-15 | 株式会社デンソー | 圧電体薄膜及びその製造方法 |
| JP2017045749A (ja) | 2015-08-24 | 2017-03-02 | 株式会社村田製作所 | 窒化アルミニウム圧電薄膜及びその製造方法、並びに圧電材及び圧電部品及び窒化アルミニウム圧電薄膜の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5190841B2 (ja) | 2007-05-31 | 2013-04-24 | 独立行政法人産業技術総合研究所 | 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー |
| JP2009228131A (ja) * | 2008-02-27 | 2009-10-08 | Sumitomo Electric Ind Ltd | 窒化アルミニウム薄膜およびその製造方法 |
| JP6123019B2 (ja) * | 2014-03-03 | 2017-04-26 | 株式会社村田製作所 | 窒化アルミニウム圧電薄膜、圧電材、圧電部品及び窒化アルミニウム圧電薄膜の製造方法 |
| GB2578979B (en) * | 2017-07-07 | 2023-01-18 | Skyworks Solutions Inc | Substituted aluminium nitride for improved acoustic wave filters |
| US11557716B2 (en) * | 2018-02-20 | 2023-01-17 | Akoustis, Inc. | Method and structure of single crystal electronic devices with enhanced strain interface regions by impurity introduction |
| JP7151096B2 (ja) * | 2018-02-21 | 2022-10-12 | 株式会社デンソー | 圧電膜、その製造方法、圧電膜積層体、その製造方法 |
-
2021
- 2021-02-24 JP JP2021027147A patent/JP7572048B2/ja active Active
- 2021-11-24 WO PCT/JP2021/042898 patent/WO2022180961A1/ja not_active Ceased
- 2021-11-24 US US18/264,362 patent/US20240101423A1/en active Pending
- 2021-11-24 EP EP21928055.9A patent/EP4273945A4/en active Pending
- 2021-11-24 CN CN202180094141.2A patent/CN116897615A/zh active Pending
- 2021-11-24 KR KR1020237021492A patent/KR102803105B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013128267A (ja) * | 2011-11-18 | 2013-06-27 | Murata Mfg Co Ltd | 圧電薄膜共振子及び圧電薄膜の製造方法 |
| JP2013148562A (ja) * | 2012-01-23 | 2013-08-01 | National Institute Of Advanced Industrial & Technology | 圧電素子およびその製造方法、ならびに圧電センサ |
| JP2014236051A (ja) * | 2013-05-31 | 2014-12-15 | 株式会社デンソー | 圧電体薄膜及びその製造方法 |
| JP2017045749A (ja) | 2015-08-24 | 2017-03-02 | 株式会社村田製作所 | 窒化アルミニウム圧電薄膜及びその製造方法、並びに圧電材及び圧電部品及び窒化アルミニウム圧電薄膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230111235A (ko) | 2023-07-25 |
| US20240101423A1 (en) | 2024-03-28 |
| JP7572048B2 (ja) | 2024-10-23 |
| CN116897615A (zh) | 2023-10-17 |
| EP4273945A4 (en) | 2025-04-30 |
| JP2022128755A (ja) | 2022-09-05 |
| WO2022180961A1 (ja) | 2022-09-01 |
| KR20230111235A9 (ko) | 2024-03-25 |
| EP4273945A1 (en) | 2023-11-08 |
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