KR102510829B1 - 가공 장치 - Google Patents

가공 장치 Download PDF

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Publication number
KR102510829B1
KR102510829B1 KR1020180136367A KR20180136367A KR102510829B1 KR 102510829 B1 KR102510829 B1 KR 102510829B1 KR 1020180136367 A KR1020180136367 A KR 1020180136367A KR 20180136367 A KR20180136367 A KR 20180136367A KR 102510829 B1 KR102510829 B1 KR 102510829B1
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KR
South Korea
Prior art keywords
user terminal
processing
setting screen
operator
processing device
Prior art date
Application number
KR1020180136367A
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English (en)
Korean (ko)
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KR20190062191A (ko
Inventor
고이치 마키노
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190062191A publication Critical patent/KR20190062191A/ko
Application granted granted Critical
Publication of KR102510829B1 publication Critical patent/KR102510829B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • User Interface Of Digital Computer (AREA)
  • Numerical Control (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020180136367A 2017-11-27 2018-11-08 가공 장치 KR102510829B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-226530 2017-11-27
JP2017226530A JP6934407B2 (ja) 2017-11-27 2017-11-27 加工装置

Publications (2)

Publication Number Publication Date
KR20190062191A KR20190062191A (ko) 2019-06-05
KR102510829B1 true KR102510829B1 (ko) 2023-03-15

Family

ID=66844969

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180136367A KR102510829B1 (ko) 2017-11-27 2018-11-08 가공 장치

Country Status (4)

Country Link
JP (1) JP6934407B2 (ja)
KR (1) KR102510829B1 (ja)
CN (1) CN109860075B (ja)
TW (1) TWI791685B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7275824B2 (ja) * 2019-05-09 2023-05-18 村田機械株式会社 工作機械システム
JP7446136B2 (ja) * 2020-03-26 2024-03-08 東京エレクトロン株式会社 制御システム、制御方法、及び基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105404216A (zh) 2014-09-08 2016-03-16 罗伯特·博世有限公司 装置和用于运行该装置的方法
JP2019125736A (ja) 2018-01-18 2019-07-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法、基板処理装置、プログラム

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JP4500402B2 (ja) * 2000-03-09 2010-07-14 キヤノン株式会社 ファインダー装置及びそれを用いた光学機器
JP2007109967A (ja) * 2005-10-14 2007-04-26 Tokyo Electron Ltd 半導体処理装置
KR101132291B1 (ko) * 2008-03-18 2012-04-05 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 기판 처리 시스템
US8509954B2 (en) * 2009-08-21 2013-08-13 Allure Energy, Inc. Energy management system and method
JP5678468B2 (ja) * 2010-05-06 2015-03-04 株式会社リコー 画像処理システム及び動作管理方法
JP2011255472A (ja) * 2010-06-10 2011-12-22 Disco Corp 加工装置
JP2012000701A (ja) 2010-06-15 2012-01-05 Disco Corp 加工装置
CN103221986B (zh) * 2010-11-25 2016-04-13 松下电器（美国）知识产权公司 通信设备
JP2014010745A (ja) 2012-07-02 2014-01-20 Disco Abrasive Syst Ltd 加工装置
JP2014063423A (ja) * 2012-09-24 2014-04-10 Disco Abrasive Syst Ltd 加工装置
JP6098232B2 (ja) * 2013-03-01 2017-03-22 大日本印刷株式会社 店舗支援システム、携帯端末、通信装置、およびプログラム
JP5935771B2 (ja) * 2013-07-30 2016-06-15 ブラザー工業株式会社 レーザ加工システム
JP5907624B2 (ja) * 2013-09-13 2016-04-26 シャープ株式会社 情報処理装置
DE102013220865A1 (de) * 2013-10-15 2015-04-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und System zum Fernbedienen einer Werkzeugmaschine mittels eines mobilen Kommunikationsgeräts
JP6206099B2 (ja) * 2013-11-05 2017-10-04 セイコーエプソン株式会社 画像表示システム、画像表示システムを制御する方法、および、頭部装着型表示装置
JP6382554B2 (ja) * 2014-03-31 2018-08-29 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
KR20160016579A (ko) * 2014-07-31 2016-02-15 삼성전자주식회사 특정 영역에서 애플리케이션을 실행하는 휴대 단말 및 그 방법
JP6149822B2 (ja) * 2014-08-21 2017-06-21 コニカミノルタ株式会社 情報処理システム、情報処理装置、携帯端末装置およびプログラム
CN105527845A (zh) * 2014-10-20 2016-04-27 上海本星电子科技有限公司 一种智能家居控制系统以及智能控制软件系统
TW201618928A (zh) * 2014-11-24 2016-06-01 弘訊科技股份有限公司 射出成形設備
JP6194876B2 (ja) * 2014-12-12 2017-09-13 コニカミノルタ株式会社 画像処理装置、その制御方法、およびプログラム
CN107636545A (zh) * 2015-06-10 2018-01-26 三菱电机大楼技术服务株式会社 设备维护管理系统、设备维护装置以及程序
JP6575326B2 (ja) * 2015-11-27 2019-09-18 コニカミノルタ株式会社 画像形成システム、画像形成装置およびプログラム
JP6661354B2 (ja) * 2015-12-04 2020-03-11 キヤノン株式会社 通信装置及び制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105404216A (zh) 2014-09-08 2016-03-16 罗伯特·博世有限公司 装置和用于运行该装置的方法
JP2019125736A (ja) 2018-01-18 2019-07-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法、基板処理装置、プログラム

Also Published As

Publication number Publication date
TW201925936A (zh) 2019-07-01
JP2019096175A (ja) 2019-06-20
KR20190062191A (ko) 2019-06-05
CN109860075B (zh) 2023-10-03
TWI791685B (zh) 2023-02-11
JP6934407B2 (ja) 2021-09-15
CN109860075A (zh) 2019-06-07

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