GB1398940A - Method of dividing semiconductor wafers - Google Patents
Method of dividing semiconductor wafersInfo
- Publication number
- GB1398940A GB1398940A GB3238173A GB3238173A GB1398940A GB 1398940 A GB1398940 A GB 1398940A GB 3238173 A GB3238173 A GB 3238173A GB 3238173 A GB3238173 A GB 3238173A GB 1398940 A GB1398940 A GB 1398940A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plasma
- gas
- wafer
- freon
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 title 1
- 210000002381 plasma Anatomy 0.000 abstract 5
- 238000005530 etching Methods 0.000 abstract 3
- 239000007789 gas Substances 0.000 abstract 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052786 argon Inorganic materials 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000001307 helium Substances 0.000 abstract 1
- 229910052734 helium Inorganic materials 0.000 abstract 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 229910052743 krypton Inorganic materials 0.000 abstract 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052754 neon Inorganic materials 0.000 abstract 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Dicing (AREA)
Abstract
1398940 Removing material by gas plasmas MITSUBISHI DENKI KK 6 July 1973 [8 July 1972] 32381/73 Heading B3V [Also in Divisions B5 H1 and B6] A semi-conductor wafer is divided by forming one or more grooves using the etching action of a Freon (R.T.M.) gas plasma and by subsequently separating the parts defined by the groove(s). A silicon wafer containing a plurality of integrated circuits, transistors, thyristors or diodes may be photoresist masked and then plasma etched along sets of intersecting grooves. The Freon gas may be mixed with argon, helium, neon or krypton. The etching rate may be controlled by the overall pressure, by the ratio of Freon to inert gas, or by the power supplied at high frequency to the plasma. The photoresist may be removed by normal etching or by the use of an oxygen plasma. The wafer is divided by hand, by the application of a differential pressure to the faces of the wafer (making it a wall of a vacuum chamber), or by ultrasonic action.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6839872A JPS523775B2 (en) | 1972-07-08 | 1972-07-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1398940A true GB1398940A (en) | 1975-06-25 |
Family
ID=13372538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3238173A Expired GB1398940A (en) | 1972-07-08 | 1973-07-06 | Method of dividing semiconductor wafers |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS523775B2 (en) |
DE (1) | DE2334658C3 (en) |
FR (1) | FR2192378B1 (en) |
GB (1) | GB1398940A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003036712A1 (en) * | 2001-10-19 | 2003-05-01 | Applied Materials, Inc. | Method and apparatus for dicing a semiconductor wafer |
CN103341692A (en) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | Method for cutting irregular figure substrate and display device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0644592B2 (en) * | 1984-10-25 | 1994-06-08 | 日本電気株式会社 | Method for manufacturing semiconductor device |
JP7102065B2 (en) * | 2018-06-20 | 2022-07-19 | 株式会社ディスコ | Chip manufacturing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615956A (en) * | 1969-03-27 | 1971-10-26 | Signetics Corp | Gas plasma vapor etching process |
-
1972
- 1972-07-08 JP JP6839872A patent/JPS523775B2/ja not_active Expired
-
1973
- 1973-07-06 GB GB3238173A patent/GB1398940A/en not_active Expired
- 1973-07-07 DE DE19732334658 patent/DE2334658C3/en not_active Expired
- 1973-07-09 FR FR7325121A patent/FR2192378B1/fr not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003036712A1 (en) * | 2001-10-19 | 2003-05-01 | Applied Materials, Inc. | Method and apparatus for dicing a semiconductor wafer |
CN103341692A (en) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | Method for cutting irregular figure substrate and display device |
US9416041B2 (en) | 2013-06-26 | 2016-08-16 | Beijing Boe Display Technology Co., Ltd. | Method for cutting substrate of irregular pattern and display device |
US10414683B2 (en) | 2013-06-26 | 2019-09-17 | Boe Technology Group Co., Ltd. | Method for cutting substrate of irregular pattern and display device |
Also Published As
Publication number | Publication date |
---|---|
FR2192378A1 (en) | 1974-02-08 |
DE2334658C3 (en) | 1978-11-23 |
FR2192378B1 (en) | 1977-09-02 |
JPS4928270A (en) | 1974-03-13 |
DE2334658B2 (en) | 1978-03-30 |
DE2334658A1 (en) | 1974-01-24 |
JPS523775B2 (en) | 1977-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19930705 |