KR102653068B1 - Connection structure, and anisotropic conductive adhesive - Google Patents

Abstract

(assignment)
Provided is a connection structure and an anisotropic conductive adhesive that can prevent the appearance of a decorated printed portion from being damaged even when a defect such as a pinhole occurs in the decorated printed portion.
(Solution)
In the connection structure, a first electronic component (10) in which an electrode (13) is formed on a decorative layer (12), and a second electronic component (10) in which an electrode (22) opposing the electrode (13) of the first electronic component (10) is formed. An electronic component (20) is provided with an anisotropic conductive film (30) connecting the electrode (13) of the first electronic component (10) and the electrode (22) of the second electronic component (20). ) This consists of a cured product of an anisotropic conductive adhesive containing conductive particles (31) and black pigment (32). As a result, light leakage from the pinhole of the decorative printing part can be reduced, and the design of the decorative printing part can be maintained.

Description

Connection structure and anisotropic conductive adhesive {CONNECTION STRUCTURE, AND ANISOTROPIC CONDUCTIVE ADHESIVE}

The present invention relates to a connection structure in which electronic components are connected using an anisotropic conductive adhesive and an anisotropic conductive adhesive.

Recently, in order to improve design freedom, for example, in a cover glass integrated touch panel, it has been proposed to form electrodes on a decorative layer printed in a frame shape on the outer periphery and to bond them to a circuit member on the decorative layer. .

However, if a defect such as a pinhole occurs in the decorative printing unit, light leakage occurs due to irradiated light from the backlight, and the appearance is damaged. Additionally, even if a pinhole is found in the decoration printed portion through inspection, it is difficult to repair because the wiring has already been formed on the decoration layer.

Japanese Patent Publication No. 2009-088465

The present invention was proposed in consideration of such conventional circumstances, and provides a connection structure and an anisotropic conductive adhesive that can prevent the appearance of the decorative printing part from being damaged even when defects such as pinholes occur in the decorative printing part. The purpose is to

In order to solve the above-described problem, the connection structure according to the present invention includes a first electronic component in which an electrode is formed on a decorative layer, a second electronic component in which an electrode opposing the electrode of the first electronic component is formed, and the first electronic component. An anisotropic conductive film is provided that connects an electrode of one electronic component to an electrode of a second electronic component, and the anisotropic conductive film is made of a cured product of an anisotropic conductive adhesive containing conductive particles and a black pigment.

In addition, the touch panel according to the present invention includes a display window portion having a touch panel function, a decorative layer formed on a peripheral portion other than the display window portion, a first electronic component in which an electrode is formed on the decorative layer, and the first electronic component a second electronic component having an electrode opposing the electrode of It is characterized by being made of a cured product of an anisotropic conductive adhesive containing.

Additionally, the anisotropic conductive adhesive according to the present invention is characterized by containing a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, conductive particles, and a black pigment whose main raw material is not carbon.

In addition, the method for manufacturing a bonded structure according to the present invention includes temporarily attaching an anisotropic conductive film containing conductive particles and a black pigment to the electrode of a first electronic component in which an electrode is formed on a decorative layer, and forming the anisotropic conductive film on the anisotropic conductive film. A second electronic component is placed on the second electronic component, and the second electronic component is pressed with a compression head from the upper surface.

According to the present invention, since the black pigment of the anisotropic conductive film reduces light leakage in the decorative printing portion, the appearance of the decorative printing portion can be prevented from being damaged.

1 is a cross-sectional view showing a connection structure to which the present invention is applied.
Figure 2 is a perspective view showing an example of a connection structure.
Figure 3 is a photograph of the bonded structure manufactured using the anisotropic conductive film of Example 3, illuminated from the glass substrate side for evaluation, and observed with a metallographic microscope from the FPC side for evaluation.
Figure 4 is a photograph of the bonded structure manufactured using the anisotropic conductive film of Comparative Example 1, illuminated from the glass substrate side for evaluation, and observed with a metallographic microscope from the FPC side for evaluation.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.

1. Connection structure

2. Anisotropic conductive adhesive

3. Example

<1. Connection structure>

1 is a cross-sectional view showing a bonded structure to which the present invention is applied. As shown in FIG. 1, the connection structure includes a first electronic component 10 in which an electrode 13 is formed on a decorative layer 12, and an electrode opposing the electrode 13 of the first electronic component 10 ( 22) is provided with the formed second electronic component 20 and an anisotropic conductive film 30 that connects the electrode 13 of the first electronic component 10 and the electrode 22 of the second electronic component 20. . In addition, the anisotropic conductive film 30 is made of a cured product of an anisotropic conductive adhesive containing conductive particles 31 and black pigment 32. Accordingly, even when defects such as pinholes occur in the decorative printing section, the black pigment 32 of the anisotropic conductive film 30 reduces light leakage in the decorative printing section, preventing the appearance of the decorative printing section from being damaged. You can.

The first electronic component 10 includes a transparent substrate 11, a decorative layer 12 decoratively printed on the transparent substrate, and an electrode 13 formed on the decorative layer 12.

As the transparent substrate 11, for example, one having a transmittance of 80% or more to visible light can be used, and one having a transmittance of 95% or more can be preferably used. Inorganic transparent substrates such as glass, which are generally used in liquid crystal display devices, or transparent resin substrates such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, and cyclic olefin copolymer can be used.

The decorative layer 12 is formed from a cured product of a colored resin composition. The colored resin composition is prepared by dispersing a coloring agent in a resin binder containing, for example, a monomer, a photopolymerization initiator, a sensitizer, a solvent, etc. As the colorant, a pigment or dye can be used to color the decorative layer 12 in a desired color. The pigment may be either an organic pigment or an inorganic pigment, and its blending amount is not particularly limited. As the color of the decorative layer 12, black, which has light-shielding properties, is preferably used from the viewpoint of design and productivity. In cases where design is emphasized, a metal layer may be formed, but even in this case, a resin layer is often formed on the outermost surface using a coating material or the like, and the material of the adhesive surface does not differ significantly.

Examples of such a first electronic component 10 include a touch panel integrated with a cover glass. The cover glass-integrated touch panel is formed on a surface opposite to the viewing side of the transparent substrate 11, a display window portion having a touch panel function in which a signal line for detecting the touch position is formed, and a peripheral portion other than the display window portion. It has a decorative layer (12). The display window portion, for example, is a capacitive touch panel layer in which transparent electrodes such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or SiNx (Silicon Nitride) are formed. Even if the cover glass is replaced with a glass substitute material, there is no particular problem because it does not affect the essence of the invention.

The second electronic component 20 includes a substrate 21 and an electrode 22 formed on the substrate 21. Examples of such second electronic components include Flexible Printed Circuits (FPC), Integrated Circuits (IC), and the like.

The anisotropic conductive film 30 is made of a cured product of an anisotropic conductive adhesive containing conductive particles 31 and a black pigment 32, and is connected to the first electronic component 10 and the second electronic component by the conductive particles 31. The electronic components 20 are electrically connected.

As the anisotropic conductive adhesive, any of radical polymerization type, anionic polymerization type, cation polymerization type, etc. may be used, but the radical polymerization type is preferable as it enables lower temperature curing and causes less heat damage to the decorative layer 12. .

The radical polymerization type anisotropic conductive adhesive contains a film-forming resin, a radical polymerization resin, a radical polymerization initiator, conductive particles, and a black pigment. Here, carbon black, which is generally used as a black pigment, has radical complementation and is a factor in curing inhibition, so a black pigment that does not contain carbon as the main raw material is used in radical polymerization type anisotropic conductive adhesives. Examples of black pigments that do not contain carbon as a main raw material include titanium-based black pigments.

The connection structure having such a structure temporarily attaches an anisotropic conductive film to the electrode 13 of the first electronic component 10, arranges the second electronic component 20 on the anisotropic conductive film, and It is manufactured by pressing from the top of the electronic component 20 with a pressing head. According to this manufacturing method, the electrode 13 of the first electronic component 10 and the electrode 22 of the second electronic component 20 are electrically connected via the conductive particles 31, and anisotropic conduction is achieved. The first electronic component 10 and the second electronic component 20 can be bonded to each other by the anisotropic conductive film 30 obtained by curing the film.

＜2. Anisotropic conductive adhesive>

Next, the anisotropic conductive adhesive used in the above-described connection structure will be explained. The anisotropic conductive adhesive in this embodiment contains a film-forming resin, a radically polymerizable resin, a radical polymerization initiator, conductive particles, and a black pigment whose main raw material is not carbon.

The film-forming resin corresponds to a high molecular weight resin with an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation. Examples of the film-forming resin include various resins such as phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, acrylic resin, polyimide resin, and butyral resin. These may be used alone, 2 You may use a combination of more than one type. Among these, phenoxy resin is preferably used from the viewpoint of film formation state, connection reliability, etc. The content of film-forming resin is usually 30 to 80 parts by mass, preferably 40 to 70 parts by mass, per 100 parts by mass of the adhesive composition.

Radically polymerizable resin is a substance having a functional group that polymerizes by radicals, and includes epoxy acrylate, urethane acrylate, and polyester acrylate. These may be used individually, or two or more types may be used in combination. It's okay too. Among these, epoxy acrylate is preferably used in this embodiment. The content of the radically polymerizable resin is usually 10 to 60 parts by mass, preferably 20 to 50 parts by mass, per 100 parts by mass of the adhesive composition.

As a radical polymerization initiator, a known one can be used, and an organic peroxide can be used preferably. Examples of organic peroxides include peroxyketals, diacyl peroxides, peroxydicarbonates, peroxyesters, dialkyl peroxides, hydroperoxides, and silyl peroxides, and these can be used alone. Alternatively, two or more types may be used in combination. Among these, peroxyketals are preferably used in this embodiment. The content of the radical polymerization initiator is usually 0.1 to 30 parts by mass, preferably 1 to 20 parts by mass, with respect to 100 parts by mass of the radical adhesive composition.

In addition, as conductive particles, for example, metal particles such as gold particles, silver particles, and nickel particles, and metal coatings in which the surfaces of resin particles such as benzoguanamine resin and styrene resin are coated with metals such as gold, nickel, and zinc. Resin particles, etc. can be used. The average particle diameter of these conductive particles is 1 to 30 μm, more preferably 3 to 20 μm.

Black pigments are not particularly limited as long as carbon is not the main raw material, and include titanium-based black pigments such as titanium oxide, iron oxides (magnetite-type triferric tetroxide), complex oxides of copper and chromium, and complexes of copper, chromium, and zinc. Oxide-based black pigments such as oxides can be used.

When using a titanium-based black pigment, the average primary particle size is preferably 60 nm or more and 800 nm or less. Moreover, it is preferable to mix 2 to 40 parts by mass of the titanium-based black pigment with respect to 100 parts by mass of the adhesive component. Thereby, a bonded structure excellent in conduction resistance, peeling strength, and light-shielding characteristics can be obtained.

Additionally, it is preferable to add a silane coupling agent as another additive to the binder. Examples of silane coupling agents include epoxy-based, amino-based, mercapto-based, sulfide-based, ureido-based, etc.

Additionally, in order to improve adhesion to an inorganic substrate, it is preferable to add phosphoric acid acrylate. Examples of phosphoric acid acrylate include curable phosphoric acid ester compounds that are reaction products of 2-hydroxyethyl methacrylate and phosphoric acid.

Additionally, an inorganic filler may be added. As the inorganic filler, silica, talc, calcium carbonate, magnesium oxide, etc. can be used, and the type of the inorganic filler is not particularly limited. In addition, when mixing each component of these binders, toluene, ethyl acetate, or a mixed solvent thereof is preferably used.

Since the anisotropic conductive adhesive having this structure contains black pigment rather than carbon as the main raw material, it reduces light leakage from the pinhole of the decorative printing part without inhibiting radical reaction, and prevents the appearance of the decorative printing part from being damaged. You can.

＜3. Example>

Hereinafter, embodiments of the present invention will be described. In this example, a radically curable anisotropic conductive film containing a black pigment was manufactured, and the transmittance of the anisotropic conductive film was measured. Moreover, a bonded structure was manufactured using an anisotropic conductive film, and the conduction resistance, peeling strength, and light-shielding characteristics of the bonded structure were evaluated. Additionally, the present invention is not limited to these examples.

Transmittance measurement of the anisotropic conductive film, production of the connection structure, measurement of conduction resistance, measurement of peeling strength, and evaluation of light-shielding properties were performed as follows.

[Measurement of transmittance of anisotropic conductive film]

The transmittance of the anisotropic conductive adhesive film in an uncured state was measured using a spectrophotometer (UV-3600 manufactured by Shimadzu Corporation).

[Manufacture of connection structure]

Fig. 2 is a perspective model diagram showing the connection structure in this embodiment. Evaluation glass that becomes glass/black ink layer/ITO by coating a glass surface with a thickness of 0.7 mm with black ink (GLS-HF919 manufactured by Teikoku Ink Co., Ltd.) to a thickness of 5 ㎛, and then coating the surface with ITO (Indium Tin Oxide). A substrate 51 was produced. In addition, 150 to 200 pinholes per 1 mm2 were formed in the black ink layer with a size of 1 μm to 6 μm. The glass substrate 51 for evaluation is the same as a known ITO (Indium Tin Oxide) coated glass substrate for evaluation (full surface ITO coat, glass thickness 0.7 mm), except that it has a black ink layer in the middle layer. This evaluation glass substrate 51 and the evaluation FPC (400 ㎛P, Cu 18 ㎛t-Au plating, 25 ㎛t-Espanex-S base material) 52 are bonded together using an anisotropic conductive film 53. I ordered it.

The anisotropic conductive film 53 slit to a width of 1.5 mm is attached to the glass substrate 51 for evaluation, and the FPC 52 is temporarily fixed thereon, and then a cushioning material (polytetrafluoroethylene) with a thickness of 100 μm is applied. A connection structure was manufactured by bonding under conditions of 150°C -4 MPa-10 sec using a 1.5 mm wide heat tool.

[Measurement of conduction resistance]

The connection resistance was measured for the connection structure initially and after a high temperature and high humidity test of 60°C/95%/500 hr. Using a digital multimeter (part number: Digital Multimeter 7555, manufactured by Yokogawa Electric Co., Ltd.), the connection resistance when a current of 1 mA was passed was measured using the four-terminal method.

[Measurement of peel strength]

The peeling strength of the bonded structure was measured initially and after a high temperature and high humidity test of 60°C/95%/500 hr. A 90° peeling test (JIS K 6854-1) was conducted in which the evaluation FPC 52 was peeled from the evaluation glass substrate 51 in a 90° direction, and the peeling strength (N/cm) was measured.

[Evaluation of light blocking characteristics]

The connection structure was illuminated from the side of the glass substrate 51 for evaluation on which pinholes had been formed in advance, and observed with a metallographic microscope from the side of the FPC 52 for evaluation. The case where the number of pinholes per 1 mm2 was less than 10 was marked as "◎". Cases where the number of pinholes per 1 mm2 were 10 to 50 were evaluated as “○”, and cases where the number of pinholes per 1 mm2 were 50 or more were evaluated as “×”.

[Total judgment]

The case where the light-shielding property was evaluated as “◎” and the case where the conduction resistance after the high-temperature, high-humidity test was less than 5.0 Ω was evaluated as “A.” In addition, the case where the light-shielding property was evaluated as "◎" and the case where the conduction resistance after the high temperature and high humidity test was 5.0 Ω or more and less than 10.0 Ω was evaluated as "B". The case where the light-shielding property was evaluated as “◎” and the case where the conduction resistance after the high-temperature, high-humidity test was 10.0 Ω or more was evaluated as “C.” In addition, the case where the light-shielding property was evaluated as “○” and the case where the conduction resistance after the high-temperature, high-humidity test was less than 5.0 Ω was evaluated as “B.” In addition, the case where the light-shielding property was evaluated as “○” and the case where the conduction resistance after the high-temperature, high-humidity test was 5.0 Ω or more was evaluated as “C.” In addition, the case where the evaluation of light-shielding property was "×" was evaluated as "C".

[Example 1]

As the film-forming resin, 60 parts by mass of polyester urethane resin (product name: UR8200, manufactured by Toyo Spinning Co., Ltd., dissolved at 20% by mass in a mixed solvent of methyl ethyl ketone/toluene = 50/50), radically polymerizable resin (product name: EB-600, manufactured by Daicel/Cytech Co., Ltd.) 34 parts by mass, silane coupling agent (product name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.) 1 part by mass, phosphoric acid acrylate (product name: P-1M, manufactured by Kyoei Chemical Co., Ltd.) 1 Conductive particles (product name: AUL705, manufactured by Sekisui Chemical Industry Co., Ltd.) are dispersed in an adhesive containing 4 parts by mass of a reaction initiator (product name: Perhexa C, manufactured by Nippon Yuji Co., Ltd.) so that the particle density is 5000 pieces/㎟, and An anisotropic conductive film with a thickness of 20 μm was produced by dispersing 12 parts by mass of a titanium-based black pigment (product name: 12S, manufactured by Mitsubishi Materials) with an average primary particle size of 60 nm.

The transmittance of the anisotropic conductive film of Example 1 was 13.4%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 2.2 Ω, and the conduction resistance after the high-temperature, high-humidity test was 7.0 Ω. In addition, the initial peeling strength was 6.0 N/cm, and the peeling strength after the high temperature and high humidity test was 4.1 N/cm. Additionally, the evaluation of light-shielding properties was ◎. Therefore, the total judgment was B. Table 1 shows these results.

[Example 2]

*An anisotropic conductive film was produced in the same manner as in Example 1, except that 12 parts by mass of a titanium-based black pigment (product name: 13M-C, manufactured by Mitsubishi Materials) with an average primary particle size of 100 nm was dispersed.

The transmittance of the anisotropic conductive film of Example 2 was 13.3%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 2.0 Ω, and the conduction resistance after the high-temperature, high-humidity test was 5.5 Ω. In addition, the initial peeling strength was 6.1 N/cm, and the peeling strength after the high temperature and high humidity test was 4.0 N/cm. Additionally, the evaluation of light-shielding properties was ◎. Therefore, the total judgment was B. Table 1 shows these results.

[Example 3]

An anisotropic conductive film was produced in the same manner as in Example 1, except that 12 parts by mass of a titanium-based black pigment (product name: Tilack D, manufactured by Ako Kasei) with an average primary particle size of 800 nm was dispersed.

The transmittance of the anisotropic conductive film of Example 3 was 13.8%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 1.8 Ω, and the conduction resistance after the high-temperature, high-humidity test was 3.2 Ω. In addition, the initial peeling strength was 6.0 N/cm, and the peeling strength after the high temperature and high humidity test was 4.3 N/cm.

Moreover, FIG. 3 is a photograph of the bonded structure manufactured using the anisotropic conductive film of Example 3, illuminated from the side of the glass substrate for evaluation on which a pinhole was formed in advance, and observed with a metallographic microscope from the side of the FPC for evaluation. No pinholes were observed, and the light-shielding property was evaluated as ◎. Therefore, the total judgment was A. Table 1 shows these results.

[Comparative Example 1]

An anisotropic conductive film was manufactured in the same manner as in Example 1, except that the black pigment was not dispersed.

The transmittance of the anisotropic conductive film of Comparative Example 1 was 84.6%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 1.8 Ω, and the conduction resistance after the high-temperature, high-humidity test was 3.0 Ω. In addition, the initial peeling strength was 5.8 N/cm, and the peeling strength after the high temperature and high humidity test was 4.0 N/cm.

In addition, Figure 4 is a photograph of the bonded structure manufactured using the anisotropic conductive film of Comparative Example 1, illuminated from the side of the glass substrate for evaluation on which a pinhole was previously formed, and observed with a metallographic microscope from the side of the FPC for evaluation. A pinhole was observed, and the light-shielding property was evaluated as ×. Therefore, the total judgment was C. Table 1 shows these results.

[Comparative Example 2]

An anisotropic conductive film was produced in the same manner as in Example 1, except that 1 part by mass of a titanium-based black pigment (product name: Tilack D, manufactured by Ako Kasei) with an average primary particle size of 800 nm was dispersed.

The transmittance of the anisotropic conductive film of Comparative Example 2 was 67.4%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 1.8 Ω, and the conduction resistance after the high-temperature, high-humidity test was 3.2 Ω. In addition, the initial peeling strength was 5.9 N/cm, and the peeling strength after the high temperature and high humidity test was 4.0 N/cm. Additionally, the evaluation of light-shielding properties was ×. Therefore, the total judgment was C. Table 1 shows these results.

[Example 4]

*An anisotropic conductive film was produced in the same manner as in Example 1, except that 2 parts by mass of a titanium-based black pigment (product name: Tilack D, manufactured by Ako Kasei) with an average primary particle size of 800 nm was dispersed.

The transmittance of the anisotropic conductive film of Example 4 was 50.3%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 1.8 Ω, and the conduction resistance after the high-temperature, high-humidity test was 3.0 Ω. In addition, the initial peeling strength was 6.0 N/cm, and the peeling strength after the high temperature and high humidity test was 4.2 N/cm. Additionally, the evaluation of light-shielding properties was ○. Therefore, the total judgment was B. Table 1 shows these results.

[Example 5]

An anisotropic conductive film was produced in the same manner as in Example 1, except that 5 parts by mass of a titanium-based black pigment (product name: Tilack D, manufactured by Ako Kasei) with an average primary particle size of 800 nm was dispersed.

The transmittance of the anisotropic conductive film of Example 5 was 17.9%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 1.8 Ω, and the conduction resistance after the high-temperature, high-humidity test was 3.1 Ω. In addition, the initial peeling strength was 6.1 N/cm, and the peeling strength after the high temperature and high humidity test was 4.0 N/cm. Additionally, the evaluation of light-shielding properties was ◎. Therefore, the total judgment was A. Table 1 shows these results.

[Example 6]

An anisotropic conductive film was produced in the same manner as in Example 1, except that 36 parts by mass of a titanium-based black pigment (product name: Tilack D, manufactured by Ako Kasei) with an average primary particle size of 800 nm was dispersed.

The transmittance of the anisotropic conductive film of Example 6 was 11.2%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 2.3 Ω, and the conduction resistance after the high-temperature, high-humidity test was 7.9 Ω. In addition, the initial peeling strength was 6.3 N/cm, and the peeling strength after the high temperature and high humidity test was 4.1 N/cm. Additionally, the evaluation of light-shielding properties was ◎. Therefore, the total judgment was B. Table 1 shows these results.

[Comparative Example 3]

An anisotropic conductive film was produced in the same manner as in Example 1, except that 48 parts by mass of a titanium-based black pigment (product name: Tilack D, manufactured by Ako Kasei) with an average primary particle size of 800 nm was dispersed.

The transmittance of the anisotropic conductive film of Comparative Example 3 was 10.7%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 2.5 Ω, and the conduction resistance after the high-temperature, high-humidity test was 11.3 Ω. In addition, the initial peeling strength was 6.5 N/cm, and the peeling strength after the high temperature and high humidity test was 4.2 N/cm. Additionally, the evaluation of light-shielding properties was ◎. Therefore, the total judgment was C. Table 1 shows these results.

[Comparative Example 4]

An anisotropic conductive film was produced in the same manner as in Example 1, except that 12 parts by mass of carbon black (product name: #2350, manufactured by Mitsubishi Chemical) with an average primary particle size of 15 nm was dispersed as a black pigment.

The transmittance of the anisotropic conductive film of Comparative Example 4 was 12.0%. Additionally, the initial conduction resistance of the bonded structure manufactured using the anisotropic conductive film was 5.2 Ω, and the conduction resistance after the high-temperature, high-humidity test was 10.6 Ω. In addition, the initial peeling strength was 1.5 N/cm, and the peeling strength after the high temperature and high humidity test was 0.5 N/cm. Additionally, the evaluation of light-shielding properties was ◎. Therefore, the total judgment was C. Table 1 shows these results.

As shown in Table 1, it was found that by mixing an appropriate amount of black pigment, a restorative function that prevents light leakage from pinholes can be provided, and the design of the decorative part can be maintained. As shown in Examples 1 to 6, when using a titanium-based black pigment, by mixing 2 to 40 parts by mass of a titanium-based black pigment with an average primary particle size of 60 nm or more and 800 nm or less with respect to 100 parts by mass of the adhesive component, the conduction resistance, It was found that a bonded structure with excellent peeling strength and light-shielding properties was obtained. Additionally, as shown in Comparative Example 4, carbon black has radical replenishment properties and becomes a factor in curing inhibition, so in the case of a radically curable anisotropic conductive film, it is necessary to use a black pigment other than carbon black.

10: first electronic component
11: transparent substrate
12: Decorative layer
13: electrode
20: second electronic component
21: substrate
22 ; electrode
30: Anisotropic conductive film
51: glass substrate
52:FPC
53: Anisotropic conductive film

Claims (10)

As an anisotropic conductive film,
Contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, conductive particles, and a black pigment that does not contain carbon,
When the thickness is converted to 20 μm, it has a transmittance of 11.2% or more and 50.3% or less to visible light,
An anisotropic conductive film in which the black pigment is blended in an amount of 2 to 40 parts by mass with respect to 100 parts by mass of the adhesive component containing a film-forming resin, a radical polymerizable resin, and a radical polymerization initiator. According to claim 1,
When the anisotropic conductive film is used to connect a first electronic component with an electrode formed on a decorative layer forming a pinhole with a diameter of 1 μm to 6 μm and a second electronic component, the number of pinholes through which illumination light passes is 1. Anisotropic conductive film, less than 50 per mm2. According to claim 2,
An anisotropic conductive film in which 150 to 200 pinholes in the decorative layer are formed per 1 mm2. delete According to claim 1,
An anisotropic conductive film wherein the black pigment is a titanium-based black pigment. According to claim 1,
The average particle diameter of the conductive particles is 3 to 20 ㎛,
An anisotropic conductive film wherein the black pigment is a titanium-based black pigment with an average primary particle size of 60 to 1000 nm. As an anisotropic conductive adhesive,
Contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, conductive particles, and a black pigment that does not contain carbon,
When the thickness is converted to 20 μm, it has a transmittance of 11.2% or more and 50.3% or less to visible light,
An anisotropic conductive adhesive in which the black pigment is blended in an amount of 2 to 40 parts by mass with respect to 100 parts by mass of the adhesive component containing a film-forming resin, a radical polymerizable resin, and a radical polymerization initiator. On the electrode of the first electronic component in which the electrode is formed on the decoration layer, the anisotropic conductive film according to any one of claims 1 to 3 and 5 to 6, or the anisotropic conductive film according to claim 7 Placing a second electronic component through a conductive adhesive,
A method of manufacturing a connection structure, wherein the second electronic component is pressed from the upper surface with a pressing head. A first electronic component with an electrode formed on the decoration layer,
a second electronic component having an electrode opposing the electrode of the first electronic component;
Provided with an anisotropic conductive film connecting the electrode of the first electronic component and the electrode of the second electronic component,
A bonded structure in which the anisotropic conductive film is a cured product of the anisotropic conductive film according to any one of claims 1 to 3 and 5 to 6, or the anisotropic conductive adhesive according to claim 7. A first electronic component comprising a display window having a touch panel function, a decorative layer formed on a peripheral portion other than the display window, and an electrode formed on the decorative layer;
a second electronic component having an electrode opposing the electrode of the first electronic component;
and an anisotropic conductive film connecting the electrode of the first electronic component and the electrode of the second electronic component, wherein the anisotropic conductive film is as defined in any one of claims 1 to 3 and 5 to 6. A touch panel comprising the anisotropic conductive film described above or a cured product of the anisotropic conductive adhesive described in claim 7.