JP2022119534A - Substrate processing device - Google Patents

Abstract

To provide a substrate processing device that can improve a quality of a substrate.SOLUTION: A substrate processing device 30 according to an embodiment, which conveys a substrate W having warpage, comprises: a plurality of conveying rollers 31 that convey the substrate W by rotating with shafts thereof as centers while supporting a concave side of the substrate W; first shafts 31c provided concentrically with the conveying rollers 31; and a fluid supply part 40 that supplies fluid to the concave side of the substrate W. Shafts of the conveying rollers 31 are pointed in a width direction orthogonal to a conveying direction Td of the substrate W, and a plurality of sets of the conveying rollers 31, constituted of the two conveying rollers separately provided in the width direction as one set are arranged in the conveying direction Td. The two conveying rollers 31 of each set are provided with two first shafts 31c separated in the width direction. The fluid supply part 40 supplies fluid from a space between the separated conveying rollers of each set to the concave surface of the substrate.SELECTED DRAWING: Figure 1

Description

An embodiment of the present invention relates to a substrate processing apparatus.

2. Description of the Related Art Substrate processing apparatuses for processing substrates such as glass substrates and semiconductor substrates are used in manufacturing processes for liquid crystal display devices, semiconductor devices, and the like. Substrate processing includes, for example, resist coating processing, resist stripping processing, etching processing, cleaning processing, and drying processing. A substrate processing apparatus processes a substrate by supplying a processing fluid such as a processing liquid or a drying gas to the substrate from a supply tool while transporting the substrate by a plurality of transport rollers. .

JP-A-11-10096

Substrates to be transported are usually flat substrates, but some substrates have warpage. For example, when a thin substrate with a thickness of about 1 mm is used as a substrate to be processed and a film is formed on one surface of the substrate, the substrate warps due to the stress of the film. Therefore, one surface of the substrate may be concave and the other surface may be convex. When such a warped substrate is conveyed with its concave surface facing up and in a warped state by a plurality of conveying rollers, the processing fluid from the supply tool accumulates in the central portion of the concave surface. Poor or non-uniform treatment of the substrate. For this reason, uneven processing such as uneven coating, uneven peeling, uneven etching, uneven cleaning, and uneven drying may occur, and the quality of the substrate deteriorates.

An object of the present invention is to provide a substrate processing apparatus capable of improving the quality of substrates.

An embodiment of the present invention is a substrate processing apparatus for processing a warped substrate, comprising: a plurality of transport rollers supporting a concave surface side of the substrate and rotating about an axis to transport the substrate; a first shaft provided coaxially with the transport roller; and a fluid supply unit that supplies a fluid to the concave surface of the substrate. and a plurality of sets of the conveying rollers are arranged in the conveying direction, each set including two conveying rollers spaced apart in the width direction. Two spaced-apart first shafts are provided, and the fluid supply unit supplies fluid to the concave surface of the substrate from between each set of the spaced-apart transport rollers.

According to embodiments of the present invention, the quality of substrates can be improved.

1 is a side view showing a schematic configuration of a substrate processing apparatus according to an embodiment; FIG. 2 is a view taken along arrow AA' in FIG. 1; FIG. 2 is a plan view showing a schematic configuration of the substrate processing apparatus of the embodiment of FIG. 1; FIG. It is a top view which shows schematic structure of the substrate processing apparatus of other embodiment.

A substrate processing apparatus 10 according to an embodiment will be described with reference to FIGS. 1 to 4. FIG. Note that the dimensions and shapes of the drawings do not accurately reflect the actual substrate and device, and some parts are exaggerated for easy understanding. Further, in the following description, the direction following gravity is defined as "downward" and the direction against gravity is defined as "upper", but these directions do not limit the installation direction of the device.

[substrate]
As shown in FIGS. 1 and 2, in this embodiment, the substrate W to be transported or processed has a warp. As the substrate W, for example, a rectangular thin substrate such as a glass substrate is used. In this embodiment, the thickness of the substrate W is approximately 0.5 to 1.1 mm, and the amount of warpage of the substrate W is approximately 7 to 10 mm. In the drawing, the substrate W has a U-shaped shape in the lateral direction, but the actual rectangular substrate W is warped in its four directions. The warpage causes one surface of the substrate W to contract and the other surface to expand. A concave surface S1 is a surface that is depressed by contraction, and a convex surface S2 is a surface that is raised by stretching. The substrate W of the present embodiment has the concave surface S1 as the processing surface. For example, a substrate W having a circuit pattern P formed on its surface to be processed, such as a multilayer substrate, is used. It should be noted that there is a region in which the pattern P is not formed near the outer edge of the processing surface of the substrate W. As shown in FIG. A region of the processing surface where the pattern P is formed is referred to as a "pattern forming region", and a region where the pattern P is not formed is referred to as a "non-pattern forming region".

[Basic configuration]
The substrate processing apparatus 10 of the present embodiment is an apparatus that processes the concave surface S1, which is the surface to be processed, while supporting and transporting the substrate W on the concave surface S1 side. In this manner, when the substrate W is transported so that the concave surface S1 is downward and the convex surface S2 is upward, basically the substrate W can be stably transported only by supporting the end portion thereof. Then, the substrate processing apparatus 10 processes the lower concave surface S1. This substrate processing apparatus 10 has a processing chamber 21 , a substrate transfer device 30 , a fluid supply section 40 and a control section 50 . The processing chamber 21 is a housing having therein a transport path T along which the substrate W is transported, and is formed so that the substrate W can pass through the interior along the transport path T. As shown in FIG. The processing chamber 21 functions as a room for processing the substrates W moving on the transport path T. As shown in FIG. The processing of the substrate W is cleaning and drying in this embodiment. A discharge port (not shown) for discharging the processing liquid is formed in the bottom surface of the processing chamber 21 .

The substrate conveying device 30 has a plurality of conveying rollers 31 and a plurality of pressing rollers 32 . The substrate conveying device 30 is provided throughout the processing chamber 21 and conveys the substrate W while pressing the convex surface S2 of the substrate W with the pressing rollers 32 and supporting the concave surface S1 with the conveying rollers 31 .

[Substrate transfer device]
(Arrangement of transport rollers and presser rollers)
As described above, the substrate transport device 30 transports the substrate W with the concave surface S1 facing downward. The transport rollers 31 are arranged below the transport path T along the transport direction Td of the substrate W at predetermined intervals. Each pressing roller 32 is positioned above the transport path T so as to be separated from each transport roller 31 with the transport path T interposed therebetween. are lined up. The conveying roller 31 and the pressing roller 32 are arranged in the processing chamber 21 so as to face each other in the vertical direction in FIG. It is configured to rotate The conveying roller 31 rotates clockwise in FIG. 1, and the pressing roller 32 rotates counterclockwise.

In the processing chamber 21, a plurality of sets are provided, each of which is made up of a set of a conveying roller 31 (two rollers in this embodiment) and a pressure roller 32, which are arranged to face each other with a gap between them with the conveying path T interposed therebetween. The separation distance H between the conveying roller 31 and the pressing roller 32 for each set in the processing chamber 21 is constant. In this embodiment, the separation distance H is, for example, a vertical separation distance. The fact that the separation distance H is constant means that the distance H is set to a predetermined distance at which the substrate can be transported in an amount equal to or less than the amount of warpage of the substrate W, for example. The amount of warp is the maximum vertical separation distance between the plane on which the substrate W is placed and the upper surface of the substrate W placed on the plane.

(Specific Configuration of Conveying Roller)
As shown in FIG. 2, the transport roller 31 supports the concave surface S1 side of the substrate W, and transports the substrate W by rotating about an axis a perpendicular to the transport direction Td of the substrate W in the horizontal plane. do. The conveying roller 31 has a cylindrical portion 31a and a flange portion 31b which are coaxially positioned on the same axis a. The cylindrical portion 31a supports the substrate W in contact with the end portion of the substrate W on the side of the concave surface S1. The cylindrical portion 31a is a roller made of rubber or resin, for example. The axis of the cylindrical portion 31a is the width direction X orthogonal to the transport direction Td. A plurality of sets of the conveying rollers 31 including the cylindrical portion 31a are arranged in the conveying direction Td, with two rollers spaced apart in the width direction X forming one set. The two cylindrical portions 31a of each set have the same diameter.

The separation distance H between the conveying roller 31 and the pressing roller 32 is the distance of the portion in contact with the substrate W. be. That is, the separation distance H between the conveying roller 31 and the pressing roller 32 includes the case where it is the distance between a part of the conveying roller 31 and the pressing roller 32 . Further, the conveying path T of the present embodiment is located between the cylindrical portion 31 a of the conveying roller 31 and the pressing roller 32 .

The brim-shaped portions 31b are portions provided at opposite ends of the columnar portions 31a of the two conveying rollers 31 so as to have a larger diameter. The brim portion 31b can come into contact with the end portion of the substrate W along the transport direction Td.

As shown in FIG. 3, the separation distance D between the conveying rollers 31 in each set (the distance between the facing surfaces of the cylindrical portions 31a in each set) is constant. It is preferable that the separation distance D satisfies D≦L, where L is the length in the width direction X of the warped substrate W in plan view. In addition, it is preferable that d≧L, where d is the distance between the flange portions 31b of the conveying rollers 31 of each pair (the distance between the facing surfaces). As a result, the edge of the substrate W can be supported by the transport rollers 31 . Furthermore, as shown in FIG. 2, it is preferable that D>Lp, where Lp is the length in the width direction X of the pattern formation region in plan view of the substrate W. This suppresses the supply of the fluid to the pattern P by the fluid supply unit 40 , which will be described later, from being interrupted by the transport roller 31 . The axial length ax of the cylindrical portion 31a is (d−D)/2.

Further, the conveying roller 31 is provided with a first shaft 31c coaxially therewith. Two first shafts 31c are provided on the two conveying rollers 31 of each set, spaced apart in the width direction X and coaxially with each other. The first shaft 31c has a diameter smaller than that of the cylindrical portion 31a, and is provided on opposite end surfaces of the two cylindrical portions 31a of each set. The plurality of first shafts 31c are synchronously rotatable by, for example, a drive mechanism having a helical gear (not shown). Both of the two conveying rollers 31 of each set are rotationally driven at the same peripheral speed.

When the first shaft 31c rotates, each cylindrical portion 31a attached to the first shaft 31c rotates around the first shaft 31c as a rotation axis. The transport rollers 31 support the non-pattern formation area on the concave surface S1 side or the end portion of the substrate W along the transport direction Td, and transport the substrate W in the transport direction Td. As shown in FIG. 2, there is no first shaft 31c below the pattern formation area in the width direction X of the substrate W being transported.

(Specific configuration of pressing roller)
The pressing roller 32 has a circular shape with the width direction X as an axis. As shown in FIG. 2, the pressing rollers 32 are located above the respective transport rollers 31 so as to abut on the center of the convex surface S2 of the substrate W and form a set of two pressing rollers 32 . is provided to face the center in the width direction X in the space existing between the conveying rollers 31 . The pressing roller 32 is coaxially provided with a second shaft 32a. The second shaft 32a is arranged parallel to the first shaft 31c. The second shaft 32a has a diameter smaller than that of the pressing roller 32, and has, for example, a spur gear (spur gear) (not shown) in the processing chamber 21 over a length exceeding the length of the substrate W in the width direction X. They are rotatably provided synchronously by a drive mechanism.

When the second shaft 32a rotates, the pressing roller 32 attached to the second shaft 32a rotates around the second shaft 32a while contacting the convex surface S2. The conveying roller 31 and the pressing roller 32 are both controlled to rotate at the same peripheral speed.

[Fluid supply part]
As shown in FIGS. 1 and 2, the processing chamber 21 is provided with a fluid supply section 40 . The fluid supply unit 40 supplies fluid to the substrate W from between each pair of the transport rollers 31 that are separated from each other. The fluid supply unit 40 has a liquid injection unit 41 and a gas blowout unit 42 .

(liquid injection part)
The liquid injection unit 41 injects and supplies the processing liquid to the processing surface of the substrate W moving on the transport path T. As shown in FIG. The liquid injection part 41 is provided so as to face the substrate W while being separated from the substrate W to be transported across the transport path T so as not to interfere with the transport of the substrate W by the substrate transport device 30 . No shaft, roller, or the like is interposed between the liquid ejecting portion 41 and the transport path T. As shown in FIG. When the processing liquid is jetted toward the transport path T by the liquid jetting portion 41, the processing liquid is supplied to the concave surface S1 of the substrate W moving in the transport path T. As shown in FIG. As the processing liquid, cleaning liquid, stripping liquid, developing liquid, and rinsing liquid (pure water, etc.) are applied for each intended processing.

More specifically, for example, a shower pipe having a plurality of through holes or a pipe having a plurality of nozzles can be used as the liquid injection part 41 . As shown in FIGS. 1 and 2, the liquid injection section 41 of the present embodiment has a pipe 411 extending in the transport direction Td. It is configured. In this embodiment, as shown in FIG. 2, pipes 411A and 411C are arranged at positions near two conveying rollers 31 spaced apart in the width direction X, and the two conveying rollers 31 One pipe 411B is arranged at the center in the width direction X between. Hereinafter, the pipes 411A, 411B, and 411C will be referred to as the pipe 411 when not distinguished. The pipe 411 is connected to a processing liquid supply source including a pump and a tank (not shown).

The pipe 411 is provided with a plurality of discharge portions 412 . In this embodiment, the ejection part 412 is a nozzle that supplies the processing liquid in a shower form from an ejection port onto the processing surface of the substrate W being transported. That is, the ejection part 412 ejects the processing liquid onto the lower surface of the substrate W from below the substrate W. As shown in FIG. The discharge part 412 may be a through hole. The discharge portions 412 provided in the respective pipes 411A, 411B, and 411C are referred to as 412A, 412B, and 412C.

The plurality of ejection portions 412 arranged along the width direction X are closer to the two conveying rollers 31 of each set, that is, the ejection portions 412 located on both end sides of the width direction X are closer to each pair. , i.e., the ejection portion 412 located on the center side in the width direction X, the amount of treatment liquid ejected per unit time (hereinafter sometimes simply referred to as "ejection amount") is greater. is set to In this embodiment, the discharge amount of the discharge section 412B is larger than the discharge amount of the discharge sections 412A and 412C. In order to achieve such a discharge amount, the plurality of discharge sections 412 arranged along the width direction X are provided with individually variable flow rates of the processing liquid discharged per unit time. More specifically, the control unit 50 controls valves (not shown) provided in pipes connected to the pipes 411 to adjust the amount of processing liquid flowing through each pipe 411 .

(Gas blowing part)
The gas blowing part 42 blows and supplies drying gas such as air or nitrogen gas to the substrate W moving on the transport path T, for example. The gas blowing part 42 is provided so as to face the substrate W while being separated from the transported substrate W across the transport path T so as not to interfere with the transport of the substrate W by the substrate transport device 30 . No shaft, roller, or the like is interposed between the gas blowout portion 42 and the transport path T. As shown in FIG. The gas blowing part 42 blows off a high-pressure gas toward the substrates W passing through the transport path T, blows away the processing liquid such as the cleaning liquid adhering to the substrates W, and dries the processing surface of the substrates W. FIG.

The gas blowout part 42 is, for example, an air knife having a slit-shaped blowout port 42a longer than the width of the warped substrate W, as shown in FIGS. The gas blowing part 42 is provided so as to blow off the liquid adhering to the substrate W by blowing off the gas from the blowing port 42a toward the upstream side in the transport direction Td.

[Control section]
As shown in FIG. 1, the control section 50 is a computer that controls each section of the substrate processing apparatus 10 such as the substrate transfer apparatus 30 and the fluid supply section 40, and stores various information and programs related to substrate transfer and substrate processing. and a processor for executing various programs. The control unit 50 of the present embodiment controls the valves as described above to adjust the amount of processing liquid flowing through the pipe 411, and the end portions near the two conveying rollers 31 of each set, that is, the width The ejection amount is greater on the central side farther from the two conveying rollers 31 of each set, that is, on the center in the width direction X and in the vicinity thereof than on both end sides in the X direction.

[motion]
Next, the operation of the substrate processing apparatus 10 will be described. The following operation is an example of the operation of cleaning the substrate W with the cleaning liquid and drying it. As described above, in the substrate processing apparatus 10, the conveying rollers 31 and the pressing rollers 32 of the substrate conveying device 30 rotate synchronously, and the substrate W is supported on the conveying rollers 31 at the end on the concave surface S1 side. In this state, it is transported in the transport direction Td, moves along the transport path T, and passes through the processing chamber 21 .

The processing chamber 21 is in a liquid supply state in which the cleaning liquid is supplied in advance from below the transport path T by the ejection portions 412 of the pipes 411 . When the warped substrate W is conveyed and passes through the region in which the liquid is supplied, the concave surface S1 of the substrate W is supplied with the cleaning liquid and cleaned. There is no first shaft 31c on the concave surface S1 side of the substrate W, and the cleaning liquid supplied to the concave surface S1 of the substrate W hits the pattern formation region without being blocked by the first shaft 31c. The cleaning liquid supplied to the substrate W flows toward the edge of the substrate W, drops from the edge, flows along the bottom surface of the processing chamber 21, and is discharged from the discharge port.

The concave surface S1 is inclined downward from the center toward both ends. Therefore, the cleaning liquid supplied from the ejection parts 412A and 412C near the edge of the substrate W drops from the edge without reaching the center. On the other hand, in the present embodiment, by supplying the cleaning liquid from the discharge part 412B to the center of the concave surface S1 of the substrate W, a flow that sweeps away the contaminants from the center toward the edge is formed. As a result, contaminants existing on the processing surface of the substrate W can be removed.

However, since the substrate W has a warp, when the center of the concave surface S1 is farther from the discharge part 412 than the end part, when the discharge part 412 is arranged at a constant height position, the center If the flow rate of the ejection portion 412B is the same as the flow rate of the ejection portions 412A and 412C at both ends, there may be cases where a sufficient flow rate of the cleaning liquid cannot be supplied to the center of the concave surface S1. Then, the cleaning liquid stays or falls before reaching the end of the concave surface S1, which leads to reattachment of contaminants due to their staying. In the present embodiment, the flow rate of the central ejection portion 412B is made larger than that of the ejection portions 412A and 412C closer to the ends, so that a sufficient flow rate of the cleaning liquid is supplied to the center of the concave surface S1, and the flow rate from the center to the ends is increased. A directed flow can be formed and contaminants can be removed.

In the processing chamber 21 , the drying gas is supplied in advance from below the transport path T by the gas blowing section 42 . When the substrate W passes through the region in which the gas is supplied, the cleaning liquid adhering to the concave surface S1 of the substrate W is blown off by the gas, and the substrate W dries. The cleaning liquid blown off from the substrate W flows along the bottom surface of the processing chamber 21 and is discharged from the discharge port.

[Effects of Embodiment]
(1) The present embodiment is a substrate transporting apparatus 30 for transporting a warped substrate W, which supports the concave surface S1 side of the substrate W and rotates about an axis to transport the substrate W. A transport roller 31, a first shaft 31c provided coaxially with the transport roller 31, and a fluid supply unit 40 for supplying a fluid to the concave surface S1 of the substrate W are provided.

The rotation axis of the transport rollers 31 is in the width direction X perpendicular to the transport direction Td of the substrate W, and the transport rollers 31 are arranged in a plurality of pairs, each set including two rollers spaced apart in the width direction X. 31 are arranged in the conveying direction Td, the two conveying rollers 31 of each set are provided with two first shafts 31c spaced apart in the width direction X, and the fluid supply part 40 is provided with the spaced apart pair of the rollers 31c. A fluid is supplied to the concave surface S<b>1 of the substrate W from between the transport rollers 31 .

If the substrate W were to be transported with the convex surface S2 downward, the inclined surface on the convex surface S2 side would have to be supported. etc. should be added. On the other hand, in this embodiment, by supporting the concave surface S1 side, it is basically only necessary to support only the edge portion of the substrate W, so that the substrate can be transported stably.

Further, if the shaft were provided over the entire width direction X of the substrate W, the fluid supplied from the fluid supply unit 40 would hit the shaft, and there would be a portion where the substrate W could not be reached. The substrates W are not supplied uniformly, which prevents efficient processing of the substrates W. However, in the present embodiment, since the transport roller 31 and the first shaft 31c are spaced apart in the width direction X on the side of the concave surface S1, the fluid supplied from the fluid supply unit 40 is Blocking by the first shaft 31c is prevented. Therefore, the fluid can be uniformly applied to the surface to be processed, so that uniform processing can be performed and degradation of the quality of the substrate W can be suppressed.

Furthermore, by supplying the fluid to the concave surface S1 of the substrate W from between each pair of transport rollers 31 and the first shaft 31c, the inclination of the concave surface S1 forms a flow from the center to the end, Insufficient processing of the concave surface S1 can be suppressed, and the quality of the substrate W can be improved.

(2) This embodiment includes a pressing roller 32 that presses the convex surface S2 of the substrate W, and a second shaft 32a provided coaxially with the pressing roller 32 . Therefore, even if pressure is applied from the concave surface S1 side by the supply of the processing liquid, the pressing roller 32 prevents the substrate W from floating, so that the position of the substrate W is stabilized and uniform processing can be maintained.

(3) The plurality of discharge portions 412 arranged along the width direction X are arranged to distribute the treatment liquid farther from the two transport rollers 31 of each set than the side closer to the two transport rollers 31 of each set. Discharge volume is large. Therefore, the amount of treatment liquid ejected from the ejecting portion positioned closer to the center of the recessed surface S1 is greater than that at the end, making it easier to form a flow from the center to the edge, thereby making the entire process uniform. For example, as shown in FIG. 2, when a plurality of ejection portions 412 are provided at the same height, the ejection port of the central ejection portion 412B is separated from the substrate W by the other ejection portions 412A. , and 412C, the ejected processing liquid varies among the ejecting portions 412A, 412B, and 412C, and the pressure at which the processing liquid collides with the center of the concave surface S1 of the substrate W becomes weaker. In the present embodiment, the ejection amount of the ejection portion 412B provided below the center of the concave surface S1 is made larger than that of the other ejection portions 412A and 412C, thereby securing the flow rate of the processing liquid in the center. can form a flow from to the edge. It is also possible to make uniform the pressure at which the treatment liquid collides with the concave surface S1.

(4) A plurality of ejection sections 412 arranged along the width direction X are provided to individually vary the flow rate of the treatment liquid to be ejected. Therefore, by adjusting the flow rate of each ejection part 412 according to the difference in the distance between the concave surface S1 and each ejection part 412 due to the warping of the substrate W, uniform processing can be performed.

(5) The fluid supply section 40 has a plurality of pipes 411 along the transport direction Td, the plurality of pipes 411 are arranged side by side in the width direction X, and the discharge section 412 is provided in the pipes 411 . Therefore, by adjusting the flow rate of the processing liquid in each pipe 411, the discharge amount of the processing liquid from the plurality of discharging portions 412 arranged along the width direction X can be adjusted.

[Other embodiments]
(1) The conveying roller 31 does not necessarily need to be provided with the flange portion 31b. For example, as shown in FIG. 4, guide rollers 33 that guide the movement of the substrate W may be provided between a plurality of first shafts 31c arranged in the substrate W transport direction Td. In this case, it is preferable that e≧L, where e is the distance between the pair of opposing guide rollers 33 .

(2) In the above embodiment, one pressing roller 32 is provided in the width direction X orthogonal to the transport direction Td, but the present invention is not limited to this, and a plurality of pressing rollers 32 may be provided. For example, one pressing roller 32 may be provided at a position facing each conveying roller 31 . A belt may be wound around the pressing roller 32 to form a roller conveyor. By adopting such a configuration, compared to the case where only the pressing roller 32 is used, the contact area against the warpage of the substrate W increases, so the substrate W can be transported more stably. Moreover, it is good also as a flat type roller.

(3) A measurement unit for measuring the warp amount of the substrate W may be provided, and the discharge amount from the discharge unit 412 may be adjusted according to the warp amount of the substrate W measured by the measurement unit. For example, when the amount of warpage of the substrate W measured by the measurement unit is larger than a predetermined value, the discharge amount from the central discharge unit 412B may be increased.

(4) A measurement unit for measuring the amount of warpage of the substrate W and a moving mechanism for lifting and lowering each pressing roller 32 are provided. You may make it adjust the separation distance of .

(5) In the above embodiment, the cleaning process and the drying process are performed in a common room as an example, but the invention is not limited to this. The cleaning process and the drying process may be performed in different rooms.

(6) In the above aspect, the plurality of discharge sections 412 are arranged such that the side farther from the two transport rollers 31 of each group is the unit of treatment liquid than the side closer to the two transport rollers 31 of each group. It is set so that the discharge amount per hour is large. At this time, when the diameters of the ejection holes of the respective ejection portions 412 are equal, the side farther from the two conveying rollers 31 of each set discharges more than the side closer to the two conveying rollers 31 of each set. The ejection speed of the processing liquid in the portion may be increased.

(7) In the above embodiment, there are three pipes 411, ie, pipes 411A, 411B, and 411C, but the number is not limited to three, and more than three may be provided. At this time, only one on the central side may have a larger ejection amount than the others, or the ejection amount may increase stepwise from the side closer to the conveying roller 31 toward the center. .

(8) The fluid supply unit 40 may be a nozzle that ejects the treatment liquid in a shower-like manner, an air knife, or an aqua knife. Furthermore, these multiple types of tools may be used in combination. Further, the fluid supply unit 40 is provided above the transport path T of the substrate W, and supplies the processing fluid to the convex surface S2 of the substrate W (the non-pattern forming surface on which the pattern P is not formed), so that the substrate W may be processed on both sides.

(9) In the above aspect, as the processing of the substrate processing apparatus 10, the processing of cleaning and drying the substrate W was exemplified, but the processing is not limited to this. For manufacturing liquid crystal substrates, semiconductor substrates, photomasks, etc., for example, a resist processing device, an exposure processing device, a development processing device, an etching processing device, and a stripping processing device may be used. Accordingly, various chemical solutions can be used as the treatment liquid.

(10) In the above embodiment, the substrate W is conveyed in a horizontal state, but the present invention is not limited to this. One end in the width direction X may be higher than the other end, and the substrate W may be tilted and transported.

(11) In the above embodiment, the substrate W warped on all four sides (the substrate W warped on all four sides) was described, but the present invention is not limited to this. The present invention is applicable even if there is

(12) Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.

10 Substrate processing apparatus 21 Processing chamber 30 Substrate transfer apparatus 31 Transfer roller 31a Cylindrical portion 31b Collar portion 31c First shaft 32 Press roller 32a Second shaft 33 Guide roller 40 Fluid supply unit 41 Liquid injection unit 42 Gas blowout unit 42a Blowout port 50 : Control unit 411 : Pipe 411A : Pipe 411B : Pipe 411C : Pipe 412 : Discharge unit 412A : Discharge unit 412B : Discharge unit 412C : Discharge unit T : Conveyance path

An embodiment of the present invention is a substrate processing apparatus for processing a substrate having a warp, wherein a set of two substrates provided apart in a width direction perpendicular to the transport direction of the substrate is arranged in the transport direction of the substrate. A plurality of sets of transport rollers provided along the transport direction of the substrate support the concave surface side of the substrate and transport the substrate, and two rollers spaced apart in the width direction are set as one set along the transport direction of the substrate. a first shaft to which the conveying roller is attached ; and a fluid supply unit for supplying a fluid to the concave surface of the substrate. A fluid is supplied to the concave surface of the substrate from between the transport rollers.

Claims (5)

A substrate processing apparatus for processing a warped substrate,
a plurality of transport rollers that support the concave side of the substrate and transport the substrate by rotating about an axis;
a first shaft provided coaxially with the conveying roller;
a fluid supply unit that supplies a fluid to the concave surface of the substrate;
with
The axes of the conveying rollers are in the width direction perpendicular to the conveying direction of the substrate, and the conveying rollers are arranged in the conveying direction, with two conveying rollers set apart in the width direction being one set. is,
The two transport rollers of each set are provided with the two first shafts spaced apart in the width direction,
The substrate processing apparatus, wherein the fluid supply unit supplies the fluid to the concave surface of the substrate from between each pair of the conveying rollers that are separated from each other. a pressing roller that presses the convex surface of the substrate;
a second shaft provided coaxially with the pressing roller;
2. The substrate processing apparatus according to claim 1, comprising: The fluid supply unit has a plurality of discharge units arranged along the width direction,
2. The plurality of discharge units discharge a larger amount of the treatment liquid on a side farther from the two conveying rollers of each set than on a side closer to the two conveying rollers of each set. 3. The substrate processing apparatus according to claim 2. The fluid supply unit has a plurality of discharge units arranged along the width direction,
4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the plurality of discharge units are provided so that the flow rate of the processing liquid to be discharged is individually variable. The fluid supply unit has a plurality of pipes along the transport direction,
The plurality of pipes are arranged side by side in the width direction,
5. The substrate processing apparatus according to claim 3, wherein said discharge part is provided in said pipe.

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