KR20190072373A - Deposition System - Google Patents

Abstract

The purpose of the present invention is to configure a large area RGB pixel deposition system in an inline form, not in a cluster form so that two substrates can be carried in each process chamber to be continuously deposited, thereby enhancing productivity through the deposition system. To this end, according to the present invention, a robot arm is provided only to a TM chamber, and a deposition line enables a substrate checked by a chuck plate to be transported by a substrate transport means such as a roller, a tray, and a shuttle. A dual deposition chamber capable of depositing two sheets of substrates is configured for organic material deposition. An inorganic deposition line can deposit one by one separately from the organic deposition line. In addition, the dual deposition chamber has a three-layered vertical layer structure so that a mask supply path and a substrate proceeding path do not interfere with each other.

Description

{Deposition System}

The present invention relates to a deposition system for forming OLED pixels on a large area substrate.

White OLED TVs using Open Mask and OLEDs using Fine Metal Mask Demand for mobile displays is on the rise, requiring a more productive production system. 2. Description of the Related Art Conventionally, in order to improve the productivity of an organic material deposition system for a large-area substrate, a dual system has been developed in which the processing time in each process chamber is shortened and two substrates are deposited in one process chamber. No. 10-1252987 by the present applicant also proposes a dual deposition system. However, it is necessary to improve the problem of the overall layout and the path of the evaporation source for supplying and collecting the mask and chuck in order to be applied to the deposition of pixels.

On the other hand, the deposition system using FMM has a cluster system in which a deposition chamber is attached around the robot chamber, and a plurality of cluster systems are arranged in a lined array. In such a cluster system, a robot for transporting a substrate is required for each cluster, and a substrate and a mask are carried in and out of each process chamber by a robot, and even when they are moved to different clusters, they must be carried by a turn robot . This requires a lot of robots and one robot has to handle the process of loading and unloading a large area substrate and mask. Therefore, it takes a long time due to the high cost of equipment, resulting in low productivity and a disadvantage in terms of yield and defective rate. Further, since a large chamber for a vacuum robot is disposed at the center, there is a problem that it occupies a large space. Conventionally, the cluster chamber is constituted by a hexagonal shape, and the robot disposed therein has a very limited factor in designing the overall layout because the robot carries the substrate only by rotating the hand while the main body is fixed on the floor.

An object of the present invention is to construct an inline type FMM deposition system for a large area substrate, unlike the conventional clusters, in which two substrates are carried in each process chamber to be continuously deposited. Through this deposition system, it is aimed to increase the space efficiency and productivity.

According to the above object, according to the present invention, deposition chambers are arranged on both sides of a rectangular robot chamber to inline the robot chamber, and a traveling robot is disposed in the robot chamber, and a traveling robot capable of translating by a linear motor Thereby providing an inline large-area RGB pixel forming system by transferring the substrate and the mask to the deposition chambers while translating and rotating the substrate and the mask.

In addition, it is also possible to arrange the deposition chambers in-line, place the substrate transfer chamber between the deposition chambers, place a shuttle, a tray, a roller, or a telescopic transfer means in the substrate transfer chamber, Thereby forming an inline large-area RGB pixel formation system in which the transfer means brings the substrate and the mask into and out of the deposition chamber.

In addition, when the deposition chambers are arranged in-line and the substrate is transferred using the chuck, the first branch chamber is located at the front end (the TM chamber side) of the first deposition chamber and the second branch chamber is disposed at the rear end of the last deposition chamber, An inline large-area RGB pixel formation system is provided in which a substrate carried by a plate is carried in and out one by one and a mask stock chamber is provided for each deposition chamber to supply a mask.

In the above, the deposition chamber is a dual deposition chamber, and the two deposition chambers can be arranged in line and arranged in two lines to further shorten the tack time.

In the above, a recovery line for collecting the chuck plate may be disposed along the line where the mask stocker is arranged, or may be arranged to pass through the lower part of the center of the deposition chamber.

According to the present invention, it is possible to inline the OLED pixel forming system, so that only one robot in the first TM chamber needs to be in the first TM chamber, and all the chambers including the dual deposition chamber can be robotized by the substrate transferring means such as a roller, a tray, It can be transported and the area of the equipment can be greatly reduced. In the case of transferring the substrate without the chuck, it is possible to implement a deposition apparatus using FMM using a substrate of 6th generation (1850x1500 mm) or more by adding a substrate deflection prevention device.

Figure 1 shows the layout of a modified cluster-type deposition system.
FIG. 2 is a cross-sectional view showing the internal structure of the chamber disposed in FIG. 1; FIG.
FIG. 3 shows a layout of an inline large area RGB pixel deposition system using a telescopic robot according to the present invention.
4 is a cross-sectional view showing the internal structure of the chamber disposed in FIG.
5 shows a layout of an inline system using a chuck plate as another embodiment of the present invention.
6 is a cross-sectional view showing the configuration of the chambers included in FIG.
7 is a logistic flow diagram according to the embodiment of FIG.
Figure 8 is a layout showing another in-line system embodiment using a chuck plate in accordance with the present invention.
9 is a cross-sectional view showing a chamber configuration included in the inline system of FIG.

1 is a layout of a large area deposition system for transferring a substrate and a mask using a vacuum robot. Four chambers for depositing pixels are arranged symmetrically on both sides of a robot chamber in which the robot is disposed. An inline system is constructed by arranging a plurality of modules in a line by using a robot chamber and a plurality of evaporators as one cluster module. The deposition chamber 1 is a dual deposition chamber in which the substrates can be arranged in pairs. Therefore, a total of eight substrates can be continuously deposited in one cluster module.

Unlike the conventional cluster system, the robot chamber proposed in this embodiment is composed of squares suitable for inline rather than hexagonal. This allows efficient use of space. Also, in the rectangular robot chamber, a traveling robot capable of translational movement is disposed unlike the conventional fixed robot. Conventionally, the robot of the cluster system is a fixed type, and only a robot hand can rotate. Therefore, a robot chamber close to a circular shape is required. However, if a translational movement is applied to the operation of the robot, a rectangular chamber can be formed as shown in FIG. The robot can translate in the robot chamber in the left and right direction (the direction in which the robot chambers are arranged and ultimately the substrate flows) in FIG. 1, and a linear motor 16 is installed as shown in FIG. The linear motor 16 serves to translate the box-shaped support itself to which the forked robot 15 is fixed.

In this embodiment, the process is performed without chucking the substrate on the chuck plate. Therefore, a large-area substrate may be sagged, and a center pin 18 supporting the central portion of the bottom of the substrate is installed in the deposition chamber 1 as a countermeasure thereto. In addition, the touch plate 12 is provided on the alignment unit 11 so as to be placed on the substrate. An electrostatic chuck unit is provided on the lower surface of the touch plate 12 for cooling. The center pin 18 shown in FIGS. 2 and 4 is used to support the center of the substrate to compensate for deflection of the substrate, So that the substrate can be chucked. The magnetic unit is provided, and the substrate is attached to the touch plate by the electrostatic chuck, and the magnetic unit is pulled to bring the mask into close contact with the substrate.

In the TM chamber 10 of Fig. 1, when the robot carries the substrate into the flip chamber 20, it flips the substrate in the flip chamber 20 and takes over the robot to the robot again. The robot moves the substrate to the adjacent substrate reversing chamber 3 Import it. In the substrate reversing chamber 3, the substrate is rotated to hold the substrate in a constant direction. In some cases, it may not be reversed.

A robot for loading and unloading substrates is disposed in a robot chamber 2 disposed at the center. Two dual deposition chambers 1 are disposed on the left and right sides of the robot chamber 2 in the substrate moving direction, and a mask is provided between the dual deposition chambers A mask stock chamber 4 is provided.

The robots in the robot chamber 2 bring the substrates taken in from the substrate reversing chamber 3 into each of the dual deposition chambers 1 successively two by two. One substrate is carried in each of the four deposition chambers 1, and then the second substrate is put back into the deposition chamber 1 in that order. Further, the substrate after the deposition is received by the robot and transferred to the substrate reversing chamber 3 connected to the next deposition cluster. In the substrate reversing chamber 3, the substrate is rotated in a predetermined direction to fix the direction constantly. The next cluster has the same configuration as that described above. The substrate reversal chamber is placed at the end point where the last cluster is located, and the TM chamber and the flip chamber are placed there.

In the dual deposition chamber 1, two substrates can be arranged side by side. In the bottom surface, the evaporation source is scanned by a scanner, and two substrates are sequentially deposited. The evaporation source is scanned on the same path so that two substrates are formed with the same pixel. That is, the path in the chamber 1 is set to a 'C' shape to deposit the deposition material along the substrate length direction with respect to the first substrate, and the second substrate to be deposited in the same manner And the second substrate is scanned and deposited in the same direction as the first substrate.

2 shows a cross-sectional view of the structure of the dual deposition chamber 1. As shown in Fig.

The robot chamber 2 is provided with a fork-shaped robot 15 for carrying the substrate and the mask into and out of the deposition chamber 2. And a cable bearer 17 for a linear motor 16, a linear motor, a power line for robot control, a sensor wire, and the like are provided to enable driving of the robot. By applying various methods for wire processing in vacuum, the robot can perform linear motion.

The substrate and the mask that the robot 15 has brought into the deposition chamber 1 are aligned, adhered, and then deposited. A touch plate 12 is provided on the upper part of the deposition chamber 1 to provide an alignment unit 11 and to cool the substrate. A mask and a mask base 13 are supported by a support. A latch capable of ascending and descending is provided. The central portion supporting the mask base holds the substrate centering pin in the center of the substrate. The touch plate is provided with a magnet plate which has an electrostatic chuck and can pull the mask so as to prevent the substrate from sagging. The mask used several times for the substrate needs to be replaced, and the mask replacement is performed as follows.

First, the used mask is separated from the substrate, and the substrate is taken out by the robot, and the latch is lowered so that the used mask is lifted up to allow the robot to come in. When the robot comes in, the latch descends and puts the mask on the robot, and the robot takes out the mask. The mask is carried into the mask stock chamber 4 by the robot. The mask is brought into the lower part of the mask stock chamber 4, and the cassettes on which the masks are loaded are simultaneously elevated to allow the robot to exit. At the top of the stacked cassettes, there is a new mask not used, so that the cassettes descend moderately, allowing the robot to come in and take out the new mask. When the mask is brought into the deposition chamber by the robot and the latch is raised by the mask, the robot is released and the latch is lowered to seat the mask on the mask base. When the robot carries the substrate and places it on the new mask, the deposition is carried out again with the replaced mask.

That is, the substrate is transferred to the deposition chamber 1 in a state in which the robot is aligned in the reversing chamber, is aligned with the mask, is attached, and then deposited. After completion of the deposition, the film is separated from the mask and carried to the next reverse chamber by the robot. Thereafter, the same process is repeated to perform a subsequent deposition process.

In this method, the process is performed using only the substrate and the mask without the chuck plate.

3 shows the layout of a deposition system using a telescopic robot. In this embodiment, the substrate is put into and discharged from the chamber using a telescopic conveying mechanism. The telescopic conveying mechanism expands or collapses the foldable arms in the substrate transfer chamber 22 drawn at the lower end of FIG. 3, and distributes and transports the substrate to the four paths.

In this embodiment as well, since the large-area substrate is handled without the chuck plate, the alignment method using the center pin 6 as shown in Fig. 4 is used. The mask and the substrate are aligned with the same configuration as the evaporator shown in Fig. However, in the evaporator used in FIG. 3, the directions are opposite to each other, the substrate is inserted from the left side of the evaporator, and the right side of the evaporator used in FIG. . Two dual deposition chambers are arranged in parallel and two transfer chambers are placed next to the deposition chamber to form one module, which is arranged in a line to form an inline structure.

In the TM chamber, if the robot inserts the substrate into the flip chamber 20, the substrate is flipped and brought into the substrate transfer chamber 22. [ In the substrate transfer chamber 22, the shuttle receives the substrate and transfers it to the deposition chamber 1. At this time, the four substrates are successively distributed to the two dual deposition chambers 1 arranged in parallel. The mask stock chamber 4 provided at both ends of the substrate transfer chamber 22 disposed at the front end of the dual deposition chamber (in the forward direction with respect to the substrate advancing direction) stores the mask. Instead of the telescopic robot used in the layout of FIG. 3, the same evaporator can be constructed by applying rollers, shuttles, linear motors, shuttles, or the like.

4 shows a sectional view of the internal structure of the deposition chamber 1 and the internal structure of the substrate transfer chamber 22. As shown in Fig. The upper side of the deposition chamber is provided with an alignment unit 11 and a latch 5 connected to the alignment unit is provided to take up and down the mask. The touch plate 12 is also connected to the alignment unit. Because of the dual deposition, two alignment units are arranged side by side and a substrate centering pin 6 is arranged at the center between them. An evaporation source 14 is placed on the bottom of the deposition chamber and can be transported by the scanner.

The substrate and the mask are carried by a shuttle or a telescopic robot, and the mask replacement is performed by the operation of a latch. In other words, if the mask is used, the shuttle or the telescopic robot enters and the latch descends to release the mask used on the shuttle. The shuttle moves to the mask stock chamber 4 with a mask, stores the mask, transfers the unused mask to the deposition chamber, and the operation is the same as described above with reference to FIG. The new mask is brought into the deposition chamber by the shuttle, the shuttle leaves the deposition chamber and the mask is placed on the mask base, the latch is raised to prepare the alignment to complete the mask replacement.

Substrate replacement is as follows.

The telescopic robot or shuttle brings the substrate in, the latch receives the substrate, the substrate is seated and the latch is raised so that the telescopic robot or shuttle can exit. When the telescopic robot or shuttle exits, the latch is lowered and the substrate is lowered. In this state, the centering pin 6 rises after the rotation, and the substrate and the mask are aligned and then joined together. Next, the touch plate 12 is attached to the substrate, and the centering pin 6 is lowered and rotated, and after the alignment is confirmed, the deposition is performed. After the deposition, the substrate is lifted by the latch so that the telescopic robot or shuttle enters, the latch is lowered and the substrate is put down on the telescopic robot or shuttle, and the telescopic robot or shuttle receives the substrate. The process proceeds while the carry-in and carry-out of the substrate is repeated.

Also, in the deposition systems of FIGS. 1 and 3, the substrates are arranged and the directions in which the substrates are scanned are rotated by 90 degrees with respect to each other. That is, in FIG. 1, when the substrate array and the deposition source scan direction are viewed in the y-axis direction, the substrate array and the deposition source scan direction are in the x-axis direction.

3, the vertical layer structure of the movement path is used to bring the substrate into the inner space. That is, while the substrates are arranged and deposited, the next substrate is transported at a different height as the movement path to avoid the vertical height of the substrate to be deposited in order to be placed in the chamber.

5 shows a layout in the case where a chuck plate is used as another embodiment of the present invention.

In the upper part of FIG. 5, one dual deposition chamber is arranged in a row, and the lower portion is a row in which two dual deposition chambers are arranged in parallel. The upper one is the Y direction where the substrate is arranged and the direction in which the evaporation source is scanned is the X direction and the lower side is rotated 90 degrees.

A mask stock chamber 4 for supplying a mask to the deposition chamber 1 is provided in parallel with the mask stock chamber 4 for each of the deposition chambers 1, The mask is filled with an independent path, and the used mask is discharged and collected in an independent path.

However, when the mask stock chambers 4 provided in each deposition chamber 1 are communicated with each other to fill the mask, all of them are carried through the first mask stock chamber 4 and are sequentially transferred to the adjacent mask stock chambers 4 . And is carried out through the maskstock chamber 4 at the last stage at the time of collecting the old mask.

The mask stock chamber 4 is configured to communicate with the deposition chamber 1 without breaking the vacuum.

The tack time is 120 seconds at the top and 60 seconds at the bottom.

In this embodiment, since the chuck plate is used, a recovery line for collecting the chuck plate is arranged next to the vapor deposition line.

The upper part is a loading chamber 100 in which the substrate and the chuck are loaded starting from the TM chamber, a bonding chamber 200 in which the substrate and the chuck are bonded together, a buffer chamber 300 for controlling the feed rate, And a branch chamber 500 for branching and bringing the substrate into the dual deposition chamber. After the branch chamber (1) is aligned in a row and the organic material deposition process is completed, there is a branch chamber (500) for receiving the two discharged substrates in a single transfer line and a flip chamber 400, a buffer chamber 300 for controlling the feed rate, a shift chamber 250 for transferring the chuck plate to the recovery line and the substrate to another process (inorganic deposition, etc.) line.

The lower end of FIG. 5 is different from the dual deposition chambers 1 in that two are arranged side by side and the others are the same as the upper end. At the end, however, two deck chambers 250 are arranged in series, and there are further chambers in which the substrate and the chuck plate move in different directions.

The recovery line connects the dechucking chamber and the loading chamber to form a circulation structure so that the chuck plate can be recovered and used repeatedly.

A mask stock chamber 4 is provided in parallel with the side of the dual deposition chamber 1 so as to be arranged in the recovery line but not to interfere with the chuck plate transport path in a layered structure.

The branch chamber may be provided with a stocker capable of storing a chuck plate as required.

In this embodiment, the chucked substrate and mask are transported by the rollers and are much more efficient than conventional cluster systems in which the robotic arm is deployed.

6 is a cross-sectional view showing the configuration of the chambers included in FIG.

Here, the latch for the chuck plate 70 and the latch for the mask 80 are separately provided, and the rollers for the mask roller 50 and the chuck plate roller 60 are separately provided.

The process of replacing the mask is as follows.

When the mask latch 80 descends to raise the sphere mask, the mask roller 50 is driven into the deposition chamber and the sphere mask is taken by the roller 50 to the mask stock chamber 4. In the mask stock chamber 4, the old mask is taken from the in-house roller and the internal roller is driven to raise the mask stock and the roller 50 is driven in reverse to exit the mask stock chamber 4, The mask is lowered and the roller 50 comes in and comes out with a new mask. The forward and backward movements of the rollers are made in different driving directions. The new mask is carried into the deposition chamber by the roller 50 and seated on the mask base, and the latch 80 raises the new mask to prepare for alignment.

In addition, replacement of the chuck plate chucked with the substrate is performed as follows.

The roller 60 for the chuck plate is driven to bring the chuck plate into the deposition chamber. The roller 60 for the chuck plate goes out and the latch 70 for the chuck plate descends to align and align the mask and the substrate. After the touch plate 12 is fixed on the chuck plate and the alignment is confirmed, the deposition is performed. After the completion of the deposition, the latch 70 for the chuck plate is lifted to raise the chuck plate, the chuck plate roller 60 is inserted, the chuck plate latch 70 is lowered, and the chuck plate mounted on the roller 60 is taken out .

7 shows the flow of the process according to the present embodiment. The substrate is transported from the flip chamber 400 to the branch chamber 500, and the branch chamber 500 is provided with a chuck stocker for storing the chuck plate. . The substrates are sequentially transferred from the branch chamber 500 to the dual deposition chamber 1, and the two substrates are brought into a separate path from each other. The mask is supplied in the mask stock chamber 4 provided in the side of the dual deposition chamber 1 and the supply path of the mask is orthogonal to the direction in which the substrate advances to perform the deposition process. Therefore, these moving paths are separated from each other by the vertical layered structure, and no collision interference occurs. The mask supply path is located in a higher layer than the substrate travel path, and vertically shows a three-layered structure. That is, the structure is a three-layer structure (A) having a mask supply path, two layers (B) in which a mask replacement operation takes place, and a one-layer structure (C)

8 shows another embodiment of the present invention in which a chucked substrate and a mask are transferred to a chuck plate by a shuttle or roller by a linear motor and a chuck plate recovery line is not arranged in parallel with the dual deposition chamber, . To this end, as shown in FIG. 9, a chuck plate recovery line 600 passes through the lower space between the center of the substrate transfer chamber 22 and the lower space between the dual deposition chambers.

The same goes for the TM chamber / loading chamber 100 / the adhesion chamber 200 in which the substrate and the chuck are adhered / the buffer chamber 300 for controlling the speed / the flip chamber 400 / the branch chamber 500, After the chamber, two dual deposition chambers 1 are arranged side by side, and the transfer chamber 22 having the mask stock chamber 4 at both ends is arranged after the dual deposition chamber 1. It is also the same as FIG. 5 that the flip chamber 400 / buffer chamber 300 / shift chamber 250 are placed after the transfer chamber that is placed after the last deposition chamber. The distribution of the substrate and the supply of the mask from the mask stock chamber are the same as in Fig. The substrate and the mask are transported by the shuttle. However, unlike FIG. 5, the chuck plate recovery line 600 is connected from the vertical chamber to the loading chamber via the center of the deposition chamber. In the recovery line, the chuck plate recovery path is limited to the central portion avoiding where the substrate is located so as not to interfere with the alignment and deposition process in the deposition chamber, allowing the substrate to pass through the underlying layer in a vertical configuration.

9 is a cross-sectional view showing a chamber configuration included in the inline system of FIG.

In this embodiment, the mask replacement is carried out as follows.

The sphere mask is lifted after the catch 5 is lowered, and then raised. The shuttle 29 for the mask by the linear motor enters the deposition chamber and the latch 5 descends and the mask shuttle 29 receives the sphere mask and takes it to the mask stock chamber 4. [ The dedicated distribution roller in the mask stock chamber 4 is driven to raise the mask loading cassettes and the mask shuttle 29 to the transfer chamber. The mask loading cassettes descend and the new mask is lowered, and the shuttle 29 enters and takes the new mask to the deposition chamber. The new mask is taken up by the latch 5 and the shuttle 29 exits. The latch 5 descends to seat the new mask on the mask base, and the latch 5 rises again to complete the alignment preparation. In this case, the mask shuttle 29 can be replaced with a roller.

Replacement of the chuck plate on which the substrate is chucked is as follows.

The shuttle 27 for the chuck plate brings the chuck plate into the deposition chamber and the shuttle 27 for the chuck plate goes out and the latch for the chuck plate descends to align and align the mask and the substrate. After the touch plate 12 is fixed on the chuck plate and the alignment is confirmed, the deposition is performed. After the completion of the deposition, the latch for the chuck plate rises to lift the chuck plate, the roller or shuttle 27 for the chuck plate is inserted, the latch for the chuck plate is lowered, and the chuck plate mounted on the roller or the shuttle 27 is taken out.

The total turn-off time according to the present embodiment is shortened to 60 seconds.

In this manner, the RGB pixel forming process can be configured as an inline system, resulting in improved productivity, space saving, and facility simplification.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

The deposition chamber 1, the robot chamber 2, the substrate reversal chamber 3, the mask stock chamber 4, the latch 5, the centering pin 6, the telescopic shuttle 7 chamber TM 10, The unit 11, the touch plate 12, the mask and the mask base 13, the evaporation source 14, the fork type robot 15, the linear motor 16, the cable bearer 17, the flip chamber 20, The transfer chamber 22, the chuck plate shuttle 30, the loading chamber 100, the adhesion chamber 200, the buffer chamber 300, the flip chamber 400, the branch chamber 500, The chuck plate latch 70, the mask latch 80, the mask roller 50, the chuck plate roller 60, the chuck plate shuttle 27, the mask shuttle 29, the recovery line 600,

Claims (6)

A substrate transfer (TM) chamber for loading the substrate into the loading chamber with the robot arm;
A first flip chamber for flipping the substrate adjacent to the substrate transfer chamber;
A substrate reversing chamber that receives the substrate from the first flip chamber and rotates the substrate to keep the substrate in a fixed orientation;
A rectangular robot chamber connected to the substrate reversing chamber and having a traveling robot;
A dual deposition chamber arranged on each of left and right sides of the robot chamber; And
And a mask stock chamber disposed between the dual deposition chambers to supply a mask to the dual deposition chamber,
Wherein the robot chamber, the dual deposition chamber, and the mask stock chamber are formed as a single module and are arranged in a line, and the connection between the robot chambers is performed by a substrate reversing chamber,
The traveling robot is capable of rotating motion of the hand and linear motion by the linear motor,
The dual deposition chamber may include a center pin interlocked with the aligning unit to support the center of the bottom surface of the substrate. And
And a touch plate for covering an upper surface of the substrate, wherein the touch plate is attached with an electrostatic chuck, and a separate magnetic plate is provided to press and pull the substrate and prevent the sagging phenomenon by pulling the mask. Inline deposition system. A substrate transfer (TM) chamber for loading the substrate into the loading chamber with the robot arm;
A first flip chamber for flipping the substrate adjacent to the substrate transfer chamber;
A first substrate transfer chamber for transferring a substrate from the first flip chamber to the dual deposition chamber in turn;
A plurality of substrate transfer chambers adjacent to the substrate transfer chamber, the substrate transfer chamber being disposed in a row to form a dual deposition chamber for depositing organic material and a dual deposition chamber; And
And a second flip chamber for flipping the substrate again after the substrate transfer chamber that is located after the last dual deposition chamber,
And a mask transfer chamber for supplying a mask to both ends of the substrate transfer chamber after the dual deposition chamber, wherein the dual deposition chambers are arranged in a line in a state that two of the dual deposition chambers are arranged in parallel,
Wherein the substrate transfer chamber is provided with one of a shuttle, a tray, a roller, and a telescopic transfer means for transferring the substrate,
The dual deposition chamber may include a center pin interlocked with the aligning unit to support the center of the bottom surface of the substrate. And
Wherein the touch plate includes an electrostatic chuck element and a magnetic element for pressing and pulling the substrate and pulling the mask to prevent sagging phenomenon. A substrate transfer (TM) chamber for loading the substrate into the loading chamber with the robot arm;
A loading chamber for loading a substrate and a chuck plate adjacent to the substrate transfer chamber;
A holding chamber for holding the substrate and the chuck plate from the loading chamber and holding the substrate together with the chuck plate;
A first buffer chamber adjacent to the ligation chamber;
A first flip chamber adjacent to the first buffer chamber for flipping a substrate and chuck plate cement;
A first branch chamber for transferring the chucked substrate from the first flip chamber to the chuck plate and transferring the chucked substrate to the dual deposition chamber in turn;
A plurality of dual deposition chambers arranged in a row adjacent to the first branch chamber for depositing organic material;
A second branch chamber arranged in a sequence following the last dual deposition chamber out of the dual deposition chambers and sequentially carrying out the substrates to be transferred one by one;
A second flip chamber disposed next to the second branch chamber to flip back the substrate and chuck plate assembly again;
A second buffer chamber adjacent to the second flip chamber for adjusting a conveying speed;
A shift chamber for separating the substrate from the chuck plate adjacent to the second buffer chamber; And
And a recovery line connecting the deck chamber and the loading chamber to recover a deck chuck plate,
Wherein each of the dual deposition chambers is provided with a mask stock chamber, wherein the mask is supplied when necessary in a state in which the vacuum is not broken. The method of claim 3, wherein the dual deposition chambers are arranged in parallel and arranged in a row, the direction in which the substrate is laid and scanned by the evaporation source is orthogonal to the line in which the inline deposition system is arranged,
Wherein the mask stock chambers juxtaposed to each of the dual deposition chambers communicates with one another in a vacuum so that the mask is filled through one of the two mask stock chambers and discharged by the other. A substrate transfer (TM) chamber for loading the substrate into the loading chamber with the robot arm;
A loading chamber for loading a substrate and a chuck plate adjacent to the substrate transfer chamber;
A holding chamber for holding the substrate and the chuck plate from the loading chamber and holding the substrate together with the chuck plate;
A first buffer chamber adjacent to the ligation chamber;
A first flip chamber adjacent to the first buffer chamber for flipping a substrate and chuck plate cement;
A first branch chamber for transferring the chucked substrate from the first flip chamber to the chuck plate and transferring the chucked substrate to the dual deposition chamber in turn;
A substrate transfer chamber arranged next to the first branch chamber and arranged in a dual deposition chamber arranged in two in parallel and arranged in parallel for two, arranged in a row adjacent to the first branch chamber for depositing organic material;
A second branch chamber disposed in the following order from the last dual deposition chamber and the substrate transfer chamber to sequentially carry out the substrates to be transferred one by one;
A second flip chamber disposed next to the second branch chamber to flip back the substrate and chuck plate assembly again;
A second buffer chamber adjacent to the second flip chamber for adjusting a conveying speed;
A shift chamber for separating the substrate from the chuck plate adjacent to the second buffer chamber; And
And a collecting line for collecting the chuck plate connected to the deckchamber chamber and the loading chamber, the collecting line passing through the lower part of the center of the substrate transfer chamber, the dual deposition chamber and the first and second branch chambers, And,
Wherein each of the substrate transfer chambers has a mask stock chamber and is supplied with a mask when replacement is required. 6. The method according to any one of claims 1 to 5, wherein the dual deposition chamber is provided with a supply path for the mask, a substrate transfer path, and a position where the mask and the mask base are disposed for attaching the substrate to each other, In-line color deposition system.

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