KR102495221B1 - 열성형성 전도성 잉크 및 코팅 및 열성형된 디바이스의 제조 방법 - Google Patents

열성형성 전도성 잉크 및 코팅 및 열성형된 디바이스의 제조 방법 Download PDF

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KR102495221B1
KR102495221B1 KR1020177009706A KR20177009706A KR102495221B1 KR 102495221 B1 KR102495221 B1 KR 102495221B1 KR 1020177009706 A KR1020177009706 A KR 1020177009706A KR 20177009706 A KR20177009706 A KR 20177009706A KR 102495221 B1 KR102495221 B1 KR 102495221B1
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ink
coating
printed
resin
conductive
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KR20170067768A (ko
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마우라 모스토위-갤러거
존 왓슨
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썬 케미칼 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
KR1020177009706A 2014-10-14 2015-09-29 열성형성 전도성 잉크 및 코팅 및 열성형된 디바이스의 제조 방법 Active KR102495221B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462063643P 2014-10-14 2014-10-14
US62/063,643 2014-10-14
PCT/US2015/052808 WO2016060838A1 (en) 2014-10-14 2015-09-29 Thermoformable conductive inks and coatings and a process for fabrication of a thermoformed device

Publications (2)

Publication Number Publication Date
KR20170067768A KR20170067768A (ko) 2017-06-16
KR102495221B1 true KR102495221B1 (ko) 2023-02-01

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Country Link
US (1) US10544317B2 (cg-RX-API-DMAC7.html)
EP (1) EP3207545B1 (cg-RX-API-DMAC7.html)
JP (1) JP6626501B2 (cg-RX-API-DMAC7.html)
KR (1) KR102495221B1 (cg-RX-API-DMAC7.html)
CN (1) CN107077909B (cg-RX-API-DMAC7.html)
WO (1) WO2016060838A1 (cg-RX-API-DMAC7.html)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102543985B1 (ko) * 2015-10-27 2023-06-14 삼성전자주식회사 전도막 및 이를 포함하는 전자 소자
US10359929B2 (en) * 2015-11-09 2019-07-23 Analog Devices, Inc. Slider and gesture recognition using capacitive sensing
FR3052594B1 (fr) * 2016-06-10 2018-11-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif a piste electriquement conductrice et procede de fabrication du dispositif
JP7186709B2 (ja) * 2016-10-25 2022-12-09 イー２アイピー テクノロジーズ インコーポレイテッド プリンテッド・エレクトロニクス
FR3061800B1 (fr) * 2017-01-12 2019-05-31 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur
EP3625295A4 (en) 2017-05-15 2021-07-21 Alpha Assembly Solutions Inc. DIELECTRIC INK COMPOSITION
US20190060583A1 (en) 2017-08-22 2019-02-28 Jabil Circuit, Inc. Apparatus, system and method of providing a conformable heater system
US11304263B2 (en) * 2017-08-29 2022-04-12 Jabil Inc. Apparatus, system and method of providing a conformable heater in wearables
WO2019039511A1 (ja) * 2017-08-24 2019-02-28 東洋紡株式会社 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器
FR3074087B1 (fr) * 2017-11-30 2021-01-01 Commissariat Energie Atomique Procede pour fabriquer un objet thermoforme metallise
WO2019123123A1 (en) * 2017-12-20 2019-06-27 3M Innovative Properties Company Low dielectric constant curable ink compositions
JP6521138B1 (ja) * 2018-04-19 2019-05-29 東洋インキＳｃホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法
GB2573752B (en) * 2018-05-11 2022-12-07 Tangi0 Ltd Sensor device and method
TWI788358B (zh) * 2018-05-29 2023-01-01 林世智 具有靜電印製導電線路之電路板之製作
TWI853828B (zh) * 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
TWI658765B (zh) * 2018-09-28 2019-05-01 正美企業股份有限公司 導電線路結構及使用其的被動式無線感測裝置
WO2020092507A2 (en) * 2018-10-30 2020-05-07 Henkel IP & Holding GmbH Conductive ink composition
US11261341B2 (en) * 2019-05-07 2022-03-01 Xerox Corporation Conductive ink composition and article of manufacture made therefrom
CN111423793A (zh) * 2020-04-26 2020-07-17 常州市碳索新材料科技有限公司 一种石墨烯改性超耐候粉末涂料及其制备方法
CN111681804A (zh) * 2020-06-09 2020-09-18 上海三屹电子科技有限公司 一种模内电子技术(ime)用导电浆料及其制备方法
CH717619A1 (de) * 2020-07-07 2022-01-14 Daetwyler Schweiz Ag Verfahren zum Herstellen einer elastomeren Komponente, die eine gedruckte Struktur umfasst, und elastomere Komponente.
KR102212462B1 (ko) * 2020-11-04 2021-02-08 (주)범민케미칼 Tpu를 이용한 친환경 동분항균필름
CN112961540A (zh) * 2021-03-31 2021-06-15 上海宝银电子材料有限公司 一种移印工艺用导电油墨及其制备方法
CN113932699A (zh) * 2021-09-23 2022-01-14 浦江荣达量具有限公司 一种数显卡尺容栅传感器制造工艺
KR102705943B1 (ko) * 2021-11-25 2024-09-11 티에스엠카본 주식회사 그래핀 제조 방법
CN114410148B (zh) * 2021-12-22 2023-03-24 广州亦盛环保科技有限公司 一种低温热固可4d热弯拉伸成型油墨及其制备方法
WO2024015547A1 (en) 2022-07-15 2024-01-18 Sun Chemical Corporation Uv curable thermoformable conductive ink and dielectric ink

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013028115A (ja) * 2011-07-29 2013-02-07 Toda Kogyo Corp 成型物の製造方法及び成型物

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62177885A (ja) 1986-01-31 1987-08-04 日本写真印刷株式会社 ヒ−タ−回路を有する成型品およびその製造方法
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
US5855706A (en) 1992-04-21 1999-01-05 Branson Ultrasonics Corporation Simultaneous amplitude and force profiling during ultrasonic welding of thermoplastic workpieces
US5744557A (en) * 1993-06-16 1998-04-28 Minnesota Mining And Manufacturing Company Energy-curable cyanate/ethylenically unsaturated compositions
US5631311A (en) * 1994-08-18 1997-05-20 E. I. Du Pont De Nemours And Company Transparent static dissipative formulations for coatings
GB2359556B (en) 1999-11-19 2003-08-20 Sericol Ltd An ink for decoration of substrates such as polycarbonate
US7200009B2 (en) * 2003-07-01 2007-04-03 Nokia Corporation Integrated electromechanical arrangement and method of production
WO2006108165A2 (en) 2005-04-06 2006-10-12 Ohmcraft, Inc. Conductive ink with nanotubes
US7486280B2 (en) 2005-08-04 2009-02-03 Uniplas Enterprises Pte, Ltd. Contoured capacitive touch control panel
TWI450054B (zh) 2005-09-20 2014-08-21 Mitsubishi Rayon Co 碳粉用聚酯樹脂、其製造方法以及碳粉
GB2435472A (en) 2006-02-23 2007-08-29 3M Innovative Properties Co Method for forming an article having a decorative surface
JP5212108B2 (ja) * 2006-11-02 2013-06-19 東洋インキＳｃホールディングス株式会社 導電性インキ、導電回路および非接触型メディア
JP4986976B2 (ja) 2007-12-20 2012-07-25 キヤノン株式会社 画像処理装置、画像形成装置および画像処理方法
WO2009142626A1 (en) 2008-05-20 2009-11-26 Hewlett-Packard Development Company, L.P. Radio frequency identification device molded into a product part
KR101759180B1 (ko) 2009-04-03 2017-07-18 보르벡크 머터리얼스 코포레이션 그라핀 시트 및 흑연을 함유하는 중합체 조성물
WO2011072717A1 (de) 2009-12-15 2011-06-23 Novelty Group Limited Autorisierungssystem, abgleicheinrichtung und verfahren zur autorisierung eines subjekts
EP2338664A1 (de) 2009-12-23 2011-06-29 Bayer MaterialScience AG Verfahren zur Herstellung eines verformten Folienteils aus thermoplastischem Kunststoff
US9268244B2 (en) 2011-04-26 2016-02-23 Ricoh Company, Ltd. Electrostatic image developing toner, image forming apparatus, image forming method, and process cartridge
US9030837B2 (en) 2011-06-10 2015-05-12 Scott Moncrieff Injection molded control panel with in-molded decorated plastic film that includes an internal connector
US8692131B2 (en) 2011-09-20 2014-04-08 E I Du Pont De Nemours And Company Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
EP2644664B1 (en) * 2012-03-29 2015-07-29 Fujifilm Corporation Actinic radiation-curing type ink composition, inkjet recording method, decorative sheet, decorative sheet molded product, process for producing in-mold molded article, and in-mold molded article
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013028115A (ja) * 2011-07-29 2013-02-07 Toda Kogyo Corp 成型物の製造方法及び成型物

Also Published As

Publication number Publication date
US10544317B2 (en) 2020-01-28
EP3207545B1 (en) 2021-09-01
EP3207545A4 (en) 2018-03-14
EP3207545A1 (en) 2017-08-23
JP6626501B2 (ja) 2019-12-25
KR20170067768A (ko) 2017-06-16
US20170298242A1 (en) 2017-10-19
CN107077909A (zh) 2017-08-18
WO2016060838A1 (en) 2016-04-21
JP2017538247A (ja) 2017-12-21
CN107077909B (zh) 2019-08-23

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