CN114864436A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN114864436A
CN114864436A CN202210096669.XA CN202210096669A CN114864436A CN 114864436 A CN114864436 A CN 114864436A CN 202210096669 A CN202210096669 A CN 202210096669A CN 114864436 A CN114864436 A CN 114864436A
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CN
China
Prior art keywords
substrate
conveying
width direction
processing apparatus
concave surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210096669.XA
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Chinese (zh)
Inventor
西部幸伸
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Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
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Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN114864436A publication Critical patent/CN114864436A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1044—Apparatus or installations for supplying liquid or other fluent material to several applying apparatus or several dispensing outlets, e.g. to several extrusion nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors 
    • B65G39/02—Adaptations of individual rollers and supports therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Paper (AREA)

Abstract

The invention provides a substrate processing apparatus capable of improving the quality of a substrate. An embodiment is a substrate processing apparatus that processes a substrate having a warp, and includes: a plurality of conveying rollers, which are provided with a plurality of groups along the conveying direction, and are separated from each other in the width direction orthogonal to the conveying direction of the substrate to form a group, and which support the concave surface side and rotate around the shaft to convey the substrate; a first shaft having a plurality of sets of two shafts spaced apart in a width direction as a set, the plurality of sets being provided along a conveying direction, and a conveying roller being attached to the first shaft; and a fluid supply unit that supplies a fluid to the concave surface of the substrate, the fluid supply unit supplying the fluid to the concave surface of the substrate from between the conveying rollers of each group spaced in the width direction.

Description

Substrate processing apparatus
Technical Field
Embodiments of the present invention relate to a substrate processing apparatus.
Background
In a manufacturing process of a liquid crystal display device, a semiconductor device, or the like, a substrate processing apparatus for processing a substrate such as a glass substrate or a semiconductor substrate is used. Examples of substrate processing include resist coating processing, resist stripping processing, etching processing, cleaning processing, and drying processing. The substrate processing apparatus processes a substrate by supplying a processing fluid such as a processing liquid or a drying gas to the substrate by a supply tool while conveying the substrate by a plurality of conveying rollers.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent application laid-open No. Hei 11-10096
Disclosure of Invention
[ problems to be solved by the invention ]
The substrate to be conveyed is usually a flat substrate, but some substrates have warpage. For example, when a substrate having a thickness as thin as about 1mm is used as a substrate to be processed, and film formation is performed on one surface of the substrate, the substrate warps due to stress of the film. Therefore, one surface of the substrate may be a concave surface and the other surface may be a convex surface. When the substrate having warpage is conveyed with the concave surface facing upward by the plurality of conveying rollers while maintaining the warpage as described above, the processing fluid from the supply tool is accumulated in the center of the concave surface, and the processing of the substrate becomes insufficient or uneven. Therefore, for example, treatment unevenness such as coating unevenness, peeling unevenness, etching unevenness, cleaning unevenness, and drying unevenness may occur, and the quality of the substrate may be degraded.
The present invention is directed to provide a substrate processing apparatus capable of improving the quality of a substrate.
[ means for solving problems ]
An embodiment of the present invention is a substrate processing apparatus that processes a substrate having warpage, and includes: a conveying roller which is provided with a plurality of groups along a conveying direction of the substrate, and supports a concave surface side of the substrate to convey the substrate, wherein two conveying rollers which are arranged in a width direction orthogonal to the conveying direction of the substrate are used as one group; a first shaft having a plurality of sets of two of the conveying rollers arranged at intervals in the width direction as a set, the plurality of sets being arranged along the conveying direction of the substrate, and the conveying rollers being mounted thereon; and a fluid supply unit configured to supply a fluid to the concave surface of the substrate, the fluid supply unit supplying the fluid to the concave surface of the substrate from between the transport rollers spaced in the width direction.
[ Effect of the invention ]
According to the embodiments of the present invention, the quality of the substrate can be improved.
Drawings
Fig. 1 is a side view showing a schematic configuration of a substrate processing apparatus according to an embodiment.
Fig. 2 is a view a-a' of fig. 1.
Fig. 3 is a plan view schematically showing the structure of the substrate processing apparatus according to the embodiment of fig. 1.
Fig. 4 is a plan view schematically showing the structure of a substrate processing apparatus according to another embodiment.
[ description of symbols ]
10: substrate processing apparatus
21: processing chamber
30: substrate conveying device
31: conveying roller
31 a: cylindrical part
31 b: flange-like part
31 c: first shaft
32: press roller
32 a: second shaft
33: guide roller
40: fluid supply unit
41: liquid ejecting section
42: gas blowout part
42 a: blow-out opening
50: control unit
411. 411A, 411B, 411C: pipe
412. 412A, 412B, 412C: discharge part
a: axial center
ax, L, Lp: length of
D. e, H: separation distance
d: separation distance (distance between facing surfaces)
P: pattern(s)
S1: concave surface
S2: convex surface
T: conveying path
Td: direction of conveyance
W: substrate
X: the width direction.
Detailed Description
A substrate processing apparatus 10 according to an embodiment will be described with reference to fig. 1 to 4. The dimensions and shapes of the drawings do not reflect the exact dimensions and shapes of the actual substrate and device, and are exaggerated for ease of understanding. In the following description, the direction of the compliance gravity is referred to as "lower" and the direction of the resistance gravity is referred to as "upper", but these directions do not limit the installation direction of the device.
[ substrate ]
As shown in fig. 1 and 2, in the present embodiment, a substrate W to be conveyed or processed has warpage. As the substrate W, for example, a rectangular thin substrate such as a glass substrate is used. In the present embodiment, the thickness of the substrate W is about 0.5mm to 1.1mm, and the warpage amount of the substrate W is about 7mm to 10 mm. In the figure, the short side direction of the substrate W is shown as being along a U-shape, but the warp of the actual rectangular substrate W is around the substrate W. One surface of the substrate W contracts and the other surface thereof expands due to the warp. The surface depressed by contraction is a concave surface S1, and the surface raised by expansion is a convex surface S2. The substrate W of the present embodiment has the concave surface S1 as a processing surface. For example, a substrate W having a pattern P of a circuit formed on a processing surface, such as a multilayer substrate, is used. In addition, a region where the pattern P is not formed exists near the outer edge of the processing surface of the substrate W. The region of the processing surface where the pattern P is formed is referred to as a "pattern formation region", and the region located on the outer periphery of the pattern formation region where the pattern P is not formed is referred to as a "non-pattern formation region".
[ basic Structure ]
The substrate processing apparatus 10 of the present embodiment is an apparatus that processes a concave surface S1 as a processing surface while supporting the concave surface S1 side and conveying a substrate W. When the substrate W is transported with the concave surface S1 facing downward and the convex surface S2 facing upward as described above, the substrate W can be stably transported by being supported only by the end portions of the substrate W. Then, the substrate processing apparatus 10 processes the concave surface S1 below. The substrate processing apparatus 10 includes: a processing chamber 21, a substrate transfer apparatus 30, a fluid supply unit 40, and a control unit 50. The processing chamber 21 is a housing having a transfer path T for transferring the substrate W therein, and is formed so that the substrate W can pass through the inside along the transfer path T. The processing chamber 21 functions as a place for processing the substrate W moving on the transport path T. The processing of the substrate W is cleaning and drying in the present embodiment. A discharge port (not shown) for discharging the processing liquid is formed in the bottom surface of the processing chamber 21.
The substrate transport device 30 includes a plurality of transport rollers 31 and a plurality of pressing rollers 32. The substrate transfer device 30 is provided throughout the inside of the processing chamber 21, and transfers the substrate W by pressing the convex surface S2 of the substrate W by the pressing rollers 32 and supporting the concave surface S1 side by the transfer rollers 31.
[ substrate conveying apparatus ]
(arrangement of conveying roller and pressing roller)
As described above, the substrate transfer apparatus 30 transfers the substrate W with the concave surface S1 facing downward. The conveying rollers 31 are arranged below the conveying path T at predetermined intervals along the conveying direction Td of the substrate W. The pressing rollers 32 are positioned above the conveying path T so as to face the conveying rollers 31 at intervals across the conveying path T, and are arranged along the conveying direction Td at predetermined intervals equal to the predetermined intervals of the conveying rollers 31. The conveying roller 31 and the pressing roller 32 are disposed in the processing chamber 21 so as to face each other in the vertical direction in fig. 1, are rotatably provided, and are configured to rotate in synchronization with each other by a drive mechanism (not shown). The conveyance roller 31 rotates clockwise in fig. 1, and the pressing roller 32 rotates counterclockwise.
In the processing chamber 21, a plurality of sets of the conveying rollers 31 (in the present embodiment, two rollers are one set) and the pressing rollers 32 are provided as one set so as to face each other with a space therebetween through the conveying path T, and the separation distance H between the conveying rollers 31 and the pressing rollers 32 in each set in the processing chamber 21 is constant. In the present embodiment, the separation distance H is a separation distance in a direction perpendicular to the conveyance path, for example, in the vertical direction. The separation distance H is a predetermined distance that allows the substrate W to be conveyed, for example, a distance equal to or less than the warpage amount of the substrate W. The warpage amount is a maximum vertical distance between a plane on which the substrate W is placed and an upper surface of the substrate W placed on the plane.
(concrete Structure of conveying roller)
As shown in fig. 2, the conveying roller 31 supports the concave surface S1 side of the substrate W and rotates about an axial center a orthogonal to the conveying direction Td of the substrate W in the horizontal plane as a rotation axis, thereby conveying the substrate W. The conveying roller 31 has a cylindrical portion 31a and a flange portion 31b located on the same axial center a. The columnar portion 31a is in contact with the end portion of the substrate W on the concave surface S1 side to support the substrate W. The cylindrical portion 31a is, for example, a roller made of rubber or resin. The axis of the columnar portion 31a is the width direction X orthogonal to the conveyance direction Td. The conveying rollers 31 including the cylindrical portion 31a are arranged in plural sets along the conveying direction Td with two rollers spaced apart in the width direction X as one set. The two cylindrical portions 31a of each group are of the same diameter.
The distance H between the conveying roller 31 and the pressing roller 32 is a distance of a portion contacting the substrate W, and in the present embodiment, is a distance between the outer circumferential surface of the cylindrical portion 31a and the outer circumferential surface of the pressing roller 32. That is, the separation distance H between the conveyance roller 31 and the pressing roller 32 includes a case where a part of the conveyance roller 31 is spaced apart from the pressing roller 32. The conveyance path T of the present embodiment is located between the cylindrical portion 31a of the conveyance roller 31 and the pressing roller 32.
The flange-like portion 31b is a portion provided so as to have a larger diameter at the opposite end portions of the cylindrical portion 31a of the two conveying rollers 31. The flange-shaped portion 31b can abut against an end of the substrate W along the transport direction Td.
As shown in fig. 3, the distance D between the conveying rollers 31 of each set (the distance between the facing surfaces of the columnar portions 31a of each set) is constant. When the length of the substrate W having warpage in the width direction X in a plan view is L, the separation distance D is preferably D ≦ L. Further, if d is the distance (distance between facing surfaces) separating the flange-shaped portions 31b of the conveying rollers 31 of each group, d ≧ L is preferable. This enables the end of the substrate W to be supported by the conveying roller 31. Further, as shown in fig. 2, it is preferable that the length of the pattern forming region in the width direction X of the substrate W in a plan view is Lp, and D > Lp. This can prevent the conveyance roller 31 from blocking the supply of the fluid supplied from the fluid supply unit 40 to the pattern P. Further, the length ax in the axial direction of the cylindrical portion 31a is (D-D)/2.
Further, the conveying roller 31 is provided with a first shaft 31c coaxially therewith. The first shafts 31c are provided in a plurality of sets along the transport direction Td with two of the first shafts 31c spaced apart in the width direction X as one set, and are attached with the transport rollers 31. That is, two first shafts 31c are provided in the two conveying rollers 31 of each set so as to be spaced apart in the width direction X and coaxial with each other. The first shaft 31c has a diameter smaller than the cylindrical portion 31a and is provided on the opposite end surfaces of the two cylindrical portions 31a of each group. The plurality of first shafts 31c are provided so as to be capable of synchronous rotation by a drive mechanism having a helical gear (helical gear), not shown, for example. Both the conveying rollers 31 of each group are rotationally driven at the same circumferential speed.
When the first shaft 31c rotates, the respective columnar portions 31a attached to the first shaft 31c rotate about the first shaft 31c as a rotating shaft. The conveying roller 31 supports the non-pattern forming region on the concave surface S1 side or the end of the substrate W along the conveying direction Td and conveys the substrate W along the conveying direction Td. As shown in fig. 2, the first shaft 31c is not provided below the pattern forming region in the width direction X of the substrate W being conveyed.
(concrete Structure of Press roll)
The pressing roller 32 is circular with the width direction X as an axis. As shown in fig. 2, the pressing roller 32 is provided above each of the conveying rollers 31 so as to be in contact with the center of the convex surface S2 of the substrate W and so as to face the center in the width direction X in the space between the two conveying rollers 31 in the set. The pressing roller 32 is provided with a second shaft 32a coaxially. The second shaft 32a is arranged parallel to the first shaft 31 c. The second shaft 32a has a diameter smaller than that of the press roller 32 and extends over a length exceeding the length of the substrate W in the width direction X, and is provided in the processing chamber 21 so as to be rotatable in synchronization with the drive mechanism having a spur gear (spur gear), for example, which is not shown.
When the second shaft 32a rotates, the pressing roller 32 attached to the second shaft 32a rotates about the second shaft 32a as a rotation axis while contacting the convex surface S2. Both the conveying roller 31 and the pressing roller 32 are controlled to be rotationally driven at the same circumferential speed.
[ fluid supply part ]
As shown in fig. 1 and 2, the processing chamber 21 is provided with a fluid supply unit 40. The fluid supply unit 40 supplies a fluid to the concave surface S1 of the substrate W from between the conveying rollers 31 of each set spaced apart in the width direction X with respect to the substrate W. The fluid supply unit 40 includes a liquid ejecting unit 41 and a gas blowing unit 42.
(liquid ejecting section)
The liquid ejecting unit 41 ejects and supplies a processing liquid to a processing surface of the substrate W moving on the transport path T. The liquid ejecting section 41 is provided so as to face the substrate W to be conveyed with a space therebetween through the conveyance path T so as not to interfere with the conveyance of the substrate W by the substrate conveying device 30. Further, a shaft, a roller, or the like is not interposed between the liquid ejecting section 41 and the conveyance path T. When the processing liquid is ejected to the conveyance path T by the liquid ejecting section 41, the processing liquid is supplied to the concave surface S1 of the substrate W moving on the conveyance path T. As the processing liquid, a cleaning liquid, a stripping liquid, a developing liquid, and a rinsing liquid (pure water or the like) are applied for each target process.
More specifically, as the liquid ejecting section 41, for example, a shower pipe (shower pipe) having a plurality of through holes or a pipe including a plurality of nozzles can be used. As shown in fig. 1 and 2, the liquid ejecting section 41 of the present embodiment includes a plurality of tubes 411 extending in a direction along the transport direction Td, and is configured by arranging the plurality of tubes 411 in a row in the width direction X. In the present embodiment, as shown in fig. 2, one pipe 411A and one pipe 411C are disposed at positions close to two conveying rollers 31 provided at a distance in the width direction X, respectively, and one pipe 411B is disposed at the center in the width direction X between the two conveying rollers 31. Hereinafter, the tube 411 will be described as the tube 411 without distinguishing the tube 411A, the tube 411B, and the tube 411C. A supply source of the treatment liquid including a pump and a tank, not shown, is connected to the pipe 411.
The tube 411 is provided with a plurality of discharge portions 412 in the width direction X. In the present embodiment, the discharge portion 412 is a nozzle for supplying the processing liquid in a shower-like manner from the discharge port to the processing surface of the substrate W to be conveyed. That is, the discharge unit 412 discharges the processing liquid from below the substrate W toward the lower surface of the substrate W. The ejection portion 412 may be a through hole. The ejection portions 412 provided in the tubes 411A, 411B, and 411C are 412A, 412B, and 412C, and the ejection portions 412 will be described without distinguishing them.
The plurality of discharge portions 412 arranged along the width direction X are set to: the discharge amount per unit time (hereinafter, sometimes simply referred to as "discharge amount") of the processing liquid from the discharge portion 412 located on the side away from the two conveying rollers 31 of each group, that is, on the center side in the width direction X is larger than the discharge portion 412 located on the side closer to the two conveying rollers 31 of each group, that is, on both end sides in the width direction X. In the present embodiment, the ejection rate of the ejection portion 412B is larger than the ejection rates of the ejection portion 412A and the ejection portion 412C. In order to achieve such a discharge rate, the plurality of discharge portions 412 arranged along the width direction X are each provided with a variable flow rate per unit time of the processing liquid to be discharged. More specifically, the control unit 50 controls a valve (not shown) provided in a pipe connected to the pipes 411 to adjust the amount of the treatment liquid flowing through each pipe 411.
(gas blowout part)
The gas blowout part 42 blows and supplies a drying gas such as air or nitrogen gas to the substrate W moving on the conveyance path T. The gas blowout part 42 is provided so as to face the substrate W to be conveyed with a space therebetween through the conveyance path T so as not to interfere with the conveyance of the substrate W by the substrate conveyance device 30. Further, a shaft, a roller, or the like is not interposed between the gas blowout part 42 and the conveyance path T. The gas blowout part 42 blows a gas at a high pressure toward the substrate W passing through the conveyance path T, blows off a processing liquid such as a cleaning liquid adhering to the substrate W, and dries the processing surface of the substrate W.
For example, as shown in fig. 1 and 2, the gas blowing section 42 is an air knife (air knife) having a slit-shaped blowing port 42a longer than the width of the warped substrate W. The gas blowing section 42 is provided to blow gas from the blowing port 42a toward the upstream side in the transport direction Td, and to blow away the liquid adhering to the substrate W.
[ control section ]
As shown in fig. 1, the control unit 50 is a computer that controls each unit of the substrate processing apparatus 10 such as the substrate transfer apparatus 30 and the fluid supply unit 40, and includes a storage unit that stores various information and programs related to substrate transfer and substrate processing, and a processor that executes the various programs. As described above, the control unit 50 of the present embodiment adjusts the amount of the treatment liquid flowing through the pipe 411 by controlling the valve, and the discharge amount is larger on the center side of the two conveying rollers 31 distant from each group, that is, the center in the width direction X and the vicinity thereof, than on the end side of the two conveying rollers 31 close to each group, that is, on both ends in the width direction X.
[ actions ]
Next, the operation of the substrate processing apparatus 10 will be described. The following operation is an example of an operation of cleaning and drying the substrate W with the cleaning liquid. As described above, in the substrate processing apparatus 10, the conveying rollers 31 and the pressing rollers 32 of the substrate conveying device 30 rotate in synchronization, and the substrate W is conveyed in the conveying direction Td while being supported by the conveying rollers 31 at the end portion on the concave surface S1 side, moves along the conveying path T, and passes through the processing chamber 21.
In the processing chamber 21, a liquid supply state is established in which the cleaning liquid is supplied from below the conveying path T by the discharge portion 412 of each tube 411. When the warped substrate W is conveyed to pass through the region in the liquid supply state, the concave surface S1 of the substrate W is cleaned by supplying the cleaning liquid. On the concave surface S1 side of the substrate W, the first shaft 31c is not present, and the cleaning liquid supplied to the concave surface S1 of the substrate W hits the pattern forming region without being blocked by the first shaft 31 c. The cleaning liquid supplied to the substrate W flows toward the end of the substrate W and drops from the end, and flows through the bottom surface of the processing chamber 21 and is discharged from the discharge port.
Further, the concave surface S1 is inclined so as to descend from the center to both ends. Therefore, the cleaning liquid supplied from the discharge portions 412A and 412C near the end portions of the substrate W drops from the end portions without reaching the center. On the other hand, in the present embodiment, the cleaning liquid is supplied from the discharge portion 412B to the center of the concave surface S1 of the substrate W, thereby forming a flow that washes away contaminants from the center to the end. This makes it possible to remove contaminants present on the processing surface of the substrate W.
However, since the substrate W has warpage, when the distance from the discharge portion 412 is long compared to the end portion at the center of the concave surface S1, and the arrangement height position of the discharge portion 412 is constant, if the flow rate of the discharge portion 412B at the center is set to be the same as the flow rates of the discharge portions 412A and 412C at the both ends, a sufficient flow rate of the cleaning liquid may not be supplied to the center of the concave surface S1. Then, the cleaning liquid stays or falls down before reaching the end of the concave surface S1, and reattachment due to the stay of the contaminants may be caused. In the present embodiment, since the flow rate of the discharge portion 412B at the center is set to be larger than the flow rates of the discharge portions 412A and 412C near the end portions, a sufficient flow rate of the cleaning liquid is supplied to the center of the concave surface S1, and a flow from the center to the end portions can be formed, whereby contaminants can be removed.
In the processing chamber 21, a gas for drying is supplied in advance from below the conveyance path T by the gas blowout part 42. When the substrate W passes through the region in the gas supply state, the cleaning liquid adhering to the concave surface S1 of the substrate W is blown off by the blowing of the gas, and the substrate W becomes dry. The cleaning liquid blown off from the substrate W flows through the bottom surface of the processing chamber 21 and is discharged from the discharge port.
[ Effect of the embodiment ]
(1) The present embodiment is a substrate processing apparatus 10 for processing a substrate W having a warp, the substrate processing apparatus 10 including: a plurality of conveying rollers 31 that are provided in a plurality of sets along the conveyance direction Td, with two of the conveying rollers being provided at intervals in the width direction X orthogonal to the conveyance direction Td of the substrate W, and that support the concave surface S1 side and rotate about an axis to convey the substrate W; a first shaft 31c on which a plurality of conveying rollers 31 are mounted, the first shaft being provided in a pair of two shafts spaced apart in the width direction X and arranged along the conveying direction Td; and a fluid supply unit 40 for supplying a fluid to the concave surface S1 of the substrate W.
The fluid supply unit 40 supplies the fluid to the concave surface S1 of the substrate W from between the conveying rollers 31 of each group spaced in the width direction X.
If the substrate W is transported so as to have the convex surface S2 on the lower side, the inclined surface on the convex surface S2 side is supported, and the support is easy to slide and unstable, and therefore, a member, a mechanism, or the like for supporting the substrate W needs to be added on the lower side. On the other hand, in the present embodiment, since the end portion of the substrate W is basically supported only by the support concave surface S1 side, stable conveyance is possible.
Further, if the shaft is provided over the entire width direction X of the substrate W, the fluid supplied from the fluid supply portion 40 may collide with the shaft or may not reach the substrate W, and thus the fluid cannot be uniformly supplied to the substrate W, which may hinder efficient processing of the substrate W. However, in the present embodiment, since the conveying roller 31 and the first shaft 31c are provided at a distance in the width direction X on the concave surface S1 side, the fluid supplied from the fluid supply portion 40 can be prevented from being caught by the conveying roller 31 or the first shaft 31 c. Therefore, since the fluid can be uniformly sprayed onto the processing surface, uniform processing can be achieved, and degradation of the quality of the substrate W can be suppressed.
Further, by supplying the fluid to the concave surface S1 of the substrate W from between the conveying rollers 31 of each group and the first shaft 31c, the flow from the center to the end portion is formed due to the inclination of the concave surface S1, so that the insufficient processing of the concave surface S1 can be suppressed, and the quality of the substrate W can be improved.
(2) The present embodiment includes the pressing roller 32 that presses the convex surface S2 of the substrate W, and the second shaft 32a provided coaxially with the pressing roller 32. Therefore, even if a pressure due to the supply of the processing liquid is applied from the concave surface S1 side, the pressure roller 32 prevents the floating, so that the position of the substrate W is stabilized, and a uniform process can be maintained.
(3) The fluid supply unit 40 has a plurality of discharge portions 412 in the width direction X, and the discharge portion 412 disposed on the center side in the width direction X has a larger discharge amount of the processing liquid than the discharge portions 412 disposed on the side closer to the two conveying rollers 31 of each group. Therefore, the discharge amount of the processing liquid from the discharge portion located on the center side of the end portion of the concave surface S1 is increased, and the flow from the center to the end portion is easily formed, so that the entire process can be made uniform. For example, as shown in fig. 2, when the plurality of ejection portions 412 are provided at the same height, the ejection port of the central ejection portion 412B is spaced apart from the substrate W by a longer distance than the other ejection portions 412A and 412C, and therefore the ejected processing liquid is dispersed among the ejection portions 412A, 412B, and 412C, or the pressure at which the processing liquid collides with the center of the concave surface S1 of the substrate W becomes weak. In the present embodiment, the discharge amount of the discharge portion 412B provided below the center of the concave surface S1 is made larger than that of the other discharge portions 412A and 412C, so that the flow from the center to the end portions can be formed while securing the flow rate of the processing liquid at the center. Further, the pressure at which the processing liquid collides with the concave surface S1 can be made uniform.
(4) The fluid supply unit 40 has a plurality of discharge units 412 in the width direction X, and the plurality of discharge units 412 variably set the flow rate of the processing liquid to be discharged, respectively. Therefore, the flow rate of each of the ejection portions 412 is adjusted according to the difference in the distance between the concave surface S1 and each of the ejection portions 412 caused by the warp of the substrate W, thereby achieving uniform processing.
(5) The fluid supply unit 40 includes a plurality of tubes 411 extending in the direction along the transport direction Td, the plurality of tubes 411 are arranged in a row in the width direction X, and the discharge unit 412 is provided in the tubes 411. Therefore, by adjusting the flow rate of the treatment liquid in each pipe 411, the discharge rate of the treatment liquid from the plurality of discharge portions 412 arranged along the width direction X can be adjusted.
[ other embodiments ]
(1) The conveyance roller 31 does not necessarily have to be provided with the flange portion 31 b. For example, as shown in fig. 4, a guide roller 33 for guiding the movement of the substrate W may be provided between the plurality of first shafts 31c arranged along the conveyance direction Td of the substrate W. In this case, if the separation distance between the pair of opposed guide rollers 33 is defined as e, e ≧ L is preferable.
(2) In the embodiment, the pressing roller 32 is provided in one width direction X orthogonal to the conveyance direction Td, but the present invention is not limited thereto, and a plurality of pressing rollers may be provided. For example, the pressing rollers 32 may be provided at positions facing the conveying rollers 31. The belt may be wound around the pressing roller 32 and may be configured as a roller conveyor. With this configuration, the area of contact with the warp of the substrate W is increased as compared with the case where only the pressing roller 32 is used, and therefore the substrate W can be conveyed more stably. In addition, a flat (flat type) roller may be used.
(3) A measuring section for measuring the amount of warp of the substrate W may be provided, and the amount of discharge from the discharge section 412 may be adjusted based on the amount of warp of the substrate W measured by the measuring section. For example, when the warp amount of the substrate W measured by the measuring section is larger than a predetermined value, the ejection amount from the central ejection section 412B may be increased.
(4) A measuring portion for measuring the amount of warp of the substrate W and a moving mechanism for moving up and down the pressing rollers 32 may be provided, and the distance between the conveying roller 31 and the pressing roller 32 in each set may be adjusted based on the amount of warp of the substrate W measured by the measuring portion.
(5) In the embodiment, the cleaning process and the drying process are performed in a common chamber, but not limited thereto. The cleaning process and the drying process may be performed in different chambers.
(6) In the above embodiment, the plurality of discharge portions 412 are set so that the discharge amount per unit time of the processing liquid on the side away from the two conveying rollers 31 of each group is larger than that on the side closer to the two conveying rollers 31 of each group. In this case, when the diameters of the discharge holes of the discharge portions 412 are equal, the discharge speed of the processing liquid in the discharge portion on the side away from the two conveying rollers 31 of each group may be higher than that on the side closer to the two conveying rollers 31 of each group.
(7) In the embodiment, the number of the tubes 411 is three, that is, three tubes 411A, 411B, and 411C, but the number is not limited to three, and three or more tubes may be provided. In this case, only one of the center side may have a larger ejection amount than the other, and the ejection amount may be increased stepwise from the side close to the conveying roller 31 toward the center.
(8) The fluid supply unit 40 may be a water knife (aqua knife) or the like, in addition to the above-described nozzle or air knife for ejecting the treatment liquid in a shower shape, and the tool used is not particularly limited as long as it is a tool for ejecting the fluid. Further, the above-described various tools may be used in combination. The fluid supply unit 40 may be disposed above the transfer path T of the substrate W, and may supply the processing fluid to the convex surface S2 (non-pattern-formed surface on which the pattern P is not formed) of the substrate W to process both surfaces of the substrate W.
(9) In the above embodiment, the substrate processing apparatus 10 is exemplified as a process of cleaning and drying the substrate W, but the process is not limited thereto. For example, a resist processing apparatus, an exposure processing apparatus, a development processing apparatus, an etching processing apparatus, and a peeling processing apparatus may be used to manufacture a liquid crystal substrate, a semiconductor substrate, a photomask, and the like. Accordingly, various chemical solutions can be used as the treatment solution.
(10) In the above embodiment, the case where the substrate W is conveyed in a horizontal state is exemplified, but the present invention is not limited to this, and the substrate W may be conveyed in an inclined state by being inclined, and for example, the substrate W may be conveyed in an inclined state by having one end in the width direction X of the substrate W be higher than the other end.
(11) In the above-described embodiment, the substrate W with warp at all sides (substrate W with warp at all sides) is described as an object, but the present invention is not limited to this, and can be applied to any substrate with warp at any two sides or three sides of a rectangle, for example.
(12) While several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various embodiments, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Claims (7)

1. A substrate processing apparatus that processes a substrate having a warp, comprising:
a conveying roller which is provided with a plurality of groups along a conveying direction of the substrate, and supports a concave surface side of the substrate to convey the substrate, wherein two conveying rollers which are arranged in a width direction orthogonal to the conveying direction of the substrate are used as one group;
a first shaft having a plurality of sets of two of the conveying rollers arranged at intervals in the width direction as a set, the plurality of sets being arranged along the conveying direction of the substrate, and the conveying rollers being mounted thereon; and
a fluid supply part for supplying fluid to the concave surface of the substrate,
the fluid supply unit supplies a fluid to the concave surface of the substrate from between the conveying rollers spaced in the width direction.
2. The substrate processing apparatus according to claim 1, wherein the concave surface of the substrate has a pattern forming region where a pattern is formed, and a non-pattern forming region where no pattern is formed at a periphery of the pattern forming region,
the distance separating the conveying rollers of each group is longer than the width of the pattern forming area in the width direction.
3. The substrate processing apparatus according to claim 1 or 2, comprising:
a pressing roller for pressing the convex surface of the substrate; and
and the second shaft is provided with the pressing roller.
4. The substrate processing apparatus according to claim 3, wherein the press rollers are disposed so as to face the respective groups of the conveying rollers with a space therebetween,
the distance separating the conveying roller from the pressing roller in the direction perpendicular to the conveying path is constant between the respective sets of conveying rollers.
5. The substrate processing apparatus according to any one of claims 1 to 4, wherein the fluid supply portion has a plurality of ejection portions in the width direction,
the plurality of discharge portions variably set the flow rate of the processing liquid to be discharged, respectively.
6. The substrate processing apparatus according to any one of claims 1 to 5, wherein the fluid supply portion has a plurality of ejection portions in the width direction,
the discharge portion disposed on the center side in the width direction has a larger discharge amount of the processing liquid than the discharge portion disposed on the side closer to the two conveying rollers of each group.
7. The substrate processing apparatus according to claim 5 or 6, wherein the fluid supply section has a plurality of tubes extending in a direction along the carrying direction,
a plurality of the tubes are arranged in line in the width direction,
the ejection portion is provided to the tube,
the flow rate of the treatment liquid discharged from the discharge portion is increased by adjusting the flow rate of the treatment liquid flowing through the pipe.
CN202210096669.XA 2021-02-04 2022-01-26 Substrate processing apparatus Pending CN114864436A (en)

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JPH07188949A (en) * 1993-12-27 1995-07-25 Masamichi Kodama Surface treatment of substrate and treating device therefor
JPH08288250A (en) * 1995-04-19 1996-11-01 Dainippon Screen Mfg Co Ltd Liquid drip apparatus
JPH1110096A (en) 1997-06-20 1999-01-19 Dainippon Screen Mfg Co Ltd Substrate treating device
JP2001085496A (en) * 1999-09-10 2001-03-30 Daiichi Shisetsu Kogyo Kk Carrying device of plate-like member
JP4180250B2 (en) 2001-05-30 2008-11-12 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2017147399A (en) 2016-02-19 2017-08-24 芝浦メカトロニクス株式会社 Substrate processing device and substrate processing method
JP2019067848A (en) * 2017-09-29 2019-04-25 株式会社Ｆｅｂａｃｓ Substrate transfer apparatus and substrate processing apparatus provided with substrate transfer apparatus
JP2019091746A (en) * 2017-11-13 2019-06-13 株式会社荏原製作所 Device and method for substrate surface treatment
KR102656981B1 (en) * 2018-03-27 2024-04-11 가부시키가이샤 에바라 세이사꾸쇼 Cleaning appratus, plating apparatus including the same, and cleaning method
KR102404501B1 (en) 2019-07-25 2022-06-07 시바우라 메카트로닉스 가부시끼가이샤 Substrate transport apparatus and substrate processing apparatus

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