CN109076697A - 印刷电路板及包括该印刷电路板的电子元件封装 - Google Patents
印刷电路板及包括该印刷电路板的电子元件封装 Download PDFInfo
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Abstract
实施例提供一种印刷电路板和包括该印刷电路板的电子元件封装,该印刷电路板包括:数据线层;设置在数据线层上的接地层;设置在接地层上的电源线层;分别设置在数据线层和接地层之间以及接地层和电源线层之间的绝缘层,其中,接地层包括共同接地部和与共同接地部电绝缘的底盘接地部。
Description
技术领域
本发明涉及印刷电路板及包括该印刷电路板的电子元件封装。
背景技术
诸如电动车辆(EV)或插入式混合动力电动车辆(PHEV)的驱动装置使用安装在充电站中的电动车辆供电设备(EVSE)来为电池充电。
当EV正在充电且仅充电插头耦接到EV的入口而便携式充电器未连接到电源时,因为车辆的电子控制单元(ECU)识别出插头连接到入口并进入接通状态,所以可能发生在车辆未被驱动和停止的状态下消耗电力的情况。
为了解决这种问题,需要被配置为当便携式充电器的电源插头连接到壁挂(wallmount)使得充电器准备好时使用控制导频输出的脉宽调制(PWM)信号来施加电力的充电控制模块(电动车辆通信控制器(EVCC))。
EV通常处于被施加高电压或者大电流从其中流过的环境中。因此,存在过量的电流或电压施加到嵌入充电控制模块(EVCC)中的多个集成芯片(IC)并损坏多个IC芯片的风险。
发明内容
技术问题
本发明旨在提供一种印刷电路板及包括该印刷电路板的电子元件封装,该印刷电路板包括即使在过量电流被导入到IC中时也能够保护集成电路(IC)的保护电路。
另外,本发明旨在提供一种印刷电路板及包括该印刷电路板的电子元件封装,该印刷电路板能够将施加到IC的过量电流释放到外部。
技术方案
本发明的一个方面提供一种印刷电路板,包括:数据线层;接地层,设置在所述数据线层上方;电源线层,设置在所述接地层上方;以及绝缘层,插设在所述数据线层和所述接地层之间以及所述接地层和所述电源线层之间,其中,所述接地层包括共同接地部以及与所述共同接地部电绝缘的底盘接地部。
印刷电路板可以进一步包括:多个贯通电极,穿过所述绝缘层并电连接所述数据线层和所述底盘接地部;以及底盘电极,将所述底盘接地部电连接到底盘壳体。
所述多个贯通电极可以设置在电流集中区域中,并且电流集中区域可以是电流密度为印刷电路板的平均电流密度的1.2倍或更多倍的区域。
所述多个贯通电极可以设置在电流密度在0.1A/mm2至20A/mm2的范围内的区域中。
所述底盘电极和所述多个贯通电极之间的最小分离距离可以在所述底盘电极的直径的0.1至0.25倍的范围内。
印刷电路板可以还包括保护电路,所述保护电路包括串联连接的电感器和电阻器。
电感器可以沿数据传输方向设置在电阻器的前方。
本发明的一个方面提供一种电子元件封装,包括:底盘壳体;印刷电路板,设置在所述底盘壳体内;以及至少一个有源元件,设置在所述印刷电路板上并包括多个接地部,其中,所述印刷电路板包括:数据线层;接地层,设置在所述数据线层的上方并包括共同接地部以及与所述共同接地部电绝缘的底盘接地部;电源线层,设置在所述接地层的上方;绝缘层,插设在所述数据线层和所述接地层之间以及所述接地层和所述电源线层之间;多个贯通电极,穿过所述绝缘层并将有源元件的接地部电连接到所述底盘接地部;底盘电极,将所述底盘接地部电连接到所述底盘壳体;以及保护电路,连接到所述有源元件,其中,所述保护电路包括串联连接的电感器和电阻器,所述电感器沿数据被传输到所述有源元件的方向设置在所述电阻器的前方,所述多个贯通电极将所述有源元件的接地部中的设置在电流集中区域中的接地部连接到所述底盘电极,并且所述电流集中区域的电流密度是所述印刷电路板的平均电流密度的1.2倍或更多倍。
有益效果
根据实施例,当使用保护电路时,可以减少由于过量电流引起的产品的故障和停止现象。
另外,过量电流可以经由接地部快速释放以保护元件。因此,在被施加1100V的高电压并且200A或更大的大电流流经其中的电动车辆(EV)中可以最小化高电压和/或过量电流的影响。
附图说明
图1是示出根据本发明的一个实施例的电动车辆(EV)的充电系统的框图。
图2是示出将EV连接到电动车辆供电设备(EVSE)的方法的示例的图。
图3是示出根据本发明的一个实施例的电动车辆EV的充电设备的框图。
图4是示出根据本发明的一个实施例的充电控制模块的概念图。
图5是示出保护电路连接到集成电路(IC)的数据线的状态的图。
图6是示出保护电路连接到IC的电源线的状态的图。
图7是示出根据本发明的一个实施例的印刷电路板的概念图。
图8是示出表面层中的电流流动的图。
图9是示出接地层中的电流流动的图。
图10是示出IC中的电流流动的图。
具体实施方式
由于本发明允许各种变化和许多实施例,因此将在附图中示出特定实施例并在书面描述中详细描述。然而,这并非旨在将本发明限制于特定的实践模式,并且应当理解,不脱离本发明的精神和技术范围的所有改变、等同物和替代物都包含在本发明中。
应当理解,尽管本文中可以使用术语“第一”、“第二”等来描述各种元件,但是这些元件不应限于这些术语。这些术语仅用于区分一元件与另一个元件。例如,在不脱离本发明的范围的情况下,第一元件可以被称为第二元件,第二元件可以类似地被称为第一元件。如本文中所使用的,术语“和/或”包括多个相关列出项的组合或任意一个。
应当理解,当一个元件被称为“连接”或“耦接”到另一个元件时,它可以直接连接或耦接到另一个元件,或者可以存在中间元件。相反,当一个元件被称为“直接连接”或“直接耦接”到另一个元件时,没有中间元件。
本文中使用的术语仅用于描述特定实施例的目的,并不意图限制本发明。如本文中所使用的,除非上下文另有明确说明,否则单数形式“一”、“一个”、“该”旨在也包括复数形式。将进一步理解,当在本文中使用术语“包括”、“包含”时,指定所述特征、整数、步骤、操作、元件、组件和/或它们的组的存在,但不排除存在或添加一个或多个其他特征、整数、步骤、操作、元件、组件和/或它们的组。
除非另外定义,否则本文中使用的所有术语(包括技术和科学术语)具有与本发明所属领域的普通技术人员通常理解的含义相同的含义。将进一步理解,诸如在通用词典中定义的那些术语应当被解释为具有与其在相关领域的背景中的含义一致的含义,并且除非本文中明确地定义,否则将不被理解为理想化或过于正式的含义。
下面将参考附图更详细地描述本发明的示例实施例。无论图号如何,彼此相同或相应的组件都被赋予相同的附图标记,并且将省略多余的描述。
图1是示出根据本发明的一个实施例的电动车辆(EV)的充电系统的框图,图2是示出将EV连接到电动车辆供电设备(EVSE)的方法的示例的图,并且图3是示出根据本发明的一个实施例的电动车辆EV的充电设备的框图。
参考图1,EV 10可以通过EVSE 20充电。为此,连接到EVSE 20的充电电缆可以连接到EV 10的注入口。这里,EVSE 20是被配置为提供交流电(AC)或直流电(DC)的设备,可以形成为设置在充电站中,设置在家中,或者也可以是便携式的。
参考图2,EV 10和EVSE 20通过充电电缆50连接,并且充电电缆50的插头可以永久地安装在EV 10中。这里,充电电缆50可以连接到家庭用或工业用插座,或连接到充电站。
参考图3,充电设备11包括在EV中并连接到EV中的电子控制单元(ECU)12。EV的充电设备11包括控制导频(CP)端口101、接近检测(PD)端口102、保护接地(PE)端口103、充电控制模块100以及电源输入端口104和105。
这里,CP端口101是被配置为接收通过连接到EVSE的充电电缆传输的CP信号的端口。
PD端口102是被配置为检测充电电缆的连接器是否靠近EVSE 20的端口。
PE端口103是连接到EVSE 20的接地部的端口。
充电设备11控制电池13被充电。为此,充电设备11可以具有导频功能(PF)逻辑和PD逻辑,导频功能(PF)逻辑被配置为执行通过CP端口101接收的PF,PD逻辑被配置为经使用通过PD端口102接收的信号来检测连接器是否插入到EVSE 20中。
当充电控制模块100接收通过CP端口101接收的信号和通过PD端口102接收的信号时,充电控制模块100控制连接到电源输入端口104和105的开关,使得电池13从EVSE 20接收充电电力。充电控制模块100可以是电动车辆通信控制器(EVCC)。
然而,充电控制模块的配置不必限于此,并且充电控制模块可以包括能够使用EVCC控制待充电的EV的各种元件。
图4是示出根据本发明的一个实施例的充电控制模块的概念图,图5是示出保护电路连接到集成电路(IC)的数据线的状态的图,图6是示出保护电路连接到IC的电源线的状态的图。
参考图4,充电控制模块可以包括底盘壳体160、印刷电路板(PCB)150和安装在PCB150上的多个有源元件120。底盘壳体160可以由形成外部的金属材料形成。
有源元件120可以包括IC、现场可编程门阵列(FPGA)等。例如,有源元件120可以是微控制器单元(MCU)IC,但不必限于此,并且有源元件120可以包括被配置为执行各种功能的有源元件120。
在本实施例中,被配置为控制待充电的EV的EVCC被描述为一个实施例,但是不必限于此,并且本发明可以应用于在PCB上设置有有源元件的各种类型的电子元件封装。也就是说,本发明可以应用于各种电子元件,例如相机模块和导航系统。
有源元件120可以包括安装在PCB 150上的多个端口,并且该多个端口可以包括电源端口、数据端口和接地端口。数据端口可以电连接到形成在PCB 150上的数据线L1。
根据实施例,包括串联连接的电感器131和电阻器132的保护电路130可以连接到数据线L1。在过量电流施加到数据线的情况下,保护电路130可以保护有源元件120。
保护电路130可以包括串联连接的电感器131和电阻器132。例如,电阻器132可以用于执行传输线的阻抗匹配,并且电感器131可以用于补偿由于过量电流引起的过冲(overshoot)或下冲(undershoot)。
这里,电感器131可以设置成相对地靠近输入端子,并且电阻器132可以设置成靠近有源元件120。因为电感器131的容量大于电阻器132的容量,所以将电感器131设置为靠近输入端子有利于防止数据丢失。另外,当电感器131设置为靠近输入端子时,由峰值电流引起的过量电流得到补偿,并且可以发送或接收具有干净波形的信号。
保护电路130的电感器131和电阻器132可以执行具有大约25欧姆至75欧姆的传输线的阻抗匹配。因此,可以降低数据信号的噪声和信号失真现象。
通过考虑感抗和容抗,保护电路130可以设计成具有合适的值。这里,可以通过考虑引入电流的频率、数据时钟的数字等来设计保护电路130。
由于根据实施例的保护电路130,可以减少由于输入电流而发生的过冲和下冲。因此,可以最小化电流的影响以减少故障现象和停止现象。因此,根据实施例的保护电路130的配置可以与被配置为切断特定带宽之外的频率的带通滤波器(pass filter)区分开。
然而,保护电路130不必限于此,并且不受特别限制,只要保护电路130可以执行传输线的阻抗匹配并补偿失真信号即可。还可以使用除了上述RL电路之外的RLC电路或RC电路来补偿失真信号。
参考图5,当过量电流被引入数据线并且数据信号失真时,发生不执行通信和图像传输的现象。这里,电阻器132可以用作控制器区域网络(CAN)IC与IC芯片之间的阻抗匹配电路。电感器131可用于补偿由于在CAN IC与IC芯片之间流动的峰值电流引起的过量电流。如图6所示,即使在过量电流施加到电源线的情况下,也可以根据相同的原理补偿电流值。
再次参考图4,PCB 150的接地结构140连接到底盘壳体160,以将施加到IC芯片的过量电流释放到底盘接地部。根据实施例,PCB 150使用保护电路130补偿峰值电流,并且超出保护电路130的设计范围的过量电流可以通过底盘接地部而被快速释放。因此,即使在通过传输线施加各种类型的过量电压或电流时,也可以保护有源元件120。
图7是示出根据本发明的一个实施例的PCB的概念图,图8是示出表面层中的电流流动的图,图9是示出接地层的电流流动的图,图10是示出IC中的电流流动的图。
参考图7,PCB 150包括:第一层158,在该第一层158上形成数据线,该数据线被配置为将数据信号传输到有源元件120;第二层153,在该第二层153上形成电源线,该电源线被配置为向有源元件120施加电力;接地层154,包括彼此电绝缘的共同接地部154a和底盘接地部154b;多个绝缘层152,插设在第一层158、第二层153与接地层154之间;多个贯通电极156,将第一层158电连接到底盘接地部154b;以及底盘电极157,将底盘接地部154b电连接到底盘壳体160。
电路板可包括基于树脂基PCB 150、金属芯PCB、柔性PCB、陶瓷PCB和阻燃(FR)-4板。
由于第一层158产生高频波的噪声,所以第一层158可以设置在接地层154下方,从而使高频波的辐射最小化。因此,接地层154可以用作配置为阻挡由第一层158辐射的噪声的屏蔽部。由于第二层153产生低频波的噪声,所以第二层153可以设置在接地层154上方。接地层154可以插设在第一层158与第二层153之间。
然而,所述层的布置不必限于此,也可以进行各种改变。根据电路图案的设计,第一层158可以包括多个层。其上安装有IC芯片的表面层也可以进一步设置在第二层153上。
接地层154包括电连接到底盘壳体160的底盘接地部154b以及与底盘接地部154b绝缘的共同接地部154a。底盘接地部154b可以电连接到EV的主体以确保稳定的接地区域。共同接地部154a可以是除了底盘接地部154b之外的接地区域。共同接地部154a是通常的PCB接地部,并且可以连接到有源元件的接地部。
贯通电极156可以穿过绝缘层152并将第一层158和/或第二层153电连接到底盘接地部154b。贯通电极156包括将第一层158连接到底盘接地部154b的多个第一贯通电极156a以及将第二层153连接到底盘接地部154b的多个第二贯通电极156b。尽管未在图中示出,但是共同接地部154a也可以通过贯通电极连接到IC的接地部。
第一贯通电极156a和第二贯通电极156b可以形成在电流密度高的电流集中区域中。根据这样的配置,电路板中电流密度变高的区域可以与底盘壳体160接地,使得电流可以被快速地释放。另外,由于底盘壳体160连接到EV的主体,所以底盘壳体160可以确保宽的接地面积。
由于IC通常包括多个接地端口,因此在设计电路时可能难以将所有接地部连接到底盘接地部。因此,在本实施例中,选择当施加过量电流时电流集中的接地区域并将该接地区域连接到底盘接地部154b,并且其余的接地区域连接到共同接地部154a以防止施加过量电流时IV芯片的损坏。
底盘接地部154b和共同接地部154a彼此电绝缘的结构具有各种优点。例如,该结构可以阻挡从另一IC施加的外部噪声信号。由于耦合引起的外部噪声可以通过线束(harness)被引入至电源线或信号线中。在这种情况下,当所有接地部被设计成连接到一个接地部时,可能存在这样的下述问题:传输到电源线的噪声通过该接地部被引入信号线中。例如,由于电源IC以数KHz的低频运行,因此电源IC可能不受1MHz至400MHz之间的外部噪声的影响。然而,由于通信IC以数十MHz的频率运行,因此通信IC可能受到很大影响。因此,优点在于:电源IC和通信IC连接到不同的接地部,从而防止电源IC的噪声被引入通信IC中。例如,通信IC也可以连接到底盘接地部,并且电源IC也可以连接到底盘接地部。
根据本实施例,由于共同接地部和底盘接地部电气分离,因此可以旁路滤过外部噪声,并且可以最小化由于通过电源线引入的外部噪声引起的干扰。因此,可以保护抗噪声弱的IC。
底盘接地部154b可以连接到多个贯通电极156以及底盘电极157。底盘电极157的直径可以在2cm到5cm的范围内。底盘电极157和贯通电极156可以设置为彼此间隔开至少3mm至5mm。在底盘电极157和贯通电极156设置成彼此间隔小于3mm的情况下,过量电流可能不会通过底盘电极157释放到外部,而是可能通过贯通电极156返回到板。底盘电极157与多个贯通电极156之间的最小分离距离可以在底盘电极157的直径的0.1到0.25倍的范围内。
参考图8和图9,在通过数据线和/或电源线从外部施加过量电流的情况下,电流在所有层中流动。如图8所示,电流也在最外层中流动,如图9所示,电流也在接地层154中流动。这里,在每个层中产生电流集中的区域。大量的电流集中区域D可以分布在设置有源元件的区域S中。
电流集中区域D可以定义为电流密度在PCB 150的平均电流密度的1.2至1.5倍的范围内的区域。电流集中区域也可以是接地区域,或者电流集中区域可以不是接地区域,而可以是在设计电路时电流集中的区域。可以将过量电流施加到电路板的数据线,并且可以测量电流方向和电流密度以计算电流集中区域D。例如,电流集中区域D的电流密度可以在1E+05A/m2至2E+07A/m2(约100000A/m2至20000000A/m2,或0.1A/mm2至20A/mm2)的范围内。电流密度可以定义为单位面积(area)的电流值。
根据本实施例,如图9所示,贯通电极156形成在设置于电流集中区域D中的接地部上并且电连接到底盘接地部。当过量电流施加到电路板时,较大的电流可能集中在电流集中区域D中。因此,当电流集中区域D连接到底盘接地部时,过量电流可以快速地释放到外部。在通过模拟或样品实验确定电流集中区域之后,可以将贯通电极156连接到电流集中区域。
参考图10,可以在有源元件120安装在板上的状态下测量电流集中区域D。因此,电流集中区域D可以根据有源元件的种类、设置位置和设置数量或电路板的种类而改变。根据本实施例,在将有源元件安装在电路板上之后,可以使用过量电流测试来计算电流集中区域D,并且贯通电极156可以形成在相应的电流集中区域D中并机械地连接到底盘接地部。可以通过利用螺栓耦接将电路板连接到底盘壳体160来执行机械连接,但是不必限于此。
Claims (8)
1.一种印刷电路板,包括:
数据线层;
接地层,设置在所述数据线层上方;
电源线层,设置在所述接地层上方;以及
绝缘层,插设在所述数据线层和所述接地层之间以及所述接地层和所述电源线层之间,
其中,所述接地层包括共同接地部以及与所述共同接地部电绝缘的底盘接地部。
2.根据权利要求1所述的印刷电路板,还包括:
多个贯通电极,穿过所述绝缘层并将所述数据线层电连接到所述底盘接地部;以及
底盘电极,将所述底盘接地部电连接到底盘壳体。
3.根据权利要求2所述的印刷电路板,其中:
所述多个贯通电极设置在电流集中区域中,并且
所述电流集中区域是电流密度为所述印刷电路板的平均电流密度的1.2倍或更多倍的区域。
4.根据权利要求2所述的印刷电路板,其中,所述多个贯通电极设置在电流密度在0.1A/mm2至20A/mm2的范围内的区域中。
5.根据权利要求2所述的印刷电路板,其中,所述底盘电极和所述多个贯通电极之间的最小分离距离在所述底盘电极的直径的0.1至0.25倍的范围内。
6.根据权利要求1所述的印刷电路板,还包括保护电路,所述保护电路包括串联连接的电感器和电阻器。
7.根据权利要求6所述的印刷电路板,其中,所述电感器沿数据传输方向设置在所述电阻器的前方。
8.一种电子元件封装,包括:
底盘壳体;
印刷电路板,设置在所述底盘壳体内;以及
至少一个有源元件,设置在所述印刷电路板上并包括多个接地部,
其中,所述印刷电路板包括:
数据线层;
接地层,设置在所述数据线层的上方并包括共同接地部以及与所述共同接地部电绝缘的底盘接地部;
电源线层,设置在所述接地层的上方;
绝缘层,插设在所述数据线层和所述接地层之间以及所述接地层和所述电源线层之间;
多个贯通电极,穿过所述绝缘层并电连接所述有源元件的接地部和所述底盘接地部;
底盘电极,将所述底盘接地部电连接到所述底盘壳体;以及
保护电路,连接到所述有源元件,
其中,所述保护电路包括串联连接的电感器和电阻器,
所述电感器沿数据被传输到所述有源元件的方向设置在所述电阻器的前方,
所述多个贯通电极将设置在电流集中区域中的接地部连接到所述底盘电极,并且
所述电流集中区域的电流密度是所述印刷电路板的平均电流密度的1.2倍或更多倍。
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EP (1) | EP3454630A4 (zh) |
JP (1) | JP6972016B2 (zh) |
KR (1) | KR102580988B1 (zh) |
CN (1) | CN109076697B (zh) |
WO (1) | WO2017191968A2 (zh) |
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CN114269064A (zh) * | 2021-12-03 | 2022-04-01 | 上海宏英智能科技股份有限公司 | 电源控制模块及电源控制模块的制备方法 |
CN114567963A (zh) * | 2020-11-27 | 2022-05-31 | 中车时代电动汽车股份有限公司 | 一种电机控制器控制板及其接地方法 |
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KR102628354B1 (ko) * | 2018-09-27 | 2024-01-24 | 엘지이노텍 주식회사 | 충전 제어 모듈 및 이를 포함하는 전자부품패키지 |
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JP6972016B2 (ja) | 2021-11-24 |
WO2017191968A2 (ko) | 2017-11-09 |
EP3454630A2 (en) | 2019-03-13 |
US10660195B2 (en) | 2020-05-19 |
WO2017191968A3 (ko) | 2018-08-09 |
KR102580988B1 (ko) | 2023-09-21 |
JP2019515504A (ja) | 2019-06-06 |
EP3454630A4 (en) | 2020-01-15 |
KR20170124270A (ko) | 2017-11-10 |
CN109076697B (zh) | 2021-08-03 |
US20190166682A1 (en) | 2019-05-30 |
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