HK1206457A1 - The connection structure and the anisotropic conductive adhesive - Google Patents

The connection structure and the anisotropic conductive adhesive

Info

Publication number
HK1206457A1
HK1206457A1 HK15107017.7A HK15107017A HK1206457A1 HK 1206457 A1 HK1206457 A1 HK 1206457A1 HK 15107017 A HK15107017 A HK 15107017A HK 1206457 A1 HK1206457 A1 HK 1206457A1
Authority
HK
Hong Kong
Prior art keywords
connection structure
conductive adhesive
anisotropic conductive
anisotropic
adhesive
Prior art date
Application number
HK15107017.7A
Other languages
Chinese (zh)
Inventor
林慎
田中雄介
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1206457A1 publication Critical patent/HK1206457A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Position Input By Displaying (AREA)
  • Adhesive Tapes (AREA)
HK15107017.7A 2013-09-12 2015-07-23 The connection structure and the anisotropic conductive adhesive HK1206457A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013189044A JP6238655B2 (en) 2013-09-12 2013-09-12 Connection structure and anisotropic conductive adhesive

Publications (1)

Publication Number Publication Date
HK1206457A1 true HK1206457A1 (en) 2016-01-08

Family

ID=52820557

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107017.7A HK1206457A1 (en) 2013-09-12 2015-07-23 The connection structure and the anisotropic conductive adhesive

Country Status (4)

Country Link
JP (1) JP6238655B2 (en)
KR (3) KR20150030621A (en)
CN (2) CN112080243B (en)
HK (1) HK1206457A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6346877B2 (en) * 2015-06-25 2018-06-20 株式会社タムラ製作所 Anisotropic conductive adhesive and method for producing printed wiring board using the same
JP5974147B1 (en) 2015-07-31 2016-08-23 株式会社フジクラ Wiring assembly, structure with conductor layer, and touch sensor
CN109614017B (en) * 2018-11-27 2021-07-06 武汉华星光电半导体显示技术有限公司 Touch panel and display device
CN112768590A (en) * 2020-12-30 2021-05-07 深圳市华星光电半导体显示技术有限公司 Preparation method of display panel and display panel
JP2024146277A (en) * 2023-03-31 2024-10-15 デクセリアルズ株式会社 Filler-arranged film and its manufacturing method, and connection structure and its manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001126541A (en) * 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd Anisotropic-conductive film and electric/electronic parts
CN1250663C (en) * 2001-06-25 2006-04-12 泰勒弗氏股份有限公司 Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same
JP3886401B2 (en) * 2002-03-25 2007-02-28 ソニーケミカル＆インフォメーションデバイス株式会社 Method for manufacturing connection structure
JP5029372B2 (en) 2007-09-14 2012-09-19 日立化成工業株式会社 Anisotropic conductive adhesive, anisotropic conductive film, and method for manufacturing circuit connection structure
KR101025620B1 (en) * 2009-07-13 2011-03-30 한국과학기술원 Anisotropic Conductive Adhesives for UltraSonic Bonding and Electrical Interconnection Method of Electronic Components Using Thereof
JP2012088412A (en) * 2010-10-18 2012-05-10 Sekisui Chem Co Ltd Light-shielding sealing agent for liquid crystal display element, vertical conducting material and liquid crystal display element
JP5690637B2 (en) * 2011-04-12 2015-03-25 デクセリアルズ株式会社 Anisotropic conductive film, connection method and connection structure
JP5844599B2 (en) * 2011-10-12 2016-01-20 デクセリアルズ株式会社 CONNECTION DEVICE, CONNECTION MANUFACTURING METHOD, CONNECTION METHOD
JP5886588B2 (en) * 2011-10-18 2016-03-16 デクセリアルズ株式会社 Conductive adhesive, solar cell module using the same, and manufacturing method thereof
JP5133449B1 (en) * 2011-11-04 2013-01-30 Ｓｍｋ株式会社 Transparent touch panel
KR101355854B1 (en) * 2011-12-16 2014-01-29 제일모직주식회사 Anisotropic conductive film

Also Published As

Publication number Publication date
JP6238655B2 (en) 2017-11-29
KR20220159332A (en) 2022-12-02
CN104461117A (en) 2015-03-25
KR102653068B1 (en) 2024-03-29
KR20150030621A (en) 2015-03-20
CN112080243A (en) 2020-12-15
KR20210090587A (en) 2021-07-20
JP2015056285A (en) 2015-03-23
CN104461117B (en) 2020-09-08
KR102469837B1 (en) 2022-11-22
CN112080243B (en) 2023-01-17

Similar Documents

Publication Publication Date Title
HK1257883A1 (en) Anisotropic electroconductive film and connection structure
GB2512195B (en) Connecting device and electronic device assembly
HK1209450A1 (en) Anisotropic conductive adhesive
HK1246509A1 (en) Anisotropic conductive film and connection structure
EP3062707A4 (en) Stethoscope and electronic device structure
HK1250424A1 (en) Anisotropic conductive film and connection structure
IL240527A0 (en) Dental-prosthetic assembly and dental-prosthetic system
EP3087057A4 (en) Ring-contracted morphinans and the use thereof
EP2899244A4 (en) Anisotropic conductive adhesive and connection structure
EP3045508A4 (en) Adhesive and light-emitting device
EP2982727A4 (en) Conductive adhesive, anisotropic conductive film and electronic devices using both
EP3041043A4 (en) Assembly and power-module substrate
EP3065170A4 (en) Pressing structure and pressing unit
EP3041045A4 (en) Assembly and power-module substrate
HK1249665A1 (en) Anisotropic conductive film and connection structure
EP3087638A4 (en) Antenna device and electrical device including the same
EP3087950A4 (en) Artificial-blood-vessel connector and artificial-blood-vessel unit
EP2933176A4 (en) Skateboard member and skateboard having same
HK1198448A1 (en) Anisotropic conductive film, connecting method and joined structure
HK1245509A1 (en) Anisotropic conductive film and connection structure
HK1252270A1 (en) Anisotropic conductive film and connection structure
EP3041044A4 (en) Assembly and power-module substrate
EP3005479A4 (en) Antenna device and electronic device having the same
IL235516A0 (en) Waveguide to parallel-plate transition and device including the same
EP3007277A4 (en) Conducting member