JPS523775B2 - - Google Patents
Info
- Publication number
- JPS523775B2 JPS523775B2 JP6839872A JP6839872A JPS523775B2 JP S523775 B2 JPS523775 B2 JP S523775B2 JP 6839872 A JP6839872 A JP 6839872A JP 6839872 A JP6839872 A JP 6839872A JP S523775 B2 JPS523775 B2 JP S523775B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Landscapes
- Drying Of Semiconductors (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Dicing (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6839872A JPS523775B2 (https=) | 1972-07-08 | 1972-07-08 | |
| GB3238173A GB1398940A (en) | 1972-07-08 | 1973-07-06 | Method of dividing semiconductor wafers |
| DE2334658A DE2334658C3 (de) | 1972-07-08 | 1973-07-07 | Verfahren zum Zerteilen von Halbleiterscheiben |
| FR7325121A FR2192378B1 (https=) | 1972-07-08 | 1973-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6839872A JPS523775B2 (https=) | 1972-07-08 | 1972-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4928270A JPS4928270A (https=) | 1974-03-13 |
| JPS523775B2 true JPS523775B2 (https=) | 1977-01-29 |
Family
ID=13372538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6839872A Expired JPS523775B2 (https=) | 1972-07-08 | 1972-07-08 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS523775B2 (https=) |
| DE (1) | DE2334658C3 (https=) |
| FR (1) | FR2192378B1 (https=) |
| GB (1) | GB1398940A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0644592B2 (ja) * | 1984-10-25 | 1994-06-08 | 日本電気株式会社 | 半導体装置の製造方法 |
| US6642127B2 (en) * | 2001-10-19 | 2003-11-04 | Applied Materials, Inc. | Method for dicing a semiconductor wafer |
| CN103341692A (zh) | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | 切割不规则图形基板的方法和显示装置 |
| JP7102065B2 (ja) * | 2018-06-20 | 2022-07-19 | 株式会社ディスコ | チップの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615956A (en) * | 1969-03-27 | 1971-10-26 | Signetics Corp | Gas plasma vapor etching process |
-
1972
- 1972-07-08 JP JP6839872A patent/JPS523775B2/ja not_active Expired
-
1973
- 1973-07-06 GB GB3238173A patent/GB1398940A/en not_active Expired
- 1973-07-07 DE DE2334658A patent/DE2334658C3/de not_active Expired
- 1973-07-09 FR FR7325121A patent/FR2192378B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1398940A (en) | 1975-06-25 |
| DE2334658A1 (de) | 1974-01-24 |
| FR2192378B1 (https=) | 1977-09-02 |
| JPS4928270A (https=) | 1974-03-13 |
| DE2334658B2 (de) | 1978-03-30 |
| DE2334658C3 (de) | 1978-11-23 |
| FR2192378A1 (https=) | 1974-02-08 |