KR102658977B1 - 기능성 마이크로 전자 디바이스의 수율 향상 - Google Patents
기능성 마이크로 전자 디바이스의 수율 향상 Download PDFInfo
- Publication number
- KR102658977B1 KR102658977B1 KR1020207015979A KR20207015979A KR102658977B1 KR 102658977 B1 KR102658977 B1 KR 102658977B1 KR 1020207015979 A KR1020207015979 A KR 1020207015979A KR 20207015979 A KR20207015979 A KR 20207015979A KR 102658977 B1 KR102658977 B1 KR 102658977B1
- Authority
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- South Korea
- Prior art keywords
- semiconductor
- wafer
- manufacturing
- semiconductor wafer
- area
- Prior art date
Links
- 238000004377 microelectronic Methods 0.000 title claims description 113
- 239000004065 semiconductor Substances 0.000 claims abstract description 238
- 238000004519 manufacturing process Methods 0.000 claims abstract description 228
- 235000012431 wafers Nutrition 0.000 claims abstract description 202
- 238000000034 method Methods 0.000 claims abstract description 126
- 230000009897 systematic effect Effects 0.000 claims abstract description 35
- 238000005259 measurement Methods 0.000 claims description 97
- 239000010410 layer Substances 0.000 claims description 90
- 230000008859 change Effects 0.000 claims description 42
- 238000003860 storage Methods 0.000 claims description 31
- 238000012800 visualization Methods 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 238000000206 photolithography Methods 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 11
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- 238000004220 aggregation Methods 0.000 claims description 2
- 230000006872 improvement Effects 0.000 abstract description 26
- 230000008569 process Effects 0.000 description 33
- 239000000758 substrate Substances 0.000 description 10
- 238000013459 approach Methods 0.000 description 6
- 230000000875 corresponding effect Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
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- 238000012546 transfer Methods 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
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- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000003542 behavioural effect Effects 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/025—General constructional details concerning dedicated user interfaces, e.g. GUI, or dedicated keyboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Drying Of Semiconductors (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762581535P | 2017-11-03 | 2017-11-03 | |
| US62/581,535 | 2017-11-03 | ||
| US201862753155P | 2018-10-31 | 2018-10-31 | |
| US201862753153P | 2018-10-31 | 2018-10-31 | |
| US62/753,153 | 2018-10-31 | ||
| US62/753,155 | 2018-10-31 | ||
| PCT/US2018/059019 WO2019090122A1 (en) | 2017-11-03 | 2018-11-02 | Enhancement of yield of functional microelectronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200067933A KR20200067933A (ko) | 2020-06-12 |
| KR102658977B1 true KR102658977B1 (ko) | 2024-04-18 |
Family
ID=66327085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207015979A KR102658977B1 (ko) | 2017-11-03 | 2018-11-02 | 기능성 마이크로 전자 디바이스의 수율 향상 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11435393B2 (zh) |
| EP (1) | EP3704734A4 (zh) |
| JP (1) | JP7300597B2 (zh) |
| KR (1) | KR102658977B1 (zh) |
| CN (1) | CN111316412A (zh) |
| TW (2) | TWI813595B (zh) |
| WO (1) | WO2019090122A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11435393B2 (en) | 2017-11-03 | 2022-09-06 | Tokyo Electron Limited | Enhancement of yield of functional microelectronic devices |
| US10867877B2 (en) * | 2018-03-20 | 2020-12-15 | Kla Corporation | Targeted recall of semiconductor devices based on manufacturing data |
| US11244873B2 (en) | 2018-10-31 | 2022-02-08 | Tokyo Electron Limited | Systems and methods for manufacturing microelectronic devices |
| US11868119B2 (en) | 2021-09-24 | 2024-01-09 | Tokyo Electron Limited | Method and process using fingerprint based semiconductor manufacturing process fault detection |
| WO2023091321A1 (en) * | 2021-11-17 | 2023-05-25 | Coventor, Inc. | System and method for performing hole profile modeling in a virtual fabrication environment |
Citations (4)
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| JP2002039801A (ja) * | 2000-06-08 | 2002-02-06 | Internatl Business Mach Corp <Ibm> | 特性値表示方法および特性値表示装置 |
| WO2014024178A1 (en) * | 2012-08-08 | 2014-02-13 | Dsp Group Ltd. | Method of improving wafer yield |
| JP2014529909A (ja) * | 2011-09-01 | 2014-11-13 | ケーエルエー−テンカー コーポレイション | 問題のある高度プロセス制御パラメータの検出及び訂正のための方法及びシステム |
| US20150006097A1 (en) * | 2013-06-26 | 2015-01-01 | Kla-Tencor Corporation | Calculated Electrical Performance Metrics For Process Monitoring And Yield Management |
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| US11244873B2 (en) * | 2018-10-31 | 2022-02-08 | Tokyo Electron Limited | Systems and methods for manufacturing microelectronic devices |
-
2018
- 2018-11-02 US US16/179,526 patent/US11435393B2/en active Active
- 2018-11-02 CN CN201880070921.1A patent/CN111316412A/zh active Pending
- 2018-11-02 EP EP18872757.2A patent/EP3704734A4/en active Pending
- 2018-11-02 WO PCT/US2018/059019 patent/WO2019090122A1/en unknown
- 2018-11-02 TW TW107138952A patent/TWI813595B/zh active
- 2018-11-02 JP JP2020524618A patent/JP7300597B2/ja active Active
- 2018-11-02 US US16/179,492 patent/US11346882B2/en active Active
- 2018-11-02 KR KR1020207015979A patent/KR102658977B1/ko active IP Right Grant
- 2018-11-02 TW TW107138959A patent/TWI797187B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002039801A (ja) * | 2000-06-08 | 2002-02-06 | Internatl Business Mach Corp <Ibm> | 特性値表示方法および特性値表示装置 |
| JP2014529909A (ja) * | 2011-09-01 | 2014-11-13 | ケーエルエー−テンカー コーポレイション | 問題のある高度プロセス制御パラメータの検出及び訂正のための方法及びシステム |
| WO2014024178A1 (en) * | 2012-08-08 | 2014-02-13 | Dsp Group Ltd. | Method of improving wafer yield |
| US20150006097A1 (en) * | 2013-06-26 | 2015-01-01 | Kla-Tencor Corporation | Calculated Electrical Performance Metrics For Process Monitoring And Yield Management |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3704734A1 (en) | 2020-09-09 |
| US20190139798A1 (en) | 2019-05-09 |
| TWI797187B (zh) | 2023-04-01 |
| JP2021502694A (ja) | 2021-01-28 |
| KR20200067933A (ko) | 2020-06-12 |
| CN111316412A (zh) | 2020-06-19 |
| US11435393B2 (en) | 2022-09-06 |
| WO2019090122A1 (en) | 2019-05-09 |
| US20190137565A1 (en) | 2019-05-09 |
| TW201931483A (zh) | 2019-08-01 |
| US11346882B2 (en) | 2022-05-31 |
| JP7300597B2 (ja) | 2023-06-30 |
| EP3704734A4 (en) | 2021-08-11 |
| TWI813595B (zh) | 2023-09-01 |
| TW201931180A (zh) | 2019-08-01 |
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