KR102519797B1 - Deposition apparatus and deposition - Google Patents

Abstract

A deposition apparatus according to an embodiment of the present invention includes a deposition unit for performing a deposition process on a substrate, a transport unit including a carrier for transporting the substrate and a transport member for transporting the carrier, and disposed adjacent to the deposition unit and adjacent to the carrier. and a maintenance unit performing maintenance, wherein the transfer member includes a maintenance transfer member disposed between the deposition unit and the maintenance unit to transfer the carrier from the deposition unit to the maintenance unit.

Description

Deposition apparatus and deposition method {DEPOSITION APPARATUS AND DEPOSITION}

The present invention relates to a deposition apparatus and a deposition method.

Recently, an organic light emitting diode display (OLED) having low power consumption, high luminance, and high response speed is drawing attention as a next-generation flat panel display device.

In general, an organic light emitting display device includes a self-emitting organic light emitting device that emits light by itself, and can be made lightweight and thin because it does not require a separate light source.

As a deposition apparatus for forming an organic thin film on such an organic light emitting device, a vacuum thermal evaporation apparatus is mainly used.

The vacuum thermal evaporation apparatus consists of a plurality of vacuum chambers in which deposition is performed in a high vacuum state. Inside the vacuum chamber of the deposition apparatus, the organic material is deposited on the substrate while the substrate is fixed to a carrier and moved from the upper side of the crucible.

The carrier was taken out of the deposition apparatus, and maintenance was performed, such as a worker manually replacing the anti-stick member or removing particles from the electrostatic chuck.

However, as the size of the substrate has increased due to the recent technological development, the carrier for transporting the substrate has also become larger and heavier.

Accordingly, taking out a carrier with a heavy load from the deposition apparatus to perform maintenance of the large-sized carrier in the deposition process line causes safety problems for workers and inefficiency of work.

An object to be solved by the present invention is to provide a deposition apparatus and a deposition method for performing maintenance of an enlarged carrier within a process by arranging a maintenance unit inside the deposition apparatus.

The tasks of the present invention are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the following description.

A deposition apparatus according to an embodiment of the present invention for achieving the above object is a deposition unit for performing a deposition process on a substrate, a transport unit including a carrier for transporting the substrate and a transport member for transporting the carrier, the deposition unit and a maintenance unit disposed adjacent to and performing maintenance of the carrier, wherein the transfer member is disposed between the deposition unit and the maintenance unit to transfer the carrier from the deposition unit to the maintenance unit. can include

The deposition unit may include: a deposition chamber; a deposition assembly disposed in the deposition chamber and providing a deposition material to the substrate; a transfer chamber disposed below the deposition chamber and connected to the maintenance unit; It may include a substrate supply chamber disposed on one side of the deposition chamber and the transfer chamber, and a substrate recovery chamber disposed on the other side of the deposition chamber and the transfer chamber.

The transfer member may further include a first transfer member disposed in the deposition chamber and a second transfer member disposed in the transfer chamber, wherein the maintenance transfer member is branched from the second transfer member to maintain the transfer chamber and the maintenance transfer member. Can be placed between units.

The carrier includes a main body, an electrostatic chuck disposed on one surface of the main body to fix the substrate to the main body, and at least one first coupling disposed on one surface of the main body and coupled to the anti-catch member to the main body. It may include a member and a cam follower disposed outside the main body and moving the main body along the transfer member.

The transfer member may include at least one support surface supporting a surface of the cam follower and a guide surface guiding a side surface of the cam follower.

The maintenance unit may include a carrier maintenance unit that performs maintenance on the carrier and an anti-chat material maintenance unit that replaces the anti-chat material coupled to the carrier.

The carrier maintenance unit may include a carrier stocker in which the carrier is loaded and fixed, a particle removal unit disposed on both side walls of the carrier stocker and removing particles attached to the carrier, and an oiling unit for supplying lubricant to the carrier. there is.

The carrier stocker may further include a hollow formed in the sidewall so that the particle removal unit can enter and exit.

The carrier stocker may be formed in multiple layers such that a plurality of carriers are stacked.

The anti-navigation member maintenance unit includes a anti-navigation member stocker in which the surplus anti-navigation members are stacked in multiple layers, and a anti-navigation member replacement unit for replacing the anti-navigation member from the carrier, wherein the anti-navigation member replacement unit includes the carrier stocker and the anti-navigation member. Can be placed between stalkers.

The deposition unit further includes a control unit that checks whether the carrier is being repaired, wherein the control unit is connected to the deposition unit, the transfer unit, and the maintenance unit, respectively, so that the maintenance unit performs maintenance on the carrier; Driving of the transfer unit and the maintenance unit may be respectively controlled.

A deposition apparatus according to another embodiment of the present invention for achieving the above object is a deposition unit including a process chamber for performing a deposition process on a substrate, a transfer unit including a carrier for transferring the substrate, disposed on one side of the process chamber and a maintenance unit including a maintenance chamber for performing maintenance of the carrier, a transition chamber disposed between the process chamber and the maintenance chamber, and a first connection unit connected to the process chamber and the transition chamber, and the transition chamber and the transition chamber. A second connection portion connected to the maintenance chamber may be included.

The process chamber may be configured as a vacuum chamber, and the maintenance chamber may be configured as a normal pressure chamber.

The first connection part and the second connection part may include a gate valve that converts the conversion chamber into a vacuum state or normal pressure state.

A deposition method of a deposition apparatus according to an embodiment of the present invention includes combining a substrate and a carrier loaded into a substrate supply chamber, transferring the carrier from the substrate supply chamber to a deposition chamber, and removing the carrier to which the substrate is coupled. performing a deposition process on the substrate coupled to the carrier while transferring it from the deposition chamber to the substrate recovery chamber along a first transport member; separating the substrate on which the deposition process has been performed from the carrier and leaving the substrate recovery chamber outside; transporting the carrier from which the substrate is separated from the deposition chamber to a transport chamber, transporting the carrier transferred to the transport chamber to the substrate supply chamber along a second transport member, and Determining whether maintenance is to be performed on the carrier transferred to the transport chamber, transferring a first carrier requiring maintenance among the carriers to a maintenance unit along a maintenance transfer member branched from the second transfer member, the maintenance unit The method may include repairing the first carrier transported to and returning the repaired first carrier to the transfer chamber along the maintenance transfer member.

Classifying the carrier transferred to the transfer chamber into the first carrier requiring maintenance and a second carrier other than the first carrier, and transferring the second carrier to the substrate supply chamber along the second transfer member. It may further include steps to do.

Classifying the carrier transferred to the transfer chamber into the first carrier requiring repair and a second carrier other than the first carrier, and the repaired first carrier returned to the transfer chamber as the second transfer member. A step of transferring the substrate to the substrate supply chamber may be further included.

The repairing of the carrier may include fixing the first carrier transferred to the maintenance unit, replacing the anti-attachment member of the first carrier using an anti-attachment member replacement unit, and electrostatic chuck of the first carrier. The method may further include spraying gas to remove particles and lubricating grease to the cam follower of the first carrier.

Details of other embodiments are included in the detailed description and drawings.

A deposition apparatus according to an embodiment of the present invention may improve worker safety by arranging a maintenance unit in the deposition apparatus.

In addition, the deposition apparatus and method according to the embodiment of the present invention can minimize the loss of the deposition operation.

In addition, the deposition apparatus and the deposition method according to the embodiment of the present invention can minimize the maintenance time of the carrier.

Effects according to the embodiments of the present invention are not limited by the contents exemplified above, and more diverse effects are included in the present specification.

1 is a plan layout view of a deposition apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional arrangement view of the deposition apparatus of FIG. 1 .
FIG. 3 is an AA-sectional view of the deposition unit of FIG. 1 .
4 is a partial perspective view of a transfer member according to an embodiment of the present invention.
5 is a partial perspective view of a transfer member according to another embodiment of the present invention.
FIG. 6 is an enlarged cross-sectional view of the maintenance unit shown in FIG. 2 .
7 is a block diagram of a control unit according to an embodiment of the present invention;
8 is a flow chart of a deposition method according to an embodiment of the present invention.
9 to 12 are process-step cross-sectional views of a maintenance process of a deposition apparatus according to an embodiment of the present invention.
13 is a cross-sectional view of a maintenance unit of a deposition apparatus according to another embodiment of the present invention.
14 is a cross-sectional view of a maintenance unit of a deposition apparatus according to another embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

When an element or layer is referred to as “on” another element or layer, it includes all cases where another element or layer is directly on top of another element or another layer or other element intervenes therebetween. Like reference numbers designate like elements throughout the specification.

Although first, second, etc. are used to describe various components, these components are not limited by these terms, of course. These terms are only used to distinguish one component from another. Accordingly, it goes without saying that the first element mentioned below may also be the second element within the technical spirit of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First, a configuration of a deposition apparatus according to embodiments of the present invention will be described.

1 is a plane arrangement view of a deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional arrangement view of the deposition apparatus of FIG. 1, more specifically, a schematic cross-sectional view of the deposition apparatus of FIG. 1 projected onto an XZ plane. A layout view, FIG. 3 is the A-A? of the deposition unit of FIG. it is a cross section

Referring to FIGS. 1 to 3 , the deposition apparatus 1000 includes a deposition unit 100 , a maintenance unit 200 , and a transfer unit 300 .

The substrate S on which the deposition process is performed in the deposition apparatus 1000 may be a substrate for a display device such as an organic light emitting display device. The substrate S may be a mother glass substrate in which a plurality of substrate areas for forming a plurality of display devices are defined. However, it is not limited thereto, and an individual substrate for a display device may be used as the substrate S.

A material deposited on the substrate S may be an organic material applied to an organic light emitting device of an organic light emitting display device, such as an organic light emitting layer, a hole injection layer, a hole transport layer, a charge injection layer, or a charge transport layer. However, it is not limited thereto, and the material deposited on the substrate S may be an interlayer insulating film, a planarization film, or an organic material used for a color filter.

The deposition unit 100 includes a process chamber 110 and at least one deposition assembly 130 disposed inside the process chamber 110 and providing a deposition material to the substrate S.

The process chamber 110 may include a deposition unit, a transfer unit, a substrate supply unit, and a substrate recovery unit. The deposition unit, the transfer unit, the substrate supply unit, and the substrate recovery unit may each be configured as separate chambers, or may be divided into a plurality of regions and disposed in each of the divided regions. For example, in the case of a deposition unit and a transport unit, one chamber may be divided into a first layer and a second layer, and then the transport unit may be placed on the first floor and the deposition unit may be disposed on the second floor. In the following embodiment, a case in which the deposition unit, the transfer unit, the substrate supply unit, and the substrate recovery unit each consist of separate chambers will be described as an example.

The process chamber 110 includes a deposition chamber 111 in which a deposition process is performed, a transfer chamber 112 disposed below the deposition chamber 111, and one side (left side of the drawing) of the deposition chamber 111 and the transfer chamber 112. ), the substrate supply chamber 113 and the deposition chamber 111, and the substrate recovery chamber 114 disposed on the other side (right side of the drawing) of the transport chamber 112.

The deposition chamber 111 is a chamber in which a deposition process is performed. The deposition chamber 111 may be a vacuum chamber. The deposition chamber 111 may have a shape extending in the first direction (X).

At least one deposition assembly 130 is disposed within the deposition chamber 111 . In the drawings, a case in which the plurality of deposition assemblies 130 are disposed at regular intervals along the first direction X is illustrated, but the arrangement of the deposition assemblies 130 may be variously changed.

The deposition assembly 130 serves to deposit a thin film on one surface of the substrate S facing the deposition assembly 130 by discharging the deposition material toward the substrate S. The deposition assembly 130 may be disposed below the substrate S. The deposition assembly 130 includes a crucible 131 accommodating a deposition material, a heater disposed outside the crucible 131 to vaporize the deposition material by heating the crucible 131, and at least one nozzle to discharge the vaporized deposition material. (135). The nozzle 135 may be disposed above the crucible 131 so as to face the substrate S.

The transport chamber 112 serves to transport the carrier 310 from which the substrate S is separated after the deposition process is completed to the inlet of the deposition chamber 111 or to the substrate supply chamber 113 side. The transfer chamber 112 may be disposed below the deposition chamber 111 . Like the deposition chamber 111 , the transfer chamber 112 may have a shape extending in the first direction X. The transfer chamber 112 may be disposed to overlap the deposition chamber 111 . For example, the transfer chamber 112 may be located on the first floor and the deposition chamber 111 may be disposed on the transfer chamber 112 to constitute the second floor.

The substrate supply chamber 113 is disposed on one side of the deposition chamber 111 and the transfer chamber 112 . A substrate S is input into the substrate supply chamber 113 from the outside. The substrate S loaded into the substrate supply chamber 113 is fixed to the carrier 310 within the substrate supply chamber 113 .

The substrate supply chamber 113 may include a first elevator 331 . The carrier 310 is put into the substrate supply chamber 113 from the conveyance chamber 112 on the first floor, and the first elevator 331 can lift the loaded carrier 310, and the lifted carrier 310 can lift the 2 It may be injected into the deposition chamber 111 of the layer. The carrier 310 may fix the substrate S put into the substrate supply chamber 113 and move toward the deposition chamber 111 , and then a deposition process may be performed in the deposition chamber 111 .

The substrate recovery chamber 114 is disposed on the other side of the deposition chamber 111 and the transfer chamber 112 . The substrate S, after completion of the deposition process in the deposition chamber 111, moves into the substrate recovery chamber 114 together with the carrier 310, and the substrate S is separated from the carrier 310 in the substrate recovery chamber 114. and is transported out of the substrate recovery chamber 114 .

The substrate recovery chamber 114 may include a second elevator 333 . The second elevator 333 may lower the carrier 310 from which the substrate S is separated, and the lowered carrier 310 may be put into the transfer chamber 112 on the first floor. The carrier 310 introduced into the transfer chamber 112 may be transferred to the substrate supply chamber 113 side. When the deposition chamber 111, the transfer chamber 112, the substrate supply chamber 113, and the substrate recovery chamber 114 are configured as separate chambers, a connection unit 400 is disposed between the chambers.

Specifically, the connection unit 400 is between the substrate supply chamber 113 and the deposition chamber 111, between the deposition chamber 111 and the substrate recovery chamber 114, between the transfer chamber 112 and the substrate recovery chamber 114, It may be disposed between the transfer chamber 112 and the substrate supply chamber 113 .

The connection part 400 includes an opening/closing connection part 401 and a gate connection part 402 .

When the transfer chamber 112, the substrate supply chamber 113, and the substrate recovery chamber 114 are all vacuum chambers like the deposition chamber 111, the opening/closing connection unit 401 is disposed between the chambers to open and close each chamber. play a role The opening and closing connection unit 401 may be an opening and closing shutter.

The gate connection unit 402 is connected to the deposition chamber when each chamber has a different atmosphere, for example, when the deposition chamber 111 maintains a vacuum while the adjacent substrate recovery chamber 114 maintains normal pressure (or atmospheric pressure). 111 is maintained in a vacuum state and the substrate recovery chamber 114 is maintained in a normal pressure state. The gate connection unit 402 may be an opening and closing shutter including a gate valve.

The transfer unit 300 serves to move the substrate (S) and includes a carrier 310 for fixing the substrate (S) and a transfer member 350 for moving the carrier 310 .

The carrier 310 is disposed outside the body portion 311, the electrostatic chuck 317 disposed on one side of the body portion 311, and the width direction of the body portion 311 (direction parallel to the moving direction of the body portion). A cam follower 313 may be included.

The body portion 311 supports the load of the substrate S and may be formed in various shapes and structures. The body portion 311 is configured to withstand the load of the substrate S, and may be made of, for example, a metal having rigidity such as iron or SUS.

The electrostatic chuck 317 may be located at the center of one surface of the main body 311 and serves to fix the substrate S using electrostatic force. The electrostatic chuck 317 may include a body made of ceramic and an electrode buried therein. As the electrostatic chuck 317, a mother electro static chuck formed integrally as a whole may be applied. When the electrostatic chuck 317 is a mother electrostatic chuck, stains on the substrate S to be fixed can be prevented.

The cam follower 313 is installed on the side of the main body 311 . A plurality of cam followers 313 may be disposed on the side of the main body 311 .

The cam follower 313 is a type of bearing and may serve as a wheel for transporting the body portion 311 . The cam follower 313 may be formed in the form of a roller to be moved along a transfer member 350 to be described later.

The cam follower 313 may further include a needle roller inside. The needle roller is a roller for driving the cam follower 313, and uneven wear may progress as the carrier 310 moves. Such uneven wear can be reduced by supplying lubricating oil such as grease to the cam follower 313 in the maintenance unit 200 to be described later.

The plurality of cam followers 313 may have different sizes. If each cam follower 313 has a different size, it is easy to overcome the obstacle even when an obstacle is formed due to damage to the transfer member 350 during the deposition process.

The carrier 310 may further include a first coupling member 315a coupling the anti-chacking member B to the main body 311 to be described later. A plurality of first coupling members 315a may be provided on both side edges of one surface of the body portion 311 to which the electrostatic chuck 317 is coupled. However, it is not limited thereto, and the number of first coupling members 315a may be variously modified.

As exemplarily shown in FIG. 3 , the first coupling member 315a may be coupled to one surface of the body portion 311 and partially protrude beyond one surface of the body portion 311 .

The second coupling member 315b coupled to the first coupling member 315a may be provided in an anti-chacking member B to be described later. The second coupling member 315b is formed to correspond to the shape of the first coupling member 315a that partially protrudes from one surface of the body portion 311 . That is, the second coupling member 315b may be formed in the form of an inlet groove corresponding to the shape of the first coupling member 315a on one surface of the anti-chacking member B.

Therefore, when the first coupling member 315a and the second coupling member 315b are coupled, one surface of the body portion 311 and the surface of the anti-chassis member B may directly contact each other and may be in close contact with each other. A datum clamp may be applied to the first coupling member 315a and the second coupling member 315b, but is not limited thereto.

Referring again to FIGS. 1 and 2 , the transfer member 350 is branched from the main transfer members 351 and 352 and the main transfer members 351 and 352 disposed in the deposition unit 100, and the deposition unit 100 and a maintenance transfer member 353 disposed between the maintenance unit 200 . The main transfer members 351 and 352 include a first transfer member 351 disposed in the deposition chamber 111 and a second transfer member 352 disposed in the transfer chamber 112 . The first conveying member 351, the second conveying member 352, and the maintenance conveying member 353 may have substantially the same structure and shape, except for differences in positions and functions.

The first transfer member 351 serves to transfer the carrier 310 to which the substrate S is fixed from the substrate supply chamber 113 to the substrate recovery chamber 114 via the deposition chamber 111 .

The second transfer member 352 serves to transfer the carrier 310 from which the substrate S is separated from the substrate recovery chamber 114 to the substrate supply chamber 113 via the transfer chamber 112 .

The maintenance transfer member 353 transfers the carrier 310 from the transfer chamber 112 to the maintenance unit 200 when the carrier 310 needs to be repaired, and removes the carrier 310 from the maintenance unit 200 after maintenance has been completed. It functions to return to the transfer chamber 112 side again.

The maintenance transfer member 353 may branch from the second transfer member 352 within the transfer chamber 112 . In the transfer chamber 112, whether the carrier 310 moving along the second transfer member 352 of the transfer chamber 112 continues to move along the second transfer member 352 or moves to the maintenance transfer member 353. The control unit 600 to be described below may determine whether or not it is lost.

Reference is made to FIGS. 4 and 5 for a more detailed description of the various structures of the transfer member 350 .

4 is a partial perspective view of a transfer member according to an embodiment of the present invention. 5 is a partial perspective view of a transfer member according to another embodiment of the present invention.

4 illustrates a case in which the conveying member 350 includes a bottom surface 350a and a side wall 350b. The bottom surface 350a is a support surface for supporting the surface of the cam follower 313, and the side wall 350b is a guide surface for guiding the side surface of the cam follower 313.

5 illustrates a case in which the transfer member 350_1 further includes an upper cover 350c in addition to the bottom surface 350a and the side wall 350b. The bottom surface 350a and the top cover 350c are support surfaces for supporting the surface of the cam follower 313 from the upper and lower sides, and the side wall 350c is a guide for guiding the side surface of the cam follower 313 as described above. it is cotton

Also, although not shown in the drawings, at least one groove may be further formed on the bottom surface 350a and the upper cover 350c. A cam follower 313 is seated in the groove so that the carrier 310 can move precisely.

Here, the conveying member 350 may form a bottom surface 350a, a side wall 350b, and an upper cover 350c by bending one flat plate or by screwing together a plurality of flat plates.

The conveying member 350 may be a conveying rail for conveying the carrier 310 .

Referring back to FIGS. 1 and 2 , the carrier 310 may be moved from the second transfer member 352 to the maintenance transfer member 353 and transferred to the maintenance unit 200 .

In FIG. 2 , the maintenance unit 200 is expressed as being disposed below the deposition unit 100, but this shows the configuration of the deposition unit 100, the maintenance unit 200, and the conversion chamber 500 in FIG. 2 in detail. It is intended to be shown as Therefore, the maintenance unit 200 shown in FIG. 2 is disposed on the same plane as the transfer chamber 112 of the deposition unit 100 . That is, the maintenance unit 200 may be disposed on the same Y line on the XY plane.

The maintenance unit 200 serves to perform maintenance of the transported carrier 310 . The maintenance unit 200 may be disposed adjacent to the process chamber 110 . 6 is referred to for a more detailed description of the maintenance unit 200 .

FIG. 6 is an enlarged cross-sectional view of the maintenance unit shown in FIG. 2 . Referring to FIG. 6 , the maintenance unit 200 includes a carrier maintenance unit 230 and an anti-attachment member maintenance unit 250 .

The carrier maintenance unit 230 includes a carrier maintenance chamber 213 , carrier stockers 231 and 237 respectively disposed in the carrier maintenance chamber 213 , a particle removal unit 233 , and an oil lubricating unit 235 .

The carrier maintenance chamber 213 is a chamber in which the transported carrier 310 is maintained. The carrier maintenance chamber 213 may be a normal pressure chamber. The carrier maintenance chamber 213 may be disposed adjacent to the transfer chamber 112 . Inside the carrier maintenance chamber 213, carrier stockers 231 and 237 are disposed.

The carrier 310 transferred from the maintenance transfer member 353 is loaded on the carrier stockers 231 and 237 . The carrier stockers 231 and 237 may be shelf-type lattice frames. The carrier stockers 231 and 237 include a support plate 237 and at least one side wall 231 . The carrier 310 may be accommodated in the space defined by the support plate 237 and the side wall 231 . The support plate 237 is disposed below the transported carrier 310 and may support one surface of the carrier 310 .

Meanwhile, the carrier maintenance unit 230 may further include fixing members 236 disposed spaced apart from each other by a predetermined interval on one surface of the support plate 237 .

The fixing member 236 functions to fix the carrier 310 transferred to the carrier stockers 231 and 237 and to prevent the carrier 310 from escaping to the outside of the carrier stockers 231 and 237 . The fixing member 236 may be formed in a plate shape and, as shown in FIG. 6 , may include a groove having a shape corresponding to one surface of the carrier 310 or the electrostatic chuck 317 of the carrier 310 . Also, the electrostatic chuck 317 of the carrier 310 may be inserted into the groove, and thus the carrier 310 may be fixed to the fixing member 236 . However, the shape of the fixing member 236 is not limited thereto. For example, the fixing member 236 may be a bar like a stopper.

Sidewalls 231 of the carrier stockers 231 and 237 may be connected to the maintenance transport member 353, and the sidewall 231 receives the carrier 310 from the maintenance transport member 353, and the carrier stockers 231 and 237 ) can be moved to the inside of the However, the method of moving the carrier 310 is not limited thereto. For example, a robot arm is disposed between the carrier stockers 231 and 237 and the maintenance transfer member 353, and the robot arm transfers the carrier 310 from the maintenance transfer member 353 to the carrier stocker 231 and 237. It can also be moved to the inside of the .

Meanwhile, the carrier maintenance unit 230 may further include a reinforcing rib 234 coupled to the side wall 231 . The reinforcing rib 234 serves to increase the rigidity of the sidewall 231 of the carrier stockers 231 and 237 on which the carrier 310 is loaded.

The carrier maintenance unit 230 may further include a hollow 232 formed in the sidewall 231 . The particle removal unit 233 and the anti-blocking member replacement unit 353, which will be described later, may be inserted into the hollow 232 or separated from the hollow 232.

The particle removal unit 233 serves to remove particles attached to the electrostatic chuck 317 of the carrier 310 . A plurality of particle removal units 233 may be connected to both side walls 231 of the carrier stockers 231 and 237 . The particle removal unit 233 is disposed adjacent to the hollow 232 and may move in and out of the carrier stockers 231 and 237 through the hollow 232 according to a decision of the controller 600 to be described later. To this end, the particle removal unit 233 may be connected to the sidewall 231 through a separate moving member, and the moving member may be a sliding rail. However, the connection between the particle removal unit 233 and the sidewall 231 is not limited thereto. For example, the particle removal unit 233 may be moved in and out of the carrier stockers 231 and 237 by a robot arm connected to one side of the side wall 231 . In addition, the angle of the particle removal unit 233 may be adjustable at various angles. The particle removal unit 233 may be an air nozzle.

The lubrication unit 235 serves to supply lubricating oil such as grease to the needle rollers configured in the cam follower 313 that transports the body unit 311 . A plurality of lubricating parts 235 may be disposed on one side of the sidewall 231 of the carrier stockers 231 and 237. The lubricator 235 may move left and right based on the drawing according to the decision of the control unit 600, and may be disposed adjacent to the cam follower 313 of the carrier 310. To this end, the lubrication unit 235 may be connected to the side walls 231 of the carrier stockers 231 and 237 through a separate moving member, and the moving member may be a sliding rail by way of example. However, the connection between the lubricating part 235 and the side wall 231 is not limited thereto. For example, the lubricating part 235 may be disposed adjacent to the cam follower 233 by a robot arm connected to one side of the side wall 231 .

Referring to FIGS. 1 and 6 , the carrier maintenance chamber 213 may be a normal pressure chamber as described above. Accordingly, when the transfer chamber 112 is configured as a vacuum chamber, the conversion chamber 500 may be disposed between the transfer chamber 112 and the carrier maintenance chamber 213 . The changeover chamber 500 may be a buffer chamber, that is, a waiting chamber for changing an atmosphere before the carrier 310 transferred along the maintenance transfer member 353 is transferred to the carrier maintenance chamber 213 . For example, when the carrier 310 moves from the transfer chamber 112 in a vacuum state to the conversion chamber 500 along the maintenance transfer member 353, the internal state of the conversion chamber 500 may be in a vacuum state. Then, the gate connection part (or first connection part) 402 between the conversion chamber 500 and the transfer chamber 112 may be opened, and the carrier 310 may enter the conversion chamber 500 . Accordingly, the vacuum state of the transfer chamber 112 may be maintained. After the carrier 310 enters the conversion chamber 500, the first connection 402 between the conversion chamber 500 and the transfer chamber 112 may be closed, and the interior of the conversion chamber 500 is in a normal pressure state. can be changed to Then, the gate connection (or second connection) 402 between the transition chamber 500 and the carrier maintenance chamber 213 can be opened, and the carrier 310 in the transition chamber 500 moves to the carrier maintenance chamber 213. can Accordingly, the atmospheric pressure state of the carrier maintenance chamber 213 may be maintained.

As described above, a gate connection unit 402 for maintaining an atmosphere may be disposed between the transfer chamber 112 and the transition chamber 500 and between the transition chamber 500 and the carrier maintenance chamber 213 , respectively.

An anti-attachment member maintenance unit 250 is disposed on the other side of the carrier maintenance chamber 213 that is not connected to the conversion chamber 500 .

The anti-attachment member maintenance unit 250 serves to perform maintenance of the anti-attachment member (B). The anti-chak member maintenance unit 250 is disposed between the anti-chak member maintenance chamber 215, the chak-prevention member stocker 251 disposed in the chak-prevention member maintenance chamber 215, and between the chak-prevention member maintenance chamber 215 and the carrier maintenance chamber 213 and an anti-chacking member replacement unit 253.

The anti-chatting member maintenance chamber 215 may be a normal pressure chamber like the carrier maintenance chamber 213 . An anti-chat material stocker 251 is disposed at the inner center of the anti-chak member maintenance chamber 215 .

The anti-chak member stocker 251 serves to load and store the extra anti-chak member B to be replaced. The anti-chacking member stocker 251 may be formed in a multi-layer shelf shape.

The anti-attachment member (B) serves to prevent the deposition material from being deposited on the carrier 310 during the deposition process. The anti-chacking member B may be a wide iron plate. The anti-chacking member B may include the aforementioned second coupling member (315b in FIG. 3). The anti-chak member B coupled to the carrier 310 may be replaced by the anti-chak member replacement unit 253 .

The anti-attachment member replacement unit 253 may be disposed between the carrier maintenance chamber 213 and the anti-attachment member maintenance chamber 215 . The anti-blocking member replacement unit 253 may be disposed together with the anti-blocking member stocker 251 inside the anti-blocking member maintenance chamber 215, but may also be disposed outside the anti-blocking member maintenance chamber 215 as shown in FIG. there is. The obstruction member replacement unit 253 removes the obsolete obstruction member B from the carrier 310 according to the decision of the control unit 600, which will be described later, and replaces the obsolete obstruction member B with the removed carrier 310. It serves to couple the anti-chacking member (B). The anti-blocking member replacing unit 253 may be a robot arm that couples the anti-blocking member B loaded on the anti-blocking member stocker 251 to the first coupling member 315a formed on one surface of the carrier 310 .

7 is a schematic block diagram of a deposition apparatus according to an embodiment of the present invention.

It may further include a controller 600 according to an embodiment of the present invention, and the controller 600 controls driving of the deposition unit 100, maintenance unit 200, transfer unit 300, and connection unit 400. can do.

Specifically, the controller 600 may check whether the carrier 310 is being repaired, and drive the transfer unit 300 so that the carrier 310 can be moved within the deposition unit 100 and the maintenance unit 200. Control.

Illustratively, the controller 600 may determine whether maintenance of the carrier 310 should be performed. In the branching area between the second conveying member 352 and the maintenance conveying member 353, a switching device for changing the conveying direction from the second conveying member 352 to the maintenance conveying member 353, or the second conveying member 352 A robot arm for moving the carrier 310 to the maintenance transfer member 353 may be provided. The switching device and the robot arm may be switched and operated according to the decision of the control unit 600 . Among the carriers 310 circulating in the deposition apparatus 1000, the carrier 310 (or the first carrier) requiring maintenance is transferred to the second transfer member 352 by a switching device or a robot arm under the control of the controller 600. can be transferred to the maintenance transfer member 353, and is transferred to the carrier maintenance chamber 213 via the transition chamber 500 along the maintenance transfer member 353.

Meanwhile, among carriers 310 circulating in the deposition apparatus 1000, carriers (or second carriers) 310 that do not require maintenance follow the second transfer member 352 under the control of the controller 600 to the next It may be continuously transferred to the substrate supply chamber 113 of the step. That is, the second carrier 310 is continuously transferred to the substrate supply chamber 113 along the second transfer member 352 without stopping the transfer operation.

In addition, the control unit 600 may be connected to the connection unit 400 disposed between each chamber and may control an operation of the connection unit 400 connecting each chamber.

However, the operation of the controller 600 is not limited to the above. Regardless of whether the carrier 310 is in a state or not, the carrier 310 may be transferred from the second transfer member 352 to the maintenance transfer member 353 at predetermined intervals under the control of the controller 600 . For example, when one carrier 310 moves the second transfer member 352 a predetermined number of times (eg, 5 times), the corresponding carrier 310 is controlled by the controller 600 to move the second transfer member ( In 352, it may be transferred to the maintenance transfer member 353.

The controller 600 may control driving of the maintenance unit 200 performing maintenance of the carrier 310 .

The carrier 310 after completion of repair may be returned to the transfer chamber 112 along the maintenance transfer member 353 under the control of the controller 600 . Here, the repaired carrier 310 may remain in a standby state in the conversion chamber 500 and then returned to the transfer chamber 112 . Accordingly, the plurality of carriers 310 circulating in the process chamber 110 may be continuously transferred to the next step without stopping the transfer operation.

Next, a deposition method according to an embodiment of the present invention will be described together with the operation of the deposition apparatus 1000 .

8 is a flowchart illustrating a deposition method according to an embodiment of the present invention. Referring to FIG. 8 , the deposition method according to an embodiment of the present invention includes combining a substrate and a carrier loaded into a substrate supply chamber (S11), transferring the carrier from the substrate supply chamber to a deposition chamber (S12), and including a substrate Performing a deposition process on the substrate coupled to the carrier while transferring the combined carrier from the deposition chamber to the substrate recovery chamber along the first transfer member (S13), separating the substrate on which the deposition process has been performed from the carrier and the substrate recovery chamber Transferring the carrier to the outside (S14), transferring the carrier from the deposition chamber to the transfer chamber (S15), transferring the carrier transferred to the transfer chamber to the substrate supply chamber along the second transfer member (S16). ), determining whether maintenance of the carrier is to be performed (S17), transferring the carrier to the substrate supply chamber along the second transfer member (S18), and carrying the carrier to the maintenance transfer member branched from the second transfer member. A step of transferring the carrier to the maintenance unit (S19) and a step of repairing the carrier transferred to the maintenance unit (S20) may be further included.

Hereinafter, a deposition method according to an embodiment of the present invention will be described in more detail with reference to FIGS. 9 to 12 .

9 to 12 are process-step cross-sectional views of a maintenance process of a deposition apparatus according to an embodiment of the present invention.

Referring to FIGS. 2 and 8 to 12 , steps S11 and S12 may proceed as follows.

The undeposited substrate S introduced into the substrate supply chamber 113 is mounted on one surface of the carrier 310 on which the electrostatic chuck 317 is formed. Subsequently, one side of the carrier 310 on which the substrate S is mounted is connected to the first transfer member 351 . At this time, the carrier 310 may be transported along the moving direction of the first transport member 351 .

Next, the carrier 310 connected to the first transfer member 351 is transferred from the substrate supply chamber 113 to the deposition chamber 111 .

Steps S13 and S14 may proceed as follows.

While the carrier 310 transferred to the deposition chamber 111 moves the top of the deposition assembly 130 along the moving direction of the first transport member 351, the deposition material is deposited on the substrate S mounted on the carrier 310. deposit

Next, the carrier 310 on which the substrate S on which the deposition process is completed is transferred from the deposition chamber 111 to the substrate recovery chamber 114 . Subsequently, the substrate S on which the deposition process is completed is separated from the carrier 310 and transported out of the substrate recovery chamber 114 .

Steps S15 to S17 may proceed as follows.

The carrier 310 from which the substrate S is separated is lowered from the deposition chamber 111 on the second floor to the transfer chamber 112 on the first floor using the second elevator 333 .

Subsequently, one side of the carrier 310 introduced into the transfer chamber 112 is connected to the second transfer member 352 . Subsequently, the carrier 310 connected to the second transfer member 352 is transported toward the substrate supply chamber 113 along the moving direction of the second transfer member 352 .

Subsequently, it is determined whether the carrier 310 transported along the second transport member 352 needs to be repaired, and the carrier 310 is divided into a first carrier requiring maintenance and a second carrier other than the first carrier.

Step S19 may proceed as follows.

Before the first carrier is transferred to the conversion chamber 500 , the first connection 402 between the transfer chamber 112 and the conversion chamber 500 converts the interior of the conversion chamber 500 to a vacuum state. Subsequently, when the interior of the conversion chamber 500 is converted to a vacuum state, the first connection portion 402 between the conversion chamber 500 and the transfer chamber 112 is opened. Subsequently, the first carrier 310 is transferred into the conversion chamber 500 . Next, after the first carrier 310 is transported into the conversion chamber 500 , the first connection portion 402 between the conversion chamber 500 and the transport chamber 112 is closed. Then, the second connection part 402 between the conversion chamber 500 and the maintenance chamber 213 converts the inside of the conversion chamber 500 to normal pressure. Then, when the inside of the conversion chamber 500 is converted to normal pressure, the second connection part 402 between the conversion chamber 500 and the carrier maintenance chamber 213 is opened. Next, the first carrier 310 is transferred from the transition chamber 500 to the carrier maintenance chamber 213 along the maintenance transfer member 353 .

Subsequently, when the first carrier 310 enters the carrier stockers 231 and 237 along the maintenance transport member 353, the operation of the maintenance transport member 353 is stopped.

Step S20 may proceed as follows.

First, a step of fixing the first carrier transferred to the maintenance unit 200 is performed. Specifically, in the above step, the first carrier transferred to the maintenance unit 200 is fixed to the supporting plate 237 of the carrier stockers 231 and 237 using the fixing member 236 .

Next, a step of replacing the attachment prevention member B of the first carrier by using the attachment prevention member replacing unit 253 is performed. Specifically, in the above step, the worn anti-attachment member B is separated from the carrier 310 using the anti-attachment member replacement unit 253 . Then, by using the anti-blocking member replacement unit 253, the anti-blocking member B loaded in the anti-blocking member stocker 251 is moved to one side of the carrier 310 where the exhausted anti-blocking member B is replaced. Subsequently, the anti-chacking member replacement unit 253 is coupled to one surface of the carrier 310 with the anti-chat material B interposed therebetween.

Next, a step of spraying gas to the electrostatic chuck 317 of the first carrier to remove particles and supplying lubricating oil to the cam follower 313 of the first carrier proceeds. Specifically, in the above step, the particle removal unit 233 is placed adjacent to the area where the particles are located, and the particles are removed by spraying gas. At this time, the particle remover 233 may adjust the angle of the spray nozzle to spray the gas at an accurate location.

Then, after a predetermined injection time, for example, 5 to 30 seconds, the operation of the particle removal unit 233 is stopped.

Then, the lubrication part 235 is positioned at the lubrication position of the cam follower 313. The lubrication unit 235 located at the lubrication position supplies lubricant such as grease to the cam follower 313 . Then, when a certain oil supply amount arrives, the operation of the oil oil part 235 is stopped.

Next, the first carrier for which repair is completed is separated from the carrier stockers 231 and 237 and returned to the maintenance transfer member 353 . Then, the carrier 310 is transferred to the transition chamber (500 in FIG. 1) along the maintenance transfer member 353. At this time, the first carrier may stand by in the conversion chamber 500 so that it can be returned to its original position where it was circulated in the process chamber 110 .

Subsequently, when the original position where the first carrier was placed returns after a certain period of time, the first carrier is returned from the maintenance conveying member 353 to the second conveying member 352 .

Subsequently, the first carrier is transferred to the substrate supply chamber 113 along the moving direction of the second transfer member 352 . The carrier 310 transferred to the substrate supply chamber 113 may be circulated within the process chamber 110 according to the above-described cycle of the carrier 310 .

Step S18 may more specifically proceed as follows.

The second carrier is transferred to the substrate supply chamber 113 along the second transfer member 352, and then moves from the transport chamber 112 on the first floor to the deposition chamber 111 on the second floor through the first elevator 331. elevate Thereafter, by repeating the above operation, the carrier 310 is circulated within the process chamber 110 .

Hereinafter, a deposition apparatus according to another embodiment of the present invention will be described.

13 is a cross-sectional view of a maintenance unit of a deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 13 , in the maintenance unit 200_1 of the deposition apparatus according to the present embodiment, the carrier maintenance unit 230_1 and the anti-attachment member maintenance unit 250_1 are disposed together in one maintenance chamber 210 as shown in FIG. 1 . It is different from the Example.

Specifically, the maintenance chamber 210 may be a vacuum chamber. Therefore, when the transfer chamber 112 is configured as a vacuum chamber, one side of the transfer chamber 112 and the maintenance chamber 210 may be directly connected. When the transfer chamber 112 and the maintenance chamber 210 are directly connected, the transition chamber (500 in FIG. 1 ) is not required, as in the embodiment of FIG. 1 . Accordingly, since the configuration of the transition chamber (500 in FIG. 1) is excluded in the present embodiment, the maintenance time can be reduced compared to the embodiment in FIG.

In addition, a carrier maintenance unit 230_1 and an anti-attachment member maintenance unit 250_1 are respectively disposed inside the maintenance chamber 210 . Therefore, in this embodiment, as in the embodiment of FIG. 1 , the configuration of the carrier maintenance chamber ( 213 in FIG. 1 ) and the anti-chat member maintenance chamber ( 215 in FIG. 1 ) is not required. Therefore, since the configuration of the carrier maintenance chamber (213 in FIG. 1) and the anti-chat member maintenance chamber (215 in FIG. 1) are excluded in this embodiment, the maintenance time can be reduced compared to the embodiment of FIG.

That is, the maintenance unit 200_1 according to the present embodiment has the advantage of reducing the maintenance process time compared to the embodiment of FIG. 1 .

Hereinafter, a deposition apparatus according to another embodiment of the present invention will be described.

14 is a cross-sectional view of a maintenance unit of a deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 14, the maintenance unit 200_2 according to the present embodiment includes support plates 237a and 237b, particle removal units 233a and 233b, cavities 232a and 232b, lubricating units 235a and 235b, and fixing members. (236a, 236b) is different from the above-described embodiment in the description of FIGS.

In detail, the carrier stockers 231_1, 237a, and 237b have a plurality of support plates 237a and 237b spaced apart from each other at regular intervals. Accordingly, a plurality of storage spaces are formed inside the carrier stockers 231_1, 237a, and 237b. In the plurality of storage spaces of the carrier stockers 231_1, 237a, and 237b, a plurality of first carriers may be stacked along the third direction Z, respectively.

The carrier stockers 231_1, 237a, and 237b are disposed adjacent to the maintenance transfer member 353. A robot arm may be disposed between the carrier stockers 231_1 , 237a and 237b and the maintenance transfer member 353 . The robot arm moves the first carrier from the maintenance transport member 353 to the carrier stockers 231_1, 327a, and 327b, or moves the first carrier for which maintenance has been completed from the carrier stocker 231_1, 327a, and 327b to the maintenance transport member. It functions to move to (353).

On the other hand, on both side walls 231 of the carrier stockers 231_1, 327a, 327b, a plurality of particle removal parts 233a, 233b, hollows 232a, 232b, lubricating parts 235a, 235b and fixing members 236a, 236b ) is placed. A plurality of particle removal units (233a, 233b), hollows (232a, 232b), lubrication units (235a, 235b) and fixing members (236a, 236b) are respectively in a plurality of storage spaces of the carrier stocker (231_1, 327a, 327b) can be arranged to match. Accordingly, the plurality of particle removal units 233a and 233b, the hollows 232a and 232b, the lubrication units 235a and 235b and the fixing members 236a and 236b are stacked on the carrier stockers 231_1, 327a and 327b. Each of the first carriers may be repaired.

That is, in the maintenance unit 200_2 of this embodiment, a plurality of first carriers are stacked on the carrier stockers 231_1, 327a, and 327b, and maintenance can be performed on the stacked plurality of first carriers at the same time.

Except for the above configuration, the bar is substantially the same as the above-described embodiment in the description of FIGS. 1 to 6, and thus a detailed description thereof will be omitted.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. you will be able to understand Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting.

1000: deposition device S: substrate
B: Anti-seize member
100: deposition unit 110: process chamber
111: deposition chamber 112: transfer chamber
113: substrate supply chamber 114: substrate return chamber
130: deposition assembly 200, 200_1, 200_2: maintenance unit
210: maintenance chamber 213: carrier maintenance chamber
215: anti-friction member maintenance chamber
230, 230_1, 230_2: carrier maintenance unit
231: carrier stocker 233: particle removal unit
235: gas lady
250, 250_1, 250_2: Anti-stick member maintenance unit
251: anti-blocking member stalker 253: anti-blocking member replacement unit
300: transfer unit 310: carrier
311: body part 313: cam follower
315: coupling part 315a: first coupling part
315b: second coupling part 317: electrostatic chuck
350: transfer member 400: connection
401: opening and closing connection part 402: gate connection part
500: conversion chamber

Claims (18)

a deposition unit that performs a deposition process on a substrate;
a transfer unit including a carrier for transferring the substrate and a transfer member for transferring the carrier; and
A maintenance unit disposed adjacent to the deposition unit and performing maintenance of the carrier,
The conveying member,
a maintenance transfer member disposed between the deposition unit and the maintenance unit to transfer the carrier from the deposition unit to the maintenance unit;
The maintenance unit:
a carrier maintenance unit performing maintenance of the carrier; and
And an anti-chacking member maintenance unit for replacing the anti-chacking member coupled to the carrier,
The carrier maintenance unit:
a carrier stocker in which the carrier is loaded and fixed;
Particle removal units disposed on both side walls of the carrier stocker and removing particles attached to the carrier; and
A deposition apparatus including an oil lubricating unit supplying lubricating oil to the carrier. According to claim 1,
The deposition unit,
A deposition chamber, a deposition assembly disposed in the deposition chamber and providing a deposition material to the substrate, and a transfer chamber disposed below the deposition chamber and connected to the maintenance unit. A deposition apparatus including a substrate supply chamber disposed on one side of the deposition chamber and the transfer chamber, and a substrate recovery chamber disposed on the other side of the deposition chamber and the transfer chamber. According to claim 2,
The conveying member,
further comprising a first transfer member disposed within the deposition chamber and a second transfer member disposed within the transfer chamber;
The deposition apparatus of claim 1 , wherein the maintenance transfer member is branched from the second transfer member and disposed between the transfer chamber and the maintenance unit. According to claim 1,
the carrier,
A body portion, an electrostatic chuck disposed on one surface of the body portion to fix the substrate to the body portion, at least one first coupling member disposed on one surface of the body portion and coupling an anti-seize member to the body portion; and
and a cam follower disposed outside the main body and moving the main body along the transfer member. According to claim 4,
The conveying member,
A deposition apparatus comprising at least one support surface supporting a surface of the cam follower and a guide surface guiding a side surface of the cam follower. delete delete According to claim 1,
The carrier stocker,
The deposition apparatus further comprises a hollow formed in the sidewall to allow the particle removal unit to enter and exit. According to claim 1,
The carrier stocker,
A deposition apparatus formed in multiple layers such that a plurality of carriers are stacked. According to claim 1,
The anti-stick member maintenance unit,
An anti-navigation member stocker in which the surplus anti-navigation member is laminated in multiple layers; and
And an anti-chacking member replacement unit for replacing the anti-chacking member from the carrier,
The deposition apparatus of claim 1 , wherein the anti-chacking member replacement unit is disposed between the carrier stocker and the chak-prevention member stocker. According to claim 1,
a control unit for checking whether the carrier is repaired; Including more,
The control unit,
connected to the deposition unit, the transfer unit, and the maintenance unit, respectively;
A deposition apparatus that controls driving of the deposition unit, the transfer unit, and the maintenance unit, respectively, so that the maintenance unit performs maintenance on the carrier. a deposition unit including a process chamber for performing a deposition process on a substrate;
a transport unit including a carrier transporting the substrate;
a maintenance unit disposed on one side of the process chamber and including a carrier maintenance unit for performing maintenance on the carrier and a maintenance unit for replacing the anti-chattle member coupled to the carrier;
a transition chamber disposed between the process chamber and the maintenance unit; and
A first connection part connected to the process chamber and the conversion chamber and a second connection part connected to the conversion chamber and the maintenance unit,
The carrier maintenance unit:
a carrier stocker in which the carrier is loaded and fixed;
Particle removal units disposed on both side walls of the carrier stocker and removing particles attached to the carrier; and
A deposition apparatus including an oil lubricating unit supplying lubricating oil to the carrier. According to claim 12,
The process chamber is composed of a vacuum chamber,
The deposition apparatus of claim 1 , wherein the maintenance unit is constituted by a normal pressure chamber. According to claim 12,
The first connection part and the second connection part,
and a gate valve for converting the conversion chamber into a vacuum state or normal pressure state. combining the substrate introduced into the substrate supply chamber and the carrier;
transferring the carrier from the substrate supply chamber to a deposition chamber;
performing a deposition process on the substrate coupled to the carrier while transferring the carrier coupled to the substrate from the deposition chamber to a substrate recovery chamber along a first transfer member;
separating the substrate on which the deposition process has been performed from the carrier and carrying it out of the substrate recovery chamber;
transferring the carrier from which the substrate is separated from the deposition chamber to a transfer chamber;
transferring the carrier transferred to the transfer chamber to the substrate supply chamber along a second transfer member; and
Determining whether maintenance of the carrier transported to the transfer chamber is to be performed
transferring a first carrier requiring maintenance among the carriers to a maintenance unit along a maintenance transfer member branched from the second transfer member;
repairing the first carrier transported to the maintenance unit; and
returning the repaired first carrier to the transfer chamber along the maintenance transfer member; Including,
Repairing the first carrier comprises:
fixing the first carrier transported to the maintenance unit;
replacing the attachment prevention member of the first carrier using a attachment prevention member replacement unit; and
and spraying gas to the electrostatic chuck of the first carrier to remove particles and lubricating grease to a cam follower of the first carrier. According to claim 15,
classifying the carrier transferred to the transport chamber into the first carrier requiring repair and a second carrier other than the first carrier; and
transferring the second carrier to the substrate supply chamber along the second transfer member; Deposition method further comprising a. According to claim 15,
classifying the carrier transferred to the transport chamber into the first carrier requiring repair and a second carrier other than the first carrier; and
and transferring the repaired first carrier returned to the transfer chamber to the substrate supply chamber along the second transfer member.
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