KR102665001B1 - 접속체의 제조 방법 - Google Patents

접속체의 제조 방법 Download PDF

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Publication number
KR102665001B1
KR102665001B1 KR1020170017369A KR20170017369A KR102665001B1 KR 102665001 B1 KR102665001 B1 KR 102665001B1 KR 1020170017369 A KR1020170017369 A KR 1020170017369A KR 20170017369 A KR20170017369 A KR 20170017369A KR 102665001 B1 KR102665001 B1 KR 102665001B1
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KR
South Korea
Prior art keywords
electronic component
anisotropic conductive
conductive film
manufacturing
connection
Prior art date
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Active
Application number
KR1020170017369A
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English (en)
Korean (ko)
Other versions
KR20170113037A (ko
Inventor
다이치로 가지타니
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20170113037A publication Critical patent/KR20170113037A/ko
Application granted granted Critical
Publication of KR102665001B1 publication Critical patent/KR102665001B1/ko
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020170017369A 2016-03-24 2017-02-08 접속체의 제조 방법 Active KR102665001B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-060736 2016-03-24
JP2016060736A JP6783537B2 (ja) 2016-03-24 2016-03-24 接続体の製造方法

Publications (2)

Publication Number Publication Date
KR20170113037A KR20170113037A (ko) 2017-10-12
KR102665001B1 true KR102665001B1 (ko) 2024-05-09

Family

ID=59932480

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170017369A Active KR102665001B1 (ko) 2016-03-24 2017-02-08 접속체의 제조 방법

Country Status (4)

Country Link
JP (1) JP6783537B2 (https=)
KR (1) KR102665001B1 (https=)
CN (1) CN107230646B (https=)
HK (1) HK1245501A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109637699B (zh) * 2018-12-12 2020-05-12 武汉华星光电半导体显示技术有限公司 异方性导电膜制造方法及其设备
WO2026018491A1 (ja) * 2024-07-19 2026-01-22 住友電工プリントサーキット株式会社 基板接続体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112383A1 (ja) * 2005-04-14 2006-10-26 Matsushita Electric Industrial Co., Ltd. 電子回路装置およびその製造方法
JP2012175038A (ja) * 2011-02-24 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法及び異方性導電材料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314094C (zh) * 2004-02-25 2007-05-02 友达光电股份有限公司 封装对准结构
JP5498407B2 (ja) 2011-01-25 2014-05-21 積水化学工業株式会社 接続構造体の製造方法
JP6133069B2 (ja) * 2013-01-30 2017-05-24 デクセリアルズ株式会社 加熱硬化型接着フィルム
JP5949811B2 (ja) 2014-03-04 2016-07-13 日立化成株式会社 電子部品の製造方法
JP6518101B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112383A1 (ja) * 2005-04-14 2006-10-26 Matsushita Electric Industrial Co., Ltd. 電子回路装置およびその製造方法
JP2012175038A (ja) * 2011-02-24 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法及び異方性導電材料

Also Published As

Publication number Publication date
JP6783537B2 (ja) 2020-11-11
JP2017175015A (ja) 2017-09-28
CN107230646B (zh) 2023-05-05
HK1245501A1 (zh) 2018-08-24
KR20170113037A (ko) 2017-10-12
CN107230646A (zh) 2017-10-03

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