KR102801767B1 - GaN on Si 전계 효과 트랜지스터들과 함께 측면으로 제작된 광전도성 반도체 스위치 - Google Patents
GaN on Si 전계 효과 트랜지스터들과 함께 측면으로 제작된 광전도성 반도체 스위치 Download PDFInfo
- Publication number
- KR102801767B1 KR102801767B1 KR1020237031630A KR20237031630A KR102801767B1 KR 102801767 B1 KR102801767 B1 KR 102801767B1 KR 1020237031630 A KR1020237031630 A KR 1020237031630A KR 20237031630 A KR20237031630 A KR 20237031630A KR 102801767 B1 KR102801767 B1 KR 102801767B1
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- South Korea
- Prior art keywords
- gallium nitride
- electrical contact
- integrated circuit
- semiconductor switch
- circuit structure
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/10—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices being sensitive to infrared radiation, visible or ultraviolet radiation, and having no potential barriers, e.g. photoresistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
- H10F30/2215—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction the devices comprising active layers made of only Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
- H10F77/1246—III-V nitrides, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/95—Circuit arrangements
- H10F77/953—Circuit arrangements for devices having potential barriers
Landscapes
- Junction Field-Effect Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/220,660 | 2021-04-01 | ||
| US17/220,660 US11581448B2 (en) | 2021-04-01 | 2021-04-01 | Photoconductive semiconductor switch laterally fabricated alongside GaN on Si field effect transistors |
| PCT/US2022/022523 WO2022212487A1 (en) | 2021-04-01 | 2022-03-30 | PHOTOCONDUCTIVE SEMICONDUCTOR SWITCH LATERALLY FABRICATED ALONGSIDE GaN ON Si FIELD-EFFECT TRANSISTORS |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230144086A KR20230144086A (ko) | 2023-10-13 |
| KR102801767B1 true KR102801767B1 (ko) | 2025-04-30 |
Family
ID=81585300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237031630A Active KR102801767B1 (ko) | 2021-04-01 | 2022-03-30 | GaN on Si 전계 효과 트랜지스터들과 함께 측면으로 제작된 광전도성 반도체 스위치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11581448B2 (https=) |
| EP (1) | EP4315432A1 (https=) |
| JP (1) | JP7720921B2 (https=) |
| KR (1) | KR102801767B1 (https=) |
| IL (1) | IL307235B2 (https=) |
| TW (1) | TWI847115B (https=) |
| WO (1) | WO2022212487A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12132130B2 (en) * | 2021-02-22 | 2024-10-29 | United States Of America As Represented By The Secretary Of The Air Force | Stacked thin-film photoconductive semiconductor switch |
| CN114826233B (zh) * | 2022-06-30 | 2022-10-04 | 中国工程物理研究院流体物理研究所 | 光放大和电放大组合控制的高功率重频固态开关及方法 |
| US11996840B1 (en) | 2022-09-09 | 2024-05-28 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Light controlled switch module |
| WO2024054970A1 (en) | 2022-09-09 | 2024-03-14 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Low resistance light controlled semiconductor switch (lcss) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231751A (ja) | 2008-03-25 | 2009-10-08 | Furukawa Electric Co Ltd:The | GaN系化合物半導体からなる双方向スイッチング素子 |
| US20100019279A1 (en) | 2008-04-02 | 2010-01-28 | The Hong Kong University Of Science And Technology | Integrated HEMT and Lateral Field-Effect Rectifier Combinations, Methods, and Systems |
| WO2010140370A1 (ja) | 2009-06-05 | 2010-12-09 | 住友化学株式会社 | 光デバイス、半導体基板、光デバイスの製造方法、および半導体基板の製造方法 |
| JP2014011462A (ja) * | 2012-06-27 | 2014-01-20 | Triquint Semiconductor Inc | 再成長構造を用いたiii族窒化物トランジスタ |
| WO2019012369A1 (ja) | 2017-07-14 | 2019-01-17 | 株式会社半導体エネルギー研究所 | 撮像装置、及び電子機器 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2595007B1 (fr) | 1986-02-25 | 1988-05-13 | Thomson Csf | Tete de detection optique realisee en optique integree et procede de realisation |
| US5574464A (en) | 1995-10-17 | 1996-11-12 | Northrop Grumman Corporation | High-speed switching device for monostatic impulse radar |
| US20030102473A1 (en) | 2001-08-15 | 2003-06-05 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate |
| US20030042404A1 (en) | 2001-09-05 | 2003-03-06 | The Boeing Company | III-Nitride laser activated semiconductor switch and associated methods of fabrication and operation |
| JP4173445B2 (ja) * | 2001-09-13 | 2008-10-29 | 学校法人 名城大学 | 窒化物半導体基板、その製造方法、およびそれを用いた半導体発光素子 |
| US7173295B1 (en) | 2002-06-17 | 2007-02-06 | Sandia Corporation | Multi-line triggering and interdigitated electrode structure for photoconductive semiconductor switches |
| US7626217B2 (en) * | 2005-04-11 | 2009-12-01 | Cree, Inc. | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices |
| AU2006342150A1 (en) | 2005-10-24 | 2007-10-25 | Lawrence Livermore National Security, Llc. | Optically- initiated silicon carbide high voltage switch |
| US8258632B1 (en) | 2005-10-24 | 2012-09-04 | Lawrence Livermore National Security, Llc | Optically-initiated silicon carbide high voltage switch with contoured-profile electrode interfaces |
| JP2008153330A (ja) | 2006-12-15 | 2008-07-03 | Oki Electric Ind Co Ltd | 窒化物半導体高電子移動度トランジスタ |
| US7795642B2 (en) | 2007-09-14 | 2010-09-14 | Transphorm, Inc. | III-nitride devices with recessed gates |
| US7834456B2 (en) | 2009-01-20 | 2010-11-16 | Raytheon Company | Electrical contacts for CMOS devices and III-V devices formed on a silicon substrate |
| US8853745B2 (en) | 2009-01-20 | 2014-10-07 | Raytheon Company | Silicon based opto-electric circuits |
| WO2010129804A1 (en) | 2009-05-07 | 2010-11-11 | Lawrence Livermore National Security, Llc | Photoconductive switch package |
| US7994550B2 (en) | 2009-05-22 | 2011-08-09 | Raytheon Company | Semiconductor structures having both elemental and compound semiconductor devices on a common substrate |
| US8212294B2 (en) | 2010-01-28 | 2012-07-03 | Raytheon Company | Structure having silicon CMOS transistors with column III-V transistors on a common substrate |
| US8154432B2 (en) | 2010-03-22 | 2012-04-10 | Raytheon Company | Digital to analog converter (DAC) having high dynamic range |
| US8466555B2 (en) | 2011-06-03 | 2013-06-18 | Raytheon Company | Gold-free ohmic contacts |
| US9147701B2 (en) | 2011-09-22 | 2015-09-29 | Raytheon Company | Monolithic InGaN solar cell power generation with integrated efficient switching DC-DC voltage convertor |
| US8575666B2 (en) | 2011-09-30 | 2013-11-05 | Raytheon Company | Method and structure having monolithic heterogeneous integration of compound semiconductors with elemental semiconductor |
| US9154045B2 (en) | 2011-10-07 | 2015-10-06 | Raytheon Company | Distributed power conditioning with DC-DC converters implemented in heterogeneous integrated circuit |
| KR101415226B1 (ko) * | 2012-01-30 | 2014-07-04 | 전승익 | 방사선 검출 패널 |
| WO2013156045A1 (en) | 2012-04-20 | 2013-10-24 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Opto-electronic device and pulse processing method |
| US8665013B2 (en) | 2012-07-25 | 2014-03-04 | Raytheon Company | Monolithic integrated circuit chip integrating multiple devices |
| US8823146B1 (en) | 2013-02-19 | 2014-09-02 | Raytheon Company | Semiconductor structure having silicon devices, column III-nitride devices, and column III-non-nitride or column II-VI devices |
| US9500773B2 (en) | 2013-06-07 | 2016-11-22 | Lawrence Livermore National Security, Llc | High voltage photoconductive switch package |
| US9356045B2 (en) | 2013-06-10 | 2016-05-31 | Raytheon Company | Semiconductor structure having column III-V isolation regions |
| US20150059640A1 (en) | 2013-08-27 | 2015-03-05 | Raytheon Company | Method for reducing growth of non-uniformities and autodoping during column iii-v growth into dielectric windows |
| US9761445B2 (en) | 2013-12-13 | 2017-09-12 | Raytheon Company | Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers |
| US9331153B2 (en) | 2013-12-13 | 2016-05-03 | Raytheon Company | Methods and structures for forming microstrip transmission lines on thin silicon on insulator (SOI) wafers |
| US9543462B2 (en) | 2015-03-20 | 2017-01-10 | Xi'an University Of Technology | Insulated-gate photoconductive semiconductor switch |
| CN105826406B (zh) | 2015-03-20 | 2017-12-01 | 西安理工大学 | 一种绝缘栅型光电导开关 |
| US9478508B1 (en) | 2015-06-08 | 2016-10-25 | Raytheon Company | Microwave integrated circuit (MMIC) damascene electrical interconnect for microwave energy transmission |
| US9419125B1 (en) | 2015-06-16 | 2016-08-16 | Raytheon Company | Doped barrier layers in epitaxial group III nitrides |
| JP6126181B2 (ja) * | 2015-09-01 | 2017-05-10 | 日本電信電話株式会社 | 光スイッチ |
| US10447261B1 (en) | 2016-06-23 | 2019-10-15 | Hrl Laboratories, Llc | Dual gate III-switch for high voltage current relay |
| US10096550B2 (en) | 2017-02-21 | 2018-10-09 | Raytheon Company | Nitride structure having gold-free contact and methods for forming such structures |
| US10224285B2 (en) | 2017-02-21 | 2019-03-05 | Raytheon Company | Nitride structure having gold-free contact and methods for forming such structures |
| US10305250B2 (en) * | 2017-08-23 | 2019-05-28 | The Regents Of The University Of Michigan | III-Nitride nanowire array monolithic photonic integrated circuit on (001)silicon operating at near-infrared wavelengths |
| US20190097001A1 (en) | 2017-09-25 | 2019-03-28 | Raytheon Company | Electrode structure for field effect transistor |
| US10566428B2 (en) | 2018-01-29 | 2020-02-18 | Raytheon Company | Method for forming gate structures for group III-V field effect transistors |
| US20190305157A1 (en) | 2018-04-02 | 2019-10-03 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Photodetector |
| JP2020004921A (ja) * | 2018-07-02 | 2020-01-09 | 株式会社東芝 | 半導体装置 |
| US11177216B2 (en) | 2018-09-06 | 2021-11-16 | Raytheon Company | Nitride structures having low capacitance gate contacts integrated with copper damascene structures |
| FR3086100B1 (fr) * | 2018-09-13 | 2022-08-12 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif optoelectronique comprenant une pluralite de diodes |
| US11081613B2 (en) * | 2019-08-08 | 2021-08-03 | Tower Semiconductor Ltd. | Gallium nitride based ultra-violet sensor with intrinsic amplification and method of operating same |
-
2021
- 2021-04-01 US US17/220,660 patent/US11581448B2/en active Active
-
2022
- 2022-03-30 IL IL307235A patent/IL307235B2/en unknown
- 2022-03-30 WO PCT/US2022/022523 patent/WO2022212487A1/en not_active Ceased
- 2022-03-30 KR KR1020237031630A patent/KR102801767B1/ko active Active
- 2022-03-30 EP EP22721929.2A patent/EP4315432A1/en active Pending
- 2022-03-30 JP JP2023559708A patent/JP7720921B2/ja active Active
- 2022-04-01 TW TW111112779A patent/TWI847115B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231751A (ja) | 2008-03-25 | 2009-10-08 | Furukawa Electric Co Ltd:The | GaN系化合物半導体からなる双方向スイッチング素子 |
| US20100019279A1 (en) | 2008-04-02 | 2010-01-28 | The Hong Kong University Of Science And Technology | Integrated HEMT and Lateral Field-Effect Rectifier Combinations, Methods, and Systems |
| WO2010140370A1 (ja) | 2009-06-05 | 2010-12-09 | 住友化学株式会社 | 光デバイス、半導体基板、光デバイスの製造方法、および半導体基板の製造方法 |
| JP2014011462A (ja) * | 2012-06-27 | 2014-01-20 | Triquint Semiconductor Inc | 再成長構造を用いたiii族窒化物トランジスタ |
| JP2018082192A (ja) | 2012-06-27 | 2018-05-24 | コーボ ユーエス、インコーポレイテッド | 再成長構造を用いたiii族窒化物トランジスタ |
| WO2019012369A1 (ja) | 2017-07-14 | 2019-01-17 | 株式会社半導体エネルギー研究所 | 撮像装置、及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| IL307235B2 (en) | 2024-09-01 |
| EP4315432A1 (en) | 2024-02-07 |
| JP2024512626A (ja) | 2024-03-19 |
| US20220320360A1 (en) | 2022-10-06 |
| IL307235A (en) | 2023-11-01 |
| US11581448B2 (en) | 2023-02-14 |
| KR20230144086A (ko) | 2023-10-13 |
| JP7720921B2 (ja) | 2025-08-08 |
| WO2022212487A1 (en) | 2022-10-06 |
| IL307235B1 (en) | 2024-05-01 |
| TW202243031A (zh) | 2022-11-01 |
| TWI847115B (zh) | 2024-07-01 |
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