CN101570681B - Bond composition and optical film - Google Patents
Bond composition and optical film Download PDFInfo
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- CN101570681B CN101570681B CN2008100960782A CN200810096078A CN101570681B CN 101570681 B CN101570681 B CN 101570681B CN 2008100960782 A CN2008100960782 A CN 2008100960782A CN 200810096078 A CN200810096078 A CN 200810096078A CN 101570681 B CN101570681 B CN 101570681B
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Abstract
The invention relates to a bond composition and an optical film. The bond contains (A) resin formed by monomers showed in a formula (I), (B) resin with a structure showed in a formula (II), (C) anhydride hardener, (D) diamine catalyst and (E) solvent. The bond composition can harden under low temperature, provides favorable cohesive force, has excellent optical property and is especially suitablefor manufacturing optical films. The electromagnetic shielding optical film provided by the invention comprises an essentially transparent base material and a metal material layer which is adhered tothe surface of the base material through the bond composition.
Description
Technical field
The present invention relates to a kind of binder composition.Particularly, the present invention relates to be used for the binder composition and the blooming of blooming.
Background technology
Electromagnetic noise that electronic product produced or interference can be sent out electronic installation by electromagnetic interference (EMI) screened film block electromagnetic energy.Generally speaking, can use such as metal such as copper or silver or other electro-conductive material as screened film to isolate radiation.Yet use electro-conductive material as screened film traditionally, be only applicable to circuit card or lead.In the application as for photovoltaic, for example LCD TV, plasma-screen television or mobile phone etc. are because the opacity of this conductive articles and can't be as the electromagnetic shielding in display unit the place ahead.
JP5-283889 is open to form copper net-like pattern with the electrodeless plating method, needs the substrate surface roughening for not having electricity and electroplating and use.And the processing of this roughening needs to use poisonous oxygenant, and only just can obtain during by ABS resin at substrate and be desired the result.TW485750 then discloses a kind of electromagnetic shielding bonding film, comprises that plastic base reaches the metal material layer that forms geometric scheme by lithography, and tackiness agent adhesive base plate and metal material layer.And this tackiness agent uses the thermoplastic resin with 200 ℃ or lower softening temperature.
By and large, the characteristic of tackiness agent need have can be when low temperature bonding various material and keep bonding closely.Especially, when relating to the electromagnetic shielding of display unit, the transparency of tackiness agent also is an essential condition.Therefore still need a kind of new binder composition in the technical field under.
Summary of the invention
In view of the above problems, the object of the present invention is to provide a kind of binder composition with good transparency.
Another purpose of the present invention is to provide a kind of binder composition that can carry out bonding processing when low temperature.
Another object of the present invention is to provide a kind of electromagnetic shielding blooming.
For reaching above-described purpose, the invention provides a kind of binder composition, comprise (A) 15 to 45 weight %, suc as formula the resin that monomer constituted shown in (I); (B) 15 to 55 weight %, the resin with structure shown in the formula (II); (C) the acid anhydride class stiffening agent of 1.5 to 6 weight %; (D) diamine catalyst of 2 to 15 weight %; And (E) solvent.
Binder composition of the present invention can harden under low temperature and good bounding force is provided, and has excellent optical property, is particularly suitable for making blooming.
The present invention provides a kind of electromagnetic shielding blooming again, comprises the base material of essence transparent (substantially transparent); And the metal material layer that is adhered to this substrate surface by binder composition.
Embodiment
Below will further describe viewpoint of the present invention, but be not in order to limit category of the present invention by particular embodiment.
Binder composition of the present invention comprises that the number-average molecular weight that constitutes suc as formula monomer shown in (I) is about 10000 to 20000, and is preferred about 11000 to 15000, more preferably from about 11000 to 13000 resin.
Generally speaking, in the binder composition of the present invention, the resin that constitutes suc as formula monomer shown in (I) accounts for 15 to 45 weight % of composition gross weight, preferably accounts for 25 to 40 weight % of composition gross weight, more preferably accounts for 30 to 35 weight % of composition gross weight.
Binder composition of the present invention comprise have two or more can with the epoxy group(ing) of stiffening agent reaction, the resin shown in the formula (II)
In the formula, R is expression hydrogen or the alkyl with 1 to 6 carbon atom, and n is 2 to 5 integer.The example of this alkyl includes, but not limited to methyl, ethyl, propyl group, sec.-propyl, butyl, second butyl, tributyl, amyl group, cyclopentyl, hexyl, cyclohexyl etc.
For making binder composition of the present invention have good transparency, bounding force, chemical resistant properties (chemical resistance) and low-shrinkage, resin with structure shown in the formula (II) accounts for 15 to 55 weight % of composition gross weight usually, preferably account for 20 to 50 weight % of composition gross weight, more preferably account for 25 to 45 weight % of composition gross weight.
Binder composition of the present invention comprises acid anhydride class stiffening agent, for example, but the non-methyl tetrahydro phthalic anhydride (MTHPA) that is limited to, this acid anhydride class stiffening agent accounts for 1.5 to 6 weight % of composition gross weight usually, preferably accounts for 2.5 to 5 weight % of composition gross weight.On the other hand, be the reaction times and the reduction stiffening temperature that shorten binder composition, this binder composition further comprises diamine catalyst, and this diamine catalyst is good not contain the heterocyclic compound.In a specific examples, the compound of use formula (III) is as diamine catalyst:
In the formula, R
1Expression have 1 to 6 carbon atom straight chain or branched chain alkyl, have the alkoxyl group of 1 to 6 carbon atom, and X is 2 to 8 integer, is preferably 4 to 6 integer.
In the binder composition of the present invention, diamine catalyst accounts for 2 to 15 weight % of composition gross weight, preferably accounts for 3 to 12 weight % of composition gross weight, more preferably accounts for 5 to 10 weight % of composition gross weight.
Binder composition of the present invention can further comprise additives such as thinner, softening agent, antioxidant, weighting agent, tinting material, infrared absorbent.The example of this infrared absorbent includes, but not limited to metal oxide, tungsten hexachloride, tungsten chloride, cupric sulfide (II), ammonium compound, phthalocyanine (SIR-103) of the class of ferric oxide, cerium oxide, stannic oxide, weisspiessglanz, indium tin oxide etc.In a specific examples, this infrared absorbent accounts for 0.01 to 10 weight % of composition gross weight, preferably accounts for 0.01 to 5 weight % of composition gross weight.
Binder composition of the present invention can use the solvent of any soluble resin, and the example includes, but not limited to methyl ethyl ketone (MEK), 1-Methoxy-2-propyl acetate, acetone etc.
Binder composition of the present invention is particularly suitable for making blooming, for example, uses this binder composition to make the electromagnetic shielding blooming.This electromagnetic shielding blooming comprises base material that essence is transparent and the metal material layer that is bonded in this substrate surface by binder composition.The example of the base material of this electromagnetic shielding blooming comprises, but be not limited to, polyethylene terephthalate (PET), polyolefins, for example, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene dichloride, polysulfones, polyethersulfone, poly-carbonic acid, polymeric amide, polyimide and acryl resin etc. preferably use polyethylene terephthalate.
Below further specify characteristics of the present invention and effect by particular specific embodiment, limit the scope of the invention but be not used in.
Embodiment
Embodiment 1 to 6Blooming property detection of the present invention
Component content according to each composition shown in the table 1, with resin dissolves in methyl ethyl ketone, and add methyl tetrahydro phthalic anhydride stiffening agent and diamine catalyst of the present invention, and mix the back with after aperture 180 purpose screen filtrations and the deaeration, obtain binder composition of the present invention.
Bonding, binder composition of the present invention is applied on the polyethylene terephthalate base material of thickness 90 to 110 μ m and with the copper metal material layer bonding after, with 80 ℃ of dryings 2 minutes,, obtain electromagnetic shielding blooming sample again with 65 ℃ of sclerosis.
Superelevation sensitivity moment photometric system (PHOTAL, MCPD-3000) optical property of test electromagnetic shielding blooming sample of using big tomb electronics corporation (Otsuka Electronics) to make at last.Test result is embedded in table 1.
Reference examples 1
Will
NagaseThe acrylate copolymer (SG-70L) that chemteX company produces and the resin dissolves of formula (II) are in methyl ethyl ketone, and interpolation methyl tetrahydro phthalic anhydride stiffening agent and diamine catalyst of the present invention, mix the back with after aperture 180 purpose screen filtrations and the deaeration, obtain the binder composition of acrylate copolymer.
Then this binder composition is applied on the polyethylene terephthalate base material of thickness 90 to 110 μ m and with the copper metal material layer bonding after, with 80 ℃ of dryings 2 minutes,, obtain the electromagnetic shielding blooming sample of reference examples 1 again with 65 ℃ of sclerosis.
Superelevation sensitivity moment photometric system (PHOTAL, MCPD-3000) optical property of the electromagnetic shielding blooming of test reference examples 1 of using big tomb electronics corporation (Otsuka Electronics) to make at last.Test result is embedded in table 1.
Reference examples 2
With the resin dissolves of formula of the present invention (I) and formula (II) in methyl ethyl ketone, and add methyl tetrahydro phthalic anhydride stiffening agent of the present invention, but use and have the 2-ethyl-4-methyl-imidazoles of heterocycle structure as catalyzer, mix the back with after aperture 180 purpose screen filtrations and the deaeration, obtain the binder composition of reference examples 2.
On the bonding polyethylene terephthalate substrate that this binder composition is applied to thickness 90 to 110 μ m and with the copper metal material layer bonding after, with 80 ℃ of dryings 2 minutes, with 65 ℃ of these binder compositions of sclerosis, obtain the electromagnetic shielding blooming of reference examples 2 again.
Superelevation sensitivity moment photometric system (PHOTAL, MCPD-3000) optical property of the electromagnetic shielding blooming of test reference examples 1 of using big tomb electronics corporation (Otsuka Electronics) to make at last.Test result is embedded in table 1.
Table 1
The number-average molecular weight of formula (I) resin is 11,000, weight-average molecular weight is 43,000;
In the formula (II), R is that methyl and n are 2;
In the formula (III), R
1For methyl and X are 6;
X is the x coordinate figure of the tristimulus coordinates figure of CIE (CIE);
Y is the y coordinate figure of the tristimulus coordinates figure of CIE (CIE);
Y is brightness
Show according to table 1 result, in the reference examples 1, contain on the blooming appearance color of tackiness agent of acrylic resin and be oyster white, be not suitable for being applied to optical field.In reference examples 2, though be water white transparency on this blooming appearance color, only find to be easy to generate etiolation by comprising the blooming that the 2-ethyl-tackiness agent of 4-methyl-imidazole catalyst makes with heterocycle structure, and after testing, this blooming also is positioned at the zone of inclined to one side Huang in tristimulus coordinates figure, therefore, when being applied to optical articles, the blooming of reference examples 2 can influence its color representation.Relatively, the outward appearance of blooming of the present invention is a water white transparency, and all falls within colourless zone in tristimulus coordinates figure, so blooming of the present invention has excellent optical property, is fit to be applied to optical articles and photovoltaic, for example electromagnetic shielding blooming or the like.
Claims (9)
1. binder composition that is used for blooming comprises:
(A) 15 to 45 weight % are suc as formula the resin of the formation of monomer shown in (I)
Wherein, the number-average molecular weight of the resin of the formation of monomer shown in this formula (I) is 10000 to 20000;
(B) 15 to 55 weight %, the resin with structure shown in the formula (II)
In the formula, R is expression hydrogen or the alkyl with 1 to 6 carbon atom, and n is 2 to 5 integer;
(C) the acid anhydride class stiffening agent of 1.5 to 6 weight %;
(D) diamine catalyst of 2 to 15 weight %; And
(E) all the other are solvent.
2. binder composition according to claim 1, wherein said acid anhydride class stiffening agent is a methyl tetrahydro phthalic anhydride.
3. binder composition according to claim 1, wherein said diamine catalyst are the compound of formula (III):
In the formula, R
1For expression have 1 to 6 carbon atom straight chain or branched chain alkyl, have the alkoxyl group of 1 to 6 carbon atom; And X is 2 to 8 integer.
4. binder composition according to claim 3, wherein R
1Be methyl.
5. binder composition according to claim 1, wherein said solvent is selected from methyl ethyl ketone, 1-Methoxy-2-propyl acetate or acetone.
6. binder composition according to claim 1 further comprises additive.
7. binder composition according to claim 6, this additive are infrared absorbent.
8. an electromagnetic shielding blooming comprises
Transparent base material; And
Be adhered to metal material layer on the described substrate surface by each described binder composition in the claim 1 to 7.
9. blooming according to claim 8, wherein said base material are polyethylene terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100960782A CN101570681B (en) | 2008-04-30 | 2008-04-30 | Bond composition and optical film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100960782A CN101570681B (en) | 2008-04-30 | 2008-04-30 | Bond composition and optical film |
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| Publication Number | Publication Date |
|---|---|
| CN101570681A CN101570681A (en) | 2009-11-04 |
| CN101570681B true CN101570681B (en) | 2011-06-29 |
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| CN2008100960782A Active CN101570681B (en) | 2008-04-30 | 2008-04-30 | Bond composition and optical film |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102149252A (en) * | 2010-02-04 | 2011-08-10 | 景旺电子（深圳）有限公司 | Preparation method for aluminum-base copper-clad plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124030A (en) * | 1993-05-26 | 1996-06-05 | 汉克尔股份两合公司 | Thermally cross-linkable heat-sealing adhesive |
| CN1436827A (en) * | 2002-02-08 | 2003-08-20 | 花王株式会社 | Adhesive for felt sheet |
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2008
- 2008-04-30 CN CN2008100960782A patent/CN101570681B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124030A (en) * | 1993-05-26 | 1996-06-05 | 汉克尔股份两合公司 | Thermally cross-linkable heat-sealing adhesive |
| EP0700409B1 (en) * | 1993-05-26 | 2000-08-02 | Henkel Kommanditgesellschaft auf Aktien | Thermally cross-linkable heat-sealing adhesive |
| CN1436827A (en) * | 2002-02-08 | 2003-08-20 | 花王株式会社 | Adhesive for felt sheet |
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| CN101570681A (en) | 2009-11-04 |
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