KR102645397B1 - 레이저 가공 장치 및 방법, 칩 전사 장치 및 방법 - Google Patents
레이저 가공 장치 및 방법, 칩 전사 장치 및 방법 Download PDFInfo
- Publication number
- KR102645397B1 KR102645397B1 KR1020217040941A KR20217040941A KR102645397B1 KR 102645397 B1 KR102645397 B1 KR 102645397B1 KR 1020217040941 A KR1020217040941 A KR 1020217040941A KR 20217040941 A KR20217040941 A KR 20217040941A KR 102645397 B1 KR102645397 B1 KR 102645397B1
- Authority
- KR
- South Korea
- Prior art keywords
- target
- chip
- chips
- processing
- machining
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 126
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000012546 transfer Methods 0.000 title claims description 82
- 238000003754 machining Methods 0.000 claims abstract description 64
- 239000011159 matrix material Substances 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 118
- 230000008859 change Effects 0.000 claims description 27
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000003672 processing method Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 description 13
- 230000000903 blocking effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000013518 transcription Methods 0.000 description 6
- 230000035897 transcription Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Die Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2019-111653 | 2019-06-17 | ||
JP2019111653 | 2019-06-17 | ||
JP2020011353A JP7307001B2 (ja) | 2019-06-17 | 2020-01-28 | レーザ加工装置および方法、チップ転写装置および方法 |
JPJP-P-2020-011353 | 2020-01-28 | ||
PCT/JP2020/010911 WO2020255497A1 (ja) | 2019-06-17 | 2020-03-12 | レーザ加工装置および方法、チップ転写装置および方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20220018980A KR20220018980A (ko) | 2022-02-15 |
KR102645397B1 true KR102645397B1 (ko) | 2024-03-11 |
Family
ID=73838148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217040941A KR102645397B1 (ko) | 2019-06-17 | 2020-03-12 | 레이저 가공 장치 및 방법, 칩 전사 장치 및 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7307001B2 (zh) |
KR (1) | KR102645397B1 (zh) |
CN (1) | CN114007803B (zh) |
TW (1) | TWI822986B (zh) |
WO (1) | WO2020255497A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10870226B2 (en) | 2019-03-27 | 2020-12-22 | Omachron Intellectual Property Inc. | Apparatus and methods using multiple extruders |
JP7387666B2 (ja) | 2021-03-15 | 2023-11-28 | 東レエンジニアリング株式会社 | チップ部品除去装置 |
JP7492478B2 (ja) | 2021-03-23 | 2024-05-29 | 株式会社東海理化電機製作所 | レーザリフトオフ装置およびレーザリフトオフ方法 |
WO2023101215A1 (ko) * | 2021-11-30 | 2023-06-08 | 주식회사 프로텍 | 마이크로 led 칩 전사 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101560722B1 (ko) | 2014-04-09 | 2015-10-15 | 창원대학교 산학협력단 | 직선식 레이저가공 보조장치 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS46178Y1 (zh) | 1966-07-15 | 1971-01-07 | ||
JPH08150487A (ja) * | 1994-11-28 | 1996-06-11 | Hajime Makita | デポジション装置 |
JPH1119788A (ja) | 1997-07-01 | 1999-01-26 | Nikon Corp | レーザ加工装置 |
JP3455102B2 (ja) * | 1998-02-06 | 2003-10-14 | 三菱電機株式会社 | 半導体ウエハチップ分離方法 |
JP4078825B2 (ja) * | 2001-10-30 | 2008-04-23 | ソニー株式会社 | 回路基板の製造方法、並びに表示装置の製造方法 |
JP2003334683A (ja) * | 2002-05-17 | 2003-11-25 | Sangaku Renkei Kiko Kyushu:Kk | レーザ加工装置とレーザ加工方法 |
US7119351B2 (en) * | 2002-05-17 | 2006-10-10 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
JP2004330536A (ja) * | 2003-05-06 | 2004-11-25 | Fuji Photo Film Co Ltd | 露光ヘッド |
US7744770B2 (en) * | 2004-06-23 | 2010-06-29 | Sony Corporation | Device transfer method |
US20060013680A1 (en) * | 2004-07-16 | 2006-01-19 | Tessera, Inc. | Chip handling methods and apparatus |
JP4018096B2 (ja) * | 2004-10-05 | 2007-12-05 | 松下電器産業株式会社 | 半導体ウェハの分割方法、及び半導体素子の製造方法 |
KR100694072B1 (ko) * | 2004-12-15 | 2007-03-12 | 삼성전자주식회사 | 레이저 반점을 제거한 조명계 및 이를 채용한 프로젝션시스템 |
EP2239084A1 (en) * | 2009-04-07 | 2010-10-13 | Excico France | Method of and apparatus for irradiating a semiconductor material surface by laser energy |
JP5637526B2 (ja) * | 2010-04-28 | 2014-12-10 | 株式会社ブイ・テクノロジー | レーザ加工装置 |
TWI561327B (en) * | 2013-10-16 | 2016-12-11 | Asm Tech Singapore Pte Ltd | Laser scribing apparatus comprising adjustable spatial filter and method for etching semiconductor substrate |
JP6452490B2 (ja) * | 2015-02-25 | 2019-01-16 | キヤノン株式会社 | 半導体チップの生成方法 |
JP2018098441A (ja) * | 2016-12-16 | 2018-06-21 | 株式会社ディスコ | ダイボンダー |
JP6720333B2 (ja) * | 2017-06-12 | 2020-07-08 | ユニカルタ・インコーポレイテッド | 基板上に個別部品を並列に組み立てる方法 |
WO2021117557A1 (ja) * | 2019-12-12 | 2021-06-17 | 東レエンジニアリング株式会社 | 光スポット像照射装置および転写装置 |
JP2021118284A (ja) * | 2020-01-28 | 2021-08-10 | 東レエンジニアリング株式会社 | チップ転写装置 |
-
2020
- 2020-01-28 JP JP2020011353A patent/JP7307001B2/ja active Active
- 2020-03-12 CN CN202080043575.5A patent/CN114007803B/zh active Active
- 2020-03-12 WO PCT/JP2020/010911 patent/WO2020255497A1/ja active Application Filing
- 2020-03-12 KR KR1020217040941A patent/KR102645397B1/ko active IP Right Grant
- 2020-04-06 TW TW109111468A patent/TWI822986B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101560722B1 (ko) | 2014-04-09 | 2015-10-15 | 창원대학교 산학협력단 | 직선식 레이저가공 보조장치 |
Also Published As
Publication number | Publication date |
---|---|
JP7307001B2 (ja) | 2023-07-11 |
TWI822986B (zh) | 2023-11-21 |
TW202112479A (zh) | 2021-04-01 |
WO2020255497A1 (ja) | 2020-12-24 |
JP2020203313A (ja) | 2020-12-24 |
CN114007803B (zh) | 2023-05-30 |
KR20220018980A (ko) | 2022-02-15 |
CN114007803A (zh) | 2022-02-01 |
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