KR102638100B1 - Substrate processing apparatas - Google Patents

Abstract

[Project] Provide a substrate processing device that can improve the quality of substrates.
[Solution] The embodiment is a substrate transport device 30 that transports a substrate W having a bend. The concave surface S1 side of the substrate W is supported, and the substrate W is rotated about an axis. It is provided with a plurality of transport rollers 31 for transport, a first shaft 31c provided coaxially with the transport rollers 31, and a fluid supply part 40 for supplying fluid to the concave surface S1 of the substrate W. The axis of the conveyance roller 31 is in the width direction ( As a group, a plurality of tanks are arranged in the conveyance direction Td, two conveyance rollers 31 in each tank are provided with two first shafts 31c spaced apart in the width direction (X), and a fluid supply portion 40 supplies fluid to the concave surface of the substrate from between each set of spaced apart transport rollers.

Description

Substrate processing apparatus {SUBSTRATE PROCESSING APPARATAS}

Embodiments of the present invention relate to a substrate processing apparatus.

In the manufacturing process of liquid crystal displays and semiconductor devices, substrate processing equipment is used to process substrates such as glass substrates and semiconductor substrates. Substrate processing includes, for example, resist application processing, resist peeling processing, etching processing, cleaning processing, and drying processing. A substrate processing apparatus processes a substrate by supplying a processing fluid, such as a processing liquid or a drying gas, to the substrate using a supply tool while conveying the substrate using a plurality of transport rollers.

Japanese Patent Publication No. Heisei 11-10096

The substrate to be transported is usually a flat substrate, but some of them have bending. For example, when a thin substrate of about 1 mm in thickness is used as the substrate to be processed, and film formation is performed on one side of the substrate, the substrate is bent due to the stress of the film. For this reason, one side of the substrate may be concave and the other side may be convex. In this way, if a curved substrate is transported with the concave surface facing upward and in a curved state by a plurality of transport rollers, the processing fluid from the supply tool will remain in the central part of the concave surface, resulting in insufficient or uneven processing of the substrate. . For this reason, for example, processing unevenness such as coating unevenness, peeling unevenness, etching unevenness, cleaning unevenness, drying unevenness, etc. may occur, and the quality of the substrate deteriorates.

The problem to be solved by the present invention is to provide a substrate processing device that can improve the quality of substrates.

An embodiment of the present invention is a substrate processing apparatus for processing a substrate having warpage, which includes a plurality of transport rollers that support the concave side of the substrate and transport the substrate by rotating about an axis, and a plurality of transport rollers coaxially with the transport rollers. It has a provided first shaft and a fluid supply part that supplies fluid to the concave surface of the substrate, wherein the axis of the transport roller is a width direction orthogonal to the transport direction of the substrate, and the transport rollers are spaced apart in the width direction. A plurality of tanks are arranged in the conveyance direction, with the two provided as one group, the two conveyance rollers of each group are provided with two first shafts spaced apart in the width direction, and the fluid supply The unit supplies fluid to the concave surface of the substrate from between each set of spaced apart conveying rollers.

According to an embodiment of the present invention, the quality of the substrate can be improved.

1 is a side view showing a schematic configuration of a substrate processing apparatus according to an embodiment.
FIG. 2 is a view viewed from the direction of arrow AA' in FIG. 1.
FIG. 3 is a plan view showing a schematic configuration of the substrate processing apparatus of the embodiment of FIG. 1 .
Fig. 4 is a plan view showing a schematic configuration of a substrate processing apparatus according to another embodiment.

With reference to FIGS. 1 to 4 , a substrate processing apparatus 10 of the embodiment will be described. Additionally, the dimensions and shapes in the drawings do not accurately reflect the actual substrate and device, and some parts are exaggerated to facilitate understanding. In addition, in the following description, the direction in accordance with gravity is referred to as “downward” and the direction against gravity is referred to as “upward,” but these directions do not limit the installation direction of the device.

[Board]

As shown in FIGS. 1 and 2 , in this embodiment, the substrate W to be transported or processed is warped. As the substrate W, for example, a rectangular thin substrate such as a glass substrate is used. In this embodiment, the thickness of the substrate W is about 0.5 to 1.1 mm, and the amount of bending of the substrate W is about 7 to 10 mm. In the drawing, the short longitudinal direction of the substrate W shows a U-shaped shape, but in reality, the bending of the rectangular substrate W is in all directions of the substrate W. Due to bending, one side of the substrate W contracts and the other side expands. The surface that is concave by contracting is referred to as a concave surface (S1), and the surface that is raised by expansion is referred to as a convex surface (S2). The substrate W of this embodiment uses the concave surface S1 as a processing surface. For example, a substrate W on which a circuit pattern P is formed on the processing surface, such as a multilayer substrate, is used. Additionally, near the outer edge of the processing surface of the substrate W, there is an area where the pattern P is not formed. The area on the treated surface where the pattern P is formed is called a “pattern formation area,” and the area where the pattern P is not formed is called a “non-pattern formation area.”

[Basic configuration]

The substrate processing apparatus 10 of the present embodiment is an apparatus that processes the concave surface S1, which is the processing surface, while transporting the substrate W by supporting the concave surface S1 side. In this way, if the concave surface S1 is conveyed downward and the convex surface S2 is upward, the substrate W can be stably conveyed by basically supporting only the ends of the substrate W. Then, the substrate processing apparatus 10 performs processing on the concave surface S1 below. This substrate processing apparatus 10 has a processing chamber 21, a substrate transfer device 30, a fluid supply unit 40, and a control unit 50. The processing chamber 21 is a case that has a transfer path T within which the substrate W is transported, and is formed so that the substrate W can pass through the interior along the transport path T. The processing chamber 21 functions as a chamber for processing the substrate W moving along the transfer path T. The processing of the substrate W, in this embodiment, is cleaning and drying. An outlet (not shown) for discharging the processing liquid is formed on the bottom of the processing chamber 21.

The substrate transport device 30 has a plurality of transport rollers 31 and a plurality of pressing rollers 32. The substrate transport device 30 is provided throughout the entire interior of the processing chamber 21, and presses the convex surface S2 of the substrate W with each pressing roller 32, while pressing the convex surface S2 with each transport roller 31. The substrate W is transported by supporting the surface S1 side.

[Substrate transfer device]

(Arrangement of conveyance roller and pressing roller)

As described above, the substrate transport device 30 transports the substrate W with the concave surface S1 facing downward. Each conveyance roller 31 is arranged at predetermined intervals below the conveyance path T along the conveyance direction Td of the substrate W. Each pressing roller 32 is located above the conveyance path T so as to be spaced apart from each conveyance roller 31 across the conveyance path T, and is located at a predetermined interval between each conveyance roller 31. They are arranged along the conveyance direction Td at equal predetermined intervals. These conveying rollers 31 and pressing rollers 32 are arranged to oppose the vertical direction in FIG. 1 in the processing chamber 21, are each rotatable, and are moved by a drive mechanism (not shown). They are configured to rotate in synchronization with each other. The conveyance roller 31 rotates clockwise in FIG. 1, and the pressing roller 32 rotates counterclockwise.

In the processing chamber 21, one set of conveyance rollers 31 (two in this embodiment) and pressing rollers 32 are arranged to face each other and spaced apart across the conveyance path T. , a plurality of tanks are provided, and the separation distance H between the conveyance roller 31 and the pressing roller 32 for each tank in the processing chamber 21 is constant. In this embodiment, the separation distance H is, for example, a separation distance in the vertical direction. The fact that the separation distance H is constant means, for example, that it is a predetermined distance at which the substrate can be transported below the amount of warpage of the substrate W. The amount of bending is the maximum vertical separation distance between the plane on which the substrate W is disposed and the upper surface of the substrate W disposed on the plane.

(Specific configuration of conveyance roller)

As shown in FIG. 2, the conveyance roller 31 supports the concave surface S1 side of the substrate W, and has an axis a perpendicular to the conveyance direction Td of the substrate W in a horizontal plane. The substrate W is transported by rotating it around the rotation axis. The conveyance roller 31 has a cylindrical portion 31a and a flange-shaped portion 31b located on the same axis a. The cylindrical portion 31a supports the substrate W in contact with an end portion of the substrate W on the concave surface S1 side. The cylindrical portion 31a is, for example, a roller made of rubber or resin. The axis of the cylindrical portion 31a is the width direction (X) orthogonal to the conveyance direction (Td). Two conveyance rollers 31 including this cylindrical portion 31a are provided spaced apart in the width direction (X) as one set, and multiple sets are arranged in the conveyance direction (Td). The two cylindrical parts 31a of each set have the same diameter.

In addition, the separation distance H between the conveyance roller 31 and the pressing roller 32 is the distance between the portion in contact with the substrate W, and in this embodiment, the outer peripheral surface of the cylindrical portion 31a and the pressing roller 32 ) is the distance of the outer circumference of the That is, the separation distance H between the conveyance roller 31 and the pressing roller 32 includes the case where it is the distance between a part of the conveying roller 31 and the pressing roller 32. Moreover, the conveyance path T of this embodiment is located between the cylindrical part 31a of the conveyance roller 31 and the pressing roller 32.

The flange-shaped portion 31b is a portion provided to have a larger diameter at opposite ends of the cylindrical portions 31a of the two conveyance rollers 31. The flange-shaped portion 31b can contact an end portion of the substrate W along the transport direction Td.

Moreover, as shown in FIG. 3, the separation distance D between the conveyance rollers 31 for each set (distance between opposing surfaces between the cylindrical parts 31a of each set) is kept constant. This separation distance (D) is preferably set to D≤L, assuming that L is the length in the width direction (X) seen from the plane of the bent substrate W. In addition, if the separation distance (distance between opposing surfaces) of the flange-shaped portions 31b of each set of conveyance rollers 31 is d, it is preferable that d≥L. Thereby, support of the end portion of the substrate W by the transport roller 31 becomes possible. Moreover, as shown in FIG. 2, if the length in the width direction (X) of the pattern formation area seen from the plane of the substrate W is Lp, it is preferable that D>Lp. As a result, the supply of the fluid supplied by the fluid supply unit 40, which will be described later, to the pattern P is prevented from being blocked by the conveyance roller 31. Additionally, the axial length (ax) of the cylindrical portion 31a is (d-D)/2.

In addition, the conveyance roller 31 is provided with a first shaft 31c coaxially therewith. Two first shafts 31c are provided on the two conveyance rollers 31 in each set, spaced apart from each other in the width direction (X) and coaxial with each other. The first shaft 31c has a smaller diameter than the cylindrical portion 31a and is provided on opposite end surfaces of the two cylindrical portions 31a in each set. The plurality of first shafts 31c are provided so as to be able to rotate synchronously by, for example, a drive mechanism having a helical gear (spiral gear), not shown. Both conveyance rollers 31 in each set are rotationally driven at the same peripheral speed.

When the first shaft 31c rotates, each cylindrical portion 31a attached to the first shaft 31c rotates with the first shaft 31c as the axis of rotation. The conveyance roller 31 supports the non-pattern formation area on the side of the concave surface S1 or the end portion of the substrate W along the conveyance direction Td, and conveys it in the conveyance direction Td. As shown in FIG. 2 , the first shaft 31c is not present in the lower part of the pattern formation area in the width direction (X) of the transported substrate W.

(Specific configuration of the pressing roller)

The pressing roller 32 is circular with the width direction (X) as its axis. As shown in FIG. 2, the pressing roller 32 is between two conveyance rollers 31 forming a group so as to contact the center of the convex surface S2 of the substrate W above each conveyance roller 31. It is provided opposite to the center of the width direction (X) in the space existing in . A second shaft 32a is provided coaxially on the pressing roller 32. The second shaft 32a is arranged parallel to the first shaft 31c. The second shaft 32a has a smaller diameter than the pressing roller 32, extends over a length exceeding the length in the width direction It is provided so as to be able to rotate synchronously by a drive mechanism having a gear.

When the second shaft 32a rotates, the pressing roller 32 attached to the second shaft 32a rotates with the second shaft 32a as a rotation axis while contacting the convex surface S2. Both the conveyance roller 31 and the pressing roller 32 are controlled to rotate at the same peripheral speed.

[Fluid supply part]

As shown in FIGS. 1 and 2 , a fluid supply unit 40 is provided in the processing chamber 21 . The fluid supply unit 40 supplies fluid to the substrate W from between each set of spaced apart transport rollers 31 . The fluid supply unit 40 has a liquid injection unit 41 and a gas injection unit 42.

(Liquid injection part)

The liquid injection unit 41 sprays and supplies the processing liquid to the processing surface of the substrate W moving along the transfer path T. The liquid injection unit 41 is spaced apart from the substrate W to be transported across the transport path T so as not to interfere with the transport of the substrate W by the substrate transport device 30. It is designed to face. Additionally, no shaft, roller, etc. are interposed between the liquid injection portion 41 and the conveyance path T. When the processing liquid is sprayed toward the transfer path T by the liquid injection unit 41, the processing liquid is supplied to the concave surface S1 of the substrate W moving along the transfer path T. The treatment liquid includes a cleaning liquid, stripping liquid, developing liquid, and rinsing liquid (pure water, etc.) for each desired treatment.

More specifically, as the liquid injection portion 41, for example, a shower pipe having a plurality of through holes or a pipe having a plurality of nozzles can be used. As shown in FIGS. 1 and 2 , the liquid injection unit 41 of the present embodiment has a pipe 411 extending in a direction along the conveyance direction Td, and the plurality of pipes 411 extend in the width direction ( It is composed by being listed and arranged as In this embodiment, as shown in FIG. 2, one pipe 411A, 411C is each disposed at a position close to the two conveyance rollers 31 provided apart from each other in the width direction (X), and two conveyance rollers ( 31), pipes 411B are arranged one by one in the center of the width direction (X). Hereinafter, when the pipes 411A, 411B, and 411C are not distinguished, they will be described as the pipe 411. The pipe 411 is connected to a processing liquid supply source including a pump and a tank (not shown).

The pipe 411 is provided with a plurality of discharge portions 412. In the present embodiment, the discharge unit 412 is a nozzle that supplies processing liquid in a shower manner from a discharge port to the processing surface of the conveyed substrate W. That is, the discharge unit 412 discharges the processing liquid from below the substrate W to the lower surface of the substrate W. The discharge portion 412 may be a through hole. The discharge portions 412 provided in each pipe 411A, 411B, and 411C are referred to as 412A, 412B, and 412C, and when they are not distinguished, they are described as the discharge portion 412.

The plurality of discharge portions 412 arranged along the width direction The discharge portion 412 located on the side farthest from the two conveyance rollers 31 in each set, that is, on the center side in the width direction ) is set to increase. In this embodiment, the discharge amount of the discharge portion 412B is larger than the discharge amount of the discharge portions 412A and 412C. In order to achieve this discharge amount, the flow rate per unit time of the discharged processing liquid of the plurality of discharge portions 412 arranged along the width direction (X) is individually set variably. More specifically, the control unit 50 controls a valve (not shown) provided in a pipe connected to the pipe 411 to adjust the amount of treatment liquid flowing through each pipe 411.

(Gas ejection part)

The gas blowing unit 42 blows out and supplies drying gas, such as air or nitrogen gas, to the substrate W moving along the conveyance path T. The gas blowing portion 42 is spaced apart from the transported substrate W across the transport path T so as not to interfere with the transport of the substrate W by the substrate transport device 30. It is designed to face. Additionally, no shaft, roller, etc. are interposed between the gas blowing portion 42 and the conveyance path T. The gas ejection unit 42 ejects gas at high pressure toward the substrate W passing through the transfer path T, blowing away processing liquid such as a cleaning solution adhering to the substrate W, thereby removing the substrate W from the substrate W. Dry the treated surface.

For example, as shown in FIGS. 1 and 2 , the gas blowing portion 42 is an air knife having a slit-shaped blowing port 42a that is longer than the width of the curved substrate W. The gas blowing section 42 is provided to blow off the liquid adhering to the substrate W by blowing out gas from the blowing hole 42a toward the upstream side of the conveyance direction Td.

[Control unit]

As shown in FIG. 1, the control unit 50 is a computer that controls each part of the substrate processing apparatus 10, such as the substrate transport device 30 and the fluid supply unit 40, and provides various information related to substrate transport and substrate processing. and a storage unit that stores programs, etc., and a processor that executes various programs. As described above, the control unit 50 of the present embodiment controls the valve to adjust the amount of processing liquid flowing through the pipe 411 to the end side closest to the two conveyance rollers 31 in each set, that is, the width. The discharge amount increases at the center side farther from the two conveyance rollers 31 of each set, that is, at the center and its vicinity in the width direction X, than at both ends in the direction X.

[movement]

Next, the operation of the substrate processing apparatus 10 will be described. Additionally, the following operation is an example of an operation for cleaning the substrate W with a cleaning liquid and drying it. As described above, in the substrate processing apparatus 10, each transport roller 31 and each pressing roller 32 of the substrate transport device 30 rotate in synchronization, and the substrate W has a concave surface S1. With the side end supported on each conveyance roller 31, it is conveyed in the conveyance direction Td, moves along the conveyance path T, and passes through the processing chamber 21.

The processing chamber 21 is in a liquid supply state in which the cleaning liquid is previously supplied from below the conveyance path T through the discharge portion 412 of each pipe 411. When the bent substrate W is transported and passes through the area in this liquid supply state, the cleaning liquid is supplied to the concave surface S1 of the substrate W to clean it. On the concave surface S1 side of the substrate W, there is no first shaft 31c, and the cleaning liquid supplied to the concave surface S1 of the substrate W is not blocked by the first shaft 31c. , touches the pattern formation area. The cleaning liquid supplied to the substrate W flows toward the end of the substrate W, falls from the end, flows down the bottom of the processing chamber 21, and is discharged from the discharge port.

Additionally, the concave surface S1 is inclined downward from the center toward both ends. For this reason, the cleaning liquid supplied from the discharge portions 412A and 412C near the ends of the substrate W falls from the ends without reaching the center. On the other hand, in this embodiment, the cleaning liquid is supplied from the discharge portion 412B to the center of the concave surface S1 of the substrate W, thereby forming a flow that causes contaminants to float away from the center toward the ends. As a result, contaminants present on the processed surface of the substrate W can be removed.

However, since the substrate W has a bend, when the distance from the discharge portion 412 is longer than the end portion of the center of the concave surface S1 and the arrangement height position of the discharge portion 412 is constant, the center If the flow rate of the discharge portion 412B is the same as the flow rate of the discharge portions 412A and 412C at both ends, there are cases where a sufficient flow rate of the cleaning liquid cannot be supplied to the center of the concave surface S1. In that case, the cleaning liquid stays or falls before it reaches the end of the concave surface S1, leading to re-adhesion due to retention of contaminants. In this embodiment, the flow rate of the central discharge portion 412B is set to be greater than that of the discharge portions 412A and 412C near the ends, so that a sufficient flow rate of the cleaning liquid is supplied to the center of the concave surface S1, and the flow rate of the cleaning liquid is supplied from the center. A flow toward the end can be formed, allowing contaminants to be removed.

In the processing chamber 21, drying gas is supplied in advance from below the conveyance path T through the gas blowing section 42. When the substrate W passes through the area in this gas supply state, the cleaning liquid adhering to the concave surface S1 of the substrate W is blown away by the injection of gas, and the substrate W is dried. The cleaning liquid blown away from the substrate W flows over the bottom of the processing chamber 21 and is discharged from the discharge port.

[Effect of Embodiment]

(1) This embodiment is a substrate transport device 30 that transports a substrate W having a bend, and supports the concave surface S1 side of the substrate W and rotates about an axis, thereby moving the substrate W A plurality of conveyance rollers 31 for conveying, a first shaft 31c provided coaxially with the conveyance roller 31, and a fluid supply portion 40 for supplying fluid to the concave surface S1 of the substrate W. It is available.

The rotation axis of the conveyance roller 31 is in the width direction ( Thus, a plurality of sets of conveyance rollers 31 are arranged in the conveyance direction Td, and the two conveyance rollers 31 in each set are provided with two first shafts 31c spaced apart in the width direction (X), The fluid supply unit 40 supplies fluid to the concave surface S1 of the substrate W from between each set of spaced apart conveying rollers 31.

If the substrate W is transported so that the bottom is on the convex surface S2, the inclined surface on the side of the convex surface S2 is supported, so it is prone to slipping and the support is not stable, so the substrate W is on the lower side. It is necessary to add supporting members or mechanisms. On the other hand, in the present embodiment, by supporting the concave surface S1 side, basically only the end portion of the substrate W needs to be supported, so that it can be transported stably.

In addition, if a shaft is provided throughout the width direction It is not uniformly supplied to the substrate W, preventing efficient processing of the substrate W. However, in this embodiment, on the concave surface S1 side, the conveyance roller 31 and the first shaft 31c are provided spaced apart in the width direction First, blocking is prevented by the conveyance roller 31 or the first shaft 31c. For this reason, since the fluid can be uniformly applied to the processing surface, uniform processing is possible and deterioration in the quality of the substrate W can be suppressed.

In addition, by supplying fluid to the concave surface S1 of the substrate W from between the conveyance rollers 31 of each set and the first shaft 31c, the inclination of the concave surface S1 causes the flow from the center to the ends. Because a flow is formed, insufficient treatment of the concave surface S1 can be suppressed, and the quality of the substrate W can be improved.

(2) This embodiment is provided with a pressing roller 32 that presses the convex surface S2 of the substrate W, and a second shaft 32a provided coaxially with the pressing roller 32. For this reason, even if pressure due to the supply of processing liquid is applied from the concave surface S1 side, lifting is prevented by the pressing roller 32, so the position of the substrate W is stable and uniform processing can be maintained. there is.

(3) The plurality of discharge portions 412 arranged along the width direction The discharge amount is large. For this reason, the amount of treatment liquid discharged from the discharge portion located on the center side rather than the end side of the concave surface S1 increases, and a flow from the center toward the end is easily formed, making it possible to make the overall treatment uniform. . For example, as shown in FIG. 2, when a plurality of discharge portions 412 are provided at the same height, the discharge port of the central discharge portion 412B has a different distance from the substrate W ( Since it is longer than that of 412A, 412C), the discharged processing liquid is not evenly distributed across the discharge portions 412A, 412B, and 412C, or the pressure of the processing liquid colliding with the center of the concave surface S1 of the substrate W is weakened. . In this embodiment, the discharge amount of the discharge portion 412B provided below the center of the concave surface S1 is greater than that of the other discharge portions 412A and 412C, thereby ensuring the flow rate of the processing liquid in the center, and discharging the discharge amount from the center. A flow to the end can be formed. Additionally, it is possible to equalize the pressure at which the processing liquid collides with the concave surface S1.

(4) The flow rate of the discharged processing liquid of the plurality of discharge portions 412 arranged along the width direction (X) is individually set variably. For this reason, uniform processing is possible by adjusting the flow rate of each discharge part 412 according to the difference in the distance between the concave surface S1 and each discharge part 412 caused by the bending of the substrate W.

(5) The fluid supply unit 40 has a plurality of pipes 411 along the conveyance direction Td, the plurality of pipes 411 are arranged in a row in the width direction (X), and the discharge unit 412 is provided in the pipe 411. For this reason, by adjusting the flow rate of the processing liquid in each pipe 411, the discharge amount of the processing liquid from the plurality of discharge portions 412 arranged along the width direction (X) can be adjusted.

[Other Embodiments]

(1) It is not necessarily necessary to provide the flange-shaped portion 31b in the conveyance roller 31. For example, as shown in FIG. 4, a guide roller 33 for guiding the movement of the substrate W is provided between the plurality of first shafts 31c arranged in the transport direction Td of the substrate W. It's also good. In this case, if the separation distance between the pair of opposing guide rollers 33 is e, it is preferable that e≥L.

(2) In the above embodiment, the pressing roller 32 is formed as one in the width direction For example, one pressing roller 32 may be provided at a position opposite to each conveying roller 31. A belt may be wrapped around the pressing roller 32 and used as a roller conveyor. By adopting this configuration, the area in contact with the bending of the substrate W increases compared to the case where only the pressing roller 32 is used, so the substrate W can be transported more stably. Additionally, a flat type roller may be used.

(3) A measuring unit that measures the amount of warping of the substrate W may be provided, and the discharge amount from the discharge unit 412 may be adjusted according to the amount of warping of the substrate W measured by the measuring unit. For example, when the amount of warpage of the substrate W measured by the measuring unit is greater than a predetermined value, the discharge amount from the central discharge unit 412B may be increased.

(4) A measuring unit for measuring the amount of warpage of the substrate W and a moving mechanism for raising and lowering each pressing roller 32 are provided, and each set of conveying rollers ( The separation distance between 31) and the pressing roller 32 may be adjusted.

(5) In the above embodiment, it is exemplified that the cleaning process and the drying process are performed in a common chamber, but this is not limited to this. The cleaning treatment and drying treatment may be performed in different chambers.

(6) In the above embodiment, the plurality of discharge portions 412 are disposed on the side farther from the two conveyance rollers 31 in each group than on the side closer to the two conveyance rollers 31 in each group. It is set to increase the discharge amount. At this time, when the diameters of the discharge holes of each discharge portion 412 are the same, the side farther from the two conveyance rollers 31 in each set is closer to the discharge portion than the side closer to the two conveyance rollers 31 in each set. It is good to make the discharge speed of the treatment liquid faster.

(7) In the above embodiment, the pipes 411 are made up of three pipes 411A, 411B, and 411C, but are not limited to three, and more pipes 411 may be provided. At this time, the discharge amount of only one center side may be larger than that of the others, or the discharge amount may be increased step by step from the side closer to the conveyance roller 31 toward the center.

(8) The fluid supply unit 40 may be a nozzle that discharges the treatment liquid in the shower type, an air knife, or an aqua knife, and the tool used is not limited as long as it discharges a fluid. Additionally, these plural types of tools may be used in combination. Additionally, the fluid supply unit 40 is provided above the transfer path T of the substrate W, and is provided on the convex surface S2 of the substrate W (non-pattern formed surface on which the pattern P is not formed). By supplying the processing fluid, both sides of the substrate W may be treated.

(9) In the above embodiment, the process of washing and drying the substrate W is exemplified as the process of the substrate processing apparatus 10, but the process is not limited to this. For manufacturing liquid crystal substrates, semiconductor substrates, photomasks, etc., for example, a resist processing device, an exposure processing device, a developing processing device, an etching processing device, and a peeling processing device may be used. Accordingly, it is possible to use various chemical solutions as the treatment liquid.

(10) In the above embodiment, it is exemplified that the substrate W is transported in a horizontal state, but it is not limited to this, and the substrate W may be tilted and transported in an inclined state, for example, the width of the substrate W The substrate W may be tilted and transported with one end of the direction X higher than the other end.

(11) In the above embodiment, the description has been made for the substrate W having bends in all directions (substrate W having bends in all directions), but it is not limited to this, and for example, bends may be present on any two or three sides of a rectangle. Even if there is one, the present invention is applicable.

(12) Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and their equivalents.

10 Substrate processing device
21 Processing room
30 Substrate transport device
31 Conveyance roller
31a cylindrical part
31b flange type
31c first shaft
32 pressing roller
32a second shaft
33 Guide roller
40 fluid supply part
41 Liquid injection part
42 gas ejection unit
42a vent
50 control unit
411 pipe
411A pipe
411B pipe
411C pipe
412 discharge part
412A discharge part
412B discharge part
412C discharge part
T return route

Claims (7)

In a substrate processing apparatus for processing a substrate having warpage,
A plurality of sets are provided along the transport direction of the substrate, including two sets spaced apart in the width direction perpendicular to the transport direction of the substrate, and the concave side of the substrate is supported to transport the substrate. A conveyance roller that does,
a first shaft provided in plural sets along the conveyance direction of the substrate, with two being provided spaced apart in the width direction as one set, to which the conveyance rollers are attached;
A fluid supply unit that supplies processing liquid to the concave surface of the substrate
Equipped with
The fluid supply unit supplies a processing liquid to the concave surface of the substrate from between the conveying rollers spaced apart in the width direction,
The fluid supply part has a plurality of discharge parts in the width direction, and the discharge parts are arranged on a central side in the width direction rather than the discharge parts arranged on a side closer to the two conveyance rollers of each set. A substrate processing device characterized in that the discharge amount of the processing liquid is greater in the negative portion. The method of claim 1, wherein the concave surface of the substrate has a pattern formation area in which a pattern is formed, and a non-pattern formation area in which a pattern is not formed located on the outer periphery of the pattern formation area,
A substrate processing apparatus characterized in that, in the width direction, the separation distance between the conveyance rollers in each set is equal to or greater than the width of the pattern formation area. 2. The method of claim 1, comprising: a pressing roller pressing the convex surface of the substrate;
A second shaft to which the pressing roller is attached.
A substrate processing device comprising: The method according to claim 3, wherein the pressing rollers are arranged to face each other in each set of the conveying rollers with the conveying path of the substrate interposed between them,
A substrate processing apparatus, wherein a separation distance between the conveyance roller and the press roller in a direction perpendicular to the conveyance path is constant between each set of the conveyance rollers. The fluid supply unit according to any one of claims 1 to 4, wherein the fluid supply unit has a plurality of pipes extending in a direction along the conveyance direction,
The plurality of pipes are arranged in a row in the width direction,
The substrate processing apparatus, wherein the discharge unit is provided in the pipe, and increases the flow rate of the processing liquid discharged from the discharge unit by adjusting the flow rate of the processing liquid flowing through the pipe. delete delete

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