KR102564175B1 - Packing method of substrate having suction layer and packing apparatus of substrate having suction layer - Google Patents

Abstract

The present invention includes a mounting step of loading a substrate having an adsorption layer formed thereon on a packaging container, and a flaw imparting step of imparting scratches to the surface of the adsorption layer of the substrate mounted on the packaging container, comprising the steps of: The present invention relates to a method for packing a substrate with an adsorption layer, in which a plurality of the substrates are stacked in the packing container by repeatedly performing the flaw imparting step.

Description

Method for packing a substrate with an adsorption layer and apparatus for packing a substrate with an adsorption layer

The present invention relates to a method for wrapping a substrate with an adsorption layer and an apparatus for wrapping a substrate with an adsorption layer.

BACKGROUND OF THE INVENTION [0002] As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, thinning of substrates such as glass plates, resin plates, and metal plates used in these electronic devices is desired.

However, when the thickness of the substrate becomes thin, the handleability of the substrate deteriorates, so it is necessary to form a functional layer for electronic devices (Thin Film Transistor (TFT), Color Filter (CF)) on the surface of the substrate. becomes difficult

Therefore, using a reinforcing plate (substrate) having an adsorption layer on the surface, adsorbing the back side of the substrate to the adsorption layer of the reinforcing plate to form a laminate in which the substrate is reinforced by the reinforcement plate, and A method of forming a functional layer on the surface of a substrate has been proposed (see Patent Document 1). In this method, since the handleability of the substrate is improved, the functional layer can be formed satisfactorily on the surface of the substrate. And the reinforcement board is peeled from the board|substrate after formation of a functional layer, and the peeled reinforcement board is loaded on a pallet (packing container) in multiple sheets unit.

International Publication No. 2010/090147

However, conventionally, when a plurality of reinforcing plates stacked on a pallet are taken out from the pallet one by one, since two adjacent reinforcing plates are adsorbed by the adsorption layer, the reinforcing plates are taken out from the pallet one by one. it was difficult

On the other hand, if a sheet such as so-called paper is interposed between two adjacent reinforcing boards, it becomes possible to easily take out the reinforcing boards one by one from the pallet. However, in this method, the sheet is separately required, and the sheet may be adsorbed to the adsorption layer, causing a problem that the sheet removal operation is separately required.

The present invention has been made in view of these problems, and even when a plurality of substrates having an adsorption layer on the surface are loaded in a packaging container without a sheet interposed therebetween, an adsorption capable of easily taking out the substrates one by one from the packaging container. It is an object of the present invention to provide a method for wrapping a substrate with a layer and an apparatus for wrapping a substrate with an adsorption layer.

In order to achieve the object of the present invention, a method for packing a substrate with an adsorption layer of the present invention includes a loading step of loading a substrate having an adsorption layer formed on the surface into a packing container, and adsorbing the substrate mounted on the packing container. A plurality of substrates are loaded on the packing container by including a flaw imparting step of imparting flaws to the surface of the layer, and repeating the mounting step and the flaw imparting step.

In order to achieve the object of the present invention, an apparatus for packing a substrate with an adsorption layer of the present invention includes: a loading member for loading a substrate having an adsorption layer formed on the surface into a packing container; and adsorption of the substrate mounted on the packing container. A flaw imparting member for imparting flaws to the surface of the layer is provided.

According to the present invention, in the mounting step, the substrate is mounted on the packaging container by means of the mounting member. Next, in the flaw imparting step, the surface of the adsorption layer of the substrate is flawed by a flaw imparting member. Then, by repeating the mounting step and the scratch imparting step, a plurality of substrates are loaded on the packing container.

The flaws described in the present invention are flaws applied to the surface of the adsorption layer by the flaw imparting member. More specifically, after the substrate of the present invention is loaded into a packing container by a mounting member, grooves, which are scratches, are formed on the surface of the adsorbing layer by the operation of the flaw imparting member moved by the moving member. The depth of the groove is in micrometers based on the thickness of the adsorption layer (several micrometers to several tens of micrometers).

The present invention has a technical feature in imparting scratches to the surface of the adsorption layer. As a result, since the adsorption area of the adsorption layer is reduced, the adsorption force between two adjacent substrates can be reduced. Therefore, even when a plurality of substrates having an adsorption layer on the surface are loaded in the packaging container without interposing a sheet, the substrates can be easily taken out one by one from the packaging container.

Further, the present invention has a technical feature in that scratches are applied to the surface of the adsorption layer of the substrate in a state in which the substrate is mounted on a packing container. Thereby, the space for providing flaws can be saved.

Further, in order to further reduce the adsorption force between two adjacent substrates, it is preferable to provide a plurality of scratches on the surface of the adsorption layer. Further, on the surface of the adsorption layer, scratches may be regularly applied or randomly applied. In addition, in order to further reduce the adsorption force between the substrates, it is preferable to apply flaws uniformly and densely on the surface of the adsorption layer.

In the method for wrapping a substrate with an adsorption layer of the present invention, the flaw imparting step presses a flaw imparting member on the surface of the adsorption layer of the substrate, and moves the flaw imparting member from one end side to the other end side of the substrate It is preferable to include a moving step of moving toward. It is preferable that the flaw imparting member is a roll brush. Further, the apparatus for wrapping a substrate with an adsorption layer of the present invention includes a moving member that presses the scratch imparting member on the surface of the adsorption layer of the substrate and moves it from one end side of the substrate toward the other end side. it is desirable

According to the above aspect of the present invention, since a plurality of scratches can be uniformly and densely applied to the surface of the adsorption layer by the roll brush, the adsorption force between two adjacent substrates can be further reduced. The roll brush may be moved while rotating, or may be moved in a state in which rotation is stopped.

It is preferable that the said board|substrate in the packing method of the board|substrate with an adsorption layer of this invention is a glass plate with a thickness of 0.7 mm or less and a length and width dimension of 1000 mm or more.

The substrate of one embodiment of the present invention is preferably a glass reinforcing plate for reinforcing a substrate for an electronic device. In addition, a glass plate having a length and width dimension of 1000 mm or more is preferably a reinforcing plate for reinforcing a so-called fifth generation (for example, 1100 mm x 1300 mm) or higher electronic device substrate.

It is preferable that the said adsorption layer in the packing method of the board|substrate with an adsorption layer of this invention contains a silicone resin, a polyimide resin, or an inorganic compound.

According to the above aspect of the present invention, scratches can be imparted to the surface of the adsorption layer containing a silicone resin, a polyimide resin, or an inorganic compound by the scratch imparting member.

It is preferable that the scratch imparting member in the wrapping device for a substrate with an adsorption layer of the present invention is a roll brush, the roll brush includes a shaft and a brush provided on a circumferential surface of the shaft, the brush, It is preferable to be provided in a part of the region of the circumferential surface of the shaft.

According to the above aspect of the present invention, the lower end of the adsorption layer of the substrate vertically stacked in the packing container can also be satisfactorily applied with the brush of the roll brush.

It is preferable that the moving member in the wrapping device for a substrate with an adsorbent layer of the present invention includes a driving source and a plurality of power transmission members that transmit power of the driving source to the scratch imparting member.

According to the above aspect of the present invention, even when one power transmission member among the plurality of power transmission members fails, the other power transmission member can support the flawed member, so that the scratched member can be prevented from falling. .

In the apparatus for wrapping a substrate with an adsorbent layer of the present invention, it is preferable that both ends of the flaw imparting member are connected to the moving member via a detachable coupling member.

According to the above aspect of the present invention, it is possible to easily replace the scratch imparting member with respect to the moving member.

It is preferable that the flaw imparting member in the wrapping device for a substrate with an adsorption layer of the present invention is surrounded by a damping member.

According to the above aspect of the present invention, since dust generated from the adsorption layer by the operation of the scratch imparting member can be removed by the damping member, dust can be prevented from scattering around the packaging container.

It is preferable that the wrapping device for a substrate with an adsorption layer of the present invention includes a static electricity eliminator.

According to the above aspect of the present invention, dust generated from the adsorption layer by the operation of the scratch imparting member can be prevented from being reattached to the wrapping device and the wrapping container due to static electricity.

According to the method for packing a substrate with an adsorption layer and the apparatus for packing a substrate with an adsorption layer of the present invention, even when a plurality of substrates having an adsorption layer on the surface are loaded in a packing container without a sheet interposed therebetween, The substrates can be easily taken out one by one from the packaging container. Further, since the surface of the adsorption layer of the substrate is scratched in a state where the substrate is loaded in the packing container, space for providing the scratches can be saved.

1 is an enlarged side view of essential parts showing an example of a laminate.
2 is a perspective view of the packaging container of the embodiment.
3 is a front view of the wrapping device of the embodiment.
Fig. 4 is a left side view of the wrapping device shown in Fig. 3;
Fig. 5 is an explanatory view of a packing container showing a main part in cross section in the left side view of Fig. 4;
Fig. 6 is a flowchart showing a method for wrapping a reinforcing board by the wrapping device of the embodiment.
Fig. 7 is a side view of a roll brush in which a group of brushes are planted on a part of the circumferential surface of the shaft.
Fig. 8 is a side view showing the contact of the brush with the lower end of the adsorption layer of the reinforcing plate.
Fig. 9 is a side view of a roll brush in which two brushes are provided at symmetrical positions on the outer circumferential surface of the shaft.
Fig. 10 is a side view of a roll brush provided with three brushes at equal intervals on the outer circumferential surface of the shaft.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for wrapping a substrate with an adsorption layer and an apparatus for wrapping a substrate with an adsorption layer according to the present invention will be described with reference to the accompanying drawings.

Hereinafter, a mode for using the method for packing a substrate with an adsorption layer and the apparatus for packing a substrate with an adsorption layer according to the present invention in an electronic device manufacturing plant will be described.

Electronic devices refer to electronic components such as display panels, solar cells, and thin film secondary batteries. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP), and an organic electro luminescence display (OELD) panel can be exemplified.

BACKGROUND OF THE INVENTION Electronic devices are manufactured by forming functional layers for electronic devices (thin film transistors (TFTs) and color filters (CFs) in the case of LCDs) on the surface of a substrate made of glass, resin, metal, or the like.

The back surface of the substrate is adsorbed to the adsorption layer of the reinforcing plate (substrate) before formation of the functional layer to form a laminate. After that, a functional layer is formed on the surface of the substrate in a laminated state. After the formation of the functional layer, the reinforcing plate is separated from the substrate.

[Laminate (1)]

1 is an enlarged side view of a main part showing an example of the laminate 1 .

The laminate 1 includes a substrate 2 on which a functional layer is formed, and a reinforcing plate (substrate) 3 reinforcing the substrate 2 . In addition, the reinforcement plate 3 is provided with an adsorption layer 4 on the front surface 3a, and the back surface 2b of the substrate 2 is adsorbed to the adsorption layer 4. That is, the substrate 2 is adsorbed to the reinforcing plate 3 through the adsorption layer 4 by the Van der Waals force acting between it and the adsorption layer 4 or the adhesive force of the adsorption layer 4 .

[Substrate (2)]

The substrate 2 has a functional layer formed on the surface 2a. As the substrate 2, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these substrates, since the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small linear expansion coefficient, it is preferable as the substrate 2 for electronic devices. In addition, as the linear expansion coefficient decreases, there is also an advantage that the pattern of the functional layer formed under high temperature becomes difficult to shift during cooling.

As the glass of the glass substrate, alkali-free glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses containing silicon oxide as a main component can be exemplified. As oxide type glass, the glass whose content of silicon oxide by oxide conversion is 40-90 mass % is preferable.

As the glass of the glass substrate, it is preferable to select and employ glass suitable for the type of electronic device to be manufactured. For example, it is preferable to employ|adopt the alkali free glass which does not contain an alkali metal component substantially for the glass substrate for liquid crystal panels.

The thickness of the substrate 2 is set according to the type of the substrate 2 . For example, when a glass substrate is used for the substrate 2, the thickness of the substrate 2 is preferably 0.7 mm or less, more preferably 0.3 mm or less, still more preferably, for lightening and thinning of the electronic device. Preferably, it is set to 0.1 mm or less. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Moreover, when thickness is 0.1 mm or less, although a glass substrate can be wound up in roll shape, it is preferable that the thickness of a glass substrate is 0.03 mm or more from a manufacturing viewpoint of a glass substrate, and a handling viewpoint of a glass substrate.

In addition, although the board|substrate 2 is comprised by one board|substrate in FIG. 1, the board|substrate 2 may be comprised by several board|substrates. That is, the substrate 2 may be formed of a laminated body in which a plurality of substrates are stacked. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2 .

[Reinforcing plate (3)]

As the reinforcing board 3, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or a plate-shaped body obtained by laminating these plate-shaped bodies can be exemplified.

The type of reinforcing plate 3 is selected according to the type of electronic device to be manufactured, the type of substrate 2 used for the electronic device, and the like. If the reinforcing board 3 and the substrate 2 are made of the same material, warping and peeling due to temperature change can be reduced. It is preferable that the reinforcing board 3 is a glass plate.

The difference (absolute value) of the average coefficient of linear expansion between the reinforcing plate 3 and the substrate 2 is appropriately set according to the dimensions and shape of the substrate 2, but is preferably 35×10 ^-7 /°C or less. Here, "average coefficient of linear expansion" refers to an average coefficient of linear expansion (JIS R3102: 1995) in a temperature range of 50 to 300°C.

The thickness of the reinforcing board 3 is set to 0.7 mm or less depending on the type of the reinforcing board 3, the type and thickness of the substrate 2 to be reinforcing, and the like. The thickness of the reinforcing board 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2. In addition, the vertical and horizontal dimensions of the reinforcing board 3 are preferably 1000 mm or more so as to correspond to the size of the substrate 2 of a so-called fifth generation size (1100 mm long x 1300 mm wide) or larger. In addition, the vertical and horizontal dimensions of the reinforcing board 3 may be dimensions corresponding to the size of the substrate 2 of the sixth generation (1500 mm x 1800 mm to 1500 mm x 1850 mm) or larger.

Further, in this example, the reinforcing board 3 is constituted by a single board, but the reinforcing board 3 may be constituted by a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all substrates constituting the reinforcing board 3 becomes the thickness of the reinforcing board 3 .

[Adsorption layer (4)]

In order to prevent the adsorption layer 4 from peeling between the adsorption layer 4 and the reinforcement plate 3, the bonding force between the reinforcement plate 3 is set higher than the bonding force between the substrate 2. do. Thereby, the reinforcing plate 3 is peeled from the board|substrate 2 together with the adsorption layer 4.

The material of the adsorption layer 4 is not particularly limited, and examples thereof include resins such as acrylic resins, polyolefin resins, polyurethane resins, polyimide resins, silicone resins, polyimide silicone resins, and fluororesins. In addition, the adsorption layer 4 may be constituted by mixing several types of resins. Among them, a polyimide resin, a silicone resin, and a polyimide silicone resin are preferable as the adsorption layer 4 from the viewpoint of heat resistance and peelability. In the embodiment, a silicone resin layer is exemplified as the adsorption layer 4 .

As the silicone resin layer, an addition polymerization type silicone resin layer and a condensation polymerization type silicone resin layer are preferable. As an addition polymerization type silicone resin layer, what was disclosed by Unexamined-Japanese-Patent No. 2011-046174 is preferable. For example, the addition polymerization type silicone resin layer is a cured product of a curable silicone resin composition containing the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b), and the curable silicone resin composition is applied to the surface of the reinforcing board. It is preferable to use a cured silicone resin layer formed by curing in

The linear organopolysiloxane (a) is a linear organopolysiloxane having at least two alkenyl groups per molecule. The linear organopolysiloxane (b) is a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to silicon atoms is present in the silicon atom at the end of the molecule It is a linear organopolysiloxane.

The polycondensation type silicone resin layer can be formed by curing a partially hydrolyzed condensate of a mixture containing an organoalkoxy silane compound on the surface of a reinforcing plate.

As the fluororesin layer, a plasma polymerized fluoropolymer layer is preferable. The fluororesin layer can be formed using, for example, a mixture of CF ₄ gas and C ₄ F ₈ gas with a dielectric coupling type plasma etching apparatus (ICP380, manufactured by Oxford Corporation).

The thickness of the adsorption layer 4 is not particularly limited, but when the adsorption layer 4 is a silicone resin layer, it is preferably set to 1 to 50 μm, more preferably 4 to 20 μm. By setting the thickness of the adsorption layer 4 to 1 μm or more, when air bubbles or foreign substances are mixed between the adsorption layer 4 and the substrate 2, the thickness of the air bubbles or foreign substances is absorbed by the deformation of the adsorption layer 4. can do. On the other hand, by setting the thickness of the adsorption layer 4 to 50 μm or less, the formation time of the adsorption layer 4 can be shortened, and it is economical because the resin of the adsorption layer 4 is not used more than necessary.

When the adsorption layer 4 is a fluororesin layer, the thickness of the adsorption layer 4 is preferably set to 1 to 100 nm, more preferably 1 to 10 nm.

The outer shape of the adsorption layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire adsorption layer 4. do. In addition, the outer shape of the adsorbing layer 4 is preferably equal to or larger than that of the substrate 2 so that the adsorbing layer 4 can closely adhere to the entire substrate 2. .

In Fig. 1, the adsorption layer 4 is composed of one layer, but the adsorption layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the adsorption layer 4 is the thickness of the adsorption layer 4. In addition, in this case, the kind of resin which comprises each layer may be different.

In the embodiment, a resin which is an organic film is used as the adsorption layer 4, but an inorganic layer (inorganic compound) containing MgF ₂ (magnesium fluoride) may be used instead of the resin layer. In addition, the inorganic film constituting the inorganic layer may contain, for example, at least one selected from the group consisting of metal silicides, nitrides, carbides, and carbonitrides, metal oxides, and aromatic silanes. The adsorption layer 4 preferably contains a silicone resin, a polyimide resin, or an inorganic compound.

The metal silicide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba, preferably Most likely, it is tungsten silicide.

The nitride is, for example, at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba. species, and is preferably aluminum nitride, titanium nitride, or silicon nitride.

The carbide contains, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbide.

The carbonitride contains, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbonitride.

Metal silicides, nitrides, carbides, and carbonitrides have a small difference in electronegativity between Si, N, or C contained in the material and other elements contained in the material, and a small polarization. Therefore, the reactivity between the inorganic film and water is low, and it is difficult to generate hydroxyl groups on the surface of the inorganic film. Therefore, releasability between an inorganic film and the substrate 2 which is a glass substrate can be maintained favorably.

Metal oxides are, for example SiO, SiO ₂ , Al ₂ O ₃ , MgO, Y ₂ O ₃ , La ₂ O ₃ , Pr ₆ O ₁₁ , Sc ₂ O ₃ , WO ₃ , HfO ₂ , In ₂ O ₃ , ITO, ZrO ₂ , Nd ₂ O ₃ , Ta ₂ O ₅ , CeO ₂ , Nb ₂ O ₅ , TiO, TiO ₂ , Ti ₃ O ₅ , NiO, ZnO, and combinations thereof may be used. Further, the metal oxide may be doped with Ga or the like.

Aromatic silanes can be used, for example, dodecyltriethoxysilane, trifluoropropyltriethoxysilane, phenyltriethoxysilane, diphenyldiethoxysilane, 4-pentafluorophenyltriethoxysilane, and combinations thereof. can

A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 . As a method of forming the functional layer, a vapor deposition method such as a chemical vapor deposition (CVD) method or a physical vapor deposition (PVD) method or a sputtering method is used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method. After the functional layer is formed on the surface 2a of the substrate 2, the reinforcing plate 3 is peeled off from the substrate 2.

[Packing container 10 of reinforcing plate 3]

Next, the packing container 10 on which the reinforcing plate 3 peeled from the substrate 2 is mounted will be described.

FIG. 2 is an overall perspective view showing an example of the packaging container 10. As shown in FIG.

In the packing container 10, a bottom plate 14 on which the lower edge portion of the reinforcing plate 3 is placed is installed on the upper surface of the stand 12. The top surface of the bottom plate 14 is disposed with an angle of 5° to 25°, preferably 10° to 20°, more preferably about 18° with respect to the top surface of the pedestal 12.

In addition, the back plate frame 16 is erected on the pedestal 12 . The back plate frame 16 is installed upright on the pedestal 12 so as to be at an angle of 90 ° to 100 °, preferably about 95 °, with respect to the upper surface of the inclined bottom plate 14, and a reinforcing plate is placed on the front surface of the back plate frame 16. The back plate 18 supporting the back surface of (3) is propped up and fixed.

The reinforcing board 3 is mounted one by one on the packing container 10 by a robot described later (mounting step). Then, part of the surface of the adsorption layer 4 of the reinforcing plate 3 mounted on the packing container 10 is scraped off by a roll brush described later, and scratches are applied (scratch imparting step). Then, the reinforcing board 3 is packed into the packing container 10 in the form of a laminate 20 in which a plurality of sheets (for example, 300 sheets) are stacked by repeating the mounting process and the flaw imparting process. Here, the package refers to a form in which the layered product 20 is wrapped in the packaging container 10 .

[Packing device 22 for reinforcing plate 3]

3 is a front view of the wrapping device 22 . 4 is a left side view of the wrapping device 22. Fig. 5 is an explanatory view showing a main part in cross section in the left side view of Fig. 4;

At the time of mounting of the reinforcing board 3, the packing container 10 is mounted on the upper surface of the turntable 24. Near the turntable 24, the above-described robot (mounting member) 26 is installed as shown in FIG. Further, the reinforcing plates 3 peeled from the substrate 2 are stacked one by one on the carrying out table 28 installed near the robot 26 . The reinforcing plates 3 mounted on the carrying out table 28 are transported one by one by the robot 26 and mounted on the packing container 10 .

Further, on the turntable 24, a lifting device (moving member) 32 for lifting and moving the roll brush (scratching member) 30 is provided as shown in FIGS. 3 and 4 . That is, the wrapping device 22 of the embodiment is constituted by the robot 26, the roll brush 30, and the lifting device 32.

[Robot (26)]

As shown in FIG. 2 , a plurality of suction pads 36 are provided on the same plane at the front end of the arm 34 of the robot 26 . The operation of the arm 34 is controlled by a control unit (not shown), and the suction start/stop operation of the suction pad 36 is also controlled by this control unit. That is, the controller moves the arm ( 34) is activated. In addition, the control unit starts the suction operation of the suction pad 36 when holding the reinforcing plate 3 loaded on the discharge table 28 by the suction pad 36, and the reinforcement plate is placed on the packing container 10. After (3) is mounted, the suction pad 36 is controlled so as to stop the suction operation of the suction pad 36. As a result, the reinforcing plates 3 are mounted on the packing container 10 one by one by the robot 26 .

[roll brush (30)]

The roll brush 30 is constructed by planting the brush 40 in at least a portion of the circumferential surface of the cylindrical shaft 38. The brush 40 may be planted in the entire circumferential surface of the shaft 38 or may be planted in a part of the circumferential surface area. In the embodiment, as shown in FIG. 5 , the roll brush 30 is configured by planting the brush 40 uniformly and densely over the entire circumferential surface of the shaft 38 . The roll brush 30 is horizontally supported by the lifting device 32 of FIGS. 3 and 4 . 3, the axial length L of the roll brush 30 is configured to be slightly longer than the width W of the reinforcing plate 3, and the roll brush ( 30) is configured to be pushed. The roll brush 30 is pressed against the upper end (one end) of the reinforcing plate 3 by the elevating device 32 and is further moved down from the upper end toward the lower end (the other end) (moving step). , it is possible to impart flaws to the adsorption layer 4. In addition, the roll brush 30 is rotated around the shaft 38 (see Fig. 5) by the rotational force of the motor 42 mounted on the lifting device 32, and the adsorption layer 4 is also damaged by this rotational force. can be granted.

As a material of the brush 40 capable of imparting good scratches to the adsorption layer 4, polypropylene and nylon can be exemplified. In addition, although the roll brush 30 was exemplified as the flaw imparting member, it is not limited to this, and a comb-like or serrated flaw imparting member is also applicable. Even if it is such a flaw imparting member, it is preferable that it is polypropylene or nylon.

[elevating device 32]

As shown in FIG. 3 , the elevating device 32 includes a gate frame 44 that supports the roll brush 30 so as to be able to move up and down. Both ends of the roll brush 30 are supported by both leg portions 44A and 44B of the door frame 44 so as to be able to move up and down. Leg portions 44A and 44B are inclined at the same angle as the back plate 18 of the packing container 10 and installed.

The position where the packing container 10 is placed on the upper surface of the turntable 24 between the legs 44A and 44B, and the back plate 18 of the packing container 10 is parallel to the legs 44A and 44B. are loaded into Therefore, the roll brush 30 moves up and down along the adsorption layer 4 of the reinforcing plate 3 leaning against the back plate 18.

Further, the lower end portions of the leg portions 44A and 44B are slidably supported by a rail 46 provided on the upper surface of the turntable 24 . The rail 46 is arranged along the loading direction of the reinforcing board 3 with respect to the packing container 10 . Therefore, by adjusting the position of the leg portions 44A and 44B relative to the rail 46, the amount of pushing of the roll brush 30 into the adsorption layer 4 is adjusted.

That is, the pushing amount of the brush 40 of the roll brush 30 to the adsorption layer 4 of the reinforcing plate 3 mounted on the packing container 10 is adjusted. This pressing amount is appropriately set according to the material of the brush 40, the wire diameter of the brush 40, and the wire length of the brush 40, but it is preferably set in the range of 0.1 to 9 mm. Incidentally, the press-in amount refers to the amount of press-in of the brush 40 in a direction orthogonal to the adsorption layer 4 in a state where the tip of the brush 40 is in contact with the adsorption layer 4 .

On the other hand, the timing belt (power transmission member) 48A is disposed along the longitudinal direction of the leg portion 44A, and similarly, the timing belt (power transmission member) 48B is disposed along the longitudinal direction of the leg portion 44B. do. In the embodiment, a plurality (two) of timing belts 48A and 48B are provided with respect to the leg portions 44A and 44B, respectively. A box-shaped brush conveyance unit 50A is fixed to the timing belts 48A and 48A, and a box-shaped brush conveyance unit 50B is similarly fixed to the timing belts 48B and 48B.

A motor 42 is disposed in the brush conveyance unit 50A, and an output shaft 52 of the motor 42 passes through a detachable coupling member 54A such as a rigid coupling, and the shaft of the roll brush 30 ( 38) is detachably connected to one end 38A.

In addition, in the brush conveyance unit 50B, a rotatably supported shaft 56 is provided protruding toward the shaft 38 of the roll brush 30, and this shaft 56 is disassembled such as a rigid coupling. Via the coupling member 54B, it is connected to the other end 38B of the shaft 38 of the roll brush 30 so that attachment or detachment is possible.

Further, between the brush conveyance unit 50A and the brush conveyance unit 50B, a cover 58 constituting a damping member is provided. As shown in FIG. 5, this cover 58 is installed so as to surround the roll brush 30, and opens a part of the brush 40 that opposes the adsorption layer 4 of the reinforcing plate 3 so as to open the roll brush ( A slit 60 is provided along 30).

Further, to the cover 58, a duct 62 connected to an unillustrated suction device is fixed. Therefore, when the suction device is driven, dust from the adsorption layer 4 generated by the scratch action of the roll brush 30 can be discharged to the outside through the cover 58 and the duct 62.

Further, a motor (drive source) 64 for driving the timing belts 48A and 48A is installed in the elevating device 32 . This motor 64 transmits rotational force to the pulley 66 extending the lower ends of the timing belts 48A and 48A. Therefore, when the rotational force of forward and reverse rotation of the motor 64 is transmitted to the timing belts 48A and 48A through the pulley 66, the brush conveyance unit 50A connected to the timing belts 48A and 48A is connected to the leg portion ( 44A), the brush transport unit 50B is moved up and down following this elevation movement with the timing belts 48B and 48B serving as guides. Therefore, the roll brush 30 is moved up and down while holding the horizontal attitude.

In addition, the wrapping device 22 is equipped with an ionizer (static removal member) 68 as shown in FIG. 4 . The ionizer 68 is installed above the door frame 44 and neutralizes the unevenness of electric charge by spraying positive and negative ions toward the elevating device 32 and the packing container 10.

[Method of packing the reinforcing plate 3]

6 is a flowchart showing a method for wrapping the reinforcing board 3 by the wrapping device 22 of the embodiment.

According to the same figure, when the reinforcing board 3 peeled off from the board|substrate 2 is loaded on the carrying-out table 28, the reinforcing board 3 is hold|maintained and conveyed by the robot 26, and the packing container 10 ) (Mounting process: S10).

Next, scratches are applied to the surface of the adsorption layer 4 of the reinforcing plate 3 mounted on the packing container 10 with the roll brush 30 (scratch imparting step: S20). That is, the roll brush 30 is pressed against the upper end of the adsorption layer 4 of the reinforcing plate 3 by the lifting device 32 . Next, the roll brush 30 is moved down by the power of the motor 64 from the upper end of the adsorption layer 4 toward the lower end. As a result, the surface of the adsorption layer 4 is scratched by the brush 40 of the roll brush 30. In addition, when the roll brush 30 moves down, the roll brush 30 may be moved down while being rotated by the motor 42, or in a state where the rotation of the roll brush 30 is stopped, the roll brush ( 30) may be moved downward.

Further, during the operation of the flaw imparting step (S20), the suction device of the damping member is driven to discharge the dust generated by the flaw imparting through the cover 58 and the duct 62 to the outside.

Thereafter, the mounting step (S10) and the scratch imparting step (S20) are repeatedly performed until a predetermined number of reinforcing plates 3 are loaded on the packing container 10 (S30), and the adsorption layer 4 is not scratched. The plurality of reinforcing plates 3 provided are loaded onto the packing container 10 . Then, when a predetermined number of reinforcing plates 3 are loaded on the packing container 10, mounting of the reinforcing plates 3 is finished.

In addition, in order to keep the press-in amount of the brush 40 constant or within an acceptable range, it is preferable to change the position of the gate frame 44 relative to the turntable 24 in correspondence with the loading operation of the reinforcing plate 3. . This positional change of the portal frame 44 may be performed each time one sheet of reinforcing board 3 is loaded, or may be implemented each time a plurality of reinforcing boards 3 are loaded. In addition, a device for changing the position of the door frame 44 is installed in the wrapping device 22, and the position change device is interlocked with the loading operation of the reinforcing plate 3 to automate the position change of the door frame 44. it is desirable

[Example]

<Roll brush (30)>

Diameter: 64mm

Brush Material: Polypropylene

Brush line diameter: 0.2mm to 0.3mm

Brush stroke length: 12mm

Brush press-in amount: 5 mm

Number of revolutions: 2000 revolutions/minute

<Elevating device 32>

Lifting speed: 200 mm/sec

Under the above conditions, the adsorption layer 4 of the reinforcing plate 3 was scratched with the roll brush 30, and 300 reinforcing plates 3 were placed in the packing container 10. Then, when the robot was used when taking out the reinforcing board 3 mounted on the packing container 10, it was possible to take out the reinforcing board 3 one by one from the packing container 10 by the robot.

[Features of the embodiment]

The embodiment is characterized in that groove-like scratches are applied to the surface of the adsorption layer 4 by the roll brush 30 . Since the adsorption area of the adsorption layer 4 is reduced by this, the adsorption force of two adjacent reinforcing plates 3 can be reduced.

Therefore, even when a plurality of reinforcing plates 3 having adsorption layers 4 on their surfaces are loaded on the packing container 10 without a sheet therebetween, the reinforcing plates 3 are removed from the packing container 10 by one It can be easily taken out one by one.

Further, the embodiment is characterized in that the adsorption layer 4 of the reinforcing plate 3 mounted on the packing container 10 is scratched by the roll brush 30. Thereby, the space for providing flaws can be saved. That is, in the case of providing a space for imparting flaws exclusively, it is necessary to provide the dedicated space in the vicinity of the packaging container 10, but in the embodiment, the packaging container 10 is equipped with the reinforcing plate 3 Since scratches are given in the state, a dedicated space becomes unnecessary.

In the embodiment, in the scratch imparting step, the roll brush 30 is pushed to the upper end of the adsorption layer 4 of the reinforcing plate 3, and the roll brush 30 is pushed from the upper end of the reinforcing plate 3 to the lower end. It is characterized by including a moving process for moving.

That is, since a plurality of scratches can be uniformly and densely applied to the surface of the adsorption layer 4 by the roll brush 30, the adsorption force between the two adjacent reinforcing plates 3 can be further reduced. can The roll brush 30 may be moved while rotating, or may be moved in a state where rotation is stopped. It is also possible to apply scratches by reciprocating the roll brush 30 in the vertical direction with respect to the adsorbent layer 4, but in order to suppress dust generation due to the scratch action, it is preferable to apply scratches only by one-sided movement up and down. Moreover, the time for imparting flaws to the reinforcing plate 3 of one sheet can be shortened by this operation.

Embodiment is characterized in that the reinforcing board 3 is a glass plate, thickness is 0.7 mm or less, and it is a glass plate whose length and width dimensions are 1000 mm or more.

That is, it is suitable as a glass reinforcing board 3 for reinforcing the substrate for electronic devices. In addition, a glass plate having a vertical and horizontal dimension of 1000 mm or more is suitable as a reinforcing board 3 for reinforcing a so-called fifth generation (for example, 1100 mm x 1300 mm) or higher electronic device substrate.

The embodiment is characterized in that the adsorption layer 4 of the reinforcing plate 3 contains a silicone resin, a polyimide resin, or an inorganic compound.

According to the wrapping device 22 of the embodiment, scratches can be satisfactorily applied to the surface of the adsorption layer 4 made of silicone resin, polyimide resin, or inorganic compound with the roll brush 30 .

On the other hand, the embodiment is characterized in that a package is formed by stacking a plurality of reinforcing plates 3 on which a flaw is imparted by a roll brush 30 to the packing container 10 .

According to this package, even when a plurality of reinforcing plates 3 having an adsorption layer 4 on the surface are loaded on the packing container 10 without a sheet therebetween, from the packing container 10, the reinforcement plate ( 3) can be easily taken out one by one.

Further, the embodiment is characterized in that the scratch imparting member is a roll brush, and the roll brush includes a shaft and a brush provided on a circumferential surface of the shaft. The brush may be provided over the entire circumferential surface of the shaft, or may be provided over a part of the circumferential surface area.

Fig. 7 is a side view of a roll brush 30 in which a group of brushes 40A are planted in a part of the circumferential surface of the shaft 38. The brush 40A is planted and installed along the longitudinal direction of the shaft 38 .

According to the roll brush 30, as shown in FIG. 8, the brush 40A can be easily applied to the lower end of the adsorption layer 4 of the reinforcing plate 3 stacked vertically on the packing container 10. When the brush 40A is applied to the lower end of the adsorption layer 4, the rotation of the roll brush 30 is stopped immediately before that, and the roll brush 40A is directed to the lower end of the adsorption layer 4. (30) can be moved down.

In addition, brush 40A may be formed in symmetrical positions on the outer circumferential surface of shaft 38 at two locations as shown in FIG. 9, or may be provided at three locations at equal intervals as shown in FIG. 10.

Further, in the embodiment, the lifting device 32 of the wrapping device 22 includes a motor 64 and a plurality (two) of timing belts 48A and 48A that transmit the power of the motor 64 to the roll brush 30. ) is characterized by having.

That is, even if one timing belt 48A of the two timing belts 48A, 48A fails due to breakage or the like, the roll brush 30 can be supported by the other timing belt 48A, so the roll brush 30 fall can be prevented. In addition, the same applies to timing belts 48B and 48B.

In embodiment, although timing belt 48A, 48B was illustrated as a power transmission member, it is not limited to this. For example, other power transmission members such as chains and feed screw devices may be used. In addition, although three or more power transmission members may be arrange|positioned instead of only two, since the size of the wrapping device 22 becomes large when three or more are arrange|positioned, it is preferable that it is two.

Further, the embodiment is characterized in that the shafts at both ends of the roll brush 30 are connected to the elevating device 32 via easily detachable coupling members 54A and 54B.

Thereby, exchange|exchange of the roll brush 30 with respect to the elevating device 32 can be performed easily.

That is, shafts at both ends of the roll brush 30 are usually press-fitted into inner rings of bearings such as ball bearings, and are rotatably supported. When replacing the roll brush 30 in this support mode, the shafts at both ends of the roll brush 30 must be removed from the inner ring of the bearing. This work requires special tools and skills.

In contrast, since the coupling member is an assembly in which a plurality of members are assembled by bolts, the coupling member can be easily disassembled by simply removing the bolts, and the shafts at both ends of the roller brush 30 can be removed. . Since this operation does not require a special tool or skill level, the roll brush 30 can be easily replaced.

Further, the embodiment is characterized in that the roll brush 30 is surrounded by the cover 58, and the cover 58 is connected to the suction device via the duct 62.

That is, since the dust generated from the adsorption layer 4 by the scratch operation of the roll brush 30 can be discharged to the outside through the duct 62 while being surrounded by the cover 58, Dust scattering can be prevented.

Further, the embodiment is characterized in that the wrapping device 22 is provided with the ionizer 68 of FIG. 4 .

That is, the dust generated from the adsorption layer 4 by the scratch operation of the roll brush 30 is reattached to the packing device 22 and the packing container 10 by static electricity. It can be prevented by elimination action.

In addition, in FIGS. 2-5, although the vertical stacking packing container 10 which mounts the reinforcing board 3 leaning obliquely was illustrated, the present invention is applied to the horizontally stacking packing container which mounts the reinforcing board 3 horizontally. may apply.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

This application is based on the Japanese Patent Application 2015-127181 filed on June 25, 2015, the contents of which are incorporated herein by reference.

1: Laminate
2: substrate
2a: the surface of the substrate
2b: back side of substrate
3: reinforcement plate
3a: surface of reinforcing plate
4: adsorption layer
10: packing container
12: pedestal
14: bottom plate
16: plate frame
18: back plate
20: laminate
22: baling device
24: turntable
26: robot
28: export table
30: roll brush
32: lifting device
34: arm
36: suction pad
38 axis
40, 40A: Brush
42: motor
44: door type frame
44A, 44B: Legs
46: rail
48A, 48B: timing belt
50A, 50B: brush transfer unit
52: output shaft
54A, 54B: coupling member
56 axis
58: cover
60: slit
62: duct
64: motor
66: pulley
68: ionizer

Claims (13)

A loading step of loading a substrate having an adsorption layer formed thereon on a packaging container;
A flaw imparting step of imparting flaws to the surface of the adsorption layer of the substrate mounted on the packing container.
including,
A method for wrapping a substrate with an adsorbent layer, wherein a plurality of the substrates are loaded on the packing container by repeatedly performing the mounting step and the scratch imparting step. The method of claim 1, wherein the flaw imparting step includes a moving step of pressing the flaw imparting member to the surface of the adsorption layer of the substrate and moving the flaw imparting member from one end side toward the other end side of the substrate. , A method for wrapping a substrate provided with an adsorption layer. The method of wrapping a substrate with an adsorption layer according to claim 2, wherein the scratch imparting member is a roll brush. The method for wrapping a substrate with an adsorption layer according to any one of claims 1 to 3, wherein the substrate is a glass plate having a thickness of 0.7 mm or less and a vertical and horizontal dimension of 1000 mm or more. The method for wrapping a substrate with an adsorption layer according to any one of claims 1 to 3, wherein the adsorption layer contains a silicone resin, a polyimide resin, or an inorganic compound. a mounting member for mounting a substrate having an adsorption layer formed thereon on a packaging container;
A flaw imparting member for imparting flaws to the surface of the adsorption layer of the substrate mounted on the packing container.
A wrapping device for a substrate with an adsorption layer comprising: 7. Packing of a substrate with an adsorption layer according to claim 6, further comprising a shifting member that presses the flaw imparting member against the surface of the adsorption layer of the substrate and moves it from one end side to the other end side of the substrate. Device. 8. The wrapping device for a substrate with an adsorption layer according to claim 7, wherein the scratch imparting member is a roll brush. 9. The wrapping of a substrate with an adsorption layer according to claim 8, wherein the roll brush includes a shaft and a brush provided on a circumferential surface of the shaft, and the brush is provided in a part area of the circumferential surface of the shaft. Device. The substrate with an adsorption layer according to any one of claims 7 to 9, wherein the moving member includes a driving source and a plurality of power transmission members that transmit power of the driving source to the flaw imparting member. baling device. 10. The wrapping device for a substrate with an adsorption layer according to any one of claims 7 to 9, wherein both ends of the scratch imparting member are connected to the moving member via a detachable coupling member. The wrapping device for a substrate with an adsorbing layer according to any one of claims 6 to 9, wherein the scratch imparting member is surrounded by a damping member. The wrapping device for a substrate with an adsorption layer according to any one of claims 6 to 9, comprising a static electricity eliminator.

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