KR102746633B1 - 칩의 제조 방법 - Google Patents

칩의 제조 방법 Download PDF

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Publication number
KR102746633B1
KR102746633B1 KR1020190063226A KR20190063226A KR102746633B1 KR 102746633 B1 KR102746633 B1 KR 102746633B1 KR 1020190063226 A KR1020190063226 A KR 1020190063226A KR 20190063226 A KR20190063226 A KR 20190063226A KR 102746633 B1 KR102746633 B1 KR 102746633B1
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KR
South Korea
Prior art keywords
workpiece
chip
laser processing
modified layer
processing step
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KR1020190063226A
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English (en)
Korean (ko)
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KR20190143364A (ko
Inventor
요시아키 요도
진얀 자오
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190143364A publication Critical patent/KR20190143364A/ko
Application granted granted Critical
Publication of KR102746633B1 publication Critical patent/KR102746633B1/ko
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    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H01L21/56—
    • H01L21/76—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020190063226A 2018-06-20 2019-05-29 칩의 제조 방법 Active KR102746633B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-117127 2018-06-20
JP2018117127A JP7102065B2 (ja) 2018-06-20 2018-06-20 チップの製造方法

Publications (2)

Publication Number Publication Date
KR20190143364A KR20190143364A (ko) 2019-12-30
KR102746633B1 true KR102746633B1 (ko) 2024-12-24

Family

ID=69096967

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190063226A Active KR102746633B1 (ko) 2018-06-20 2019-05-29 칩의 제조 방법

Country Status (4)

Country Link
JP (1) JP7102065B2 (https=)
KR (1) KR102746633B1 (https=)
CN (1) CN110690172B (https=)
TW (1) TWI800658B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7648375B2 (ja) * 2020-12-17 2025-03-18 株式会社ディスコ ウエーハの生成装置
JP7645086B2 (ja) * 2021-01-29 2025-03-13 株式会社ディスコ 剥離装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007141998A (ja) * 2005-11-16 2007-06-07 Denso Corp 半導体チップの製造装置及び半導体チップの製造方法
JP2008153420A (ja) 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP2017123400A (ja) 2016-01-07 2017-07-13 株式会社ディスコ チャックテーブル

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523775B2 (https=) * 1972-07-08 1977-01-29
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2005342760A (ja) * 2004-06-03 2005-12-15 Disco Abrasive Syst Ltd レーザー加工装置
TWI283023B (en) * 2005-12-23 2007-06-21 Advanced Semiconductor Eng Wafer level packaging process
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP6154121B2 (ja) * 2012-12-06 2017-06-28 リンテック株式会社 割断装置及び割断方法
JP6382568B2 (ja) * 2014-05-09 2018-08-29 株式会社ディスコ レーザー加工装置
JP6710463B2 (ja) * 2016-10-11 2020-06-17 株式会社ディスコ ウェーハの加工方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007141998A (ja) * 2005-11-16 2007-06-07 Denso Corp 半導体チップの製造装置及び半導体チップの製造方法
JP2008153420A (ja) 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP2017123400A (ja) 2016-01-07 2017-07-13 株式会社ディスコ チャックテーブル

Also Published As

Publication number Publication date
JP7102065B2 (ja) 2022-07-19
KR20190143364A (ko) 2019-12-30
JP2019220581A (ja) 2019-12-26
CN110690172A (zh) 2020-01-14
TWI800658B (zh) 2023-05-01
TW202002057A (zh) 2020-01-01
CN110690172B (zh) 2024-05-14

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