KR102622515B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102622515B1
KR102622515B1 KR1020210131563A KR20210131563A KR102622515B1 KR 102622515 B1 KR102622515 B1 KR 102622515B1 KR 1020210131563 A KR1020210131563 A KR 1020210131563A KR 20210131563 A KR20210131563 A KR 20210131563A KR 102622515 B1 KR102622515 B1 KR 102622515B1
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KR
South Korea
Prior art keywords
substrate
processing
processing liquid
supply pipe
discharge port
Prior art date
Application number
KR1020210131563A
Other languages
English (en)
Korean (ko)
Other versions
KR20220047514A (ko
Inventor
도모히로 다카하시
게이 다케치
미츠토시 사사키
다카시 아키야마
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20220047514A publication Critical patent/KR20220047514A/ko
Application granted granted Critical
Publication of KR102622515B1 publication Critical patent/KR102622515B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Polarising Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020210131563A 2020-10-09 2021-10-05 기판 처리 장치 KR102622515B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-171104 2020-10-09
JP2020171104A JP7461269B2 (ja) 2020-10-09 2020-10-09 基板処理装置

Publications (2)

Publication Number Publication Date
KR20220047514A KR20220047514A (ko) 2022-04-18
KR102622515B1 true KR102622515B1 (ko) 2024-01-08

Family

ID=81045340

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210131563A KR102622515B1 (ko) 2020-10-09 2021-10-05 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP7461269B2 (zh)
KR (1) KR102622515B1 (zh)
CN (1) CN114334716A (zh)
TW (1) TWI803011B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840080B (zh) * 2023-01-07 2024-04-21 映利科技股份有限公司 印刷電路板濕式製程裝置以及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047885A (ja) 2018-09-21 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2020136679A (ja) * 2019-02-20 2020-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0456321A (ja) * 1990-06-26 1992-02-24 Fujitsu Ltd 半導体ウエハの洗浄装置
JPH0722541U (ja) * 1993-09-29 1995-04-21 大日本スクリーン製造株式会社 基板処理装置
JP2003188140A (ja) 2001-12-17 2003-07-04 Seiko Epson Corp 液体処理方法、液体処理装置、及び電気光学パネル
JP2004327826A (ja) 2003-04-25 2004-11-18 Toshiba Corp 基板処理装置
JP4338612B2 (ja) 2004-01-30 2009-10-07 大日本スクリーン製造株式会社 基板処理装置
JP2005211718A (ja) 2004-01-27 2005-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置
TWI262827B (en) 2005-12-13 2006-10-01 Ind Tech Res Inst Cleaning device and method of bubble reaction
KR20070105699A (ko) 2006-04-27 2007-10-31 삼성전자주식회사 기판 식각 장치 및 이를 이용한 기판 식각 방법
JP2010040758A (ja) 2008-08-05 2010-02-18 Toshiba Mobile Display Co Ltd 基板処理装置
JP6509104B2 (ja) 2015-09-30 2019-05-08 東京エレクトロン株式会社 基板液処理装置
JP2017168612A (ja) 2016-03-16 2017-09-21 株式会社Ｎｓｃ 処理基板保持治具
JP6971137B2 (ja) * 2017-12-04 2021-11-24 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2019197814A (ja) 2018-05-09 2019-11-14 株式会社ジェイ・イー・ティ 基板処理装置
JP7116694B2 (ja) 2019-02-21 2022-08-10 キオクシア株式会社 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047885A (ja) 2018-09-21 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2020136679A (ja) * 2019-02-20 2020-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法

Also Published As

Publication number Publication date
JP7461269B2 (ja) 2024-04-03
KR20220047514A (ko) 2022-04-18
CN114334716A (zh) 2022-04-12
TW202220087A (zh) 2022-05-16
JP2022062909A (ja) 2022-04-21
TWI803011B (zh) 2023-05-21

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