KR102535995B1 - Apparatus for picking up a semiconductor device and test handler including the same - Google Patents

Abstract

A semiconductor device pick-up device and a test handler including the same are disclosed. The semiconductor element pick-up device includes a vacuum picker for vacuum adsorbing a semiconductor element, and a vertical driving unit coupled to the vacuum picker and moving the vacuum picker in a vertical direction. The vertical driving unit includes a cylinder body having an inner space, a lower cap coupled to a lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and extending downward from the piston through the lower cap, A piston rod coupled to the vacuum picker is included, and air is supplied between the lower cap and the piston rod at a predetermined pressure to prevent foreign substances from entering the inner space of the cylinder body.

Description

Semiconductor device pickup device and test handler including the same {Apparatus for picking up a semiconductor device and test handler including the same}

Embodiments of the present invention relate to a semiconductor device pick-up device and a test handler including the same. More particularly, it relates to a semiconductor device pick-up device used to transfer semiconductor devices in an electrical test process for semiconductor devices and a test handler including the same.

Semiconductor devices manufactured through a semiconductor manufacturing process may be determined to be good or defective through an electrical test process. The test process may be performed using a test handler handling the semiconductor devices and a tester providing inspection signals to inspect the semiconductor devices.

The test process may be performed after accommodating the semiconductor devices in insert assemblies mounted on a test tray and electrically connecting the semiconductor devices and the tester. The test handler for performing the test process includes a chamber module for performing the test process, a loader module accommodating the semiconductor devices in the test tray and providing the test tray to the chamber module, and the test process is performed and an unloader module that carries out the test tray from the chamber module after the test tray is finished and classifies the semiconductor devices according to test results of the semiconductor devices.

The loader module and the unloader module may include a semiconductor device pick-up device for picking up the semiconductor device. 1 is a schematic cross-sectional view for explaining a general semiconductor element pick-up device, and FIG. 2 is a schematic cross-sectional view for explaining the operation of the semiconductor element pick-up device shown in FIG.

Referring to FIGS. 1 and 2 , a conventional general semiconductor element pick-up device 100 includes a vacuum nozzle 102 for vacuum adsorbing a semiconductor element and a vertical driving unit for moving the vacuum nozzle 102 in a vertical direction ( 110) may be included. The vertical drive unit 110 may be configured in the form of a pneumatic cylinder, a cylinder tube 112, a piston 114 disposed in the cylinder tube 112, and a piston rod extending in a vertical direction from the piston 114 ( 116) may be included.

The vacuum nozzle 102 may have a rod shape extending in a vertical direction through the rod cover 118 of the vertical drive unit 110 . A first head 120 is mounted in the lower part of the piston rod 116 in the cylinder tube 112 and a second head 122 is mounted in the upper part of the vacuum nozzle 102, and the first and second heads 122 are mounted therein. An elastic member 130, for example, a coil spring, may be disposed between the two heads 120 and 122 to elastically support the vacuum nozzle 102 in a vertical direction. In addition, a vacuum chamber 140 connected to a vacuum supply unit (not shown) such as a vacuum pump may be provided in the rod cover 118, and the vacuum chamber 140 is an upper portion of the rod cover 118. and sealing members 124 and 126 respectively mounted on the bottom. The vacuum nozzle 102 may extend in a vertical direction through the sealing members 124 and 126 and may include a vacuum hole 104 communicating with the vacuum chamber 140 . That is, the vacuum hole 104 of the vacuum nozzle 102 may be connected to the vacuum supply unit through the vacuum chamber 140 .

When compressed air is supplied to the upper space of the piston 114, the piston 114 may descend, thereby causing the elastic member 130 and the vacuum nozzle 102 to descend. When the vacuum nozzle 102 is in close contact with the semiconductor element, an impact applied to the semiconductor element may be absorbed by the elastic member 130 .

When the conventional general semiconductor element pick-up device 100 having the above structure is used for a long time, contaminants may flow into the vacuum chamber 140 through the vacuum hole 104 of the vacuum nozzle 102, , As a result, the vertical movement of the vacuum nozzle 140 may not be smoothly performed. That is, when the piston 114 descends or rises, a vertical driving force can be transmitted to the vacuum nozzle 102 by the elastic member 130, but the vertical movement of the vacuum nozzle 102 is not smooth. In this case, it may be difficult to control the height of the vacuum nozzle 102.

An object of the present invention is to provide a semiconductor element pick-up device capable of smoothly moving a vacuum nozzle in a vertical direction and a test handler including the same.

A semiconductor element pick-up device according to an aspect of the present invention for achieving the above object includes a vacuum picker for vacuum adsorbing a semiconductor element, and a vertical driving unit coupled with the vacuum picker and moving the vacuum picker in a vertical direction. The vertical driving unit may include a cylinder body having an inner space, a lower cap coupled to a lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and passing through the lower cap from the piston. It includes a piston rod extending downward and coupled to the vacuum picker, and air may be supplied between the lower cap and the piston rod at a predetermined pressure to prevent foreign substances from entering the inner space of the cylinder body. .

According to some embodiments of the present invention, a through hole into which the piston rod is inserted may be provided in the lower cap, and a bush member for guiding the piston rod in a vertical direction may be disposed in the through hole.

According to some embodiments of the present invention, the air may be supplied to the gap between the lower cap and the piston rod under the bush member.

According to some embodiments of the present invention, the inner space of the cylinder body includes a lower inner space positioned below the piston and an upper inner space positioned above the piston, and the cylinder body includes the lower inner space. A first air passage for supplying air to and a second air passage for supplying air to the upper inner space may be provided.

According to some embodiments of the present invention, the lower cap and the cylinder body include a third air passage connected to the first air passage and the second air passage to supply the air between the lower cap and the piston rod. A fourth air passage connected to the passage may be provided.

According to some embodiments of the present invention, a through hole into which the piston rod is inserted is provided in the lower cap, a circular ring-shaped groove is provided on an inner surface of the through hole, and the third air passage and the third air passage are provided. 4 air passages may be connected to the grooves.

According to some embodiments of the present invention, the semiconductor element pick-up device is connected to the first air passage and the second air passage and selectively supplies the air to the first air passage or the second air passage. It may further include a valve unit for supplying the air and a valve unit connected to the valve unit.

According to some embodiments of the present invention, the semiconductor element pick-up device may further include a pressure regulator for maintaining a constant pressure of the air.

According to some embodiments of the present disclosure, the semiconductor element pick-up device may further include an upper extension extending upward from the piston, and an upper insertion hole into which the upper extension is inserted may be provided at an upper portion of the cylinder body. .

According to some embodiments of the present invention, a first vacuum passage connected to an upper insertion hole is provided at an upper portion of the cylinder body, and a second vacuum passage for connecting the first vacuum passage and the vacuum picker is provided in the upper portion of the cylinder body. It may be formed through an extension, the piston, and the piston rod.

According to some embodiments of the present invention, the vacuum picker includes a picker body coupled to the piston rod and a vacuum nozzle mounted to the picker body, and the piston rod is connected to the vacuum nozzle through the picker body. can

According to some embodiments of the present invention, the vacuum picker may further include a suction pad mounted on a lower end of the vacuum nozzle and made of a flexible material.

According to some embodiments of the present invention, the semiconductor element pick-up device further includes a valve unit connected to the first vacuum passage and a vacuum providing unit connected to the valve unit and providing vacuum to pick up the semiconductor element. can include

According to some embodiments of the present invention, the piston includes a lower piston connected to the piston rod and an upper piston disposed on top of the lower piston, and an elastic member is disposed between the lower piston and the upper piston. can

According to some embodiments of the present invention, the piston may further include a lower extension extending downward from the upper piston, and a lower insertion hole into which the lower extension is inserted may be provided in the lower piston.

According to some embodiments of the present invention, the piston may further include an upper extension extending upward from the upper piston, and an upper insertion hole into which the upper extension is inserted may be provided at an upper portion of the cylinder body.

According to some embodiments of the present invention, a first vacuum passage connected to an upper insertion hole is provided at an upper portion of the cylinder body, and a second vacuum passage for connecting the first vacuum passage and the vacuum picker is provided at the upper portion of the cylinder body. It may be formed through the extension part, the upper piston, the lower extension part, the lower piston, and the piston rod.

According to some embodiments of the present invention, sealing members may be disposed between the upper extension portion and the upper insertion hole and between the lower extension portion and the lower insertion hole, respectively.

According to another aspect of the present invention for achieving the above object, a chamber module for electrically testing semiconductor devices accommodated in a test tray, transferring the semiconductor devices from a customer tray to the test tray, and placing the test tray in the chamber A loader module provided as a module, and an unloader module for carrying the test tray out of the chamber module and transferring the semiconductor devices from the test tray to at least one customer tray after the test of the semiconductor devices is completed In the test handler, the loader module includes vacuum pickers for transferring the semiconductor devices, vertical drivers for moving the vacuum pickers in a vertical direction, and horizontal drivers for moving the vacuum pickers in a horizontal direction, , Each of the vertical driving units includes a cylinder body having an inner space, a lower cap coupled to the lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and downward through the lower cap from the piston. A piston rod extending and coupled to a corresponding vacuum picker may be included, and air may be supplied between the lower cap and the piston rod at a predetermined pressure to prevent foreign substances from entering the inner space of the cylinder body.

According to another aspect of the present invention for achieving the above object, a chamber module for electrically testing semiconductor devices accommodated in a test tray, transferring the semiconductor devices from a customer tray to the test tray, and placing the test tray in the chamber A loader module provided as a module, and an unloader module for carrying the test tray out of the chamber module and transferring the semiconductor devices from the test tray to at least one customer tray after the test of the semiconductor devices is completed In the test handler, the unloader module includes vacuum pickers for transferring the semiconductor devices, vertical drivers for moving the vacuum pickers in a vertical direction, and horizontal drivers for moving the vacuum pickers in a horizontal direction. And, each of the vertical driving units includes a cylinder body having an inner space, a lower cap coupled to the lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and a downward movement from the piston through the lower cap. It extends to and includes a piston rod coupled to a corresponding vacuum picker, and air may be supplied between the lower cap and the piston rod at a predetermined pressure to prevent foreign substances from entering the inner space of the cylinder body. .

According to the embodiments of the present invention as described above, the air can be continuously supplied at a constant pressure between the lower cap and the piston rod, and the inflow of foreign substances between the lower cap and the piston rod can be sufficiently prevented. can As a result, the inflow of the foreign matter into the inner space of the cylinder body can be blocked, and thus the vertical movement of the vacuum picker can be more smoothly performed. In addition, the performance of the semiconductor element pick-up device can be greatly improved and the life of the semiconductor element pick-up device can be greatly extended.

1 is a schematic cross-sectional view for explaining a general semiconductor element pick-up device.
FIG. 2 is a schematic cross-sectional view for explaining the operation of the semiconductor element pick-up device shown in FIG. 1 .
3 is a schematic plan view for explaining a test handler according to an embodiment of the present invention.
4 and 5 are schematic cross-sectional views for explaining the semiconductor element pickup device shown in FIG. 3 .
6 is a schematic enlarged cross-sectional view for explaining the lower cap and the piston rod shown in FIGS. 4 and 5;
FIG. 7 is a block diagram illustrating an air supply unit and a vacuum supply unit connected to the vertical driving unit shown in FIGS. 4 and 5 .
FIG. 8 is a schematic enlarged cross-sectional view illustrating another example of the third air passage and the fourth air passage shown in FIG. 6 .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather to fully convey the scope of the present invention to those skilled in the art.

In the embodiments of the present invention, when one element is described as being disposed on or connected to another element, the element may be directly disposed on or connected to the other element, and other elements may be interposed therebetween. It could be. Alternatively, when an element is described as being directly disposed on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. will not

Technical terms used in the embodiments of the present invention are only used for the purpose of describing specific embodiments, and are not intended to limit the present invention. In addition, unless otherwise limited, all terms including technical and scientific terms have the same meaning as can be understood by those skilled in the art having ordinary knowledge in the technical field of the present invention. The above terms, such as those defined in conventional dictionaries, shall be construed to have a meaning consistent with their meaning in the context of the relevant art and description of the present invention, unless expressly defined, ideally or excessively outwardly intuition. will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of idealized embodiments of the present invention. Accordingly, variations from the shapes of the illustrations, eg, variations in manufacturing methods and/or tolerances, are fully foreseeable. Accordingly, embodiments of the present invention are not to be described as being limited to specific shapes of regions illustrated as diagrams, but to include variations in shapes, and elements described in the drawings are purely schematic and their shapes is not intended to describe the exact shape of the elements, nor is it intended to limit the scope of the present invention.

3 is a schematic plan view for explaining a test handler according to an embodiment of the present invention, and FIGS. 4 and 5 are schematic cross-sectional views for explaining the semiconductor element pick-up device shown in FIG. 3 .

Referring to FIG. 3 , a semiconductor device pick-up device 200 and a test handler 10 including the device 200 according to an embodiment of the present invention may be used for electrical testing of semiconductor devices 2 . For example, the test handler 10 includes a chamber module 40 for electrically testing semiconductor devices accommodated in the test tray 20, and the semiconductor from the customer tray 30 to the test tray 20. A loader module 60 that transfers the devices 2 and provides the test tray 20 to the chamber module 40, and the test tray 20 after the test of the semiconductor devices 2 is completed It may include an unloader module 70 that transports the semiconductor devices 2 from the chamber module 40 and transfers the semiconductor devices 2 from the test tray 20 to at least one customer tray 32 .

The loader module 60 and the unloader module 70 may each include semiconductor element transfer units 80 for transferring the semiconductor elements 2, and the semiconductor element transfer units 80 It may include a plurality of semiconductor element pick-up devices 200 and a horizontal driving unit 82 for moving the semiconductor element pick-up devices 200 in a horizontal direction.

Although not shown in detail, the test tray 20 may include insert assemblies (not shown) for accommodating the semiconductor devices 2 . The loader module 60 may transfer the semiconductor devices 2 from the customer tray 30 in which the semiconductor devices 2 are accommodated to the test tray 20, and then the test tray 20 may be transferred to the chamber module 40. The unloader module 70 may transfer the semiconductor devices 10 stored in the test tray 20 to the customer trays 32 after the test process is completed, and the test tray 20 may be transferred to the customer trays 32 . It can be transferred to the loader module 60.

The chamber module 40 may include a test chamber 42 providing a space for electrical testing of the semiconductor devices 2 , and the test chamber 42 may include a test chamber 42 of the semiconductor devices 2 . It can be connected to the tester 50 that provides test signals for electrical testing. An inner chamber 44 for adjusting the semiconductor devices 2 accommodated in the test tray 20 to a predetermined test temperature may be disposed at one side of the test chamber 42, and the test chamber 42 A desok chamber 46 for restoring the semiconductor elements 2 to room temperature after the test of the semiconductor elements 2 is completed may be disposed on the other side of the chamber 46 .

Referring to FIGS. 4 and 5 , the semiconductor element pick-up device 200 is coupled with a vacuum picker 210 for vacuum adsorbing the semiconductor element and the vacuum picker 210. It may include a vertical driving unit 220 for moving in the vertical direction.

For example, a pneumatic cylinder may be used as the vertical drive unit 220 , and the vacuum picker 210 may be coupled to the piston rod 290 of the pneumatic cylinder 220 . For example, the vertical drive unit 220 includes a cylinder body 230 disposed in a vertical direction and having an inner space 232, a lower cap 250 coupled to a lower portion of the cylinder body 230, and the It may include a piston 270 disposed in the inner space of the cylinder body 230, and a piston rod 290 extending downward from the piston 270 through the lower cap 250, and the vacuum picker 210 may be coupled to the lower end of the piston rod 290.

6 is a schematic enlarged cross-sectional view for explaining the lower cap and the piston rod shown in FIGS. 4 and 5;

Referring to FIG. 6, according to one embodiment of the present invention, between the lower cap 250 and the piston rod 290 to prevent foreign substances from entering the inner space 232 of the cylinder body 230 Air may be supplied at a predetermined pressure for this purpose. In particular, the air may be continuously supplied to the inside of the gap 252 between the lower cap 250 and the piston rod 290 so that the predetermined pressure is constantly maintained, and the air is supplied to the gap ( 252) may be discharged downward. As a result, the foreign matter may be prevented from being introduced into the gap 252 by the flow of air.

For example, a through hole 254 into which the piston rod 290 is inserted may be provided in the lower cap 250, and the through hole 254 guides the piston rod 290 in a vertical direction. A bush member 256 for doing so may be disposed. The air may be supplied to the gap 252 between the lower cap 250 and the piston rod 290 under the bush member 256 .

Referring back to FIGS. 4 and 5 , the inner space 232 of the cylinder body 230 includes a lower inner space 234 positioned below the piston 270 and an upper part of the piston 270 It may include an upper inner space 236, and the cylinder body 230 includes a first air passage 240 for supplying air to the lower inner space 234 and air to the upper inner space 236. A second air passage 242 for providing may be provided.

The lower cap 250 and the cylinder body 230 have third air passages connected to the first air passage 240 to supply the air between the lower cap 250 and the piston rod 290. 258 and a fourth air passage 260 connected to the second air passage 242 may be provided. For example, as shown in FIG. 4 , when the air is supplied to the lower internal space 234 to raise the vacuum picker 210, the third air passage connected to the first air passage 240 The air may be supplied between the lower cap 250 and the piston rod 290 through 258 . In addition, while the vacuum picker 210 maintains an elevated state, the air flows through the lower cap 250 and the piston rod 290 through the first air passage 240 and the third air passage 258. ) can be supplied between

Referring to FIG. 5 , when the air is supplied to the upper inner space 236 to lower the vacuum picker 210 through the fourth air passage 260 connected to the second air passage 242 The air may be supplied between the lower cap 250 and the piston rod 290 . Also, while the vacuum picker 210 maintains a lowered state, the air flows through the lower cap 250 and the piston rod 290 through the second air passage 242 and the fourth air passage 260. ) can be supplied between

In particular, as shown in FIG. 6 , a circular ring-shaped groove 262 may be provided on the inner side of the through hole 254 of the lower cap 250, and the third air passage 258 ) and the fourth air passage 260 may be connected to the groove 262 . As a result, the air supplied through the third air passage 258 or the fourth air passage 260 is uniformly distributed between the lower cap 250 and the piston rod 290 through the groove 262. In this way, foreign substances can be sufficiently prevented from being introduced between the lower cap 250 and the piston rod 290. In addition, since the air can be always supplied through the third air passage 258 or the fourth air passage 260 as described above, the foreign matter is introduced between the lower cap 250 and the piston rod 290. This can be sufficiently prevented.

Referring back to FIGS. 4 and 5 , the semiconductor element pick-up device 200 may include an upper extension part 278 extending upward from the piston 270, and an upper part of the cylinder body 230. An upper insertion hole 244 into which the upper extension part 278 is inserted may be provided. In addition, a first vacuum passage 246 connected to the upper insertion hole 244 may be provided at an upper portion of the cylinder body 230, and between the first vacuum passage 246 and the vacuum picker 210. A second vacuum passage 248 for connecting may be formed through the upper extension part 278 , the piston 270 , and the piston rod 290 .

According to one embodiment of the present invention, the piston 270 may include a lower piston 272 connected to the piston rod 290 and an upper piston 274 disposed above the lower piston 272. An elastic member 276 may be disposed between the lower piston 272 and the upper piston 274. As an example, a coil spring may be used as the elastic member 276 as shown.

In addition, the piston 270 may include a lower extension 280 extending downward from the upper piston 274, in which case the upper extension 278 extends upward from the upper piston 274. can be extended Also, the lower piston 272 may include a lower insertion hole 282 into which the lower extension part 280 is inserted, and the second vacuum passage 248 may include the upper extension part 278 and the upper extension part 280 . The piston 274, the lower extension portion 280, the lower piston 272, and the piston rod 290 may be formed to pass through. To this end, the upper extension part 278 and the lower extension part 280 may have a tube shape, and the upper piston 274 and the piston rod 290 form the second vacuum passage 248. Through-holes for each may be provided.

Meanwhile, sealing members 284 and 286 are provided between the upper extension part 278 and the upper insertion hole 244 and between the lower extension part 280 and the lower insertion hole 282 to prevent vacuum leakage. ) can be placed.

FIG. 7 is a block diagram illustrating an air supply unit and a vacuum supply unit connected to the vertical driving unit shown in FIGS. 4 and 5 .

Referring to FIG. 7 , the semiconductor element pickup device 200 is connected to the first air passage 240 and the second air passage 242 and supplies the air to the first air passage 240 or the second air passage 240 . It may include a first valve unit 300 for selectively supplying air to the flow path 242 and an air supply unit 302 connected to the first valve unit 300 and supplying the air. In addition, a pressure regulator 304 may be disposed between the first valve unit 300 and the air supply unit 302 to maintain a constant pressure of the air. For example, the first valve unit 300 may include a first valve connected to the first air passage 240 and a second valve connected to the second air passage 242, and the lower cap Relief valves may be used as the first and second valves to keep the pressure in the gap 252 between 250 and the piston rod 290 constant. The air supplier 302 may include, for example, a compressed air tank and an air pump connected to the compressed air tank.

In particular, the first valve unit 300 may always connect one of the first air passage 240 and the second air passage 242 to the air supply unit 302 . Therefore, a constant air pressure can always be maintained between the lower cap 250 and the piston rod 290, and accordingly, the inflow of the foreign matter between the lower cap 250 and the piston rod 290 is sufficient. can be prevented

Meanwhile, as shown in FIG. 4 , when the air is supplied to the lower internal space 234 through the first air passage 240, the lower piston 272 may be raised, thereby causing the elastic member to rise. (276) That is, the coil spring can be compressed. In this case, a sealing member 288 may be disposed between the lower piston 272 and the inner surface of the cylinder body 230 .

Conversely, as shown in FIG. 5 , when the air is supplied to the upper inner space 236 through the second air passage 242 , the lower piston 272 may descend. At this time, although not shown in detail, the upper inner space 236 and the middle inner space 238 in which the elastic member 276 is disposed may communicate with each other, and the air passes through the upper inner space 236. and may be supplied to the intermediate inner space 238. For example, the air may be supplied from the upper inner space 236 to the middle inner space 238 through a gap between the upper piston 274 and the inner surface of the cylinder body 230 . In particular, for the lower piston 272 to descend, the lower extension part 280 may have a smaller outer diameter than the upper extension part 278 as shown.

Referring back to FIG. 7 , the semiconductor element pick-up device 200 is connected to the second valve unit 310 connected to the first vacuum passage 246 and the second valve unit 310, and the semiconductor element ( 2) may include a vacuum providing unit 312 for providing a vacuum to pick up. For example, the second valve unit 310 may include an on/off valve, and the vacuum supply unit 312 may include a vacuum pump or a vacuum ejector. In addition, a vacuum regulator 314 for maintaining a constant vacuum pressure may be disposed between the second valve unit 310 and the vacuum supply unit 312 .

4 and 5 again, the vacuum picker 210 includes a picker body 212 coupled to the lower portion of the piston rod 290 and a vacuum nozzle 214 mounted on the picker body 212. can do. In particular, the vacuum picker 210 may be detachably mounted on the lower part of the piston rod 290 . For example, the lower end of the piston rod 290 may pass through the picker body 212 and be connected to the vacuum nozzle 214 . At this time, the picker body 212 may have a through hole into which the lower end of the piston rod 290 is inserted, and between the through hole and the lower end of the piston rod 290, a sealing member for preventing vacuum leakage ( 216) may be placed.

In addition, a suction pad 218 made of a material having flexibility, for example, rubber or silicone resin, may be mounted at the lower end of the vacuum nozzle 214 . Although not shown, when the vacuum picker 210 is lowered by the vertical drive unit 220, the lower surface of the suction pad 218 may come into close contact with the upper surface of the semiconductor device 2, and The semiconductor device 2 may be vacuum-sucked to the suction pad 218 by vacuum pressure applied to the inside of the vacuum nozzle 214 through the first and second vacuum channels 246 and 248 .

FIG. 8 is a schematic enlarged cross-sectional view illustrating another example of the third air passage and the fourth air passage shown in FIG. 6 .

Referring to FIG. 8 , the lower cap 250 may include a plurality of third air passages 320 and a plurality of fourth air passages 322 . For example, the lower cap 250 includes a pair of third air passages 320 connected to the first air passage 240 and a pair of fourth air passages 320 connected to the second air passage 242 . Air channels 322 may be provided, and the third and fourth air channels 320 and 322 may be disposed at intervals of 90°. Therefore, the air can be more uniformly supplied between the lower cap 250 and the piston rod 290 .

According to the embodiments of the present invention as described above, the air can be continuously supplied at a constant pressure between the lower cap 250 and the piston rod 290, and the lower cap 250 and the piston Inflow of foreign matter between the rods 290 may be sufficiently prevented. As a result, the inflow of the foreign substances into the inner space 232 of the cylinder body 230 can be blocked, and accordingly, the vertical movement of the vacuum picker 210 can be performed more smoothly. In addition, the performance of the semiconductor element pick-up device 200 can be greatly improved and the lifetime of the semiconductor element pick-up device 200 can be greatly extended.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the claims below. You will understand that there is

2: semiconductor device 10: test handler
20: test tray 30, 32: customer tray
40: chamber module 42: test chamber
44: Sok chamber 46: D Sok chamber
50: tester 60: loader module
70: unloader module 200: semiconductor element pick-up device
210: vacuum picker 212: picker body
214: vacuum nozzle 218: suction pad
220: vertical drive unit 230: cylinder body
232: inner space 234: lower inner space
236: upper inner space 240: first air passage
242: second air passage 244: upper insertion hole
246: first vacuum passage 248: second vacuum passage
250: lower cap 252: gap
254: through hole 256: bush member
258: third air passage 260: fourth air passage
262: groove 270: piston
272: lower piston 274: upper piston
276: elastic member 278: upper extension
280: lower extension 282: lower insertion hole
290: piston rod 300: first valve unit
302: air supply unit 304: pressure regulator
310: second valve unit 312: vacuum supply unit
314: vacuum regulator

Claims (20)

a vacuum picker for vacuum adsorbing the semiconductor element; and
It is coupled to the vacuum picker and includes a vertical driving unit for moving the vacuum picker in a vertical direction,
The vertical driving unit includes a cylinder body having an inner space, a lower cap coupled to a lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and extending downward from the piston through the lower cap, Includes a piston rod coupled to the vacuum picker,
Air is supplied at a predetermined pressure between the lower cap and the piston rod to prevent foreign substances from entering the inner space of the cylinder body, and the supplied air is discharged to the outside of the lower cap. Characterized in that Semiconductor element pick-up device. The semiconductor element pick-up device of claim 1 , wherein a through hole into which the piston rod is inserted is provided in the lower cap, and a bush member for guiding the piston rod in a vertical direction is disposed in the through hole. . 3. The semiconductor element pick-up device according to claim 2, wherein the air is supplied from below the bush member to a gap between the lower cap and the piston rod. The internal space of the cylinder body of claim 1, wherein the internal space of the cylinder body includes a lower internal space located under the piston and an upper internal space located above the piston,
The semiconductor element pick-up device, characterized in that the cylinder body is provided with a first air passage for supplying air to the lower internal space and a second air passage for supplying air to the upper internal space. The method of claim 4, wherein the lower cap and the cylinder body have a third air passage connected to the first air passage and a third air passage connected to the second air passage to supply the air between the lower cap and the piston rod. A semiconductor element pick-up device characterized in that a fourth air flow path is provided. The method of claim 5, wherein the lower cap has a through hole into which the piston rod is inserted, a circular ring-shaped groove is provided on an inner surface of the through hole, and the third air passage and the fourth air passage are A semiconductor element pick-up device, characterized in that connected to the groove. The method of claim 5, further comprising: a valve unit connected to the first air passage and the second air passage and selectively supplying the air to the first air passage or the second air passage;
The semiconductor element pick-up device further comprises an air supply unit connected to the valve unit and configured to supply the air. 8. The semiconductor element pick-up device according to claim 7, further comprising a pressure regulator for maintaining a constant pressure of the air. The method of claim 1, further comprising an upper extension extending upward from the piston,
The semiconductor element pick-up device characterized in that the upper portion of the cylinder body is provided with an upper insertion hole into which the upper extension portion is inserted. 10. The method of claim 9, wherein a first vacuum passage connected to the upper insertion hole is provided on the top of the cylinder body,
The semiconductor element pick-up device according to claim 1, wherein a second vacuum passage for connecting between the first vacuum passage and the vacuum picker is formed through the upper extension portion, the piston, and the piston rod. 11. The method of claim 10, wherein the vacuum picker includes a picker body coupled to the piston rod and a vacuum nozzle mounted to the picker body,
The semiconductor element pick-up device, characterized in that the piston rod is connected to the vacuum nozzle through the picker body. 12. The device of claim 11, wherein the vacuum picker further comprises a suction pad mounted on a lower end of the vacuum nozzle and made of a flexible material. 11. The method of claim 10, wherein the valve unit connected to the first vacuum flow path;
The semiconductor element pick-up device further comprises a vacuum providing unit connected to the valve unit and providing a vacuum to pick up the semiconductor element. The method of claim 1, wherein the piston includes a lower piston connected to the piston rod and an upper piston disposed on top of the lower piston,
An elastic member is disposed between the lower piston and the upper piston. 15. The method of claim 14, wherein the piston further comprises a lower extension extending downward from the upper piston,
The semiconductor element pick-up device, characterized in that the lower piston is provided with a lower insertion hole into which the lower extension is inserted. 16. The method of claim 15, wherein the piston further comprises an upper extension extending upward from the upper piston,
The semiconductor element pick-up device characterized in that the upper portion of the cylinder body is provided with an upper insertion hole into which the upper extension portion is inserted. The method of claim 16, wherein the upper portion of the cylinder body is provided with a first vacuum flow path connected to the upper insertion hole,
A semiconductor characterized in that a second vacuum passage for connecting between the first vacuum passage and the vacuum picker is formed through the upper extension, the upper piston, the lower extension, the lower piston, and the piston rod. element pick-up device. 18. The semiconductor element pick-up device according to claim 17, further comprising sealing members disposed between the upper extension portion and the upper insertion hole and between the lower extension portion and the lower insertion hole, respectively. A chamber module for electrically testing the semiconductor devices accommodated in the test tray, a loader module for transferring the semiconductor devices from the customer tray to the test tray and providing the test tray to the chamber module, and for the semiconductor devices In the test handler including an unloader module that carries out the test tray from the chamber module after the test is completed and transfers the semiconductor devices from the test tray to at least one customer tray,
The loader module includes vacuum pickers for transferring the semiconductor devices, vertical driving units for moving the vacuum pickers in a vertical direction, and horizontal driving units for moving the vacuum pickers in a horizontal direction,
Each of the vertical driving parts includes a cylinder body having an inner space, a lower cap coupled to a lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and extending downward from the piston through the lower cap. and a piston rod coupled to a corresponding vacuum picker,
Air is supplied at a predetermined pressure between the lower cap and the piston rod to prevent foreign substances from entering the inner space of the cylinder body, and the supplied air is discharged to the outside of the lower cap. Characterized in that test handler. A chamber module for electrically testing the semiconductor devices accommodated in the test tray, a loader module for transferring the semiconductor devices from the customer tray to the test tray and providing the test tray to the chamber module, and for the semiconductor devices In the test handler including an unloader module that carries out the test tray from the chamber module after the test is completed and transfers the semiconductor devices from the test tray to at least one customer tray,
The unloader module includes vacuum pickers for transferring the semiconductor devices, vertical drivers for moving the vacuum pickers in a vertical direction, and horizontal drivers for moving the vacuum pickers in a horizontal direction,
Each of the vertical driving parts includes a cylinder body having an inner space, a lower cap coupled to a lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and extending downward from the piston through the lower cap. and a piston rod coupled to a corresponding vacuum picker,
Air is supplied at a predetermined pressure between the lower cap and the piston rod to prevent foreign substances from entering the inner space of the cylinder body, and the supplied air is discharged to the outside of the lower cap. Characterized in that test handler.

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