KR102580712B1 - 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 - Google Patents

기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 Download PDF

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Publication number
KR102580712B1
KR102580712B1 KR1020227033553A KR20227033553A KR102580712B1 KR 102580712 B1 KR102580712 B1 KR 102580712B1 KR 1020227033553 A KR1020227033553 A KR 1020227033553A KR 20227033553 A KR20227033553 A KR 20227033553A KR 102580712 B1 KR102580712 B1 KR 102580712B1
Authority
KR
South Korea
Prior art keywords
base plate
substrate
temperature
plate
holding device
Prior art date
Application number
KR1020227033553A
Other languages
English (en)
Korean (ko)
Other versions
KR20220137160A (ko
Inventor
폴 이머트 셰퍼스
제리 요한네스 마르티누스 페이스터
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/222,705 external-priority patent/US9829804B1/en
Priority claimed from US15/222,708 external-priority patent/US20180033586A1/en
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20220137160A publication Critical patent/KR20220137160A/ko
Application granted granted Critical
Publication of KR102580712B1 publication Critical patent/KR102580712B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020227033553A 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 KR102580712B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US15/222,705 US9829804B1 (en) 2016-07-28 2016-07-28 Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US15/222,705 2016-07-28
US15/222,708 2016-07-28
US15/222,708 US20180033586A1 (en) 2016-07-28 2016-07-28 Apparatus and method for processing or imaging a sample
KR1020197005730A KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법
PCT/JP2017/028156 WO2018021581A1 (en) 2016-07-28 2017-07-27 Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197005730A Division KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20220137160A KR20220137160A (ko) 2022-10-11
KR102580712B1 true KR102580712B1 (ko) 2023-09-21

Family

ID=61016195

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227033553A KR102580712B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법
KR1020197005730A KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020197005730A KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Country Status (5)

Country Link
JP (2) JP6951415B2 (zh)
KR (2) KR102580712B1 (zh)
CN (1) CN109844927B (zh)
TW (2) TWI835063B (zh)
WO (1) WO2018021581A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
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CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法

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US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US20080024743A1 (en) 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
US20140017613A1 (en) 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

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US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US20080024743A1 (en) 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
US20140017613A1 (en) 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

Also Published As

Publication number Publication date
JP6951415B2 (ja) 2021-10-20
CN109844927B (zh) 2024-01-09
KR20220137160A (ko) 2022-10-11
JP2019523561A (ja) 2019-08-22
CN109844927A (zh) 2019-06-04
KR102449579B1 (ko) 2022-10-04
TWI757314B (zh) 2022-03-11
JP7240463B2 (ja) 2023-03-15
TW202234574A (zh) 2022-09-01
JP2022008512A (ja) 2022-01-13
TWI835063B (zh) 2024-03-11
WO2018021581A1 (en) 2018-02-01
TW201812429A (zh) 2018-04-01
KR20190041477A (ko) 2019-04-22

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