KR102673413B1 - 수분 경화성 조성물 - Google Patents

수분 경화성 조성물 Download PDF

Info

Publication number
KR102673413B1
KR102673413B1 KR1020207004233A KR20207004233A KR102673413B1 KR 102673413 B1 KR102673413 B1 KR 102673413B1 KR 1020207004233 A KR1020207004233 A KR 1020207004233A KR 20207004233 A KR20207004233 A KR 20207004233A KR 102673413 B1 KR102673413 B1 KR 102673413B1
Authority
KR
South Korea
Prior art keywords
bis
amine
urea
weight
methylamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207004233A
Other languages
English (en)
Korean (ko)
Other versions
KR20200037266A (ko
Inventor
얀시아 후앙
위 구오
슈 첸
Original Assignee
다우 실리콘즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 실리콘즈 코포레이션 filed Critical 다우 실리콘즈 코포레이션
Publication of KR20200037266A publication Critical patent/KR20200037266A/ko
Application granted granted Critical
Publication of KR102673413B1 publication Critical patent/KR102673413B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5445—Silicon-containing compounds containing nitrogen containing at least one Si-N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020207004233A 2017-07-31 2018-07-30 수분 경화성 조성물 Active KR102673413B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/CN2017/095155 WO2019023842A1 (en) 2017-07-31 2017-07-31 MOISTURE CURING COMPOSITIONS
CNPCT/CN2017/095155 2017-07-31
PCT/CN2018/000275 WO2019024429A1 (en) 2017-07-31 2018-07-30 HUMIDITY-CURABLE COMPOSITIONS

Publications (2)

Publication Number Publication Date
KR20200037266A KR20200037266A (ko) 2020-04-08
KR102673413B1 true KR102673413B1 (ko) 2024-06-11

Family

ID=65232210

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207004233A Active KR102673413B1 (ko) 2017-07-31 2018-07-30 수분 경화성 조성물
KR1020207004443A Active KR102675608B1 (ko) 2017-07-31 2018-07-30 수분 경화성 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207004443A Active KR102675608B1 (ko) 2017-07-31 2018-07-30 수분 경화성 조성물

Country Status (6)

Country Link
US (2) US11168213B2 (enExample)
EP (2) EP3661997B1 (enExample)
JP (2) JP7858258B2 (enExample)
KR (2) KR102673413B1 (enExample)
CN (2) CN110997756B (enExample)
WO (3) WO2019023842A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020139639A1 (en) * 2018-12-26 2020-07-02 Momentive Performance Materials Inc. Curable silicone-based compositions and applications thereof cross reference to related applications
US20230022605A1 (en) * 2019-12-17 2023-01-26 Dow Silicones Corporation Sealant composition
WO2021119972A1 (en) 2019-12-17 2021-06-24 Dow Silicones Corporation Polydiorganosiloxane preparation
JP7444989B2 (ja) * 2019-12-17 2024-03-06 ダウ シリコーンズ コーポレーション シーラント組成物
WO2021119970A1 (en) 2019-12-17 2021-06-24 Dow Silicones Corporation Sealant composition
CN114846083B (zh) 2019-12-23 2023-05-02 美国陶氏有机硅公司 密封剂组合物
EP4408933A1 (en) * 2021-09-30 2024-08-07 Dow Silicones Corporation Moisture curable compositions
EP4408935A1 (en) * 2021-09-30 2024-08-07 Dow Silicones Corporation Moisture curable compositions
US20240400829A1 (en) * 2021-09-30 2024-12-05 Dow Silicones Corporation Moisture curable compositions
WO2025223927A1 (en) * 2024-04-22 2025-10-30 Henkel Ag & Co. Kgaa Curable compositions comprising at least one silane-modified polymer and bauxite residue

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2653469B2 (ja) * 1988-05-19 1997-09-17 東芝シリコーン株式会社 室温硬化性組成物
US5432206A (en) 1994-07-29 1995-07-11 Dow Corning Corporation Polyether silicone surfactants for the manufacture of urethane foams
GB9607897D0 (en) 1996-04-17 1996-06-19 Dow Corning Sa Organosiloxane compositions
ATE239737T1 (de) 1997-08-21 2003-05-15 Crompton Corp Blockierte merkaptosilane als kupplungsmittel für gefüllte kautschukzusammensetzung
DE19942467A1 (de) 1999-09-06 2001-04-26 Heraeus Kulzer Gmbh & Co Kg Bei Raumtemperatur aushärtende Silicon-Masse II und ihre Verwendung
WO2005103117A1 (en) 2004-04-20 2005-11-03 Dow Corning Corporation Silicone polyether block copolymers
JP5068451B2 (ja) 2005-11-24 2012-11-07 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
US20070129528A1 (en) * 2005-12-01 2007-06-07 Misty Huang Two-part curable composition and polyurethane-polysiloxane resin mixture obtained therefrom
DE102006010643A1 (de) 2006-03-08 2007-09-13 Bayer Healthcare Aktiengesellschaft Arzneimittel enthaltend Fluorchinolone
US20070244249A1 (en) 2006-04-06 2007-10-18 General Electric Company Two-part translucent silicone rubber-forming composition
DE102006061890A1 (de) 2006-12-28 2008-07-03 Thor Gmbh Kleb- und Dichtungsmassen mit antimikrobieller Ausrüstung
US8063140B2 (en) * 2007-06-13 2011-11-22 Momentive Performance Materials Inc. Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition
JP4877381B2 (ja) * 2008-12-16 2012-02-15 横浜ゴム株式会社 シラノール縮合触媒、加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
WO2011051173A1 (en) 2009-10-26 2011-05-05 Dow Corning Corporation Organosiloxane compositions
CN101864173A (zh) 2010-05-28 2010-10-20 郑州中原应用技术研究开发有限公司 一种建筑用硅酮结构密封胶
CN101864172A (zh) 2010-05-28 2010-10-20 郑州中原应用技术研究开发有限公司 一种建筑用双组分硅酮结构密封胶
GB201103689D0 (en) * 2011-03-04 2011-04-20 Dow Corning Organosil oxane compositions
CN102268234A (zh) 2011-06-30 2011-12-07 郑州中原应用技术研究开发有限公司 太阳能电池组件用双组份硅酮密封胶及其注胶工艺
US9663657B2 (en) * 2011-12-15 2017-05-30 Momentive Performance Materials Inc. Moisture curable organopolysiloxane compositions
JP2013139510A (ja) 2011-12-29 2013-07-18 Dow Corning Toray Co Ltd 多成分型硬化性シリコーンゴム組成物、それを用いてなる電子部品用材料および太陽電池モジュール
CA2861657A1 (en) * 2011-12-29 2013-07-04 Sumi Dinkar Moisture curable organopolysiloxane composition
EP2921527A4 (en) * 2012-11-13 2016-07-06 Momentive Performance Mat Jp AT ROOM TEMPERATURE HARDENABLE POLYORGANOSILOXANE COMPOSITION
CN102977840A (zh) * 2012-12-31 2013-03-20 上海回天化工新材料有限公司 耐湿热老化的太阳能组件用双组份硅酮密封胶及其制备方法
JP5842831B2 (ja) 2013-01-09 2016-01-13 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物及び構造体
JP6385370B2 (ja) * 2013-02-11 2018-09-05 ダウ シリコーンズ コーポレーション 安定な熱ラジカル硬化性シリコーン粘着剤組成物
EP3378905A1 (en) * 2013-02-15 2018-09-26 Momentive Performance Materials Inc. Antifouling system comprising silicone hydrogel
JP2014218558A (ja) 2013-05-07 2014-11-20 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
WO2014205251A2 (en) 2013-06-20 2014-12-24 Momentive Performance Materials Inc. Moisture curable compound with thiourea
CN105849213B (zh) * 2013-12-23 2018-07-27 美国陶氏有机硅公司 可湿固化的组合物
JP2017509741A (ja) * 2014-02-06 2017-04-06 モーメンティブ・パフォーマンス・マテリアルズ・インク 湿気硬化性シリコーン組成物
EP3130643A4 (en) * 2014-04-09 2017-12-13 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components
CN107075063A (zh) * 2014-11-20 2017-08-18 莫门蒂夫性能材料股份有限公司 可湿固化的组合物
DE102015204787A1 (de) 2015-03-17 2016-09-22 Henkel Ag & Co. Kgaa Härtbare Silikonzusammensetzungen
CN119220172A (zh) * 2016-01-27 2024-12-31 莫门蒂夫性能材料股份有限公司 抗沾污性有机硅涂料组合物

Also Published As

Publication number Publication date
CN110997756A (zh) 2020-04-10
JP2020528955A (ja) 2020-10-01
US20210087398A1 (en) 2021-03-25
KR20200037275A (ko) 2020-04-08
KR20200037266A (ko) 2020-04-08
JP2020530505A (ja) 2020-10-22
US11168213B2 (en) 2021-11-09
WO2019023842A1 (en) 2019-02-07
JP7858258B2 (ja) 2026-05-14
US20210095078A1 (en) 2021-04-01
EP3661997A4 (en) 2021-06-16
CN111051387B (zh) 2022-02-18
EP3661996A1 (en) 2020-06-10
EP3661997B1 (en) 2022-11-09
WO2019024430A1 (en) 2019-02-07
EP3661996B1 (en) 2022-07-20
CN110997756B (zh) 2022-06-07
KR102675608B1 (ko) 2024-06-18
JP7420705B2 (ja) 2024-01-23
WO2019024429A1 (en) 2019-02-07
EP3661996A4 (en) 2021-05-05
CN111051387A (zh) 2020-04-21
EP3661997A1 (en) 2020-06-10

Similar Documents

Publication Publication Date Title
KR102675608B1 (ko) 수분 경화성 조성물
JP6522625B2 (ja) 湿気硬化性組成物
KR102682503B1 (ko) 수분 경화성 조성물
KR20200139173A (ko) 축합 경화성 조성물
KR20240072222A (ko) 수분 경화성 조성물
WO2022140217A1 (en) Sealant composition
KR20240072221A (ko) 수분 경화성 조성물
US20240409696A1 (en) Moisture curable compositions
WO2021133621A1 (en) Moisture curable compositions

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000