TW202230586A - Apparatus for picking up a semiconductor device and test handler including the same - Google Patents

Abstract

An apparatus for picking up a semiconductor device and a test handler including the apparatus are disclosed. The semiconductor device pickup apparatus includes a vacuum picker for vacuum adsorption of semiconductor devices and a vertical drive unit for moving the vacuum picker in a vertical direction. The vertical drive unit includes a cylinder body having an inner space, a lower cover coupled to the lower portion of the cylinder body, a piston disposed in the inner space of the cylinder body, and a piston rod extending downward from the piston through the lower cover and coupled to the vacuum picker. In addition, air is provided between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder body.

Description

Equipment for picking up semiconductor devices and test handlers incorporating the same

The present invention relates to an apparatus for picking up semiconductor devices and a test handler including the apparatus. More specifically, the present invention relates to a semiconductor device pickup apparatus for transferring semiconductor devices during electrical testing of semiconductor devices, and a test handler including the semiconductor device pickup apparatus.

The semiconductor device manufactured through the semiconductor manufacturing process can be determined as a good product or a defective product through the electrical testing process. The test process may be performed using a test handler that processes the semiconductor device and a tester that provides test signals to electrically test the semiconductor device.

The test process may be performed after the semiconductor device is accommodated on the interposer element mounted on the test tray and the semiconductor device is electrically connected to the tester. The test handler may include a chamber module for performing a test process, a loader module for accommodating semiconductor devices in a test tray and loading the test tray into the chamber module, and removing the test tray from the chamber mold after the test process An unloader module that unloads in a group and classifies semiconductor devices according to their test results.

The loader module and the unloader module may include semiconductor device pick-up equipment for picking up semiconductor devices. FIG. 1 is an exemplary cross-sectional view illustrating a conventional semiconductor device pickup apparatus, and FIG. 2 is an exemplary cross-sectional view illustrating an operation of the semiconductor device pickup apparatus as shown in FIG. 1 .

Referring to FIGS. 1 and 2 , a conventional semiconductor device pickup apparatus 100 may include a vacuum nozzle 102 for vacuum sucking semiconductor devices and a vertical driving unit 110 for vertically moving the vacuum nozzle 102 . The vertical drive unit 110 can be constructed in the form of a pneumatic cylinder, and may include a cylinder barrel 112 , a piston 114 disposed in the cylinder barrel 112 , and a piston rod 116 extending downward from the piston 114 .

The vacuum nozzle 102 may have a rod shape that extends downward past the rod cover 118 of the vertical drive unit 110 . The first head 120 may be installed at the lower portion of the piston rod 116 , and the second head 122 may be installed at the upper portion of the vacuum nozzle 102 . The first head 120 and the second head 122 may be provided in the cylinder 112 , and an elastic member 130 (eg, a coil spring) for elastically supporting the vacuum suction nozzle 102 in the vertical direction may be provided in the first head 120 and the second head 122 .

In addition, a vacuum chamber 140 connected to a vacuum supply unit (not shown, such as a vacuum pump) may be formed in the rod cover 118 , and the vacuum chamber 140 may be defined by sealing members 124 and 126 mounted on the upper and lower parts of the rod cover 118 , respectively . The vacuum nozzle 102 may extend in a vertical direction through the sealing members 124 and 126 and the vacuum chamber 140 , and may have a vacuum hole 104 connected to the vacuum chamber 140 . That is, the vacuum hole 104 of the vacuum suction nozzle 102 may be connected to the vacuum supply unit through the vacuum chamber 140 .

When compressed air is supplied to the upper space of the piston 114, the piston 114 and the vacuum nozzle 102 can be moved downward. Especially, when the vacuum suction nozzle 102 is in close contact with the semiconductor device, the impact force acting on the semiconductor device can be absorbed by the elastic member 130 .

However, impurities may be introduced into the vacuum chamber 140 through the vacuum hole 104 of the vacuum suction nozzle 102, and the vertical movement of the vacuum suction nozzle 102 may not be smooth due to the impurities. Specifically, even when the piston 114 moves in the vertical direction, the vacuum suction nozzle 102 cannot move due to impurities and the elastic member 130 . In particular, even when the vacuum nozzle 102 moves, the moving distance of the vacuum nozzle 102 may be different from the moving distance of the piston 114 . That is, the vertical driving force provided by the compressed air is not sufficiently transmitted to the vacuum nozzle, and thus it may be difficult to control the height of the vacuum nozzle 102 .

Embodiments of the present invention provide a semiconductor device pickup apparatus capable of smoothly moving a vacuum nozzle in a vertical direction, and a test handler including the semiconductor device pickup apparatus.

According to an aspect of the present invention, an apparatus for picking up a semiconductor device may include a vacuum pickup for vacuum sucking the semiconductor device, and a vertical driving unit for moving the vacuum pickup in a vertical direction. Specifically, the vertical driving unit may include a cylinder having an inner space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and extending downward from the piston through the lower cover and coupled It is applied to the piston rod of the vacuum pickup, and can provide air between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder.

According to some embodiments of the present invention, the lower cover may have a through hole into which the piston rod is inserted, and a sleeve member for guiding the piston rod in a vertical direction may be disposed in the through hole.

According to some embodiments of the present invention, air may be provided to the gap between the lower cover and the piston rod below the sleeve member.

According to some embodiments of the present invention, the inner space of the cylinder may include: a lower inner space below the piston and an upper inner space above the piston, and a first air passage for supplying air into the lower inner space and a A second air passage may be formed through the cylinder in supplying air to the upper inner space.

According to some embodiments of the present invention, the third and fourth air passages for supplying air between the lower cover and the piston rod may be connected to the first and second air passages through the lower cover and the cylinder, respectively.

According to some embodiments of the present invention, the lower cover may have a through hole into which the piston rod is inserted, a circular annular groove may be formed in an inner surface portion of the through hole, and the third and fourth air passages may be connected to the groove.

According to some embodiments of the present invention, the apparatus may further include: a valve unit connected to the first air passage and the second air passage and configured to selectively supply air to the first air passage or the second air passage, and a connection The valve unit is configured as an air supply unit for supplying air.

According to some embodiments of the present invention, the apparatus may further comprise a pressure regulator for constantly maintaining the pressure of the air at a predetermined pressure.

According to some embodiments of the present invention, the apparatus may further comprise an upper extension extending upwardly from the piston. In this case, an upper insertion hole into which the upper extension is inserted may be formed in the upper portion of the cylinder block.

According to some embodiments of the present invention, the first vacuum passage may be connected to the upper insertion hole through the upper portion of the cylinder, and the second vacuum passage for connecting the first vacuum passage with the vacuum pickup may pass through the upper extension, the piston and piston rod.

According to some embodiments of the present invention, the vacuum pickup may include a pickup body coupled to the piston rod and a vacuum nozzle mounted on the pickup body. In this case, the piston rod can be connected to the vacuum nozzle through the pickup body.

According to some embodiments of the present invention, the vacuum pickup may further include a suction pad mounted on the lower portion of the vacuum nozzle and made of a flexible material.

According to some embodiments of the present invention, the apparatus may further include a valve unit connected to the first vacuum channel, and a vacuum supply unit connected to the valve unit and supplying a vacuum to pick up the semiconductor device.

According to some embodiments of the present invention, the piston may include a lower piston connected to the piston rod, an upper piston disposed above the lower piston, and an elastic member disposed between the lower piston and the upper piston.

According to some embodiments of the present invention, the piston may further include a lower extension extending downwardly from the upper piston. In this case, a lower insertion hole into which the lower extension is inserted may be formed in the lower piston.

According to some embodiments of the present invention, the piston may further include an upper extension extending upwardly from the upper piston. In this case, an upper insertion hole into which the upper extension is inserted may be formed at an upper portion of the cylinder block.

According to some embodiments of the present invention, the first vacuum channel may pass through the upper portion of the cylinder to be connected to the upper insertion hole, and the second vacuum channel for connecting the first vacuum channel with the vacuum pickup may pass through the upper extension, The upper piston, the lower extension, the lower piston and the piston rod are formed.

According to some embodiments of the present invention, the apparatus may further include sealing members disposed between the upper extension part and the upper insertion hole, and between the lower extension part and the lower insertion hole, respectively.

According to another aspect of the present invention, a test handler may include: a chamber module for conducting electrical tests on semiconductor devices contained in test trays, for transferring semiconductor devices from customer trays to test trays, and loading the test trays A loader module in the chamber module, and an unloader module for unloading the test tray from the chamber module and transferring the semiconductor device from the test tray to at least one customer tray after testing the semiconductor device. At this time, the loader module may include a vacuum pickup for transferring semiconductor devices, a vertical driving unit for moving the vacuum pickups in a vertical direction, respectively, and a horizontal drive for moving the vacuum pickups in a horizontal direction Drive unit. Each vertical drive unit may include a cylinder having an inner space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and extending downward from the piston through the lower cover and coupled to The piston rod of the vacuum pickup, and can provide air between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder.

According to another aspect of the present invention, a test handler may include: a chamber module for conducting electrical tests on semiconductor devices contained in test trays, for transferring semiconductor devices from customer trays to test trays, and loading the test trays A loader module in the chamber module, and an unloader module for unloading the test tray from the chamber module and transferring the semiconductor device from the test tray to at least one customer tray after testing the semiconductor device. At this time, the unloader module may include a vacuum pickup for transferring the semiconductor devices, a vertical driving unit for moving the vacuum pickups in a vertical direction, respectively, and a vacuum pickup for moving the vacuum pickups in a horizontal direction. Horizontal drive unit. Each vertical drive unit may include a cylinder having an inner space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and extending downward from the piston through the lower cover and coupled to The piston rod of the vacuum pickup, and can provide air between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder.

According to the embodiments of the present invention as described above, air can be continuously supplied between the lower cover and the piston rod at a predetermined pressure, and thus impurities can be sufficiently prevented from being introduced between the lower cover and the piston rod. As a result, the inflow of impurities into the inner space of the cylinder can be prevented, and thus the vertical movement of the vacuum pickup can be performed more smoothly. Furthermore, the performance of the semiconductor device pickup apparatus can be greatly improved, and the lifespan of the semiconductor device pickup apparatus can be greatly extended.

The above summary of the present invention is not intended to describe each illustrated implementation or every example of the present invention. The detailed description and the following claims illustrate these embodiments in more detail.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the present invention is not limited to the embodiments described below and can be implemented in various other forms. The following embodiments are intended to fully accomplish the present invention, but are not intended to fully convey the scope of the present invention to those skilled in the art.

In this specification, when a component is referred to as being on or connected to another component or layer, it can be directly on or connected to the other component or layer, or it can also be There are intervening components or layers. Unlike this, it will be understood that when an element is referred to as being directly on or directly connected to another element or layer, it will mean that there are no intervening elements present. Additionally, although terms such as first, second, and third are used to describe various regions and layers in various embodiments of the present invention, these regions and layers are not limited by these terms.

The terms used below are only used to describe specific embodiments, but do not limit the present invention. Also, unless otherwise defined herein, all terms (including technical or scientific terms) may have the same meaning as commonly understood by one of ordinary skill in the art.

Embodiments of the invention will be described with reference to illustrative drawings of idealized embodiments. Accordingly, variations and/or tolerances in manufacturing methods can be expected from the various forms of drawings. Therefore, embodiments of the present invention are not described as limited to the specific forms or regions in the drawings and include deviations from those forms. These regions may be purely exemplary, and their various forms may not describe or depict the precise shape or structure in any given region, and are not intended to limit the scope of the invention.

3 is an exemplary plan view illustrating a test handler according to an embodiment of the present invention, and FIGS. 4 and 5 are schematic cross-sectional views illustrating a semiconductor device pickup apparatus as shown in FIG. 1 .

3 , a semiconductor device pick-up apparatus 200 according to an embodiment of the present invention and a test handler 10 including the semiconductor device pick-up apparatus 200 may be used to perform electrical tests on the semiconductor device 2 . For example, the test handler 10 may include: a chamber module 40 for conducting electrical tests on the semiconductor devices 2 contained in the test tray 20, for transferring the semiconductor devices 2 from the customer tray 30 to the test tray 20, and for transferring the test trays 20 Loader module 60 loaded into chamber module 40, and for unloading test tray 20 from chamber module 40 and transferring semiconductor device 2 from test tray 20 to at least one customer after testing semiconductor devices 2 Unloader module 70 of tray 32 .

Each of the loader module 60 and the unloader module 70 may include a semiconductor device transfer part 80 for transferring the semiconductor device 2 . The semiconductor device transfer section 80 may include a plurality of semiconductor device pickup apparatuses 200 , and a horizontal driving part 82 for moving the semiconductor device pickup apparatuses 200 in the horizontal direction.

Although not shown in detail, the test tray 20 may include insertion elements (not shown) for accommodating the semiconductor devices 2 . The loader module 60 can transfer the semiconductor devices 2 from the customer tray 30 in which the semiconductor devices 2 are accommodated to the test tray 20 , which can then transfer the test tray 20 to the chamber module 40 . After the testing process is completed, the unloader module 70 may transfer the semiconductor devices 2 contained in the test tray 20 to the customer tray 32 , which may then transfer the test tray 20 to the loader module 60 .

The chamber module 40 may include a test chamber 42 that provides a space for electrical testing of the semiconductor device 2 , and the test chamber 42 may be connected to a tester 50 that provides a test signal for electrical testing of the semiconductor device 2 . The soaking chamber 44 for adjusting the temperature of the semiconductor device 2 accommodated in the test tray 20 to a predetermined test temperature can be provided on one side of the test chamber 42, and can be used for making the semiconductor device 2 test after the semiconductor device 2 is tested. A desoaking chamber 46 where the temperature of the device 2 is returned to room temperature is provided on the other side of the test chamber 42 .

4 and 5 , the semiconductor device pickup apparatus 200 may include a vacuum pickup 210 for vacuum sucking the semiconductor device 2, and a vacuum pickup 210 coupled to the vacuum pickup 210 and configured to move the vacuum pickup 210 in a vertical direction Vertical drive unit 220 .

For example, a pneumatic cylinder may be used as the vertical drive unit 220 , and the vacuum pickup 210 may be connected to the piston rod 290 of the pneumatic cylinder 220 . For example, the vertical driving unit 220 may include: a cylinder 230 disposed in a vertical direction and having an inner space 232 , a lower cover 250 coupled to a lower portion of the cylinder 230 , a piston 270 disposed in the inner space 232 of the cylinder 230 , and a piston rod 290 extending downward through the lower cover 250 , and a vacuum pickup 210 may be coupled to a lower portion of the piston rod 290 .

FIG. 6 is an exemplary enlarged cross-sectional view illustrating the lower cover and piston rod as shown in FIGS. 4 and 5 .

6 , according to an embodiment of the present invention, air is provided between the lower cover 250 and the piston rod 290 at a predetermined pressure to prevent impurities from being introduced into the inner space 232 of the cylinder block 230 . Specifically, air may be continuously supplied into the gap 252 between the lower cover 250 and the piston rod 290 to constantly maintain a predetermined pressure. Additionally, air may be vented downward from gap 252 . As a result, impurities can be prevented from being introduced into the gap 252 by the flow of air.

For example, the lower cover 250 may have a through hole 254 into which the piston rod 290 is inserted, and a sleeve member 256 that guides the piston rod 290 in a vertical direction may be disposed in the through hole 254 . Air is supplied into the gap 252 between the lower cover 250 and the piston rod 290 below the sleeve member 256 .

Referring again to FIGS. 4 and 5 , the interior space 232 of the cylinder 230 may include a lower interior space 234 located below the piston 270 and an upper interior space 236 located above the piston 270 . The cylinder block 230 may have a first air passage 240 for supplying air into the lower inner space 234 and a second air passage 242 for supplying air into the upper inner space 236 . That is, the first air passage 240 may be formed through the cylinder block 230 so as to be connected to the lower inner space 234, and the second air passage 242 may be formed through the cylinder block 230 so as to be connected to the upper inner space 236, as shown in FIG. 4 and FIG. shown in 5.

In addition, the third air passage 258 and the fourth air passage 260 for supplying air to the gap 252 between the lower cover 250 and the piston rod 290 may be connected to the first air passage through the lower cover 250 and the cylinder 230, respectively 240 and the second air passage 242. For example, when air is supplied to the lower interior space 234 through the first air channel 240 to lift the vacuum pickup 210 (as shown in FIG. 4 ), the air may be passed through the third air channel 258 connected to the first air channel 240 Supply to the gap 252 between the lower cover 250 and the piston rod 290 . In addition, while the vacuum pickup 210 is maintained in the lifted state, air may be supplied into the gap 252 between the lower cover 250 and the piston rod 290 through the first air passage 240 and the third air passage 258 .

5 , when the vacuum pickup 210 is lowered by supplying air to the upper inner space 236 through the second air channel 242, the air may be supplied to the lower cover 250 and the lower cover 250 through the fourth air channel 260 connected to the second air channel 242. in the gap 252 between the piston rods 290 . Also, while the vacuum pickup 210 is kept in the lowered state, air may be supplied into the gap 252 between the lower cover 250 and the piston rod 290 through the second air passage 242 and the fourth air passage 260 .

Specifically, as shown in FIG. 6 , a circular annular groove 262 may be formed in the inner surface portion of the through hole 254 , and the third air passage 258 and the fourth air passage 260 may be connected to the groove 262 . As a result, the air supplied through the third air passage 258 or the fourth air passage 260 may be uniformly supplied through the groove 262 between the lower cover 250 and the piston rod 290 . Therefore, it is possible to sufficiently prevent impurities from being introduced between the lower cover 250 and the piston rod 290 . Furthermore, as described above, since the air can always be supplied through the third air passage 258 or the fourth air passage 260 , it is possible to sufficiently prevent impurities from being introduced between the lower cover 250 and the piston rod 290 .

Referring again to FIGS. 4 and 5 , the semiconductor device pickup apparatus 200 may include an upper extension 278 extending upward from the piston 270 , and an upper insertion hole 244 into which the upper extension 278 is inserted may be formed at an upper portion of the cylinder 230 . In addition, the first vacuum passage 246 may be connected to the upper insertion hole 244 through the upper portion of the cylinder 230 , and the second vacuum passage 248 for connecting the first vacuum passage 246 with the vacuum pickup 210 may pass through the upper extension 278 , piston 270 and piston rod 290.

According to one embodiment of the present invention, the piston 270 may include a lower piston 272 connected to the piston rod 290 and an upper piston 274 disposed above the lower piston 272 , and an elastic member 276 may be disposed between the lower piston 272 and the upper piston 274 . As one example, a coil spring may be used as the elastic member 276 .

Additionally, the piston 270 may include a lower extension 280 extending downwardly from the upper piston 274 . In this case, the upper extension 278 may extend upwardly from the upper piston 274 . Also, a lower insertion hole 282 into which the lower extension 280 is inserted may be formed in the lower piston 272, and the second vacuum passage 248 may pass through the upper extension 278, the upper piston 274, the lower extension 280, the lower piston 272, and the piston rod 290 formed. In this case, the upper extension part 278 and the lower extension part 280 may have a tube shape, and the upper piston 274 and the piston rod 290 may each have a through hole for forming the second vacuum passage 248 .

Meanwhile, in order to prevent vacuum leakage, sealing members 284 and 286 may be disposed between the upper extension portion 278 and the upper insertion hole 244 and between the lower extension portion 280 and the lower insertion hole 282, respectively.

FIG. 7 is a block diagram illustrating the air supply unit and the vacuum supply unit connected to the vertical drive unit as shown in FIGS. 4 and 5 .

7 , the semiconductor device pickup apparatus 200 may include a first valve unit 300 connected to the first air passage 240 and the second air passage 242 and configured to selectively supply air to the first air the passage 240 or the second air passage 242; and the air supply unit 302, which is connected to the first valve unit 300 and is configured to supply air. In addition, a pressure regulator 304 for constantly maintaining the pressure of the air at a predetermined pressure may be provided between the first valve unit 300 and the air supply unit 302 . The first valve unit 300 may include a first valve (not shown) connected to the first air passage 240 and a second valve (not shown) connected to the second air passage 242 . For example, safety valves may be used as the first and second valves to maintain constant air pressure in the gap 252 between the lower cover 250 and the piston rod 290 . The air supply unit 302 may include, for example, a compressed air tank and an air pump connected to the compressed air tank.

Specifically, the first valve unit 300 may always connect any one of the first air passage 240 and the second air passage 242 to the air supply unit 302 . Therefore, a constant air pressure can be always maintained between the lower cover 250 and the piston rod 290 , and thus it is possible to sufficiently prevent impurities from being introduced between the lower cover 250 and the piston rod 290 .

Meanwhile, as shown in FIG. 4, when air is supplied to the lower inner space 234 through the first air passage 240, the lower piston 272 may be lifted, and the elastic member 276 (ie, the coil spring) may be compressed. In this case, the sealing member 288 may be disposed between the lower piston 272 and the inner surface of the cylinder 230 .

5, when air is supplied to the upper inner space 236 through the second air passage 242, the lower piston 272 may descend. At this time, although not shown in detail, the upper inner space 236 and the middle inner space 238 in which the elastic member 276 is disposed may communicate with each other, and air may be supplied to the middle inner space 238 via the upper inner space 236 . For example, air may be supplied from upper interior space 236 to intermediate interior space 238 through a gap between upper piston 274 and the inner surface of cylinder 230 . Specifically, as shown in FIG. 5 , the lower extension 280 may have a smaller outer diameter than the upper extension 278 so that the piston 272 may be lowered.

Referring again to FIG. 7 , the semiconductor device pickup apparatus 200 may include a second valve unit 310 connected to the first vacuum channel 246 , and a vacuum supply unit 312 connected to the second valve unit 310 and supplying a vacuum to pick up the semiconductor device 2 . For example, the second valve unit 310 may include an on/off valve, and the vacuum supply unit 312 may include a vacuum pump or a vacuum ejector. Also, a vacuum regulator 314 for maintaining a constant vacuum pressure may be provided between the second valve unit 310 and the vacuum supply unit 312 .

Referring again to FIGS. 4 and 5 , the vacuum pickup 210 may include a pickup body 212 coupled to a lower portion of the piston rod 290 and a vacuum suction nozzle 214 mounted on the pickup body 212 . Specifically, the vacuum pickup 210 may be detachably mounted to the lower portion of the piston rod 290 . For example, the lower portion of the piston rod 290 may be connected to the vacuum nozzle 214 through the pickup body 212 . At this time, the pickup body 212 may have a through hole into which the lower portion of the piston rod 290 is inserted, and a sealing member 216 for preventing vacuum leakage may be provided between the through hole of the pickup body 212 and the lower portion of the piston rod 290 .

Additionally, a suction pad 218 made of a flexible material such as rubber or silicone may be mounted on the lower portion of the vacuum suction nozzle 214 . Although not shown, when the vacuum pickup 210 is lowered by the vertical driving unit 220, the lower surface of the suction pad 218 may be in close contact with the upper surface of the semiconductor device 2, and the suction pad 218 may be used to pass through the first and second vacuum passages 246 and 246 and The vacuum pressure 248 applied to the inside of the vacuum suction nozzle 214 vacuum suctions the semiconductor device 2 to the suction pad 218 .

FIG. 8 is an exemplary enlarged cross-sectional view illustrating another example of the third and fourth air passages as shown in FIG. 6 .

Referring to FIG. 8 , the lower cover 250 may have a plurality of third air passages 320 and a plurality of fourth air passages 322 . For example, the lower cover 250 may have a pair of third air passages 320 connected to the first air passages 240 and a pair of fourth air passages 322 connected to the second air passages 242 . The third air passage 320 and the fourth air passage 322 can be arranged at intervals of 90°, as shown in FIG. 8 . Therefore, air can be more uniformly supplied between the lower cover 250 and the piston rod 290 .

According to the embodiments of the present invention as described above, air can be continuously supplied between the lower cover 250 and the piston rod 290 at a predetermined pressure, and thus impurities can be sufficiently prevented from being introduced between the lower cover 250 and the piston rod 290 . As a result, the inflow of impurities into the inner space 232 of the cylinder block 230 can be prevented, and thus the vertical movement of the vacuum pickup 210 can be performed more smoothly. Furthermore, the performance of the semiconductor device pickup apparatus 200 can be greatly improved, and the lifespan of the semiconductor device pickup apparatus 200 can be greatly extended.

Although the exemplary embodiments of the present invention have been described with reference to specific embodiments, they are not limited thereto. Accordingly, those skilled in the art will readily understand that various modifications and changes can be made therein without departing from the spirit and scope of the appended claims.

2: Semiconductor device 10: Test handler 20: Test tray 30: Customer Tray 32: Customer Tray 40: Chamber Module 42: Laboratory 44: Immersion Chamber 46: Go to the soaking room 50: Tester 60: Loader Module 70: Uninstaller mod 80: Semiconductor device transfer department 82: Horizontal drive components 100: Semiconductor device pick-up equipment 102: Vacuum nozzle 104: Vacuum hole 110: Vertical drive unit 112: cylinder barrel 114: Piston 116: Piston rod 118: Rod Cover 120: first head 122: Second head 124: Sealing member 126: Sealing member 130: elastic member 140: Vacuum Chamber 200: Semiconductor device pick-up equipment 210: Vacuum Picker 212: Pickup body 214: Vacuum nozzle 216: Sealing member 218: suction pad 220: Vertical drive unit 230: Cylinder block 232: Interior Space 234: Lower Interior Space 236: Upper Interior Space 238: Intermediate Interior Space 240: First air passage 242: Second air channel 244: Upper Insertion Hole 246: First vacuum channel 248: Second vacuum channel 250: lower cover 252: Gap 254: Through hole 256: Casing member 258: Third air channel 260: Fourth air channel 262: Groove 270: Piston 272: Lower Piston 274: Upper Piston 276: Elastic member 278: Upper Extension 280: Lower Extension 282: Lower insertion hole 284: Sealing member 286: Sealing member 288: Sealing member 290: Piston Rod 300: First valve unit 302: Air supply unit 304: Pressure regulator 310: Second valve unit 312: Vacuum supply unit 314: Vacuum Regulator 320: Third air channel 322: Fourth Air Channel

Exemplary embodiments can be understood in greater detail based on the following description taken in conjunction with the accompanying drawings, wherein:

1 is an exemplary cross-sectional view illustrating a conventional semiconductor device pickup apparatus;

2 is an exemplary cross-sectional view illustrating the operation of the conventional semiconductor device pickup apparatus shown in FIG. 1;

3 is an exemplary plan view illustrating a trial handler according to one embodiment of the present invention;

4 and 5 are schematic cross-sectional views illustrating the semiconductor device pickup apparatus shown in FIG. 1;

6 is an exemplary enlarged cross-sectional view illustrating the lower cover and piston rod as shown in FIGS. 4 and 5;

7 is a block diagram illustrating the air supply unit and the vacuum supply unit connected to the vertical drive unit as shown in FIGS. 4 and 5; and

FIG. 8 is an exemplary enlarged cross-sectional view illustrating another example of the third and fourth air passages as shown in FIG. 6 .

While the various embodiments are capable of various modifications and alternative forms, the details thereof have been disclosed by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the claimed invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the scope of the claims.

200: Semiconductor device pick-up equipment

210: Vacuum Picker

212: Pickup body

214: Vacuum nozzle

216: Sealing member

218: suction pad

220: Vertical drive unit

230: Cylinder block

232: Interior Space

234: Lower Interior Space

236: Upper Interior Space

238: Intermediate Interior Space

240: First air passage

242: Second air channel

244: Upper Insertion Hole

246: First vacuum channel

248: Second vacuum channel

250: lower cover

256: Casing member

258: Third air channel

260: Fourth air channel

262: Groove

270: Piston

272: Lower Piston

274: Upper Piston

276: Elastic member

278: Upper Extension

280: Lower Extension

282: Lower insertion hole

284: Sealing member

286: Sealing member

288: Sealing member

290: Piston Rod

Claims (20)

A device for picking up semiconductor devices, characterized in that the device comprises: Vacuum pickups for vacuum adsorption of semiconductor devices; and a vertical drive unit for moving the vacuum pickup in the vertical direction, Wherein the vertical driving unit includes a cylinder having an inner space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and extending downward from the piston through the lower cover and a piston rod coupled to the vacuum pickup, and Air is supplied between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder. The apparatus of claim 1, wherein the lower cover has a through hole into which the piston rod is inserted, and a sleeve member for guiding the piston rod in the vertical direction is provided in the through hole. The apparatus of claim 2, wherein the air is supplied to the gap between the lower cover and the piston rod below the sleeve member. The apparatus of claim 1, wherein the interior space of the cylinder includes a lower interior space below the piston and an upper interior space above the piston, and A first air passage for supplying air into the lower inner space and a second air passage for supplying air into the upper inner space are formed through the cylinder. The apparatus of claim 4, wherein a third air passage and a fourth air passage for supplying air between the lower cover and the piston rod are connected to the first air passage through the lower cover and the cylinder, respectively and the second air passage. The apparatus of claim 5, wherein the lower cover has a through hole into which the piston rod is inserted, A circular annular groove is formed in the inner surface portion of the through hole, and The third air passage and the fourth air passage are connected to the groove. The device as described in claim 5, further comprising: a valve unit connected to the first air passage and the second air passage and configured to selectively supply air to the first air passage or the second air passage; and An air supply unit connected to the valve unit and configured to supply air. The apparatus of claim 7, further comprising a pressure regulator for constantly maintaining the pressure of the air at the predetermined pressure. The apparatus of claim 1, further comprising an upper extension extending upwardly from the piston, An upper insertion hole into which the upper extension is inserted is formed in the upper portion of the cylinder. The apparatus of claim 9, wherein the first vacuum passage is connected to the upper insertion hole through an upper portion of the cylinder, and A second vacuum channel for connecting the first vacuum channel with the vacuum pickup is formed through the upper extension, the piston and the piston rod. The apparatus of claim 10, wherein the vacuum pickup includes a pickup body coupled to the piston rod and a vacuum nozzle mounted on the pickup body, and The piston rod is connected to the vacuum nozzle through the pickup body. The apparatus of claim 11, wherein the vacuum pickup further includes a suction pad mounted on the lower portion of the vacuum nozzle and made of a flexible material. The equipment as described in claim 10 also includes: a valve unit connected to the first vacuum passage; and A vacuum supply unit is connected to the valve unit and provides vacuum to pick up the semiconductor device. The apparatus of claim 1, wherein the piston comprises: a lower piston connected to the piston rod; an upper piston disposed above the lower piston; and an elastic member disposed between the lower piston and the upper piston. The apparatus of claim 14, wherein the piston further includes a lower extension extending downwardly from the upper piston, and A lower insertion hole into which the lower extension is inserted is formed in the lower piston. The apparatus of claim 15, wherein the piston further includes an upper extension extending upwardly from the upper piston, and An upper insertion hole into which the upper extension is inserted is formed in the upper portion of the cylinder. The apparatus of claim 16, wherein the first vacuum passage is connected to the upper insertion hole through an upper portion of the cylinder, and A second vacuum channel for connecting the first vacuum channel with the vacuum pickup is formed through the upper extension, the upper piston, the lower extension, the lower piston and the piston rod. The apparatus of claim 17, further comprising sealing members disposed between the upper extension portion and the upper insertion hole and between the lower extension portion and the lower insertion hole, respectively. A test handler comprising: a chamber module for conducting electrical tests on semiconductor devices contained in test trays; a loader module for transferring the semiconductor device from a customer tray to the test tray and loading the test tray into the chamber module; and an unloader module for unloading the test tray from the chamber module after testing the semiconductor device and transferring the semiconductor device from the test tray to at least one customer tray, Wherein the loader module includes a vacuum pickup for transferring the semiconductor device, a vertical drive unit for moving the vacuum pickup in a vertical direction, respectively, and a vacuum pickup for moving the vacuum pickup in a horizontal direction horizontal drive unit, Each of the vertical drive units includes a cylinder having an inner space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and extending downward from the piston through the lower cover and is coupled to the piston rod of the vacuum pickup, and Air is supplied between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder. A test handler comprising: a chamber module for conducting electrical tests on semiconductor devices contained in test trays; a loader module for transferring the semiconductor device from a customer tray to the test tray and loading the test tray into the chamber module; and an unloader module for unloading the test tray from the chamber module after testing the semiconductor device and transferring the semiconductor device from the test tray to at least one customer tray, The unloader module includes a vacuum pickup for transferring the semiconductor device, a vertical drive unit for moving the vacuum pickup in a vertical direction, respectively, and a vacuum pickup for moving the vacuum pickup in a horizontal direction. horizontal drive unit, Each of the vertical drive units includes a cylinder having an inner space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and extending downward from the piston through the lower cover and is coupled to the piston rod of the vacuum pickup, and Air is supplied between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the inner space of the cylinder.

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