KR102593231B1 - 점착성 기재 및 점착성 기재의 제조방법 - Google Patents

점착성 기재 및 점착성 기재의 제조방법 Download PDF

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Publication number
KR102593231B1
KR102593231B1 KR1020180142405A KR20180142405A KR102593231B1 KR 102593231 B1 KR102593231 B1 KR 102593231B1 KR 1020180142405 A KR1020180142405 A KR 1020180142405A KR 20180142405 A KR20180142405 A KR 20180142405A KR 102593231 B1 KR102593231 B1 KR 102593231B1
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KR
South Korea
Prior art keywords
adhesive
substrate
adhesive layer
convex
support substrate
Prior art date
Application number
KR1020180142405A
Other languages
English (en)
Korean (ko)
Other versions
KR20190068420A (ko
Inventor
히로유키 이구치
토시오 시오바라
츠토무 카시와기
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20190068420A publication Critical patent/KR20190068420A/ko
Application granted granted Critical
Publication of KR102593231B1 publication Critical patent/KR102593231B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/206—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer comprising non-adhesive protrusions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
KR1020180142405A 2017-12-08 2018-11-19 점착성 기재 및 점착성 기재의 제조방법 KR102593231B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017236434A JP6842404B2 (ja) 2017-12-08 2017-12-08 粘着性基材の製造方法
JPJP-P-2017-236434 2017-12-08

Publications (2)

Publication Number Publication Date
KR20190068420A KR20190068420A (ko) 2019-06-18
KR102593231B1 true KR102593231B1 (ko) 2023-10-25

Family

ID=67061806

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180142405A KR102593231B1 (ko) 2017-12-08 2018-11-19 점착성 기재 및 점착성 기재의 제조방법

Country Status (3)

Country Link
JP (1) JP6842404B2 (zh)
KR (1) KR102593231B1 (zh)
TW (1) TWI791644B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111048502A (zh) * 2019-12-27 2020-04-21 上海天马微电子有限公司 显示面板、其制作方法及显示装置
JP7429173B2 (ja) 2020-09-08 2024-02-07 信越ポリマー株式会社 粘着性保持治具の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054628A (ja) * 2007-08-23 2009-03-12 Shin Etsu Polymer Co Ltd 基板保持具
JP2013206961A (ja) * 2012-03-27 2013-10-07 Lintec Corp 粘着フィルム
JP2015500562A (ja) * 2011-11-18 2015-01-05 ルクスビュー テクノロジー コーポレイション マイクロ発光ダイオード
JP2017175087A (ja) * 2016-03-25 2017-09-28 株式会社写真化学 デバイスチップを用いた電子デバイスの製造方法およびその製造装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5701465B2 (ja) 2012-12-21 2015-04-15 株式会社新川 フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法
US9550353B2 (en) 2014-07-20 2017-01-24 X-Celeprint Limited Apparatus and methods for micro-transfer-printing
JP2016001752A (ja) 2015-08-25 2016-01-07 日本航空電子工業株式会社 フリップチップ実装構造、フリップチップ実装方法及びフリップチップ実装構造の使用方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054628A (ja) * 2007-08-23 2009-03-12 Shin Etsu Polymer Co Ltd 基板保持具
JP2015500562A (ja) * 2011-11-18 2015-01-05 ルクスビュー テクノロジー コーポレイション マイクロ発光ダイオード
JP2013206961A (ja) * 2012-03-27 2013-10-07 Lintec Corp 粘着フィルム
JP2017175087A (ja) * 2016-03-25 2017-09-28 株式会社写真化学 デバイスチップを用いた電子デバイスの製造方法およびその製造装置

Also Published As

Publication number Publication date
TWI791644B (zh) 2023-02-11
TW201925393A (zh) 2019-07-01
KR20190068420A (ko) 2019-06-18
JP6842404B2 (ja) 2021-03-17
JP2019104785A (ja) 2019-06-27

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