JP7307001B2 - レーザ加工装置および方法、チップ転写装置および方法 - Google Patents

レーザ加工装置および方法、チップ転写装置および方法 Download PDF

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Publication number
JP7307001B2
JP7307001B2 JP2020011353A JP2020011353A JP7307001B2 JP 7307001 B2 JP7307001 B2 JP 7307001B2 JP 2020011353 A JP2020011353 A JP 2020011353A JP 2020011353 A JP2020011353 A JP 2020011353A JP 7307001 B2 JP7307001 B2 JP 7307001B2
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JP
Japan
Prior art keywords
chips
processed
target
chip
workpiece
Prior art date
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Active
Application number
JP2020011353A
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English (en)
Japanese (ja)
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JP2020203313A (ja
Inventor
英治 森
真一 星野
正剛 岡田
豪 常吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
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Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to PCT/JP2020/010911 priority Critical patent/WO2020255497A1/ja
Priority to CN202080043575.5A priority patent/CN114007803B/zh
Priority to KR1020217040941A priority patent/KR102645397B1/ko
Priority to TW109111468A priority patent/TWI822986B/zh
Publication of JP2020203313A publication Critical patent/JP2020203313A/ja
Application granted granted Critical
Publication of JP7307001B2 publication Critical patent/JP7307001B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2020011353A 2019-06-17 2020-01-28 レーザ加工装置および方法、チップ転写装置および方法 Active JP7307001B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2020/010911 WO2020255497A1 (ja) 2019-06-17 2020-03-12 レーザ加工装置および方法、チップ転写装置および方法
CN202080043575.5A CN114007803B (zh) 2019-06-17 2020-03-12 激光加工装置及方法、芯片转印装置及方法
KR1020217040941A KR102645397B1 (ko) 2019-06-17 2020-03-12 레이저 가공 장치 및 방법, 칩 전사 장치 및 방법
TW109111468A TWI822986B (zh) 2019-06-17 2020-04-06 雷射加工裝置及方法、晶片轉移裝置及方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019111653 2019-06-17
JP2019111653 2019-06-17

Publications (2)

Publication Number Publication Date
JP2020203313A JP2020203313A (ja) 2020-12-24
JP7307001B2 true JP7307001B2 (ja) 2023-07-11

Family

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Family Applications (1)

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JP2020011353A Active JP7307001B2 (ja) 2019-06-17 2020-01-28 レーザ加工装置および方法、チップ転写装置および方法

Country Status (5)

Country Link
JP (1) JP7307001B2 (zh)
KR (1) KR102645397B1 (zh)
CN (1) CN114007803B (zh)
TW (1) TWI822986B (zh)
WO (1) WO2020255497A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10870226B2 (en) 2019-03-27 2020-12-22 Omachron Intellectual Property Inc. Apparatus and methods using multiple extruders
JP7387666B2 (ja) * 2021-03-15 2023-11-28 東レエンジニアリング株式会社 チップ部品除去装置
JP7492478B2 (ja) 2021-03-23 2024-05-29 株式会社東海理化電機製作所 レーザリフトオフ装置およびレーザリフトオフ方法
WO2023101215A1 (ko) * 2021-11-30 2023-06-08 주식회사 프로텍 마이크로 led 칩 전사 장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003334683A (ja) 2002-05-17 2003-11-25 Sangaku Renkei Kiko Kyushu:Kk レーザ加工装置とレーザ加工方法
JP2004330536A (ja) 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd 露光ヘッド
US20060013680A1 (en) 2004-07-16 2006-01-19 Tessera, Inc. Chip handling methods and apparatus
US20090141251A1 (en) 2004-12-15 2009-06-04 Samsung Electronics Co., Ltd Illumination system to eliminate laser speckle and projection system employing the same
JP4600178B2 (ja) 2004-06-23 2010-12-15 ソニー株式会社 素子の転写方法及び素子の転写装置
US20150104956A1 (en) 2013-10-16 2015-04-16 Asm Technology Singapore Pte Ltd Adjustable spatial filter for laser scribing apparatus
WO2021117557A1 (ja) 2019-12-12 2021-06-17 東レエンジニアリング株式会社 光スポット像照射装置および転写装置
JP2021118284A (ja) 2020-01-28 2021-08-10 東レエンジニアリング株式会社 チップ転写装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS46178Y1 (zh) 1966-07-15 1971-01-07
JPH08150487A (ja) * 1994-11-28 1996-06-11 Hajime Makita デポジション装置
JPH1119788A (ja) 1997-07-01 1999-01-26 Nikon Corp レーザ加工装置
JP3455102B2 (ja) * 1998-02-06 2003-10-14 三菱電機株式会社 半導体ウエハチップ分離方法
JP4078825B2 (ja) * 2001-10-30 2008-04-23 ソニー株式会社 回路基板の製造方法、並びに表示装置の製造方法
US20040144760A1 (en) * 2002-05-17 2004-07-29 Cahill Steven P. Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
JP4018096B2 (ja) * 2004-10-05 2007-12-05 松下電器産業株式会社 半導体ウェハの分割方法、及び半導体素子の製造方法
EP2239084A1 (en) * 2009-04-07 2010-10-13 Excico France Method of and apparatus for irradiating a semiconductor material surface by laser energy
JP5637526B2 (ja) * 2010-04-28 2014-12-10 株式会社ブイ・テクノロジー レーザ加工装置
KR101560722B1 (ko) 2014-04-09 2015-10-15 창원대학교 산학협력단 직선식 레이저가공 보조장치
JP6452490B2 (ja) * 2015-02-25 2019-01-16 キヤノン株式会社 半導体チップの生成方法
JP2018098441A (ja) * 2016-12-16 2018-06-21 株式会社ディスコ ダイボンダー
WO2018231344A1 (en) * 2017-06-12 2018-12-20 Uniqarta, Inc. Parallel assembly of discrete components onto a substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003334683A (ja) 2002-05-17 2003-11-25 Sangaku Renkei Kiko Kyushu:Kk レーザ加工装置とレーザ加工方法
JP2004330536A (ja) 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd 露光ヘッド
JP4600178B2 (ja) 2004-06-23 2010-12-15 ソニー株式会社 素子の転写方法及び素子の転写装置
US20060013680A1 (en) 2004-07-16 2006-01-19 Tessera, Inc. Chip handling methods and apparatus
US20090141251A1 (en) 2004-12-15 2009-06-04 Samsung Electronics Co., Ltd Illumination system to eliminate laser speckle and projection system employing the same
US20150104956A1 (en) 2013-10-16 2015-04-16 Asm Technology Singapore Pte Ltd Adjustable spatial filter for laser scribing apparatus
WO2021117557A1 (ja) 2019-12-12 2021-06-17 東レエンジニアリング株式会社 光スポット像照射装置および転写装置
JP2021118284A (ja) 2020-01-28 2021-08-10 東レエンジニアリング株式会社 チップ転写装置

Also Published As

Publication number Publication date
KR102645397B1 (ko) 2024-03-11
CN114007803B (zh) 2023-05-30
KR20220018980A (ko) 2022-02-15
TWI822986B (zh) 2023-11-21
WO2020255497A1 (ja) 2020-12-24
CN114007803A (zh) 2022-02-01
JP2020203313A (ja) 2020-12-24
TW202112479A (zh) 2021-04-01

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