KR102606448B1 - 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇 - Google Patents
박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇 Download PDFInfo
- Publication number
- KR102606448B1 KR102606448B1 KR1020207021160A KR20207021160A KR102606448B1 KR 102606448 B1 KR102606448 B1 KR 102606448B1 KR 1020207021160 A KR1020207021160 A KR 1020207021160A KR 20207021160 A KR20207021160 A KR 20207021160A KR 102606448 B1 KR102606448 B1 KR 102606448B1
- Authority
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- South Korea
- Prior art keywords
- shaped substrate
- thin plate
- plate
- purge
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018018797A JP7037379B2 (ja) | 2018-02-06 | 2018-02-06 | 薄板状基板保持装置、及び保持装置を備える搬送ロボット |
| JPJP-P-2018-018797 | 2018-02-06 | ||
| PCT/JP2019/001256 WO2019155842A1 (ja) | 2018-02-06 | 2019-01-17 | 薄板状基板保持装置、及び保持装置を備える搬送ロボット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200116919A KR20200116919A (ko) | 2020-10-13 |
| KR102606448B1 true KR102606448B1 (ko) | 2023-11-27 |
Family
ID=67549588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207021160A Active KR102606448B1 (ko) | 2018-02-06 | 2019-01-17 | 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11227784B2 (enExample) |
| EP (1) | EP3734651A4 (enExample) |
| JP (1) | JP7037379B2 (enExample) |
| KR (1) | KR102606448B1 (enExample) |
| CN (1) | CN111727500B (enExample) |
| TW (1) | TWI776016B (enExample) |
| WO (1) | WO2019155842A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3605598B1 (en) * | 2017-05-11 | 2024-05-01 | Rorze Corporation | Thin-plate substrate holding finger and transfer robot provided with said finger |
| JP2021048242A (ja) * | 2019-09-18 | 2021-03-25 | 東京エレクトロン株式会社 | 搬送装置及び搬送方法 |
| JP7045353B2 (ja) * | 2019-10-02 | 2022-03-31 | 株式会社アルバック | 基板搬送装置、および、基板搬送方法 |
| CN113939904B (zh) * | 2020-01-15 | 2025-06-13 | 日本特殊陶业株式会社 | 保持装置 |
| JP7467152B2 (ja) * | 2020-02-13 | 2024-04-15 | 東京エレクトロン株式会社 | 収容容器及び基板状センサの充電方法 |
| CN115362539B (zh) * | 2020-03-30 | 2025-10-14 | Tdk株式会社 | 压模工具、搬运装置以及元件阵列的制造方法 |
| TWI760096B (zh) * | 2021-02-05 | 2022-04-01 | 矽碁科技股份有限公司 | 微型化半導體製程系統 |
| JP2023006718A (ja) * | 2021-06-30 | 2023-01-18 | 株式会社荏原製作所 | 搬送装置、および基板処理装置 |
| CN115706440A (zh) * | 2021-08-04 | 2023-02-17 | 东京毅力科创株式会社 | 收纳容器和基板状传感器的充电方法 |
| CN116031184A (zh) * | 2021-10-25 | 2023-04-28 | 大立钰科技有限公司 | 晶圆存取总成及其晶圆存取装置与晶圆载具 |
| CN115915666A (zh) * | 2022-11-20 | 2023-04-04 | 江苏亨通线缆科技有限公司 | 一种数据中心用智能机柜 |
| CN117080135A (zh) * | 2023-08-24 | 2023-11-17 | 上海广川科技有限公司 | 一种可净化保护的末端执行器 |
| KR102707098B1 (ko) * | 2023-10-24 | 2024-09-19 | 야스카와 일렉트릭 코퍼레이션 | 엔드 이펙터의 웨이퍼 고정용 능동-수동형 그립모듈 및 이를 구비하는 반송로봇 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170740A (ja) * | 2008-01-18 | 2009-07-30 | Rorze Corp | 搬送装置 |
| JP2013006222A (ja) | 2009-10-14 | 2013-01-10 | Rorze Corp | 薄板状物の把持装置、および薄板状物の把持方法 |
| JP2013247283A (ja) * | 2012-05-28 | 2013-12-09 | Tokyo Electron Ltd | 搬送機構、搬送方法及び処理システム |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2043266A1 (en) * | 1990-09-24 | 1992-03-25 | Gary Hillman | Wafer transfer device |
| JP2000040730A (ja) * | 1998-07-24 | 2000-02-08 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
| JP4086398B2 (ja) * | 1999-01-28 | 2008-05-14 | 大日本スクリーン製造株式会社 | 基板洗浄装置 |
| US6354832B1 (en) * | 1999-07-28 | 2002-03-12 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| JP4558981B2 (ja) * | 2000-11-14 | 2010-10-06 | 株式会社ダイヘン | トランスファロボット |
| JP2003092335A (ja) * | 2001-09-18 | 2003-03-28 | Toshiba Corp | 基板搬送装置、これを用いた基板処理装置および基板処理方法 |
| CN101124663B (zh) * | 2004-07-09 | 2010-12-01 | 积水化学工业株式会社 | 用于处理基板的外周部的方法及设备 |
| JP2007048814A (ja) * | 2005-08-08 | 2007-02-22 | Mitsubishi Electric Corp | 基板保持装置、半導体製造装置及び半導体装置の製造方法 |
| JP4959457B2 (ja) * | 2007-07-26 | 2012-06-20 | 東京エレクトロン株式会社 | 基板搬送モジュール及び基板処理システム |
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2018
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2019
- 2019-01-17 CN CN201980011784.9A patent/CN111727500B/zh active Active
- 2019-01-17 EP EP19750264.4A patent/EP3734651A4/en active Pending
- 2019-01-17 US US16/966,888 patent/US11227784B2/en active Active
- 2019-01-17 WO PCT/JP2019/001256 patent/WO2019155842A1/ja not_active Ceased
- 2019-01-17 KR KR1020207021160A patent/KR102606448B1/ko active Active
- 2019-01-31 TW TW108103724A patent/TWI776016B/zh active
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| JP2009170740A (ja) * | 2008-01-18 | 2009-07-30 | Rorze Corp | 搬送装置 |
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| JP2019140130A (ja) | 2019-08-22 |
| TWI776016B (zh) | 2022-09-01 |
| WO2019155842A1 (ja) | 2019-08-15 |
| US11227784B2 (en) | 2022-01-18 |
| CN111727500B (zh) | 2025-01-28 |
| US20210050242A1 (en) | 2021-02-18 |
| EP3734651A1 (en) | 2020-11-04 |
| TW201937645A (zh) | 2019-09-16 |
| KR20200116919A (ko) | 2020-10-13 |
| JP7037379B2 (ja) | 2022-03-16 |
| CN111727500A (zh) | 2020-09-29 |
| EP3734651A4 (en) | 2021-08-25 |
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