KR102530711B1 - 점착 시트 - Google Patents

점착 시트 Download PDF

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Publication number
KR102530711B1
KR102530711B1 KR1020187001419A KR20187001419A KR102530711B1 KR 102530711 B1 KR102530711 B1 KR 102530711B1 KR 1020187001419 A KR1020187001419 A KR 1020187001419A KR 20187001419 A KR20187001419 A KR 20187001419A KR 102530711 B1 KR102530711 B1 KR 102530711B1
Authority
KR
South Korea
Prior art keywords
pressure
sensitive adhesive
adhesive sheet
adhesive layer
mass
Prior art date
Application number
KR1020187001419A
Other languages
English (en)
Korean (ko)
Other versions
KR20180048569A (ko
Inventor
켄 다카노
가즈히로 기쿠치
다카시 스기노
야스노리 가라사와
에미 후치
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20180048569A publication Critical patent/KR20180048569A/ko
Application granted granted Critical
Publication of KR102530711B1 publication Critical patent/KR102530711B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020187001419A 2015-09-01 2016-09-01 점착 시트 KR102530711B1 (ko)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JPJP-P-2015-172399 2015-09-01
JPJP-P-2015-172394 2015-09-01
JPJP-P-2015-172396 2015-09-01
JP2015172397 2015-09-01
JP2015172400 2015-09-01
JP2015172396 2015-09-01
JP2015172394 2015-09-01
JP2015172398 2015-09-01
JPJP-P-2015-172397 2015-09-01
JPJP-P-2015-172400 2015-09-01
JP2015172399 2015-09-01
JPJP-P-2015-172398 2015-09-01
JP2015172395 2015-09-01
JPJP-P-2015-172395 2015-09-01
PCT/JP2016/075608 WO2017038921A1 (ja) 2015-09-01 2016-09-01 粘着シート

Publications (2)

Publication Number Publication Date
KR20180048569A KR20180048569A (ko) 2018-05-10
KR102530711B1 true KR102530711B1 (ko) 2023-05-09

Family

ID=58187688

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187001419A KR102530711B1 (ko) 2015-09-01 2016-09-01 점착 시트

Country Status (5)

Country Link
JP (3) JP6787900B2 (zh)
KR (1) KR102530711B1 (zh)
CN (1) CN107922798B (zh)
TW (3) TW201723121A (zh)
WO (3) WO2017038921A1 (zh)

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KR102234844B1 (ko) * 2016-03-29 2021-03-31 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 장치 제조용 점착성 필름 및 반도체 장치의 제조 방법
JPWO2019098078A1 (ja) * 2017-11-17 2020-10-01 リンテック株式会社 樹脂シート
EP3780072A4 (en) * 2018-03-30 2021-12-29 Mitsui Chemicals Tohcello, Inc. Electronic device manufacturing method
CN110561877A (zh) * 2018-06-05 2019-12-13 通用矽酮股份有限公司 一种硅胶弹性体及其制造方法
CN112352027A (zh) * 2018-06-13 2021-02-09 琳得科株式会社 粘合片
CN112703240B (zh) 2018-08-10 2022-08-05 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7200961B2 (ja) * 2020-03-06 2023-01-10 味の素株式会社 半導体装置の製造方法、及び、樹脂シート

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JP2013040333A (ja) * 2011-08-16 2013-02-28 General Electric Co <Ge> エポキシ封止及び積層用接着剤及び製造方法

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JP3849978B2 (ja) * 2002-06-10 2006-11-22 日東電工株式会社 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
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JP5646021B2 (ja) * 2012-12-18 2014-12-24 積水化学工業株式会社 半導体パッケージ
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JP2015117293A (ja) * 2013-12-18 2015-06-25 日東電工株式会社 熱拡散材および電子部品
JP2015130420A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 導電性フィルム状接着剤、半導体装置の製造方法、及び、半導体装置
JP2015129226A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置
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JP2012059934A (ja) * 2010-09-09 2012-03-22 Nitto Denko Corp 樹脂封止用粘着テープ及び樹脂封止型半導体装置の製造方法
JP2013040333A (ja) * 2011-08-16 2013-02-28 General Electric Co <Ge> エポキシ封止及び積層用接着剤及び製造方法

Also Published As

Publication number Publication date
JP6759218B2 (ja) 2020-09-23
KR20180048569A (ko) 2018-05-10
CN107922798B (zh) 2022-01-04
WO2017038920A1 (ja) 2017-03-09
TW201723121A (zh) 2017-07-01
JPWO2017038920A1 (ja) 2018-06-21
TW201723123A (zh) 2017-07-01
TWI709634B (zh) 2020-11-11
TW201723122A (zh) 2017-07-01
WO2017038921A1 (ja) 2017-03-09
JPWO2017038921A1 (ja) 2018-06-21
CN107922798A (zh) 2018-04-17
JPWO2017038922A1 (ja) 2018-06-14
JP6719476B2 (ja) 2020-07-08
JP6787900B2 (ja) 2020-11-18
WO2017038922A1 (ja) 2017-03-09

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