KR102580988B1 - 인쇄회로기판 및 이를 포함하는 전자부품패키지 - Google Patents

인쇄회로기판 및 이를 포함하는 전자부품패키지 Download PDF

Info

Publication number
KR102580988B1
KR102580988B1 KR1020160053962A KR20160053962A KR102580988B1 KR 102580988 B1 KR102580988 B1 KR 102580988B1 KR 1020160053962 A KR1020160053962 A KR 1020160053962A KR 20160053962 A KR20160053962 A KR 20160053962A KR 102580988 B1 KR102580988 B1 KR 102580988B1
Authority
KR
South Korea
Prior art keywords
layer
ground
circuit board
printed circuit
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020160053962A
Other languages
English (en)
Korean (ko)
Other versions
KR20170124270A (ko
Inventor
김양현
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020160053962A priority Critical patent/KR102580988B1/ko
Priority to PCT/KR2017/004639 priority patent/WO2017191968A2/ko
Priority to JP2018557409A priority patent/JP6972016B2/ja
Priority to EP17792870.2A priority patent/EP3454630A4/en
Priority to CN201780027252.5A priority patent/CN109076697B/zh
Priority to US16/098,380 priority patent/US10660195B2/en
Publication of KR20170124270A publication Critical patent/KR20170124270A/ko
Application granted granted Critical
Publication of KR102580988B1 publication Critical patent/KR102580988B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
    • B60L3/0023—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
    • B60L3/0084—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to control modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/10—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by the energy transfer between the charging station and the vehicle
    • B60L53/14—Conductive energy transfer
    • H01L23/481—
    • H01L23/5383—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/14—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries for charging batteries from dynamo-electric generators driven at varying speed, e.g. on vehicle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/60—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries including safety or protection arrangements
    • H02J7/62—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries including safety or protection arrangements against overcurrent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02T90/10—Technologies relating to charging of electric vehicles
    • Y02T90/14—Plug-in electric vehicles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Structure Of Printed Boards (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020160053962A 2016-05-02 2016-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지 Active KR102580988B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020160053962A KR102580988B1 (ko) 2016-05-02 2016-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지
PCT/KR2017/004639 WO2017191968A2 (ko) 2016-05-02 2017-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지
JP2018557409A JP6972016B2 (ja) 2016-05-02 2017-05-02 印刷回路基板およびこれを含む電子部品パッケージ
EP17792870.2A EP3454630A4 (en) 2016-05-02 2017-05-02 Printed circuit board and electronic component package including same
CN201780027252.5A CN109076697B (zh) 2016-05-02 2017-05-02 印刷电路板及包括该印刷电路板的电子元件封装
US16/098,380 US10660195B2 (en) 2016-05-02 2017-05-02 Printed circuit board and electronic component package including same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160053962A KR102580988B1 (ko) 2016-05-02 2016-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지

Publications (2)

Publication Number Publication Date
KR20170124270A KR20170124270A (ko) 2017-11-10
KR102580988B1 true KR102580988B1 (ko) 2023-09-21

Family

ID=60203036

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160053962A Active KR102580988B1 (ko) 2016-05-02 2016-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지

Country Status (6)

Country Link
US (1) US10660195B2 (https=)
EP (1) EP3454630A4 (https=)
JP (1) JP6972016B2 (https=)
KR (1) KR102580988B1 (https=)
CN (1) CN109076697B (https=)
WO (1) WO2017191968A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102628354B1 (ko) * 2018-09-27 2024-01-24 엘지이노텍 주식회사 충전 제어 모듈 및 이를 포함하는 전자부품패키지
CN114567963A (zh) * 2020-11-27 2022-05-31 中车时代电动汽车股份有限公司 一种电机控制器控制板及其接地方法
CN114269064B (zh) * 2021-12-03 2025-03-18 上海宏英智能科技股份有限公司 电源控制模块及电源控制模块的制备方法
CN119882311A (zh) * 2024-12-31 2025-04-25 惠科股份有限公司 阵列基板的制备方法、阵列基板以及显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102517A (ja) 1999-09-30 2001-04-13 Sony Corp 回路装置
JP2001267902A (ja) * 2000-03-22 2001-09-28 Mitsubishi Electric Corp 半導体装置
JP2015156424A (ja) 2014-02-20 2015-08-27 凸版印刷株式会社 印刷回路基板、半導体装置、およびそれらの製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165055A (en) 1991-06-28 1992-11-17 Digital Equipment Corporation Method and apparatus for a PCB and I/O integrated electromagnetic containment
GB2286494B (en) * 1992-09-04 1996-10-23 Univ Sydney An optical receiver including a noise matching network
JP3055488B2 (ja) * 1997-03-03 2000-06-26 日本電気株式会社 多層プリント基板及びその製造方法
NL1011487C2 (nl) * 1999-03-08 2000-09-18 Koninkl Philips Electronics Nv Werkwijze en inrichting voor het roteren van een wafer.
US6525622B1 (en) * 2000-11-17 2003-02-25 Sun Microsystems, Inc. Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure
US7064723B2 (en) * 2003-10-20 2006-06-20 Next-Rf, Inc. Spectral control antenna apparatus and method
DE60332047D1 (de) * 2003-01-20 2010-05-20 Schaffner Emv Ag Filternetzwerk
JP2004303812A (ja) * 2003-03-28 2004-10-28 Toshiba Corp 多層回路基板および同基板の電磁シールド方法
US6949810B2 (en) * 2003-10-14 2005-09-27 Intel Corporation Active phase cancellation for power delivery
US7453363B2 (en) * 2005-08-19 2008-11-18 Thingmagic, Inc. RFID reader system incorporating antenna orientation sensing
US8063480B2 (en) * 2006-02-28 2011-11-22 Canon Kabushiki Kaisha Printed board and semiconductor integrated circuit
US8153906B2 (en) * 2007-01-10 2012-04-10 Hsu Hsiuan-Ju Interconnection structure for improving signal integrity
KR100985889B1 (ko) * 2008-06-25 2010-10-08 엘지엔시스(주) 매체감별장치 및 그 감별방법
JP4399019B1 (ja) * 2008-07-31 2010-01-13 株式会社東芝 電子機器、フレキシブルプリント配線板、およびフレキシブルプリント配線板の製造方法
KR101068583B1 (ko) * 2009-01-09 2011-09-30 부산대학교 산학협력단 하이브리드 자동차의 안전 시스템 및 그 제어방법
TW201206256A (en) * 2010-07-22 2012-02-01 Hon Hai Prec Ind Co Ltd Printed circuit board
US20130021739A1 (en) * 2011-07-20 2013-01-24 International Business Machines Corporation Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling
JP5370445B2 (ja) * 2011-09-09 2013-12-18 株式会社村田製作所 電源制御回路モジュール
JP2013084729A (ja) * 2011-10-07 2013-05-09 Fujitsu Ltd 多層配線基板、電子装置、及び多層配線基板の製造方法
CN103052254A (zh) * 2011-10-17 2013-04-17 鸿富锦精密工业（深圳）有限公司 可抑制电磁干扰的电路板
US9283852B2 (en) 2012-05-09 2016-03-15 Schneider Electric USA, Inc. Diagnostic receptacle for electric vehicle supply equipment
US8942006B2 (en) * 2013-01-19 2015-01-27 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types
WO2014115607A1 (ja) * 2013-01-23 2014-07-31 株式会社村田製作所 伝送線路、および電子機器
JP5741781B1 (ja) * 2013-08-02 2015-07-01 株式会社村田製作所 高周波信号伝送線路及び電子機器
US9426871B2 (en) * 2014-02-04 2016-08-23 Moxa Inc. Wireless communications circuit protection structure
US9510439B2 (en) * 2014-03-13 2016-11-29 Honeywell International Inc. Fault containment routing
TWI552521B (zh) * 2014-09-19 2016-10-01 Univ Nat Taiwan Electromagnetic Noise Filter and Its Equivalent Filter Circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102517A (ja) 1999-09-30 2001-04-13 Sony Corp 回路装置
JP2001267902A (ja) * 2000-03-22 2001-09-28 Mitsubishi Electric Corp 半導体装置
JP2015156424A (ja) 2014-02-20 2015-08-27 凸版印刷株式会社 印刷回路基板、半導体装置、およびそれらの製造方法

Also Published As

Publication number Publication date
CN109076697B (zh) 2021-08-03
WO2017191968A3 (ko) 2018-08-09
US20190166682A1 (en) 2019-05-30
EP3454630A4 (en) 2020-01-15
CN109076697A (zh) 2018-12-21
WO2017191968A2 (ko) 2017-11-09
JP6972016B2 (ja) 2021-11-24
JP2019515504A (ja) 2019-06-06
EP3454630A2 (en) 2019-03-13
KR20170124270A (ko) 2017-11-10
US10660195B2 (en) 2020-05-19

Similar Documents

Publication Publication Date Title
KR102580988B1 (ko) 인쇄회로기판 및 이를 포함하는 전자부품패키지
EP2648309B1 (en) Comb-structured shielding layer and wireless charging transmitter thereof
US7956566B2 (en) Driver IC with HV-isolation, especially hybrid electric vehicle motor drive concept
US11279248B2 (en) Power supply device
US8081408B2 (en) Protection of exposed contacts connected to a bridge rectifier against electrostatic discharge
US10666132B2 (en) Electromagnetic interference suppression for vehicle inverter
CN102668355B (zh) 电力变换装置
JP5841898B2 (ja) 車載用電子装置およびそれを搭載した車両
JP5147501B2 (ja) 車載電子装置
JPWO2018021005A1 (ja) 通信装置
US7495880B2 (en) Circuit board and electric device having circuit board
US7667979B2 (en) Protective circuit board for battery pack
CN202841677U (zh) 一种具有防静电的电路板
US9912149B2 (en) Lightning and surge protection for electronic circuits
CN204518211U (zh) 具有防静电功能的柔性电路板
US8441805B2 (en) Circuit board mounting structure of compound circuit
KR102628354B1 (ko) 충전 제어 모듈 및 이를 포함하는 전자부품패키지
JPWO2011162005A1 (ja) プリント回路板
US20190334581A1 (en) Transient and spurious signal filter
CN108024490A (zh) 静电放电防护的电路布局结构以及小型化电子装置
KR20150124622A (ko) 차량용 패턴 회로 기판
US9705257B2 (en) Plug connector protecting against overvoltage discharge
KR20140045630A (ko) 모터 구동 장치
WO2019082578A1 (ja) 受信回路、及び通信装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000