CN110690172B - 芯片的制造方法 - Google Patents

芯片的制造方法 Download PDF

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Publication number
CN110690172B
CN110690172B CN201910513486.1A CN201910513486A CN110690172B CN 110690172 B CN110690172 B CN 110690172B CN 201910513486 A CN201910513486 A CN 201910513486A CN 110690172 B CN110690172 B CN 110690172B
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CN
China
Prior art keywords
workpiece
holding
chip
laser processing
modified layer
Prior art date
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Active
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CN201910513486.1A
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English (en)
Chinese (zh)
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CN110690172A (zh
Inventor
淀良彰
赵金艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication of CN110690172A publication Critical patent/CN110690172A/zh
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Publication of CN110690172B publication Critical patent/CN110690172B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201910513486.1A 2018-06-20 2019-06-14 芯片的制造方法 Active CN110690172B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-117127 2018-06-20
JP2018117127A JP7102065B2 (ja) 2018-06-20 2018-06-20 チップの製造方法

Publications (2)

Publication Number Publication Date
CN110690172A CN110690172A (zh) 2020-01-14
CN110690172B true CN110690172B (zh) 2024-05-14

Family

ID=69096967

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910513486.1A Active CN110690172B (zh) 2018-06-20 2019-06-14 芯片的制造方法

Country Status (4)

Country Link
JP (1) JP7102065B2 (https=)
KR (1) KR102746633B1 (https=)
CN (1) CN110690172B (https=)
TW (1) TWI800658B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7648375B2 (ja) * 2020-12-17 2025-03-18 株式会社ディスコ ウエーハの生成装置
JP7645086B2 (ja) * 2021-01-29 2025-03-13 株式会社ディスコ 剥離装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007141998A (ja) * 2005-11-16 2007-06-07 Denso Corp 半導体チップの製造装置及び半導体チップの製造方法
TWI283023B (en) * 2005-12-23 2007-06-21 Advanced Semiconductor Eng Wafer level packaging process
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
CN105081559A (zh) * 2014-05-09 2015-11-25 株式会社迪思科 激光加工装置
JP2018063985A (ja) * 2016-10-11 2018-04-19 株式会社ディスコ ウェーハの加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523775B2 (https=) * 1972-07-08 1977-01-29
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2005342760A (ja) * 2004-06-03 2005-12-15 Disco Abrasive Syst Ltd レーザー加工装置
JP2008153420A (ja) * 2006-12-18 2008-07-03 Seiko Epson Corp 基材の分割方法、液滴吐出ヘッドの製造方法、半導体装置の製造方法、基板の製造方法、及び電気光学装置の製造方法
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP6154121B2 (ja) * 2012-12-06 2017-06-28 リンテック株式会社 割断装置及び割断方法
JP2017123400A (ja) 2016-01-07 2017-07-13 株式会社ディスコ チャックテーブル

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007141998A (ja) * 2005-11-16 2007-06-07 Denso Corp 半導体チップの製造装置及び半導体チップの製造方法
TWI283023B (en) * 2005-12-23 2007-06-21 Advanced Semiconductor Eng Wafer level packaging process
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
CN105081559A (zh) * 2014-05-09 2015-11-25 株式会社迪思科 激光加工装置
JP2018063985A (ja) * 2016-10-11 2018-04-19 株式会社ディスコ ウェーハの加工方法

Also Published As

Publication number Publication date
KR102746633B1 (ko) 2024-12-24
JP7102065B2 (ja) 2022-07-19
KR20190143364A (ko) 2019-12-30
JP2019220581A (ja) 2019-12-26
CN110690172A (zh) 2020-01-14
TWI800658B (zh) 2023-05-01
TW202002057A (zh) 2020-01-01

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